CO7140288A1 - Empaque tridimensional para implantes médicos - Google Patents
Empaque tridimensional para implantes médicosInfo
- Publication number
- CO7140288A1 CO7140288A1 CO13136182A CO13136182A CO7140288A1 CO 7140288 A1 CO7140288 A1 CO 7140288A1 CO 13136182 A CO13136182 A CO 13136182A CO 13136182 A CO13136182 A CO 13136182A CO 7140288 A1 CO7140288 A1 CO 7140288A1
- Authority
- CO
- Colombia
- Prior art keywords
- surface energy
- medical implants
- low surface
- dimensional packaging
- components
- Prior art date
Links
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L31/00—Materials for other surgical articles, e.g. stents, stent-grafts, shunts, surgical drapes, guide wires, materials for adhesion prevention, occluding devices, surgical gloves, tissue fixation devices
- A61L31/08—Materials for coatings
- A61L31/10—Macromolecular materials
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/372—Arrangements in connection with the implantation of stimulators
- A61N1/375—Constructional arrangements, e.g. casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L2420/00—Materials or methods for coatings medical devices
- A61L2420/02—Methods for coating medical devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09872—Insulating conformal coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1322—Encapsulation comprising more than one layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23—Sheet including cover or casing
- Y10T428/239—Complete cover or casing
Landscapes
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Biomedical Technology (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Radiology & Medical Imaging (AREA)
- Heart & Thoracic Surgery (AREA)
- Surgery (AREA)
- Vascular Medicine (AREA)
- Epidemiology (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Medical Uses (AREA)
- Laminated Bodies (AREA)
- Prostheses (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Dispositivos médicos implantables, y métodos para revestirlos, que incluyen una pluralidad de componentes dispuestos en un sustrato, y una capa de energía superficial baja depositada como un líquido sobre por lo menos una primera porción de los componentes y del sustrato, en donde la capa de energía superficial baja se solidifica después del depósito y se ajusta a por lo menos a primera porción de los componentes. Los dispositivos incluyen, además, un revestimiento hermético biocompatible que se ajusta y que reviste por sellamiento por lo menos una porción de la capa de energía superficial baja.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/491,081 US9345813B2 (en) | 2012-06-07 | 2012-06-07 | Three dimensional packaging for medical implants |
Publications (1)
Publication Number | Publication Date |
---|---|
CO7140288A1 true CO7140288A1 (es) | 2014-12-12 |
Family
ID=48771261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CO13136182A CO7140288A1 (es) | 2012-06-07 | 2013-06-05 | Empaque tridimensional para implantes médicos |
Country Status (6)
Country | Link |
---|---|
US (2) | US9345813B2 (es) |
EP (1) | EP2687256B1 (es) |
JP (1) | JP2013255792A (es) |
AU (1) | AU2013206095B2 (es) |
CA (1) | CA2817328A1 (es) |
CO (1) | CO7140288A1 (es) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10153321B2 (en) * | 2014-11-20 | 2018-12-11 | Koninklijke Philips N.V. | Radiation detector core assembly and method for constructing the same |
EP3319098A1 (en) | 2016-11-02 | 2018-05-09 | Abiomed Europe GmbH | Intravascular blood pump comprising corrosion resistant permanent magnet |
FR3061404B1 (fr) * | 2016-12-27 | 2022-09-23 | Packaging Sip | Procede de fabrication collective de modules electroniques hermetiques |
US11034068B2 (en) * | 2018-04-30 | 2021-06-15 | Raytheon Company | Encapsulating electronics in high-performance thermoplastics |
ES2842882T3 (es) * | 2018-05-08 | 2021-07-15 | Abiomed Europe Gmbh | Imán permanente resistente a la corrosión y bomba de sangre intravascular que comprende el imán |
EP3817808A4 (en) | 2018-07-07 | 2022-04-06 | Acucela Inc. | RETINAL HYPOXIA PREVENTION DEVICE |
CA3107824A1 (en) | 2018-07-30 | 2020-02-06 | Acucela Inc. | Optical designs of electronic contact lens to decrease myopia progression |
US11690982B1 (en) * | 2018-08-16 | 2023-07-04 | Professional Plating Inc. | Microminiature patterned metal on medical grade balloons |
WO2020114617A1 (en) | 2018-12-07 | 2020-06-11 | Pixium Vision Sa | Hermetic packaging of electronic components |
WO2021022193A1 (en) | 2019-07-31 | 2021-02-04 | Acucela Inc. | Device for projecting images on the retina |
US11733545B2 (en) | 2019-09-16 | 2023-08-22 | Acucela Inc. | Assembly process for an electronic soft contact lens designed to inhibit progression of myopia |
TW202203521A (zh) | 2020-02-21 | 2022-01-16 | 美商艾尤席拉有限公司 | 電子隱形眼鏡之充電盒 |
CN115668038A (zh) | 2020-05-13 | 2023-01-31 | 奥克塞拉有限公司 | 用于近视治疗的电可切换眼镜 |
AU2021287803A1 (en) | 2020-06-08 | 2022-10-27 | Acucela Inc. | Stick on devices using peripheral defocus to treat progressive refractive error |
CN115698832A (zh) | 2020-06-08 | 2023-02-03 | 奥克塞拉有限公司 | 用于治疗散光的非对称投影透镜 |
KR20230020951A (ko) | 2020-06-08 | 2023-02-13 | 어큐셀라 인코포레이티드 | 굴절 이상을 치료하기 위한 주변 망막에 대한 디포커스된 이미지의 투영 |
US11281022B2 (en) | 2020-06-10 | 2022-03-22 | Acucela Inc. | Apparatus and methods for the treatment of refractive error using active stimulation |
US11209672B1 (en) | 2021-04-06 | 2021-12-28 | Acucela Inc. | Supporting pillars for encapsulating a flexible PCB within a soft hydrogel contact lens |
US11366341B1 (en) | 2021-05-04 | 2022-06-21 | Acucela Inc. | Electronic case for electronic spectacles |
CN118103082A (zh) * | 2021-08-13 | 2024-05-28 | 威森卡夫实验室私人有限公司 | 具有分层式涂层的植入物表面的植入物及其制造方法 |
Family Cites Families (27)
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US7657297B2 (en) * | 2004-05-03 | 2010-02-02 | Dexcom, Inc. | Implantable analyte sensor |
TW439308B (en) | 1998-12-16 | 2001-06-07 | Battelle Memorial Institute | Environmental barrier material for organic light emitting device and method of making |
US6709715B1 (en) | 1999-06-17 | 2004-03-23 | Applied Materials Inc. | Plasma enhanced chemical vapor deposition of copolymer of parylene N and comonomers with various double bonds |
US6456812B1 (en) * | 2000-09-05 | 2002-09-24 | Xerox Corporation | Coating compositions for development electrodes |
US6881447B2 (en) | 2002-04-04 | 2005-04-19 | Dielectric Systems, Inc. | Chemically and electrically stabilized polymer films |
WO2002100769A2 (en) | 2001-06-08 | 2002-12-19 | The Regents Of The University Of Michigan | A circuit encapsulation technique utilizing electroplating |
US20070216300A1 (en) | 2002-04-04 | 2007-09-20 | International Display Systems, Inc. | Organic opto-electronic device with environmentally protective barrier |
CA2493784C (en) | 2002-07-29 | 2016-04-26 | Potencia Medical Ag | Durable implant |
US20040229051A1 (en) * | 2003-05-15 | 2004-11-18 | General Electric Company | Multilayer coating package on flexible substrates for electro-optical devices |
US6992371B2 (en) * | 2003-10-09 | 2006-01-31 | Freescale Semiconductor, Inc. | Device including an amorphous carbon layer for improved adhesion of organic layers and method of fabrication |
US7347826B1 (en) | 2003-10-16 | 2008-03-25 | Pacesetter, Inc. | Packaging sensors for long term implant |
US7459781B2 (en) * | 2003-12-03 | 2008-12-02 | Wen-Kun Yang | Fan out type wafer level package structure and method of the same |
US20050273146A1 (en) | 2003-12-24 | 2005-12-08 | Synecor, Llc | Liquid perfluoropolymers and medical applications incorporating same |
WO2006098813A1 (en) * | 2005-02-01 | 2006-09-21 | Second Sight Medical Products, Inc. | Micro-miniature implantable coated device |
EP1938965A4 (en) * | 2005-09-22 | 2013-01-23 | Tomoegawa Co Ltd | THIN FILM THIN SUBSTRATE, THIN FILM THIN FILM SUBSTRATE, AND DISPLAY DEVICE USING THE SAME |
US20070096281A1 (en) * | 2005-11-02 | 2007-05-03 | Greenberg Robert J | Implantable microelectronic device and method of manufacture |
KR101286745B1 (ko) * | 2006-03-30 | 2013-07-15 | 헨켈 아게 운트 코. 카게아아 | 열경화성 에폭시-아민 배리어 밀봉제 |
US20080200750A1 (en) | 2006-11-17 | 2008-08-21 | Natalie James | Polymer encapsulation for medical device |
US8173906B2 (en) | 2007-02-07 | 2012-05-08 | Raytheon Company | Environmental protection coating system and method |
US20090263641A1 (en) | 2008-04-16 | 2009-10-22 | Northeast Maritime Institute, Inc. | Method and apparatus to coat objects with parylene |
US20090263581A1 (en) | 2008-04-16 | 2009-10-22 | Northeast Maritime Institute, Inc. | Method and apparatus to coat objects with parylene and boron nitride |
WO2010057026A2 (en) * | 2008-11-13 | 2010-05-20 | Proteus Biomedical, Inc. | Rechargeable stimulation lead, system, and method |
US8412304B2 (en) | 2009-07-16 | 2013-04-02 | Cochlear Limited | Sealing of an implantable medical device |
US8361591B2 (en) | 2009-08-12 | 2013-01-29 | Medos International Sarl | Packaging with active protection layer |
US8313811B2 (en) | 2009-08-12 | 2012-11-20 | Medos International S.A.R.L. | Plasma enhanced polymer ultra-thin multi-layer packaging |
US8313819B2 (en) | 2009-08-12 | 2012-11-20 | Medos International S.A.R.L. | Ultra-thin multi-layer packaging |
TWI497658B (zh) * | 2009-10-07 | 2015-08-21 | Xintec Inc | 晶片封裝體及其製造方法 |
-
2012
- 2012-06-07 US US13/491,081 patent/US9345813B2/en active Active
-
2013
- 2013-05-29 CA CA2817328A patent/CA2817328A1/en active Pending
- 2013-05-31 AU AU2013206095A patent/AU2013206095B2/en not_active Ceased
- 2013-06-05 CO CO13136182A patent/CO7140288A1/es unknown
- 2013-06-06 JP JP2013119535A patent/JP2013255792A/ja active Pending
- 2013-06-06 EP EP13170792.9A patent/EP2687256B1/en active Active
-
2014
- 2014-11-25 US US14/553,404 patent/US10279085B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP2687256B1 (en) | 2019-01-09 |
US20130330498A1 (en) | 2013-12-12 |
JP2013255792A (ja) | 2013-12-26 |
EP2687256A1 (en) | 2014-01-22 |
US9345813B2 (en) | 2016-05-24 |
US20150297801A1 (en) | 2015-10-22 |
CA2817328A1 (en) | 2013-12-07 |
US10279085B2 (en) | 2019-05-07 |
AU2013206095A1 (en) | 2014-01-09 |
AU2013206095B2 (en) | 2017-02-23 |
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