CN87209309U - Silicon piezo-risistive baroceptor - Google Patents
Silicon piezo-risistive baroceptor Download PDFInfo
- Publication number
- CN87209309U CN87209309U CN 87209309 CN87209309U CN87209309U CN 87209309 U CN87209309 U CN 87209309U CN 87209309 CN87209309 CN 87209309 CN 87209309 U CN87209309 U CN 87209309U CN 87209309 U CN87209309 U CN 87209309U
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- China
- Prior art keywords
- silicon
- cup chip
- diffusion resistance
- utility
- model
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a silicon piezo-resistance air pressure sensor, comprising a pipe cap, a replaceable base, an outside lead, a pressure guiding pipe, a diffused resistor, silicon cup chip and a silicon pad. The utility model has the advantages of simple structure and low cost, and the utility model is suitable for measurement of underground cable protection air pressure and pressure intensity of the noncorrosive gas and noncorrosive liquids.
Description
The utility model relates to a kind of improved silicon piezoresistance type baroceptor, is used in the measurement of the measurement of underground cable protection air pressure and non-corrosive gas, liquid pressure especially.
Existing piezoresistive silicon sensor, complex structure, cost height.
It is low that task of the present utility model provides a kind of cost, simple in structure, can be convenient for measuring the silicon piezoresistance type baroceptor of gas, liquid pressure.
Task of the present utility model is finished as follows; By pipe cap, can cut down the silicon piezoresistance type baroceptor that pedestal, outer lead, pressure guiding pipe, diffusion resistance, silicon cup chip, silicon spacer are formed.The elastic membrane skin that it is characterized in that the silicon cup chip is manufactured with the electric bridge that diffusion resistance is formed, the silicon spacer pad is at silicon cup chip bottom and the impulse pore that can cut down pedestal, overlapping bonding, form the air pressure cavity, there is a reference pressure hole on silicon cup chip side, the aperture in reference pressure hole is stained with rubber diaphragm, the interior pressure point of diffusion resistance is connected with the outer lead end points, and with the silicon cup chip, the reference pressure hole encapsulates with pipe cap.
Be further described below in conjunction with accompanying drawing:
Fig. 1 is the synoptic diagram that diffusion resistance is formed electric bridge, and diffusion resistance 1,2,3,4 inner contacts 5,6,7,8,9,10 usefulness semiconductor fabrication process are made at silicon cup chip elastic membrane skin.
Fig. 2 is cut-away view, elastic membrane 1, the diffusion resistance 2 of silicon cup chip
Fig. 3 is the upward view of silicon cup chip
Fig. 4 is the front elevation (left side is looked, the right side is looked, backsight identical with front elevation) of silicon spacer
Fig. 5 is the vertical view (identical with upward view) of silicon spacer
Fig. 6 is silicon piezoresistance type baroceptor cut-open view, silicon cup chip 1, silicon spacer 2
Can be for pressure point and outer end points line 8, pipe cap 9 in pedestal 3, fairlead 4, outer lead 5, internal lead end points 6, the outer lead end points 7
Fig. 7 is a silicon piezoresistance type baroceptor upward view, outer lead 1,2,3,4,5,6,7, and impulse pore 8, reference pressure hole 9 can be for pedestal 10, fixed bolt hole 11
Claims (1)
1, a kind of by pipe cap, the silicon piezoresistance type baroceptor that can form for pedestal, outer lead, pressure guiding pipe, diffusion resistance, silicon cup chip, silicon spacer, the elastic membrane skin that it is characterized in that the silicon cup chip is manufactured with the electric bridge that diffusion resistance is formed, the silicon spacer pad the silicon cup chip bottom with can be for the impulse pore of pedestal, overlapping bonding, form the air pressure cavity, there is a reference pressure hole on silicon cup chip side, the interior pressure point that the aperture in reference pressure hole is stained with rubber diaphragm, diffusion resistance is connected with the outer lead end points, with the silicon cup chip, the reference pressure hole encapsulates with pipe cap.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 87209309 CN87209309U (en) | 1987-06-20 | 1987-06-20 | Silicon piezo-risistive baroceptor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 87209309 CN87209309U (en) | 1987-06-20 | 1987-06-20 | Silicon piezo-risistive baroceptor |
Publications (1)
Publication Number | Publication Date |
---|---|
CN87209309U true CN87209309U (en) | 1988-05-18 |
Family
ID=4824421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 87209309 Withdrawn CN87209309U (en) | 1987-06-20 | 1987-06-20 | Silicon piezo-risistive baroceptor |
Country Status (1)
Country | Link |
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CN (1) | CN87209309U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100449289C (en) * | 2003-06-18 | 2009-01-07 | 霍尼韦尔国际公司 | Pressure sensor apparatus and method |
CN106248265A (en) * | 2016-08-30 | 2016-12-21 | 张子青 | A kind of diffused-silicon pressure pick-up device |
-
1987
- 1987-06-20 CN CN 87209309 patent/CN87209309U/en not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100449289C (en) * | 2003-06-18 | 2009-01-07 | 霍尼韦尔国际公司 | Pressure sensor apparatus and method |
CN106248265A (en) * | 2016-08-30 | 2016-12-21 | 张子青 | A kind of diffused-silicon pressure pick-up device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |