CN2914322Y - Heat insulation wall, heating element structure holding body, heating device and substrate board processing device - Google Patents
Heat insulation wall, heating element structure holding body, heating device and substrate board processing device Download PDFInfo
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- CN2914322Y CN2914322Y CNU2006200066809U CN200620006680U CN2914322Y CN 2914322 Y CN2914322 Y CN 2914322Y CN U2006200066809 U CNU2006200066809 U CN U2006200066809U CN 200620006680 U CN200620006680 U CN 200620006680U CN 2914322 Y CN2914322 Y CN 2914322Y
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- heat insulation
- heater
- mounting groove
- wall body
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
Abstract
To prevent a heating element from lodging or deforming. Sloping tapers 40b and 40c are provided to a side wall of a mounting groove 40 with a heating element 42 in a way that they recede from the heating element 42, as the element advances to the center of the heat insulating wall 33. When the heating element 42 moves in an externally radial direction within the mounting groove 40 depending on heat expansion, it is possible to prevent the heating element 42 from hooking into the tapers 40b and 40c, so that the heating element 42 can return to the previous position by moving in an internally radial direction within the groove 40, even if the heating element 42 shrinks for temperature fall. Heating element disconnection due to heat expansion or shrinkage in the heating element can be avoided by preventing changes for heat expansion or heat shrinkage in the heating element, and consequently the life cycle of the heating element extends.
Description
Technical field
The utility model relates to heat insulation wall body, the maintenance tectosome of heater, heater and substrate board treatment are for example gone up deposition at the semiconductor wafer that is assembled with conductor integrated circuit device (below be called IC) (below be called wafer) and (deposition) dielectric film, the CVD device of metallic film and semiconductor film, the oxidation membrane formation device, disperser, the technology that the annealing device semiconductor devices such as (furnace) that heat treatments (thermal treatment) such as the carrier activate after being used for carrying out the ion injection and the backflow (reflow) of planarization and annealing are used effectively uses.
Background technology
In the manufacture method of IC, when wafer is implemented film forming processing and DIFFUSION TREATMENT, be extensive use of the hot wall type diffusion CVD device of batch (-type) erect type.
Generally, the hot wall type of batch (-type) erect type diffusion CVD device (below be called the CVD device) possesses: reaction tube, by the interior pipe that forms the process chamber of sending into wafer with surround that outer tube of pipe constitutes in this, be arranged to erect type; Brilliant boat keeps the multi-disc wafer as processed substrate, and is sent in the process chamber of interior pipe; Gas introduction tube imports to unstrpped gas in the interior pipe; Blast pipe is with exhaust in the reaction tube; Unit heater is located at outside the reaction tube, will heat in the reaction tube.
And, under the state of by brilliant boat the multi-disc wafer vertically being arranged and being kept, send into (brilliant boat loading) after interior pipe is interior from the fire door of lower end, unstrpped gas is imported in the interior pipe from gas introduction tube, and be heated by unit heater in the reaction tube.Thus, cvd film is deposited on the wafer, and implements DIFFUSION TREATMENT.
In this CVD device in the past, unit heater as heater has following structure, promptly possess: heat insulation wall body, use heat-barrier materials (heatinsulating material) such as aluminium oxide or silicon dioxide, form (vacuum suction formation) method by vacuum and form the whole long cylinder shape that covers reaction tube; Heater uses siderochrome aluminium (Fe-Cr-Al) alloy or molybdenum disilicide (MoSi
2) and form to such an extent that grow up; And housing, cover heat insulation wall body; And heater was arranged on the interior week of heat insulation wall body.
In such unit heater, under the situation of embodiment, use and form tabular heater in order to strengthen the heating effective area as the heating rapidly more than 30 ℃/minute.
Maintenance structure as the heater in the past in the interior week that will this tabular heater be arranged on heat insulation wall body has the structure that heater is set with the state that leaves groove bottom respectively in a plurality of mounting grooves of being located on the interior week of heat insulation wall body.For example with reference to patent documentation 1.
Patent documentation 1: TOHKEMY 2004-39967 communique
In above-mentioned heat insulation wall body, owing to heater is separately positioned in the mounting groove, so can prevent the contact each other of neighbouring heater.
But for the thermal expansion of dealing with heater and the needs of thermal contraction, heater can move on radial direction.
Thereby, when thermal expansion, heater in mounting groove outside radial direction side shifting, when thermal contraction, heater in mounting groove to the radial direction medial movement and return-to-home position.
But heater is stuck in when thermal expansion on the side wall surface of mounting groove, and this jammed position becomes stiff end, and by such effect, heater can be out of shape.Equally, heater is stuck on the side wall surface of mounting groove when thermal expansion, if heater is lowered the temperature and shunk under this state that blocks, then this jammed position becomes stiff end, and by such effect, heater can be out of shape.
Under the situation of this distortion accumulation or be out of shape under the big situation, existence can cause the problem of heater fracture.
The utility model content
First purpose of the present utility model is, provides a kind of card that can prevent heater to hang, prevent the heat insulation wall body that is deformed in possible trouble of heater.
Second purpose of the present utility model is, provides a kind of card that can prevent heater to hang, prevent the maintenance tectosome of the heater that is deformed in possible trouble of heater.
The 3rd purpose of the present utility model is, provides a kind of card that can prevent heater to hang, prevent the heater that is deformed in possible trouble of heater.
The 4th purpose of the present utility model is, provides a kind of card that can prevent heater to hang, prevent the substrate board treatment that is deformed in possible trouble of heater.
As follows with the representative technical scheme in the mechanism that solves above-mentioned problem.
(1) a kind of heat insulation wall body is the heat insulation wall body of drum that is used for the heater of substrate board treatment, and it forms following structure:
Have and be used for heater is accommodated in mounting groove on the inner peripheral surface of this drum;
Form the interval of the pair of sidewalls of above-mentioned mounting groove, along with diminishing near bottom land.
(2) a kind of heat insulation wall body is the heat insulation wall body of drum that is used for the heater of substrate board treatment, and it forms following structure:
Have and be used for heater is accommodated in mounting groove on the inner peripheral surface of this drum;
Form the interval of the pair of sidewalls of above-mentioned mounting groove, the top from the bottom of above-mentioned mounting groove towards this sidewall becomes big gradually.
(3) a kind of heat insulation wall body is the heat insulation wall body of drum that is used for the heater of substrate board treatment, and it forms following structure:
Have and be used for heater is accommodated in mounting groove on the inner peripheral surface of this drum:
Form the interval of the pair of sidewalls of above-mentioned mounting groove, the radial direction central side from the bottom of above-mentioned mounting groove towards above-mentioned drum becomes big gradually.
(4) a kind of heat insulation wall body is the heat insulation wall body of drum that is used for the heater of substrate board treatment, and it forms following structure:
Have and be used for heater is accommodated in mounting groove on the inner peripheral surface of this drum:
Form in the pair of sidewalls of above-mentioned mounting groove, be positioned at the sidewall of vertical direction upside than above-mentioned heater, become big to the vertical direction upside gradually towards the radial direction central side of above-mentioned drum;
Form in the pair of sidewalls of above-mentioned mounting groove, be positioned at the sidewall of vertical direction downside than above-mentioned heater, become big to the vertical direction downside gradually towards the radial direction central side of above-mentioned drum.
(5) a kind of heat insulation wall body is the heat insulation wall body of drum that is used for the heater of substrate board treatment, and it forms following structure:
Have and be used for heater is accommodated in mounting groove on the inner peripheral surface of this drum:
The width of the vertical direction of above-mentioned mounting groove forms at least bigger than the upper and lower side of the vertical direction of above-mentioned heater, and this width becomes big gradually towards the radial direction central side of above-mentioned drum.
(6) a kind of heat insulation wall body is the heat insulation wall body of drum that is used for the heater of substrate board treatment, and it forms following structure:
Be laminated with the heat insulation of a plurality of drums, this heat insulation has and is used for heater is accommodated in mounting groove on the inner peripheral surface;
Be formed with the first side wall on one in above-mentioned heat insulation, this first side wall becomes in the pair of sidewalls that forms above-mentioned mounting groove;
Be adjacent on the stacked heat insulation with the heat insulation that is formed with above-mentioned the first side wall, be formed with opposed and become another second sidewall in the pair of sidewalls that forms above-mentioned mounting groove with above-mentioned the first side wall;
The interval of above-mentioned the first side wall and above-mentioned second sidewall, the top from the bottom of above-mentioned mounting groove towards this mounting groove becomes big gradually.
(7) a kind of heat insulation wall body is the heat insulation wall body of drum that is used for the heater of substrate board treatment, and it forms following structure:
Be laminated with the heat insulation of a plurality of drums, this heat insulation has and is used for heater is accommodated in mounting groove on the inner peripheral surface;
In the bottom of above-mentioned heat insulation, the state that is cut into toroidal with the part with interior week of above-mentioned heat insulation is formed with in conjunction with protuberance;
In the upper end of above-mentioned heat insulation, the state that is cut into toroidal with the part with the periphery of above-mentioned heat insulation is formed with in conjunction with recess;
The upper end of the inner peripheral surface of above-mentioned heat insulation and and the upper end of the inner peripheral surface of the heat insulation of this heat insulation adjacency between, be formed with above-mentioned mounting groove;
Form the interval of the pair of sidewalls of above-mentioned mounting groove, the top from the bottom of above-mentioned mounting groove towards this sidewall becomes big gradually.
(8) a kind of heater has any heat insulation wall body in above-mentioned (1)～(7).
(9) a kind of substrate board treatment has the heater of above-mentioned (8).
(10) a kind of maintenance tectosome of heater is used for substrate board treatment, and it forms following structure:
Be formed with mounting groove on the inner peripheral surface of the heat insulation wall body that forms drum, above-mentioned heater is being set in this mounting groove, the interval of pair of sidewalls that forms above-mentioned mounting groove is along with diminishing near bottom land.
Description of drawings
Fig. 1 is the front section view of expression as the CVD device of an execution mode of the present utility model.
Fig. 2 is the section plan of expression as the major part of the unit heater of an execution mode of the present utility model.
Fig. 3 represents the maintenance tectosome major part as the heater of an execution mode of the present utility model, and Fig. 3 (a) is the expanded view of observing from the inboard, and Fig. 3 (b) is the cutaway view along the b-b line of Fig. 3 (a), and Fig. 3 (c) is the cutaway view along the c-c line of Fig. 3 (a).
Fig. 4 (a) is the stereogram of expression outside insulator, and Fig. 4 (b) is the stereogram of the inboard insulator in the expression same mechanism.
Fig. 5 is the stereogram of unit heater.
Fig. 6 is each outside summary section plan that expression prevents the effect of being out of shape, the situation of Fig. 6 (a) expression comparative example, the situation of Fig. 6 (b) expression present embodiment.
Embodiment
Below, with reference to a description of drawings execution mode of the present utility model.
In the present embodiment, use in the unit heater of an execution mode of the heater that relates to of the heat insulation wall body that relates to of the utility model the utility model in the CVD device (the hot wall type diffusion CVD device of batch (-type) erect type) of an execution mode that is arranged at the substrate board treatment that relates to as the utility model.
As the CVD device of an execution mode of substrate board treatment of the present utility model as shown in Figure 1, possess the reaction tube 11 of the erect type that vertically sets and supported regularly, reaction tube 11 comprises outer tube 12 and interior pipe 13.
Outer tube 12 uses quartzy (SiO
2) and be integrally formed as drum, interior pipe 13 uses quartzy (SiO
2) or carborundum (SiC) be integrally formed as drum.
Outer tube 12 forms that its internal diameter is bigger than the external diameter of interior pipe 13, upper end closed and the drum of lower ending opening, be cover circularly with one heart in pipe 13, the outside of pipe 13 in surrounding.
Interior pipe 13 forms the drum of both ends open up and down, and the tube hollow bulb of interior pipe 13 forms the process chamber 14 that the multi-disc wafer is admitted to, and this multi-disc wafer is retained the vertically state of arrangement by brilliant boat 22.The lower ending opening of interior pipe 13 is configured for sending into the fire door 15 of sending wafer.
Bottom between outer tube 12 and the interior pipe 13 is hermetic closed by the menifold 16 that forms toroidal, and for the replacing of pipe 13 and outer tube 12 in carrying out etc., menifold 16 is in dismounting is installed in freely respectively on pipe 13 and the outer tube 12.
Be supported on by menifold 16 on the heater pedestal 19 of CVD device, reaction tube 11 becomes the state of vertical assembling.
Top at the sidewall of menifold 16 is connecting blast pipe 17, and blast pipe 17 constitutes, and is connected with exhaust apparatus (not shown), process chamber 14 vacuum exhausts can be become the vacuum degree of regulation.Blast pipe 17 becomes the state that is communicated with the gap that is formed between outer tube 12 and the interior pipe 13, constitutes exhaust channel 18 by the gap of outer tube 12 and interior pipe 13.The shape of cross section of exhaust channel 18 becomes the toroidal of certain width.
Because blast pipe 17 is connected with menifold 16, so blast pipe 17 becomes the ducted body that forms drum, the state more bottom of the exhaust channel 18 of formation vertically also of being configured in.
On menifold 16, the seal cover 20 of inaccessible lower ending opening from vertical direction downside butt.Seal cover 20 forms the disc-shape that has with the external diameter diameter about equally of outer tube 12, can be by boat elevator 21 (only the illustrating a part) lifting in vertical direction that is arranged on reaction tube 11 outsides.
On the center line of seal cover 20, vertically erect and supporting the brilliant boat 22 that is used to keep as the wafer 1 of processed substrate.Brilliant boat 22 can make multi-disc wafer 1 arrange and maintenance with level and mutual Centered state.
Connecting gas introduction tube 23 on seal cover 20, this gas introduction tube 23 is communicated with the fire door 15 of interior pipe 13, is connecting unstrpped gas device and vector gas feedway (all not shown) on gas introduction tube 23.Be directed to the gas of fire door 15 from gas introduction tube 23, circulation in the process chamber 14 of interior pipe 13, by exhaust channel 18 backs from blast pipe 17 dischargings.
In the outside of outer tube 12, the heater of the inside of heating reaction tube 11 is a unit heater 30, surrounds being provided with of outer tube 12 on every side and with concentric circles.
Unit heater 30 possesses use stainless steel (SUS) and forms the housing 31 of the drum of the inaccessible lower ending opening in upper end, and the internal diameter of housing 31 and total length are set at bigger than the external diameter of outer tube 12 and total length.
Be provided with maintenance tectosome as the heater of an execution mode of the present utility model in the inside of housing 31.The maintenance tectosome of the heater that present embodiment relates to possesses heater and heat insulation wall body 33.
Heat insulation wall body 33 as an execution mode of the present utility model forms the drum bigger than the external diameter of outer tube 12, is configured to and 12 one-tenth concentric circles of outer tube.Gap 32 between the inner peripheral surface of heat insulation wall body 33 and housing 31 is to be used for the space of air cooling.
Heat insulation wall body 33 possesses: the top wall portion 34 of disc-shape has the external diameter littler than the internal diameter of housing 31; And the side wall portion 35 of drum, have than big internal diameter of the external diameter of outer tube 12 and the external diameter littler than the internal diameter of housing 31.
Top wall portion 34 covers the opening of side wall portions 35 upper ends and with its sealing, the upper surface of top wall portion 34 is configured to contact with the lower surface of the roof of housing 35.
In addition, also can constitute, the exhaust outlet of the roof that connects top wall portion 34 and housing 31 is set, make the environmental gas air blast cooling between heat insulation wall body 33 and the outer tube 12.
By setting the external diameter of side wall portion 35 littler, between side wall portion 35 and housing 31, form gap 32 as air-cooled space than the internal diameter of housing 31.
In addition, also can constitute, through hole is set at the side wall portion 35 of heat insulation wall body 33, so that the space between gap 32, heat insulation wall body 33 and the outer tube 12 connects, and, make the environmental gas air blast cooling between heat insulation wall body 33 and the outer tube 12.
And it is a cylindrical shell that the side wall portion 35 of heat insulation wall body 33 is constructed by stacked a plurality of heat insulation 36 in vertical direction.
As shown in Figures 1 and 2, heat insulation 36 possesses the main body 37 of the annular of short drum, and the heat-barrier material that main body 37 adopts fibrous or spherical aluminium oxide or silicon dioxide etc. also to have insulation material function is integrally formed by the vacuum forming method.
In addition, that heat insulation 36 and main body 37 also can be divided at the circumferencial direction along drum is a plurality of, for example with the angle of regulation drum is divided under a plurality of states and is shaped, and is assembled into drum then.
If like this, because in heat insulation 36, also form play (movability degree), so also be difficult to separately even applied stress to heat insulation 36.Preferably, cut apart if carry out four, then also better aspect size.
In the bottom of main body 37, the state that is cut into toroidal with the part with week in the main body 37 is formed with in conjunction with protuberance 38.In the upper end of main body 37, the state that is cut into toroidal with the part with main body 37 peripheries is formed with in conjunction with recess 39.
In addition, the interior all sides in main body 37 upper ends are formed with the outstanding protuberance 37a (with reference to Fig. 3 (c)) of direction to the inside.
Between the protuberance 37a of adjacent heat insulation 36 up and down, be formed with the mounting groove (recess) 40 that is used to install heater with certain degree of depth, certain height, so that it becomes the state that the inner peripheral surface of side wall portion 35 is cut into toroidal.Respectively be formed with a mounting groove 40 for each heat insulation 36, become the circle of a sealing.
At the inner peripheral surface of mounting groove 40, shown in Fig. 3 (b), the maintenance apparatus 41 of shape followed closely in the U word that the heater location keeps along a plurality of being used for circumferentially roughly equally spaced is installed.
Mounting groove 40 forms, and the width of its above-below direction is along with the external diameter direction (direction opposite with the center of cylinder) near the side wall portion 35 of drum is bottom land 40a and narrowing down gradually.That is, be formed with conical surface 40b, 40c on the pair of sidewalls up and down of mounting groove 40, the distance between two conical surface 40b, 40c is more little near bottom land 40c more.
In addition, change a kind of saying, the interval of the pair of sidewalls of the vertical direction of mounting groove 40 begins from the top (on the inner peripheral surface of protuberance 37a) of sidewall more just to become more little near the bottom (on the inner peripheral surface of bottom land 40a) of mounting groove 40.
In addition, shown in Fig. 3 (c), conical surface 40b is formed on the upside sidewall in the pair of sidewalls of vertical direction of mounting groove 40, be positioned at the vertical direction upside than the heater 42 that is accommodated in the mounting groove 40, big to the change of vertical direction upside gradually towards the drum radial direction central side of mounting groove 40.
In addition, conical surface 40c is formed on the downside sidewall in the pair of sidewalls of vertical direction of mounting groove 40, be positioned at the vertical direction downside than the heater 42 that is accommodated in the mounting groove 40, big to the change of vertical direction downside gradually towards the drum radial direction central side of mounting groove 40.
In heater 42, adopt Fe-Cr-Al alloy or MoSi
2And SiC constant resistance exothermic material.Heater 42 is corrugated writing board shape shown in Fig. 3 (a).In addition, last side wave 42a of portion and last side clearance 43a, and down the 42b of side wave portion and underside gap 43b alternately form respectively.They are integrally formed by punch process or Laser cutting etc.
In addition, the internal diameter of heater 42 formed toroidals is bigger slightly than the internal diameter of the protuberance 37a of heat insulation 36.
As mentioned above, formed the cylindrical portion 51 of the heater 42 that is toroidal.
As Fig. 1～shown in Figure 3, the cylindrical portion 51 of heater 42 is set in each mounting groove 40 of heat insulation 36.Hypomere is being provided with the cylindrical portion 51 of other adjacent heaters 42 isolator thereon.
Shown in Fig. 3 (a), Fig. 3 (b), a plurality of maintenance apparatus 41,41 are configured in respectively from the lower end of last side clearance 43a to the position of the upper end of underside gap 43b, and insert in the heat insulation 36.Like this, the state that leaves with the inner peripheral surface from mounting groove 40 keeps heater 42.
As shown in Figures 2 and 3, at the both ends 44,44 of the cylindrical portion 51 of heater 42, a pair of power supply 45,46 at right angles and to radial direction outside curve ground forms with the circumferencial direction of toroidal respectively.At the leading section of a pair of power supply 45,46, a pair of connecting portion 47,48 is at right angles crooked and form with power supply 45,46 respectively, and rightabout each other mutually.
For the reduction of the caloric value that suppresses a pair of power supply 45,46, the interval of a pair of power supply 45,46 is set lessly.
Preferably, with the crooked rectangular position of the difference in a pair of power supply 45,46 outside, be made as near the topmost of the last side wave 42a of portion of heater 42 or near the foot of time 42b of side wave portion from the circumferencial direction of toroidal towards radial direction.
By like this, can further heater be laid on a pair of power supply 45,46 very close to each otherly.
On the heat insulation 36 of the drum corresponding, be formed with a pair of slotting groove 49,50 respectively with the position of a pair of power supply 45,46.The radial direction of two slotting grooves 49,50 from mounting groove 40 sides along drum reaches the outer circumferential side of main body 37 and forms.Two power supplies 45,46 are inserted respectively and are led in two slotting grooves 49,50.
In addition, two slotting grooves 49,50 also can be, before inserting logical two power supplies 45,46, comprise between two slotting grooves 49,50 interior, two slotting grooves 49,50 form a slotting groove, after inserting logical two power supplies 45,46,, form heat insulation wall body 33 and insert groove 49,50 by bury the heat-barrier material that fibrous or spherical aluminium oxide or silicon dioxide etc. also have insulation material function underground 45,46 of two power supplies.
In two slotting groove 49,50 parts of the outer peripheral face of main body 37, be provided with insulator (below, be called outside insulator) 52.
Shown in Fig. 4 (a), outside insulator 52 is integrally formed as the square position shape with some curved surface R1, and is fixed on the outer peripheral face of main body 37 for roughly square, and this curved surface R1 is corresponding with the curved surface of the outer peripheral face of heat insulation 36.
In addition, preferably, if the hardness height of the hardness ratio heat insulation 36 of outside insulator 52 then can suppress the warpage of heater 42 effectively.
In addition, preferably, if the bending strength of outside insulator 52 and/or density than the bending strength and/or the density height of heat insulation 36, then can suppress the warpage of heater 42 effectively.
On the top of outside insulator 52, be formed with the slotting a pair of maintenance groove 53,54 that leads to portion of conduct that is used for inserting logical a pair of power supply respectively.Two positions that keep the position of groove 53,54 corresponding to two slotting grooves 49,50 are roughly same position.In two maintenance grooves 53,54, insert respectively and lead to and keeping slotting two power supplies 45,46 that lead in two slotting grooves 49,50.
Preferably, shown in Fig. 4 (a), maintenance groove 53,54 can be incised to the topmost of outside insulator 52 and form.This is because after being provided with a pair of power supply, can install, change outside insulator 52.But, keep groove 53,54 also can not be incised to the topmost of outside insulator 52, but form poroid.
By two power supplies 45,46 that keep groove 53,54 to keep heater 42 of outside insulator 52, can suppress the warpage of heater 42.Two intervals that keep the interval of groove 53,54 corresponding to two slotting grooves 49,50 of main body 37 are identical distance.
Here, the warpage of so-called heater 42 is meant by 42 power supplies make heater 42 that thermal expansion take place or by stopping power supply thermal contraction take place to heater, from the offset of original configuration or the phenomenon that moves or reverse and move.
At the position corresponding to two slotting grooves 49,50 of the inner peripheral surface of mounting groove 40, butt is fixed with insulator (below, be called inboard insulator) 55.
Shown in Fig. 4 (b), inboard insulator 55 is integrally formed as the square position shape with some curved surface R2, and is fixed on the outer peripheral face of main body 37 for roughly square, and this curved surface R2 is corresponding with the curved surface of the inner peripheral surface of heat insulation 36.
In addition, preferably,, then can suppress the warpage of heater 42 effectively if make the hardness height of the hardness ratio heat insulation 36 of inboard insulator 55.
In addition, preferably,, then can suppress the warpage of heater 42 effectively if make the bending strength of inboard insulator 55 and/or density bending strength and/or density height than heat insulation 36.
On the top of inboard insulator 55, be formed with the slotting a pair of maintenance groove 56,57 that leads to portion of conduct that is used for inserting logical a pair of power supply respectively.Two positions that keep the position of groove 56,57 corresponding to two slotting grooves 49,50 are roughly same position.In two maintenance grooves 56,57, insert respectively and lead to and keeping slotting two power supplies 45,46 that lead in two slotting grooves 49,50.
Preferably, shown in Fig. 4 (b), maintenance groove 56,57 can be incised to the topmost of inboard insulator 55 and form.This is because after being provided with a pair of power supply, can install, change inboard insulator 55.But, keep groove 56,57 also can not be incised to the topmost of inboard insulator 55, but form poroid.
By two power supplies 45,46 that keep groove 56,57 to keep heater 42 of inboard insulator 55, can suppress the warpage of heater 42.The interval of two slotting grooves 49,50 of the corresponding main body 37 in interval of two maintenance grooves 56,57 is identical distance.
On the inner side end of inboard insulator 55 (with the end face of the opposition side of heat insulation 36, be the end face of cylindrical portion 51 sides of heater 42), keep between the groove 56,57 at two, be provided with a pair of power supply 45,46 that separates heater 42 and the wall part 58 of cylindrical portion 51.The thickness of wall part 58 (t) is, when it is connected on the inner peripheral surface of mounting groove 40 fixedly, makes the position on the inner peripheral surface of its cylindrical portion 51 that can be set to heater 42 at least.
Preferably, as shown in Figure 2, the thickness of wall part 58 (t) can be, when it is connected on the inner peripheral surface of mounting groove 40 fixedly, should crosses on the inner peripheral surface of cylindrical portion 51 of heater 42 and is set to the inboard of cylindrical portion 51.By like this, can separate a pair of power supply 45,46 and the cylindrical portion 51 of heater 42 effectively.
In addition, the height of wall part 58 (h) is following size (h), promptly when it is connected on the inner peripheral surface of mounting groove 40 fixedly, at least with the equal above value of the plate width of heater 42.In addition, wall part 58 is set at and two positions that keep groove 56,57 equal heights, so that it can be arranged on the position of equal height with a pair of power supply 45,46, thereby separates a pair of power supply 45,46 of heater 42.
Preferably, the height of wall part 58 (h) is shown in Fig. 3 (a), can be made as when on the inner peripheral surface that is connected to mounting groove 40, being provided with fixedly, bigger than the value (h1) between the height of the foot of the height of the topmost of the last side wave 42a of portion of the cylindrical portion 51 of heater 42 and the following side wave 42b of portion.By like this, can separate a pair of power supply 45,46 and cylindrical portion 51 effectively.
In addition, bend R3 not only can make curve form, also can make the taper that is made of tabular surface.
As shown in Figures 2 and 3, on a connecting portion of the heater 42 of epimere side (below be called positive side connecting portion) 47, weld power supply terminal 61, on another connecting portion (below be called the minus side connecting portion) 48, welding the upper end that overlaps line 62.The bottom of overlap joint line 62 is connected with the positive side connecting portion 47 of the heater 42 of hypomere side.
Thereby, the positive side connecting portion 47 of the heater 42 of hypomere side be positioned at the epimere side heater 42 minus side connecting portion 48 under near, the both ends 44,44 of cylindrical portion 51 of heater 42 that become the hypomere side are than both ends 44,44 states to this part distance of circumferential offset of the cylindrical portion 51 of the heater 42 of epimere side.
Overlap joint line 62 will be in order to suppress from the heat radiation on overlap joint line 62 surfaces to adopt Fe-Cr-Al alloy or MoSi for less
2And SiC constant resistance exothermic material, section forms circular pole shape.But according to the situation of the current capacity that overlaps line, overlap joint line 62 also can form section tetragonal angle rod shape.
As Fig. 2 and shown in Figure 5, on the outer peripheral face of the housing 31 of unit heater 30 with power supply terminal 51 corresponding position, place is set, be covered with the terminal shell 63 that coats two connecting portions 47,48 and overlap joint line 62, be filled with heat-barrier materials 64 such as glass fibre in the inside of terminal shell 63.In terminal shell 63, be inserted with a plurality of power supply terminals 61 via insulator 65.
Then, explanation utilizes the CVD device of relevant said structure to make the film formation process of the manufacture method of semiconductor devices such as IC simply.
As shown in Figure 1, if multi-disc thin slice 1 is seated in (wafer charging) on the brilliant boat 22, the brilliant boat 22 that has then kept multi-disc wafer 1 is mentioned by boat elevator 21 and is sent to (brilliant boat loading) in the process chamber 11.
Under this state, seal cover 20 becomes the state with the lower ending opening sealing of menifold 16.
The inside of reaction tube 11 by vacuum exhaust, becomes the pressure (vacuum degree) of regulation by blast pipe 17.
In addition, the inside of reaction tube 11 is become the temperature of regulation by 30 heating of heater unit.At this moment, according to temperature sensor 24 detected temperature informations, FEEDBACK CONTROL is to the energising situation of the heater 42 of unit heater 30, so that become the Temperature Distribution of regulation in the process chamber 14.
Then, brilliant boat 22 is rotated by rotating mechanism 25, wafer 1 rotation thus.
Then, the unstrpped gas that will be controlled to be the regulation flow by gas introduction tube 23 imports in process chamber 14.
The unstrpped gas that is imported into rises in process chamber 14, flows out to exhaust channel 18 from the upper end open of interior pipe 13, is discharged from blast pipe 17 then.
Unstrpped gas is contacting with the surface of wafer 1 by in the process chamber 14 time, at this moment, by thermal cvd reactor with thin film deposition on the surface of wafer 1.
If passed through the predefined processing time, then supply with inert gas from inert gas supply source (not shown), be replaced into inert gas in the process chamber 14, and make the pressure in the process chamber 14 return to normal pressure.
Then, by boat elevator 21 seal cover 20 is descended, with the lower ending opening of menifold 16, and the wafer after will handling 1 remains under the state on the brilliant boat 22, passes out to the outside (brilliant boat unloading) of reaction tube 11 from the lower end of menifold 16.
Then, the wafer 1 after handling is taken out (wafer discharging) from brilliant boat 22.
But, if heater 42 temperature of unit heater 30 rise, then extend, so the diameter of the cylindrical portion 51 of the heater 42 of toroidal becomes big on the whole because of thermal expansion.If it is big that the diameter of heater 42 becomes, then heater 42 is held apparatus 41 and has only limited to the moving of the center position of heat insulation wall body 33, so heater 42 becomes the state of side shifting outside radial direction in mounting groove 40.
For example, shown in Fig. 6 (a), the mounting groove 40 that forms in parallel to each other at up and down sidewall, situation under, in mounting groove 40 ' outside radial direction during side shifting, might be stuck on the side wall surface of mounting groove 40 ' by heater 42, jammed position becomes stiff end, can be out of shape by such effect heater.
In addition, similarly, if heater is stuck in when thermal expansion on the side wall surface of mounting groove 40 ', heater 42 is lowered the temperature and is shunk under this state that blocks, and the part of then blocking becomes stiff end, can be out of shape by such effect heater.Under the situation of this distortion accumulation or be out of shape under the big situation, might cause heater 42 fractures.In addition, because of thermal expansion makes the 42a of side wave portion to upside, down the 42b of side wave portion extends respectively to downside, so the distance of the two side of mounting groove 40 and heater 42 narrow down, so above-mentioned problem is more remarkable.But, in the present embodiment, owing on the two side of mounting groove 40, be formed with conical surface 40b, 40c, so shown in Fig. 6 (b), when in mounting groove 40, outside radial direction, during side shifting, preventing that heater 42 is stuck on the side wall surface of mounting groove 40.In addition, even heater 42 is offset to a side wall side when thermal expansion, heater 42 also can slide on the conical surface, can be housed on the upper-lower position of regulation.
Therefore, even heater 42 is lowered the temperature and shunk, heater 42 also can turn back to original position to the radial direction medial movement in mounting groove 40.That is, can the anti-possible trouble that terminates in of distortion, deterioration, fracture of the thermal expansion and the thermal contraction of heater 42 will be accompanied by.
In addition, preferably, the width of the vertical direction (above-below direction) of the bottom land 40a of mounting groove 40 can be made as at least than the big width of value (h1) between the height of the foot of the height of the topmost of the last side wave 42a of portion of the cylindrical portion 51 of heater 42 and the following side wave 42b of portion.By like this, can be up to the bottom land 40a of mounting groove 40, heater 42 is stuck on the side wall surface, and can thermal expansion.
According to above-mentioned execution mode, can access following effect.
(1) by making the sidewall slope of the mounting groove that heater has been installed, so that the distance between sidewall is more little near bottom land more, in that heater during side shifting, can prevent that heater is stuck on the side wall surface of mounting groove outside radial direction in mounting groove along with thermal expansion.Its result, even heater is lowered the temperature and shunk, heater also can turn back to original position towards the radial direction medial movement in mounting groove.
(2) distortion and the mechanical load of the heater of thermal expansion by preventing to follow heater and thermal contraction can with the deterioration of the heater that takes place along with the thermal expansion of heater and thermal contraction and fracture is anti-terminate in possible trouble, so can prolong the life-span of heater.
(3) above-below direction (vertical direction) of the heater by making the thermal expansion of following heater and thermal contraction moves in the scope of expectation, with on the brilliant boat in the reaction tube along the vertical direction (vertical direction) lay the wafer heating time the wafer of above-below direction between temperature moving to the above-below direction of heater, can prevent the Temperature Distribution deterioration of wafer or produced the needs that are adjusted into suitable Temperature Distribution again, so can improve the performance of unit heater and CVD device.
In addition, the utility model is not limited to above-mentioned execution mode, certainly carries out various changes in the scope that does not break away from its purport.
For example, heat insulation wall body is not limited to a plurality of heat insulations stacked in vertical direction and be built into the structure of a cylindrical shell, also can form.
Outside insulator and inboard insulator are not limited to use the parts of above-mentioned execution mode, also can omit.
The heat insulation wall body that the utility model relates to is not limited to be applicable to the maintenance tectosome of the heater in the unit heater of CVD device, also can generally be applicable to all heat insulation wall bodies of heater of the unit heater etc. of oxidation membrane formation device, disperser and annealing device.
Moreover the substrate board treatment that the utility model relates to is not limited to be applicable to the CVD device, also can generally be applicable to all substrate board treatments such as oxidation membrane formation device, disperser and annealing device.
Claims (23)
1, a kind of heat insulation wall body is the heat insulation wall body of drum that is used for the heater of substrate board treatment, it is characterized in that it forms following structure:
Have and be used for heater is accommodated in mounting groove on the inner peripheral surface of this drum;
Form the interval of the pair of sidewalls of above-mentioned mounting groove, along with diminishing near bottom land.
2, a kind of heat insulation wall body is the heat insulation wall body of drum that is used for the heater of substrate board treatment, it is characterized in that it forms following structure:
Have and be used for heater is accommodated in mounting groove on the inner peripheral surface of this drum;
Form the interval of the pair of sidewalls of above-mentioned mounting groove, the top from the bottom of above-mentioned mounting groove towards this sidewall becomes big gradually.
3, a kind of heat insulation wall body is the heat insulation wall body of drum that is used for the heater of substrate board treatment, it is characterized in that it forms following structure:
Have and be used for heater is accommodated in mounting groove on the inner peripheral surface of this drum:
Form the interval of the pair of sidewalls of above-mentioned mounting groove, the radial direction central side from the bottom of above-mentioned mounting groove towards above-mentioned drum becomes big gradually.
4, a kind of heat insulation wall body is the heat insulation wall body of drum that is used for the heater of substrate board treatment, it is characterized in that it forms following structure:
Have and be used for heater is accommodated in mounting groove on the inner peripheral surface of this drum:
Form in the pair of sidewalls of above-mentioned mounting groove, be positioned at the sidewall of vertical direction upside than above-mentioned heater, become big to the vertical direction upside gradually towards the radial direction central side of above-mentioned drum;
Form in the pair of sidewalls of above-mentioned mounting groove, be positioned at the sidewall of vertical direction downside than above-mentioned heater, become big to the vertical direction downside gradually towards the radial direction central side of above-mentioned drum.
5, a kind of heat insulation wall body is the heat insulation wall body of drum that is used for the heater of substrate board treatment, it is characterized in that it forms following structure:
Have and be used for heater is accommodated in mounting groove on the inner peripheral surface of this drum:
The width of the vertical direction of above-mentioned mounting groove forms at least bigger than the upper and lower side of the vertical direction of above-mentioned heater, and this width becomes big gradually towards the radial direction central side of above-mentioned drum.
6, a kind of heat insulation wall body is the heat insulation wall body of drum that is used for the heater of substrate board treatment, it is characterized in that it forms following structure:
Be laminated with the heat insulation of a plurality of drums, this heat insulation has and is used for heater is accommodated in mounting groove on the inner peripheral surface;
Be formed with the first side wall on one in above-mentioned heat insulation, this first side wall becomes in the pair of sidewalls that forms above-mentioned mounting groove;
Be adjacent on the stacked heat insulation with the heat insulation that is formed with above-mentioned the first side wall, be formed with opposed and become another second sidewall in the pair of sidewalls that forms above-mentioned mounting groove with above-mentioned the first side wall;
The interval of above-mentioned the first side wall and above-mentioned second sidewall, the top from the bottom of above-mentioned mounting groove towards this mounting groove becomes big gradually.
7, a kind of heat insulation wall body is the heat insulation wall body of drum that is used for the heater of substrate board treatment, it is characterized in that it forms following structure:
Be laminated with the heat insulation of a plurality of drums, this heat insulation has and is used for heater is accommodated in mounting groove on the inner peripheral surface;
In the bottom of above-mentioned heat insulation, the state that is cut into toroidal with the part with interior week of above-mentioned heat insulation is formed with in conjunction with protuberance;
In the upper end of above-mentioned heat insulation, the state that is cut into toroidal with the part with the periphery of above-mentioned heat insulation is formed with in conjunction with recess;
The upper end of the inner peripheral surface of above-mentioned heat insulation and and the upper end of the inner peripheral surface of the heat insulation of this heat insulation adjacency between, be formed with above-mentioned mounting groove;
Form the interval of the pair of sidewalls of above-mentioned mounting groove, the top from the bottom of above-mentioned mounting groove towards this sidewall becomes big gradually.
8, heat insulation wall body as claimed in claim 1 is characterized in that, above-mentioned mounting groove is formed with a plurality of in vertical direction.
9, heat insulation wall body as claimed in claim 1 is characterized in that, is formed by insulating material.
10, heat insulation wall body as claimed in claim 1 is characterized in that,
Above-mentioned heater has the writing board shape of waveform,
Comprise along the inner peripheral surface of above-mentioned mounting groove and be arranged to cylindrical portion cylindraceous and be arranged at a pair of power supply at the both ends of this cylindrical portion;
Above-mentioned mounting groove with the above-mentioned cylindrical portion of taking in above-mentioned heater at least.
11, heat insulation wall body as claimed in claim 10 is characterized in that, has slotting groove, and the radial direction of this slotting groove from the above-mentioned mounting groove side that is used for inserting logical above-mentioned a pair of power supply towards drum arrives the outer circumferential side of above-mentioned heat insulation wall body and form.
12, heat insulation wall body as claimed in claim 1 is characterized in that,
Above-mentioned heater has the writing board shape of waveform,
Last side wave portion and upside clearance portion and following side wave portion and underside gap are alternately forming respectively,
Above-mentioned mounting groove with the cylindrical portion of taking in above-mentioned heater at least.
13, heat insulation wall body as claimed in claim 1 is characterized in that,
Above-mentioned heater has the writing board shape of waveform,
Last side wave portion and upside clearance portion and following side wave portion and underside gap are alternately forming respectively;
Above-mentioned mounting groove with the cylindrical portion of taking in above-mentioned heater, above-mentioned mounting groove is by becoming in the above-mentioned pair of sidewalls that forms this mounting groove one and go up another and the sidewall that is positioned at the vertical direction downside than above-mentioned side wave portion down that side wave portion is arranged in the sidewall of vertical direction upside and becomes above-mentioned pair of sidewalls and form than above-mentioned.
14, heat insulation wall body as claimed in claim 6 is characterized in that,
Above-mentioned heater has the writing board shape of waveform,
Last side wave portion and upside clearance portion and following side wave portion and underside gap are alternately forming respectively;
Above-mentioned mounting groove with the cylindrical portion of taking in above-mentioned heater, above-mentioned mounting groove is by becoming in the above-mentioned pair of sidewalls that forms this mounting groove one and go up another and above-mentioned second sidewall that is positioned at the vertical direction downside than above-mentioned side wave portion down that side wave portion is arranged in the above-mentioned the first side wall of vertical direction upside and becomes above-mentioned pair of sidewalls and form than above-mentioned.
15, heat insulation wall body as claimed in claim 1 is characterized in that, has the above-mentioned mounting groove with the circle formation of a sealing.
16, heat insulation wall body as claimed in claim 1 is characterized in that, is divided into a plurality of on the circumferencial direction of above-mentioned drum.
17, heat insulation wall body as claimed in claim 1 is characterized in that, the width of above-mentioned bottom land is set to and the equal above value of the plate width of above-mentioned heater.
18, heat insulation wall body as claimed in claim 1 is characterized in that,
For the writing board shape that will have waveform and have last side wave portion and upside clearance portion and the above-mentioned heater isolation of the above-mentioned cylindrical portion that alternately forming respectively of side wave portion and underside gap down, the height of above-mentioned bottom land is arranged to bigger than the value h1 between the height of the foot of the height of the topmost of the last side wave portion of above-mentioned heater and following side wave portion.
19, a kind of heater is characterized in that, has each described heat insulation wall body in the aforesaid right requirement 1,8～18.
20, a kind of heater is characterized in that, has aforesaid right requirement 14 described heat insulation wall bodies.
21, a kind of substrate board treatment is characterized in that,
Have aforesaid right requirement 19 described heaters;
And possess:
Process chamber is heated by this heater, handles processed substrate;
Gas introduction tube imports to above-mentioned process chamber with gas; And
Blast pipe is with above-mentioned process chamber exhaust.
22, a kind of substrate board treatment is characterized in that,
Have aforesaid right requirement 20 described heaters;
And possess:
Process chamber is heated by this heater, handles processed substrate;
Gas introduction tube imports to above-mentioned process chamber with gas; And
Blast pipe is with above-mentioned process chamber exhaust.
23, a kind of maintenance tectosome of heater is used for substrate board treatment, it is characterized in that, it forms following structure:
Be formed with mounting groove on the inner peripheral surface of the heat insulation wall body that forms drum, above-mentioned heater is being set in this mounting groove, the interval of pair of sidewalls that forms above-mentioned mounting groove is along with diminishing near bottom land.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005277210A JP4907937B2 (en) | 2005-09-26 | 2005-09-26 | Thermal insulation wall, heating element holding structure, heating device and substrate processing apparatus |
| JP277210/2005 | 2005-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2914322Y true CN2914322Y (en) | 2007-06-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2006200066809U Expired - Lifetime CN2914322Y (en) | 2005-09-26 | 2006-03-31 | Heat insulation wall, heating element structure holding body, heating device and substrate board processing device |
| CNB2006100710792A Active CN100511589C (en) | 2005-09-26 | 2006-03-31 | Heat-proof wall, heater keeper tectosome, heating arrangement and substrate processing unit |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
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| CNB2006100710792A Active CN100511589C (en) | 2005-09-26 | 2006-03-31 | Heat-proof wall, heater keeper tectosome, heating arrangement and substrate processing unit |
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| Country | Link |
|---|---|
| JP (1) | JP4907937B2 (en) |
| KR (2) | KR100727014B1 (en) |
| CN (2) | CN2914322Y (en) |
| TW (1) | TWI310215B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102709213A (en) * | 2009-07-21 | 2012-10-03 | 株式会社日立国际电气 | Heating device, substrate processing apparatus, and method of manufacturing semiconductor device |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4331768B2 (en) * | 2007-02-28 | 2009-09-16 | 東京エレクトロン株式会社 | Heat treatment furnace and vertical heat treatment equipment |
| JP4445519B2 (en) * | 2007-06-01 | 2010-04-07 | 東京エレクトロン株式会社 | Heat treatment furnace and manufacturing method thereof |
| JP5006122B2 (en) | 2007-06-29 | 2012-08-22 | 株式会社Ｓｏｋｕｄｏ | Substrate processing equipment |
| JP5128918B2 (en) | 2007-11-30 | 2013-01-23 | 株式会社Ｓｏｋｕｄｏ | Substrate processing equipment |
| JP5031611B2 (en) | 2008-02-18 | 2012-09-19 | 株式会社日立国際電気 | Substrate processing apparatus, semiconductor device manufacturing method, and ceiling insulator |
| JP5347319B2 (en) * | 2008-04-30 | 2013-11-20 | 信越半導体株式会社 | Vertical heat treatment equipment |
| US9064912B2 (en) | 2009-07-21 | 2015-06-23 | Hitachi Kokusai Electric, Inc. | Heating device, substrate processing apparatus, and method of manufacturing semiconductor device |
| JP5544121B2 (en) | 2009-07-21 | 2014-07-09 | 株式会社日立国際電気 | Heating apparatus, substrate processing apparatus, and semiconductor device manufacturing method |
| JP5645718B2 (en) * | 2011-03-07 | 2014-12-24 | 東京エレクトロン株式会社 | Heat treatment equipment |
| KR101394325B1 (en) * | 2012-08-07 | 2014-05-13 | 주식회사 테라세미콘 | Heater and method for manufacturing the same |
| JP5993272B2 (en) | 2012-10-18 | 2016-09-14 | 東京エレクトロン株式会社 | Manufacturing method of heat insulation wall |
| JP5824082B2 (en) * | 2014-02-05 | 2015-11-25 | 株式会社日立国際電気 | Heating apparatus, substrate processing apparatus, and semiconductor device manufacturing method |
| CN103928373B (en) * | 2014-04-28 | 2016-10-12 | 北京七星华创电子股份有限公司 | A kind of semiconductor heat treatment equipment |
| TWI611043B (en) * | 2015-08-04 | 2018-01-11 | Hitachi Int Electric Inc | Substrate processing apparatus, manufacturing method of semiconductor device, and recording medium |
| JP7023147B2 (en) * | 2018-03-13 | 2022-02-21 | 東京エレクトロン株式会社 | Insulation structure and vertical heat treatment equipment |
| JP7122856B2 (en) * | 2018-05-02 | 2022-08-22 | 東京エレクトロン株式会社 | Heat treatment equipment |
| CN115938995B (en) * | 2023-02-24 | 2023-05-30 | 深圳市新凯来技术有限公司 | Wafer heating device and semiconductor processing equipment |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2759673B2 (en) * | 1989-03-15 | 1998-05-28 | 科学技術庁無機材質研究所長 | Multi-stage reflective electric furnace |
| JP3241887B2 (en) * | 1993-08-11 | 2001-12-25 | 東京エレクトロン株式会社 | Heat treatment equipment |
| US5506389A (en) | 1993-11-10 | 1996-04-09 | Tokyo Electron Kabushiki Kaisha | Thermal processing furnace and fabrication method thereof |
| JP3471100B2 (en) | 1994-11-07 | 2003-11-25 | 東京エレクトロン株式会社 | Vertical heat treatment equipment |
| JP3881937B2 (en) * | 2002-07-05 | 2007-02-14 | 株式会社日立国際電気 | Semiconductor manufacturing equipment or heating equipment |
| JP2004119800A (en) * | 2002-09-27 | 2004-04-15 | Hitachi Kokusai Electric Inc | Substrate processing device and method for manufacturing semiconductor device |
-
2005
- 2005-09-26 JP JP2005277210A patent/JP4907937B2/en active Active
- 2005-09-30 KR KR1020050091963A patent/KR100727014B1/en active IP Right Grant
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- 2006-03-30 TW TW095111184A patent/TWI310215B/en active
- 2006-03-31 CN CNU2006200066809U patent/CN2914322Y/en not_active Expired - Lifetime
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102709213A (en) * | 2009-07-21 | 2012-10-03 | 株式会社日立国际电气 | Heating device, substrate processing apparatus, and method of manufacturing semiconductor device |
| CN102709213B (en) * | 2009-07-21 | 2016-02-24 | 株式会社日立国际电气 | The manufacture method of heater, lining processor and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20070034912A (en) | 2007-03-29 |
| JP4907937B2 (en) | 2012-04-04 |
| CN100511589C (en) | 2009-07-08 |
| CN1941287A (en) | 2007-04-04 |
| TW200717612A (en) | 2007-05-01 |
| KR100727014B1 (en) | 2007-06-13 |
| JP2007088325A (en) | 2007-04-05 |
| TWI310215B (en) | 2009-05-21 |
| KR100762059B1 (en) | 2007-10-01 |
| KR20070034979A (en) | 2007-03-29 |
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