CN2912885Y - Hot-press apparatus - Google Patents
Hot-press apparatus Download PDFInfo
- Publication number
- CN2912885Y CN2912885Y CN 200520066551 CN200520066551U CN2912885Y CN 2912885 Y CN2912885 Y CN 2912885Y CN 200520066551 CN200520066551 CN 200520066551 CN 200520066551 U CN200520066551 U CN 200520066551U CN 2912885 Y CN2912885 Y CN 2912885Y
- Authority
- CN
- China
- Prior art keywords
- hot
- thermal head
- press arrangement
- arrangement according
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Electronic Switches (AREA)
Abstract
The utility model discloses a hot pressing device which includes a hot pressing head and a supporting part arranged at the lower end of the hot pressing head. The utility model controls the displacement quantity of the hot pressing head by the assembly of the supporting part and a welding disc thus to control the thickness of the welding seam; the strength and the reliability of the high hot pressing welding spot can be obviously improved. The manner of the utility model controlling the thickness of the welding seam is simple, the precision and the multiplicity are high and the quality of the welding spot is stable.
Description
Technical field
The utility model relates to the solder technology of the electronics or the communications field, relates in particular to a kind of hot-press arrangement.
Background technology
Hot pressing welding has local heat, the advantage that is not subjected to that pin coplanarity influences etc.Flexible PCB), HSC (heat seal connector: conductive paper, zebra paper) and LCD (Liquid Crystal Display: LCDs) and in the welding of some particular device be widely used in FPC (flexible printed circuit: at present.And the hot pressing welding equipment realizes that the critical piece of welding is a thermal head of being made by metal or pottery.In welding process, thermal head plays a part very crucial, so the design of thermal head affects the intensity and the quality of solder joint to a great extent.As shown in Figure 1, in welding process, (printed circuit board: printed circuit board) pad 400 threes compress thermal head 100 with device pin 200, scolder 30 and PCB with a pressure of setting; Simultaneously by in 100 of thermal heads by big electric current or alternate manner, thermal head is heated to uniform temperature (200～400 ℃).The thermal head 100 of high temperature can heat device pin 200, scolder 300 and PCB pad 400, makes scolder 300 wetting device pin 200 of fusing and PCB pads 400, and finishes welding.Yet, the pressure of traditional thermal head 100 only is applied on the device pin 200, the scolder that can cause fusing during welding constantly bear the pressure effect and to around sprawl, thereby cause the amount of solder between welding back device pin 200 and PCB pad considerably less, throat depth is very thin, thereby make that the intensity of solder joint and reliability are all lower, and then influence the quality of product.
The utility model content
Technical problem to be solved in the utility model is, a kind of hot-press arrangement is provided, to reach the purpose that can control throat depth.
For achieving the above object, the utility model has adopted following technical scheme:
A kind of hot-press arrangement is provided, comprises thermal head, the lower end of described thermal head is provided with support member.
Preferably, described support member is a positioning step.
Preferably, described positioning step is fixedly installed on the lower surface of described thermal head.
Preferably, described positioning step is height-adjustable locating piece.
Preferably, described locating piece is provided with the height display unit.
Preferably, described height display unit is a rule.
Preferably, described rule matches with the end face of described thermal head.
Preferably, described locating piece comprises: but regulating shaft is to the slide block and the slide block lock solid structure of displacement.
Preferably, described slide block is arranged at the sidepiece of described thermal head.
Owing to adopted technique scheme, the utility model compared with prior art possesses following advantage:
A, the displacement by support member control thermal head, thus the thickness of weld seam can be controlled;
B, the utility model can significantly improve the intensity and the reliability of hot pressing solder joint;
The mode of c, control throat depth of the present utility model is simple, and precision and multiplicity height, and the gained quality of welding spot is stable.
Description of drawings
Fig. 1 is the structural representation of existing hot-press arrangement;
Fig. 2 is the structural representation of the utility model hot-press arrangement;
Fig. 3 is the structural representation of thermal head in the utility model;
Fig. 4 is the structural representation of the thermal head among another embodiment of the utility model;
Fig. 5 is the decomposing schematic representation of thermal head among Fig. 4.
The specific embodiment
Below in conjunction with drawings and the specific embodiments the utility model is described in further detail:
Shown in Fig. 2 and 3, be provided with a positioning step 11 on the hot pressing end face of the thermal head 10 in the utility model, this positioning step 11 can be made throat depth that the height h of positioning step 11 equals to expect and device pin thickness sum by modes such as machining or line cuttings.The utility model since in the end face arranged outside positioning step 11, when thermal head 10 pressed down, positioning step 11 was not pressed on the device pin 20, and directly is pressed on the pad 30 of PCB 40.This moment, thermal head 10 and the contact-making surface of device pin 20 and the height that the distance between the PCB pad 30 just in time equals positioning step 11 promptly equaled throat depth and the device pin 20 thickness sums expected.Therefore by different step 11 height of design, can obtain different throat depths, thereby realize the function of control throat depth.
Fig. 4 and Fig. 5 show the thermal head 50 among another embodiment of the utility model, also are provided with positioning step on the end face of thermal head 50, and this positioning step is by being arranged on can constituting by axially movable slide block 52 of thermal head 50 outsides.Slide block 52 inboards are provided with joint portion 521, and the side of thermal head 50 is provided with the engagement groove 501 corresponding with joint portion 521; Joint portion 521 can be the dovetail structure, and correspondingly, engagement groove 501 can be dovetail groove.Slide block 52 is provided with but is not limited to bolt 54, and slide block 52 is used to lock.Also be provided with on the slide block 52 but be not limited to graduation mark 56, be used for cooperating to determine the height of positioning step with the end face of thermal head 50; Certainly, also can adopt digital demonstration to wait alternate manner to realize as required.
In thermal head 50 uses, only need first loose bolts 54, slide block 52 can be moved axially, after positioning step is adjusted to suitable height, by bolt 54 slide block 52 is fastened on the thermal head again, can set the positioning step of differing heights as required, to realize the demand of different throat depths.And need not product to each different throat depth, and all to design different thermal heads to cooperate with it, thereby can increase the scope of application of thermal head 50, reduced the cost in the welding process.
Claims (9)
1. a hot-press arrangement comprises thermal head, it is characterized in that, the lower end of described thermal head is provided with support member.
2. hot-press arrangement according to claim 1 is characterized in that described support member is a positioning step.
3. hot-press arrangement according to claim 2 is characterized in that described positioning step is fixedly installed on the lower surface of described thermal head.
4. hot-press arrangement according to claim 2 is characterized in that, described positioning step is height-adjustable locating piece.
5. hot-press arrangement according to claim 4 is characterized in that, described locating piece is provided with the height display unit.
6. hot-press arrangement according to claim 5 is characterized in that, described height display unit is a rule.
7. hot-press arrangement according to claim 6 is characterized in that, described rule matches with the end face of described thermal head.
8. according to claim 4 or 5 or 6 described hot-press arrangements, it is characterized in that described locating piece comprises: but regulating shaft is to the slide block and the slide block lock solid structure of displacement.
9. hot-press arrangement according to claim 8 is characterized in that described slide block is arranged at the sidepiece of described thermal head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520066551 CN2912885Y (en) | 2005-10-26 | 2005-10-26 | Hot-press apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520066551 CN2912885Y (en) | 2005-10-26 | 2005-10-26 | Hot-press apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2912885Y true CN2912885Y (en) | 2007-06-20 |
Family
ID=38167486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520066551 Expired - Fee Related CN2912885Y (en) | 2005-10-26 | 2005-10-26 | Hot-press apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2912885Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112743184A (en) * | 2019-10-30 | 2021-05-04 | 昆山锡典机械设备科技有限公司 | Novel soldering head structure |
-
2005
- 2005-10-26 CN CN 200520066551 patent/CN2912885Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112743184A (en) * | 2019-10-30 | 2021-05-04 | 昆山锡典机械设备科技有限公司 | Novel soldering head structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201283377Y (en) | Mold for punching warpage of aluminum substrate | |
| KR101976103B1 (en) | Thermocompression bonding apparatus | |
| CN2912885Y (en) | Hot-press apparatus | |
| CN101125386A (en) | Hot press device and hot press method using the same | |
| CN102665374B (en) | Method for assembling printed circuit board | |
| CN206074947U (en) | This press and FOG Full-automatic combination equipment | |
| KR101139252B1 (en) | A bonding appartus | |
| CN203496312U (en) | Novel sealing hot pressure head device | |
| WO2018218624A1 (en) | Method for pressing flexible panel and flexible circuit board and pressing equipment | |
| CN107396551A (en) | Equipment for controlling slab to process | |
| CN103434180A (en) | Novel packaging hot-pressing head device | |
| CN115942645A (en) | Movable large-size PCB pressing table mechanism | |
| CN203426558U (en) | High-precision pulse heating reflow soldering equipment | |
| CN101862896A (en) | Impulse heat-pressing head | |
| CN109429438B (en) | Method and device for laminating thin film display and flexible circuit board | |
| CN110267433A (en) | A kind of circuit board reinforcement process and circuit board | |
| CN113523535B (en) | Friction stir welding T-shaped joint clamp with auxiliary heat | |
| CN210666246U (en) | Water-cooling pressure head on mobile phone display screen bonding equipment | |
| JP4323419B2 (en) | Thermocompression bonding tool and thermocompression bonding apparatus | |
| CN207858002U (en) | A kind of welding head of pulse thermocompression bonder | |
| KR200363179Y1 (en) | The heat pressure apparatus with multi axes and detail load control | |
| CN2727778Y (en) | Thermostatic hot crimping device | |
| CN211425157U (en) | Heat exchanger assembly for water treatment system | |
| CN100512568C (en) | Welding method of charge coupling element and clamping apparatus thereof | |
| CN218388158U (en) | SMT printed circuit board paster tray |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070620 Termination date: 20101026 |