CN2857088Y - Radiator - Google Patents
Radiator Download PDFInfo
- Publication number
- CN2857088Y CN2857088Y CN 200520146665 CN200520146665U CN2857088Y CN 2857088 Y CN2857088 Y CN 2857088Y CN 200520146665 CN200520146665 CN 200520146665 CN 200520146665 U CN200520146665 U CN 200520146665U CN 2857088 Y CN2857088 Y CN 2857088Y
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- Prior art keywords
- heat
- radiator
- circuit board
- model
- abstractor
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Abstract
The utility model discloses a heat sink used in the computer system, including a decalescence module contacting with a heating module on the circuit board; a first heat conducting pipe having a first end and a second end, wherein the first end is connected with the second end; a first radiator, connecting with the second end of the first heat conducting pipe, wherein the first radiator also includes a plurality of radiating fins and a locative structure, wherein the radiator is fixed in the computer system by means of the locative structure and one part of the plurality of radiating fins extends the outside of the computer system. The design enlarges the area of dissipation, increases the radiating force, moreover, the used form is simple and easy to disassemble.
Description
Technical field
The utility model relates to a kind of heat abstractor, particularly relates to a kind of heat abstractor of electronic product.
Background technology
At present, the modernization sci-tech product, especially the electronic product that has the electronic component of many precisions, for example computing machine, DVD player, digital film player (DVR), loudspeaker etc., parts such as engine wherein, the central processing unit of computing machine (CPU), video disc player, display card and computer housing can produce a large amount of heats, in order to guarantee the stable of above-mentioned machine operation, it is very important that the heat sinking function of electronic component just becomes.
Utilize heating radiator to get rid of heat, to prevent that mechanical hook-up or electronic product etc. are overheated and damage, become a kind of important outfit.The common heat abstractor that is used for various electronic components at present is the heat abstractor that utilizes heat-conduction principle, it mainly comprises the heat absorbing sheet that heat generating component direct and in the computing machine contacts, heat pipe that links to each other with heat absorbing sheet and the radiator that links to each other with heat pipe, wherein the radiator outside surface is the fin shape, can improve with the contact area of air to improve heat dispersion, inner sealing has condensed fluid, seeing through the heat pipe that communicates with it can import condensed fluid in the heat absorbing sheet, absorbed the heat of heat generating component when heat absorbing sheet, the heat pipe two ends produce the temperature difference, the condensed fluid of the heat pipe evaporation ends that links to each other with heat absorbing sheet one end will gasify rapidly, to the condensation end that links to each other with radiator, speed is very fast with the heat band, and liquid is after radiator condenses liquefaction, pass through capillary action, flow back to evaporation ends, and radiator sees through the heat radiation on fin shape surface, and heat is conducted in the air, reduce the temperature of condensed fluid, so move in circles, constantly with the heat band to the low end of temperature, realize heat radiation.This radiating mode can effectively avoid heat generating components overheated and reduce work efficiency, even damages.
As everyone knows, the area of heat radiation is big more, radiating effect is good more, yet the heat abstractor of prior art utilizes fastener that heat absorbing sheet is fixed on the heat generating component, radiator directly is fixed on the heat absorbing sheet, the discrete hot body of this fixed form heat absorbing sheet is nearer, and the heat of radiator can not be dispersed in the air fully, is unfavorable for heat radiation, and the too loaded down with trivial details inconvenience dismounting of existing fixed mode, bring inconvenience to use.Therefore, a kind of can dismountable safely fixing heat abstractor that can strengthen the heat radiation dynamics again be to be a kind of preferable selection.
The utility model content
It is a kind of not only can be dismountable safely fixing but also can strengthen the heat abstractor of heat radiation dynamics that fundamental purpose of the present utility model is to provide.
Therefore, for achieving the above object, the utility model discloses a kind of heat abstractor, be used for computer system, comprising: a heat-absorbing model contacts with a heat generating component on the circuit board; First heat pipe has first end and second end, and first end system links to each other with heat-absorbing model; One first radiator, link to each other with second end of first heat pipe, wherein first radiator more comprises some radiating fins and a location structure, by location structure radiator is positioned in the computer system, and makes the some of some radiating fins extend the computer system outside.
Advantage of the present utility model is first radiator is increased a series of fins that play the role of positioning, not only enlarged area of dissipation, strengthened the heat radiation dynamics, and the fixed form of using is simply firm, be convenient to dismounting, the utility model heat abstractor adopts the setting of two radiators simultaneously, has more guaranteed abundant heat radiation, two radiators lay respectively at the both sides of circuit board, have rationally utilized the space.
Description of drawings
The utility model is described in further detail below in conjunction with the drawings and specific embodiments.
Fig. 1 is the decomposing schematic representation of the utility model heat abstractor.
Fig. 2 is the front view after the combination of the utility model heat abstractor.
Fig. 3 is the rear view after the combination of the utility model heat abstractor.
Embodiment
Fig. 1 to Fig. 3 is respectively front view after the utility model heat abstractor decomposing schematic representation, the combination and the rear view after the combination, and wherein this heat abstractor is retained on the computer circuit board, comprising: radiating module 11, two heat pipes 12 and heat-absorbing models 13.Wherein, heat-absorbing model 13 contacts to absorb the heat that it sends with heat generating component 100 on the circuit board, it 131,133, two of heat absorbing sheet that comprise two symmetries is the heat pipe host body 135,137 and the heat radiator 20 of the symmetry of contact with it between heat absorbing sheet 131,133 and respectively.Wherein, heat absorbing sheet 131; 133 and heat pipe host body 135; 137 all is to be used to absorb the heat that heat generating component 100 sends; make by high conductivity material; as metallic copper; heat absorbing sheet 131; 133 afterbodys are upturned respectively; with contact heat spreader 20; thereby heat is conducted on the heat radiator 20; heat pipe host body 135; 137 sealing heat pipe 12 and condensed fluids wherein; heat pipe host body 135; 137 slightly protrude in heat absorbing sheet 131; 133 with the convenient heat pipe 12 that connects; heat radiator 20 covers heat absorbing sheet 131; 133 and heat pipe host body 135; 137; and the two is fixed on the circuit board; heat radiator 20 outside surfaces comprise some outwards outstanding fins; be used for heat radiation; the top also has a host body that protrudes in outside surface; this host body and this heat radiator 20 are wholely set; can correspondence accommodate heat pipe 12 and heat pipe host body 135; 137 outstanding and heat absorbing sheets 131; 133 connecting portion; play a protective role; and; heat radiator 20 and heat absorbing sheet 131; contact is divided in 133 warping part; can be with heat absorbing sheet 131; heat absorption on 133, and see through some fins heat is distributed.
Two heat pipe 12 types are identical, an end respectively with 135, the 137 corresponding connections of heat pipe host body, this end is evaporation ends (fire end), heat pipe 12 inner vacuum are sealed with condensed fluid, condensed fluid is met heat and is become gas rapidly.Radiating module 11 comprises two radiators 111,113, and radiator 111 and heat-absorbing model 13 all are positioned at the same side of circuit board, and radiator 113 is positioned at the opposite side of circuit board, and is relative with radiator 111 and heat-absorbing model 13 residing sides.As shown in Figure 3, wherein radiator 113 is a rectangular parallelepiped, it comprises the fin of several projections, be used for heat radiation, accommodate the back side of being fixed in fin of heat pipe 12, with the other end (condensation end or colling end) of sealing heat pipe 12, the both sides of radiator 113 comprise two fixed heads respectively, be fixed in the resettlement section corresponding with it on the circuit board, realize the fixing of radiator 113 and circuit board.
The principle of work of the utility model heat abstractor is: along with the rising of heat generating component 100 temperature, heat absorbing sheet 131 in the heat-absorbing model 13,133 with its heat absorption to self, and rely on heat radiator 20 to dispel the heat, heat pipe host body 135, after being heated, condensed fluid in 137 absorbs heat rapidly, become the radiator 111 that gas permeation heat pipe 12 is evaporated to radiating module 11, in 113, gas contacts with condensed fluid in the radiator through heat pipe 12, emit latent heat and finished the heat transfer task, again condensation becomes liquid state, flow back into thermal source again, continuous reciprocation cycle, the fin of the location division 300 of radiator 111 and the fin of radiator 113 all utilize extraneous air that the temperature of the condensed fluid of inside is further reduced simultaneously, thereby reach better heat radiating effect.
Design on the location division 300 of the radiator 111 of the utility model heat abstractor and the circuit board between the buckle not only is confined to above-mentioned structure, also can see through other elasticity or the connection of screw locator meams.
The described heat abstractor of the utility model embodiment, one of them radiator increases a series of fins that play the role of positioning, enlarge area of dissipation, strengthened the heat radiation dynamics, and, the locator meams of using is simply firm, be convenient to dismounting, the utility model heat abstractor adopts the setting of two radiators simultaneously, has more guaranteed abundant heat radiation, two radiators lay respectively at the both sides of circuit board, have rationally utilized the space.
Though the utility model is to describe in conjunction with its specific embodiment, other variation and revise and other use is conspicuous for those skilled in the art that.Therefore the scope that will protect of the utility model is not subjected to the restriction of above-mentioned explanation, and only is subjected to the restriction of the utility model claim.
Claims (6)
1. a heat abstractor is used for computer system, it is characterized in that, comprising:
One heat-absorbing model contacts with a heat generating component on the circuit board;
One first heat pipe has first end and second end, and this first end links to each other with this heat-absorbing model; And
One first radiator, link to each other with second end of this first heat pipe, wherein this first radiator more comprises some radiating fins and a location structure, relies on this location structure that this radiator is positioned in the computer system, and makes the some of these some radiating fins extend the computer system outside.
2. heat abstractor as claimed in claim 1 is characterized in that, wherein more comprises a heat radiator, and this heat radiator is arranged at this heat-absorbing model.
3. heat abstractor as claimed in claim 1 or 2, it is characterized in that, wherein more comprise one second radiator and one second heat pipe, this second heat pipe has the 3rd end and the 4th end, the 3rd end of this second heat pipe links to each other with this heat-absorbing model, and the opposite side that the 4th end extends to circuit board links to each other with this second radiator.
4. heat abstractor as claimed in claim 3 is characterized in that, wherein this second radiator comprises a fixed part, and the resettlement section that this fixed part sees through corresponding setting on this circuit board is fixed on this circuit board.
5. heat abstractor as claimed in claim 1 is characterized in that wherein this heat absorbing sheet is made by high conductivity material.
6. heat abstractor as claimed in claim 4 is characterized in that, wherein the resettlement section on this circuit board is divided into a buckle, and it comprises that the hole clipping and of this location structure of accommodating this first radiator clamps the elastic card of the fin of this location structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200520146665 CN2857088Y (en) | 2005-12-28 | 2005-12-28 | Radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200520146665 CN2857088Y (en) | 2005-12-28 | 2005-12-28 | Radiator |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2857088Y true CN2857088Y (en) | 2007-01-10 |
Family
ID=37600392
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200520146665 Expired - Fee Related CN2857088Y (en) | 2005-12-28 | 2005-12-28 | Radiator |
Country Status (1)
Country | Link |
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CN (1) | CN2857088Y (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100584178C (en) * | 2007-03-16 | 2010-01-20 | 富准精密工业(深圳)有限公司 | Heat radiation device |
CN101365325B (en) * | 2007-08-10 | 2010-12-08 | 华硕电脑股份有限公司 | Heat radiating module and dismountable extension card applying the cooling module |
CN102012183B (en) * | 2009-09-04 | 2013-02-13 | 技嘉科技股份有限公司 | Heat radiator and manufacturing method thereof |
CN105228422A (en) * | 2015-10-30 | 2016-01-06 | 广东虹勤通讯技术有限公司 | Heat radiation module |
CN111280576A (en) * | 2018-12-29 | 2020-06-16 | 深圳光启超材料技术有限公司 | Heat radiator for intelligence helmet |
WO2020221249A1 (en) * | 2019-04-28 | 2020-11-05 | 深圳光启超材料技术有限公司 | Heat dissipation apparatus and helmet |
-
2005
- 2005-12-28 CN CN 200520146665 patent/CN2857088Y/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100584178C (en) * | 2007-03-16 | 2010-01-20 | 富准精密工业(深圳)有限公司 | Heat radiation device |
CN101365325B (en) * | 2007-08-10 | 2010-12-08 | 华硕电脑股份有限公司 | Heat radiating module and dismountable extension card applying the cooling module |
CN102012183B (en) * | 2009-09-04 | 2013-02-13 | 技嘉科技股份有限公司 | Heat radiator and manufacturing method thereof |
CN105228422A (en) * | 2015-10-30 | 2016-01-06 | 广东虹勤通讯技术有限公司 | Heat radiation module |
CN111280576A (en) * | 2018-12-29 | 2020-06-16 | 深圳光启超材料技术有限公司 | Heat radiator for intelligence helmet |
WO2020221249A1 (en) * | 2019-04-28 | 2020-11-05 | 深圳光启超材料技术有限公司 | Heat dissipation apparatus and helmet |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070110 Termination date: 20141228 |
|
EXPY | Termination of patent right or utility model |