CN100584178C

CN100584178C - Heat radiation device

Info

Publication number: CN100584178C
Application number: CN200710073539A
Authority: CN
Inventors: 闵绪新; 符猛; 陈俊吉
Original assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Current assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Priority date: 2007-03-16
Filing date: 2007-03-16
Publication date: 2010-01-20
Anticipated expiration: 2027-03-16
Also published as: CN101267722A

Abstract

A heat radiating device used for dispersing heat for an electronic element, comprises a plurality of heat radiating fins and at least two hot tubes. Each of the hot tubes includes a heat adsorption segment and a heat discharge segment connected with the heat fins, wherein the heat adsorption segment is flat-shaped and coplanar-arranged with a lower surface contacted with the electronic element and an upper surface welded with the sink fins. The heat radiating device uses the flat heat tube as a base seat of the heat radiating device so as to directly contact with the electronic element, thereby improving the heat transferring performance of the heat radiating device without markedly increasing cost, and reducing the volume of the whole heat radiating device, effectively using the system space.

Description

Heat abstractor

Technical field

The present invention relates to a kind of heat abstractor, be meant a kind of heat abstractor that is used on the electronic component especially.

Background technology

Along with fast development of information technology, the arithmetic speed of central processing unit (CPU) is more and more faster, and the heat of its generation is also more and more, and too much heat is if can't in time discharge, the stability when having a strong impact on the central processing unit operation.For this reason, industry is installed a heat abstractor at the central processing unit end face usually, to assist to get rid of heat.

Existing heat abstractor combination, often comprise a radiator, this radiator comprises a heat dissipation base and the radiating fin that is formed on this base, because this base is the entity metal, it is inhomogeneous to cause easily dispelling the heat, it is slow that heat concentrates on the heating tape place and the radiating rate of central processing unit, thereby influence the integral heat sink effect.

At the problems referred to above, industry can adopt the method that increases heat pipe, announce exposure one heat abstractor in 2612068Y number as Chinese patent, this heat abstractor comprises a radiator and at least one heat pipe, this radiator has a pedestal, is formed with some radiating fins on this pedestal, and the top of these radiating fins also is formed with a flat board, one end of above-mentioned heat pipe is contained in this pedestal, and the other end is placed in this substrate.This heat abstractor is by the transfer of heat of heat pipe with pedestal, but the heat of central processing unit still reaches heat pipe and radiating fin by substrate, and the pedestal of entity metal has influenced entire heat dissipation device radiation speed.And, because pedestal has certain thickness, increased the volume of entire heat dissipation device virtually, reduced the adaptability in different system of heat abstractor.

Summary of the invention

The present invention aims to provide a kind of rapid heat dissipation, heat abstractor that volume is little.

A kind of heat abstractor, be used for an electronic element radiating, comprise some radiating fins and at least two heat pipes, described heat pipe comprises endotherm section and connects the heat release section of described radiating fin, described endotherm section is tabular and coplane setting, its lower surface is in order to directly to contact its upper surface and the welding of described radiating fin with electronic component.

Heat abstractor of the present invention contacts as the base of heat abstractor described flat hot pipe with electronic component, the heat transfer property of heat abstractor was improved, significantly do not increase manufacturing cost again, make the volume of entire heat dissipation device reduce the more efficient use system space simultaneously.

With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.

Description of drawings

Fig. 1 is the three-dimensional exploded view of heat abstractor of the present invention.

Fig. 2 is the inverted three-dimensional exploded view of Fig. 1 heat abstractor.

Fig. 3 is the constitutional diagram of Fig. 1 heat abstractor.

Fig. 4 is the constitutional diagram of Fig. 2 heat abstractor.

Embodiment

See also Fig. 1 to Fig. 4, heat abstractor 100 of the present invention is installed on the circuit board (figure does not show), in order to the electronic component on this circuit board (figure does not show), dispels the heat as central processing unit.This heat abstractor 100 comprises a radiating fin group 20 and connects some heat pipes 10 of radiating fin group 20 and central processing unit, this heat abstractor 100 also comprises two fasteners 50, and described fastener 50 is welded on radiating fin group 20 two bottom sides so that heat abstractor 100 is fixed on the circuit board.

Heat pipe 10 all takes the shape of the letter U.Each heat pipe 10 comprises that the endotherm section 12, of a level is parallel to the linkage section 13 of heat release section 14 and a connection endotherm section 12 and the heat release section 14 of endotherm section 12.Wherein, these endotherm sections 12 are pressed into and form a upper surface 120 and lower surface 125 after flat mutually side by side and jointly.The endotherm section 12 of each heat pipe 10 is closely contact mutually, with as a flat pedestal, it is contacted with the upper surface of central processing unit and welds with the bottom surface of radiating fin group 20.The heat release section 14 of heat pipe 10 is in same plane and apart, and it is in order to be arranged in the radiating fin group 20.

Radiating fin group 20 is parallel to each other at interval by some single radiating fins 21 that buckle forms, and each radiating fin 21 is the sheet metal of the setting that roughly takes the shape of the letter U, and this radiating fin 21 is perpendicular to the endotherm section 12 and the heat release section 14 of described heat pipe 10.Middle part, radiating fin group 20 bottom surfaces forms a protuberance 221, and these protuberance 221 bilateral symmetry form two accommodation spaces to accommodate two fasteners 50.Each radiating fin 21 bottom is equipped with in the same way the flanging 220,225 of bending, and wherein upper surface 120 welding of the plane formed of each flanging 225 and the endotherm section 12 of heat pipe 10 are in plane and two fasteners 50 that the flanging 220 of flanging 225 both sides formed and weld.Each radiating fin 21 both sides forms a flanging 25 respectively near the top.Described flanging 25,220 and 225 jointly with radiating fin 21 at interval same distance to form the heat dissipation ventilation road.Evenly be interval with four holes 210 on each radiating fin 21, the hole 210 common heat release section 14 of four-way (figure is mark not) of forming on the radiating fin group 20 to accommodate heat pipe 10.

Each fastener 50 comprise one be welded on the flanging 220 of radiating fin group 20 location-plate 52 and from the outward extending at an angle buckling plate 54 in location-plate 52 two ends.Buckling plate 54 is provided with through hole (figure is mark not), thereby make things convenient for screw or rivet 60 etc. to pass this heat abstractor 100 is fixed on the circuit board.

During use, be that the pedestal that the endotherm section 12 of heat pipe 10 is formed directly contacts with central processing unit with the bottom surface of this heat abstractor 100, the heat of this central processing unit generation is by endotherm section 12 lower surfaces 125 absorptions of the heat pipe 10 that is in contact with it; The heat that the endotherm section 12 of these heat pipes 10 absorbs, a part directly is passed to the bottom of the radiating fin group 20 that directly contacts with endotherm section 12; Another part then the linkage section 13 by heat pipe 10 and heat release section 14 with the heat transferred of endotherm section 12 to the middle body that is passed to radiating fin group 20; At last, these heats that are passed to radiating fin group 20 are distributed to the air from radiating fin group 20, thereby realize the heat radiation to central processing unit.

In sum, the endotherm section 12 of heat pipe 10 of the present invention area after flattening increases, directly contact with radiating fin group 20 welding backs with central processing unit, compared with prior art saved and the central processing unit substrate contacted, it has replaced pedestal, absorbs heat fast and transmits heat thereby directly contact with radiating fin group 20.And the volume of entire heat dissipation device has had bigger adaptability because of saving pedestal, can install flexibly in more system.

Claims

1. heat abstractor, be used for an electronic element radiating, comprise some radiating fins and at least two heat pipes, described heat pipe comprises endotherm section and connects the heat release section of described radiating fin, it is characterized in that: described endotherm section is tabular, described endotherm section be in contact with one another and the end face of described endotherm section and bottom surface respectively coplane be provided with, lower surface, wherein said lower surface is in order to directly to contact with electronic component, middle part, described radiating fin bottom surface is formed with protuberance, the protuberance welding of described upper surface and described radiating fin, described protuberance and heat pipe heat-absorbing section bilateral symmetry are connected with fixed fastener.

2. heat abstractor as claimed in claim 1 is characterized in that: described fastener comprises that one is welded in the location-plate of radiating fin bottom surface and the outward extending at an angle buckling plate from the location-plate two ends.

3. heat abstractor as claimed in claim 1 is characterized in that: described heat pipe takes the shape of the letter U, and comprises parallel up and down endotherm section, heat release section and connects the two linkage section.

4. heat abstractor as claimed in claim 3 is characterized in that: described radiating fin space is parallel and perpendicular to the endotherm section of described heat pipe.

5. heat abstractor as claimed in claim 4 is characterized in that: described radiating fin bottom vertical is extended with flanging, the common endotherm section upper surface of forming a plane with the contact heat pipe of described flanging.

6. heat abstractor as claimed in claim 5 is characterized in that: the heat release section of described heat pipe is arranged in the described radiating fin, and the heat release section of each heat pipe is in same plane and apart.