CN2849971Y - Protective structure of photosensitive chip - Google Patents
Protective structure of photosensitive chip Download PDFInfo
- Publication number
- CN2849971Y CN2849971Y CN 200520085407 CN200520085407U CN2849971Y CN 2849971 Y CN2849971 Y CN 2849971Y CN 200520085407 CN200520085407 CN 200520085407 CN 200520085407 U CN200520085407 U CN 200520085407U CN 2849971 Y CN2849971 Y CN 2849971Y
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- CN
- China
- Prior art keywords
- sensitive chip
- protective layer
- board component
- protection structure
- flexible circuitry
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a protective structure of a sensitive chip, which is overcomes the defect that the problem of the aspect of extraneous matters caused by an FPC component can not be better solved existing in the existing technical scheme. The protective structure of a sensitive chip provided by the utility model can thoroughly solve the harmful problem that the camera head of a surface mounting technology (SMT) craft to pick up an image for the extraneous matters is adopted caused by the FPC component. The utility model comprises a flexible circuit board component EP, an FPC component, a sensitive chip (Sensor) which is arranged on the flexible circuit board component, and a protective layer with small volatility, wherein the protective layer can be insulated and wraps the surrounding areas of the sensitive chip. The protective layer of the technical scheme can not only prevent the residual matters of an FPC surface and a Sensor bottom from generating when the FPC component passes through reversed flow, but also prevent a plurality of extraneous matters on the FPC surface from remaining because of the uncleanness manufacturing environment of the SMT. Thereby, the utility model thoroughly solves the harmful problem of the camera extraneous matters caused by the PFC component.
Description
Affiliated technical field
The utility model relates to a kind of protection structure of sensitive chip.
Background technology
The bad problem of the shooting foreign matter that the camera that adopts SMT (surface mounting technology) technology produces because of FPC assembly (flexible circuitry board component) mainly is to have FLUX (scaling powder) residue and other impurity because of FPC its surperficial intrinsic meeting after having crossed Reflow Soldering.If above-mentioned bad problem is not handled, then these residues will inevitably be peeled off in follow-up assembling, test or ageing process, thereby cause the bad of camera shooting foreign matter, this can badly influence the photographic effect of camera, and the quality of product is played certain negative effect.At present in the same industry, obtained some effects aspect the preventing of foreign matter producing, as added barricade, change schemes such as camera lens material and give birth to then mutually because of camera lens.The technical scheme (both added barricade technical scheme) of a kind of invention and created name for " encapsulating structure of optical sensing chip ", its notification number " CN2691057Y " are disclosed inherent on April 6th, 2005 as Chinese patent database.The encapsulating structure of optical sensing chip, it comprises: a transparent substrates; One printing-type circuit trace layer, it is attached to a side of this transparent substrates; And a sensitive chip, it has at least one photosensitive area and a plurality of electrical connection section, and is positioned at the same side of this sensitive chip, and described electrical connection section is electrically connected on this printing-type circuit trace layer.Thereby described sensitive chip is connected on the described transparent substrates, and makes photosensitive area, adhere to sensitive chip to reduce foreign matter adjacent to this transparent substrates.Though this technical scheme can reduce the cleanliness factor requirement of Chip Packaging environment,, it also has following weak point: one, this technical scheme processing cost height, processed complex; Its two, above-mentioned solution focuses on the encapsulating structure that changes chip, can't better solve the problem of the foreign matter aspect that produces because of the FPC assembly.
Summary of the invention
In order to overcome the existing problem that can not better solve the foreign matter aspect that produces because of the FPC assembly of existing technical scheme; the utility model provides a kind of protection structure of sensitive chip, and it can thoroughly solve camera shooting foreign matter bad of employing SMT (surface mounting technology) technology that causes because of the FPC assembly.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of protection structure of sensitive chip; it comprises that a flexible circuitry board component, one be located at the protective layer that sensitive chip on the flexible circuitry board component and can be insulated and volatility is little, the peripheral region of described protective layer parcel sensitive chip.
Described protection structure is used to adopt the camera of surface mounting technology technology.
Described protective layer is coated on the lateral circle surface zone of sensitive chip.
Described protective layer is a sealant layer, and it is coated on the lateral circle surface zone of sensitive chip.
Described protective layer is a silastic-layer, and it is coated on the lateral circle surface zone of sensitive chip.
The bottom surface of described sensitive chip sets firmly and conducts electricity and is connected in flexible circuitry board component upper surface, and protective layer is wrapped in all sides of sensitive chip, and the bottom surface of described protective layer is attached at flexible circuitry board component upper surface.
Described flexible circuitry board component upper surface periphery extends upward the also outside circumference of packing protective layer.
Be provided with several lens assembly installing holes between the interior lateral circle surface of described flexible circuitry board component and the outside circumference of protective layer.
Described sensitive chip has a photosensitive area and a plurality of electrical connection section at least, and a plurality of electrical connection sections are electrically connected on the flexible circuitry board component.
Described sensitive chip has a photosensitive area, two non-photosensitive areas and a plurality of electrical connection section at least, the two-phase that two non-photosensitive areas are located at photosensitive area respectively away from the side, a plurality of electrical connection sections are electrically connected on the flexible circuitry board component.
By above-mentioned description to the utility model structure as can be known, compare with background technology, the beneficial effects of the utility model are:
One, the protective layer of the technical program both can prevent that the FPC assembly from crossing the FLUX residue that backflow FPC surface and Sensor bottom is produced, can prevent to remain in some foreign matters on FPC surface again, thereby thoroughly solve the bad problem of the shooting foreign matter that causes because of the FPC assembly because of the non-clean production environment of SMT; This scheme has obtained achievement preferably by clinical implementation, can be widely used among the production of present mobile phone cam project, and can obtain high production efficiency and quality assurance;
Its two, this protective layer has following advantage: ageing-resistant, moistureproof, insulation, nontoxic, non-corrosiveness; Volatile is little; Low solid residue; Stronger gentle contract is arranged; Can be widely used in accurate electronic product field; Other special and used technology according to product is selected.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is the generalized section of the protection structure of sensitive chip of the present utility model.
Fig. 2 is the schematic perspective view of camera module of the present utility model.
Embodiment
A kind of protection structure of sensitive chip, as shown in Figure 1, it comprises that 1, one of a flexible circuitry board component (FPC assembly) is located at the 2 and protective layers 3 of sensitive chip (Sensor) on the flexible circuitry board component 1.Described protection structure is used to adopt the mobile phone cam of surface mounting technology technology.
Sensitive chip (Sensor) 2 is for there being cubic, its have two-phase that a photosensitive area 21, two non-photosensitive areas 22 and 23, two non-photosensitive areas 22 of a plurality of electrical connection section are located at photosensitive area 21 respectively away from the side.
The bottom surface of sensitive chip 2 sets firmly and conducts electricity and is connected in flexible circuitry board component 1 upper surface, and it is to be connected in flexible circuitry board component 1 by electrical connection section 23 conductions.
Protective layer 3 is a silastic-layer, and protective layer 3 is coated on all sides of sensitive chip 2, and the coated on bottom side of described protective layer 3 covers in flexible circuitry board component 1 upper surface.Protective layer 2, flexible circuitry board component 1 upper surface, sensitive chip 2 upper surfaces cooperate sealant of formation.
Flexible circuitry board component 1 upper surface periphery extends upward the also outside circumference of packing protective layer 3.
Four corners of the interior lateral circle surface of flexible circuitry board component 1 and the outside circumference of protective layer 3 four corners between be provided with four lens assembly installing holes 4.
As shown in Figure 2, lens assembly 5 is installed on four lens assembly installing holes 4.
The above, it only is the utility model preferred embodiment, so can not limit the scope that the utility model is implemented with this, i.e. the equivalence of doing according to the utility model claim and description changes and modifies, and all should still belong in the scope that the utility model patent contains.
Claims (9)
1. the protection structure of a sensitive chip; it is characterized in that: it comprises that a flexible circuitry board component, one be located at the protective layer that sensitive chip on the flexible circuitry board component and can be insulated and volatility is little, the peripheral region of described protective layer parcel sensitive chip.
2. the protection structure of sensitive chip according to claim 1, it is characterized in that: described protective layer is coated on the lateral circle surface zone of sensitive chip.
3. the protection structure of sensitive chip according to claim 1, it is characterized in that: described protective layer is a sealant layer, it is coated on the lateral circle surface zone of sensitive chip.
4. the protection structure of sensitive chip according to claim 1, it is characterized in that: described protective layer is a silastic-layer, it is coated on the lateral circle surface zone of sensitive chip.
5. according to the protection structure of claim 2 or 3 or 4 described sensitive chips; it is characterized in that: the bottom surface of described sensitive chip sets firmly and conducts electricity and is connected in flexible circuitry board component upper surface; protective layer is wrapped in all sides of sensitive chip, and the bottom surface of described protective layer is attached at flexible circuitry board component upper surface.
6. the protection structure of sensitive chip according to claim 5 is characterized in that: described flexible circuitry board component upper surface periphery extends upward and the outside circumference of packing protective layer.
7. the protection structure of sensitive chip according to claim 6 is characterized in that: be provided with several lens assembly installing holes between the interior lateral circle surface of described flexible circuitry board component and the outside circumference of protective layer.
8. the protection structure of sensitive chip according to claim 1, it is characterized in that: described sensitive chip has a photosensitive area and a plurality of electrical connection section at least, and a plurality of electrical connection sections are electrically connected on the flexible circuitry board component.
9. the protection structure of sensitive chip according to claim 1; it is characterized in that: described sensitive chip has a photosensitive area, two non-photosensitive areas and a plurality of electrical connection section at least; the two-phase that two non-photosensitive areas are located at photosensitive area respectively away from the side, a plurality of electrical connection sections are electrically connected on the flexible circuitry board component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520085407 CN2849971Y (en) | 2005-07-15 | 2005-07-15 | Protective structure of photosensitive chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520085407 CN2849971Y (en) | 2005-07-15 | 2005-07-15 | Protective structure of photosensitive chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2849971Y true CN2849971Y (en) | 2006-12-20 |
Family
ID=37522451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520085407 Expired - Fee Related CN2849971Y (en) | 2005-07-15 | 2005-07-15 | Protective structure of photosensitive chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2849971Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11451691B2 (en) | 2018-11-21 | 2022-09-20 | Beijing Xiaomi Mobile Software Co., Ltd. | Driving mechanism, camera module and electronic device |
-
2005
- 2005-07-15 CN CN 200520085407 patent/CN2849971Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11451691B2 (en) | 2018-11-21 | 2022-09-20 | Beijing Xiaomi Mobile Software Co., Ltd. | Driving mechanism, camera module and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061220 |