CN2847460Y

CN2847460Y - Storage chip detector

Info

Publication number: CN2847460Y
Application number: CN 200520122308
Authority: CN
Inventors: 刘泗宏
Original assignee: THINK WHOLES CO Ltd
Current assignee: Jinyong International Co., Ltd.
Priority date: 2005-09-14
Filing date: 2005-09-14
Publication date: 2006-12-13
Anticipated expiration: 2015-09-14

Abstract

The utility model relates to a storage chip detector which is composed of a holding box body, an electric conduction base plate, a sharing seat and a bunting pressing block, wherein the holding box body is provided with a seat body and a cover body. The bottom of the seat body is provided with the electric conduction base plate provided with a plurality of electric conduction rubbers. The upper part of the electric conduction base plate is provided with the sharing seat provided with one holding space or a plurality of holding spaces, and the holding space can be communicated with the electric conduction base plate. A storage chip positioned in the holding space is bunted and pressed by the bunting pressing block, which leads the storage chip and the electric conduction rubbers of the electric conduction base plate to be electrically conducted. Therefore, when different storage chips are detected, people only need to replace the sharing seat and the bunting pressing block, and the different storage chips can be electrically connected with the electric conduction base plate and a circuit plate to be detected. When the elasticity of the electric conduction rubbers gradually disappears, the detector with the structure can utilize the thickness from an adjusting block for the bunting pressing block for adjustment, and the service life of the electric conduction rubbers is extended.

Description

The memory chip proving installation

Technical field

The utility model provides a kind of memory chip proving installation, only refer in particular to and to change Shared socket and press block, the proving installation that can allow the different memory chip test, and can utilize and adjust piece the thickness of press block is adjusted, fade away and cause the problem of loose contact with the elasticity that solves conductive rubber.

Background technology

Along with computerized information science and technology is flourish rapidly, design and element in the computing machine association area also constantly make rapid progress, yet, in the electronic product that makes rapid progress, all can use dissimilar memory chip modules, therefore also to also increasingly stringent of the quality requirements of memory chip, except static test, dynamic test also is an important ring of quality restriction.

Dynamic test promptly is after the peripheral element installing binding with computer main frame panel on the production line, again the memory chip module is inserted on the motherboard, whether the operation of each element is normal on testing memory chip module and the motherboard, and because dynamic test adopts the real formula test of inserting, cause memory chip abrasion and damage fast, make testing cost quite high, moreover, not only test speed is slow excessively for the dynamic test of the slotting formula of this kind reality, and need expend the considerable time, in fact be necessary further to improve these defectives, to provide efficient and proving installation cheaply.

Summary of the invention

The memory chip proving installation that the utility model fundamental purpose is to provide a kind of tool testing efficiency and can reduces testing cost, it can effectively solve the real slow excessively defective of test speed of inserting the dynamic test of formula.

The utility model secondary objective be to provide a kind of can be in order to the memory chip proving installation of test different types memory chip, it can effectively promote the convenience and the scope of application in when test.

In order to achieve the above object, memory chip proving installation of the present utility model is provided with the ccontaining box body of tool pedestal and lid, and the pedestal bottom is provided with the electrically-conductive backing plate of tool plural conductive rubber, and the electrically-conductive backing plate top is provided with the Shared socket of tool accommodation space, and accommodation space can interlink with electrically-conductive backing plate, and compress the memory chip that is placed in the accommodation space by press block, allowing the conductive rubber of memory chip and electrically-conductive backing plate be electrically conducts, so when the different memory chip is tested, only need change Shared socket and press block, can allow the different memory chip be electric connection, allow memory chip test by same ccontaining box body and electrically-conductive backing plate and circuit board.

As for detailed structure of the present utility model, application principle, effect with and the effect reached, then please refer to following specific embodiment and cooperate appended graphic explanation in detail, can be understood completely.

Description of drawings

Fig. 1 is the stereo appearance figure of the utility model preferred embodiment.

Fig. 2 is the three-dimensional exploded view of the utility model preferred embodiment.

Fig. 3 is the cut-open view of the utility model press block.

Fig. 4 is the cut-open view of the utility model preferred embodiment before test.

Fig. 5 is the cut-open view of the utility model preferred embodiment after test.

Fig. 6 is the stereo appearance figure of another preferred embodiment of the utility model.

Fig. 7 is the pin position synoptic diagram of different memory chip.

Fig. 8 A is the synoptic diagram of the utility model Shared socket first embodiment.

Fig. 8 B is the synoptic diagram of the utility model Shared socket second embodiment.

Fig. 8 C is the synoptic diagram of the utility model Shared socket the 3rd embodiment.

Fig. 8 D is the synoptic diagram of the utility model Shared socket the 4th embodiment.

Fig. 8 E is the synoptic diagram of the utility model Shared socket the 5th embodiment.

Fig. 8 F is the synoptic diagram of the utility model Shared socket the 6th embodiment.

Fig. 8 G is the synoptic diagram of the utility model Shared socket the 7th embodiment.

Symbol description among the figure:

Ccontaining box body 1 pedestal 11

Buckling groove 111 lids 12

Drive-connecting shaft 121 clamping parts 122

Spring 123 electrically-conductive backing plates 2

Embedding slot 21 conductive rubbers 22

Shared socket 3 accommodation spaces 30

Press block 4 fixtures 41

42 cushion blocks 43 of boring a hole

Open-work 44 is adjusted piece 45

Memory chip 5 contacts 51

Circuit board 6 circuit junctions 61

Embodiment

Please cooperate consult shown in accompanying drawing, the designed memory chip proving installation of the utility model as shown in Figure 1, 2, 3, the structure of this memory chip proving installation includes ccontaining box body 1, electrically-conductive backing plate 2, Shared socket 3 and press block 4 to be formed, wherein:

This ccontaining box body 1 is provided with pedestal 11 and lid 12, and pedestal 11 is breakthrough status up and down, and lid 12 1 sides are provided with drive-connecting shaft 121 and are connected with pedestal 11, and lid 12 other sides are provided with the buckling groove 111 of clamping part 122 to be fastened on pedestal 11.

This electrically-conductive backing plate 2 is arranged at the bottom of pedestal 11, and electrically-conductive backing plate 2 is provided with a plurality of embedding slots 21, and is embedded with conductive rubber 22 in embedding slot, and the thickness of conductive rubber 22 is greater than the thickness of electrically-conductive backing plate 2.

This Shared socket 3 is arranged at electrically-conductive backing plate 2 tops, and Shared socket 3 has one or more accommodation space 30, and accommodation space 30 can interlink with electrically-conductive backing plate 2.

This press block 4 is provided with a plurality of perforation 42 that can supply fixture 41 to penetrate, and press block 4 can be fixed on the lid 12 of ccontaining box body 1 by fixture 41, and press block 4 also is provided with a plurality of open-works 44 that can supply cushion block 43 to penetrate, can allow press block 4 compress memory chip 5, to allow the contact 51 of memory chip 5 be electric connection with conductive rubber 22.

Because the contact 51 of memory chip 5 of the present utility model can be patterns such as tin ball, Copper Foil, and when if the contact 51 of memory chip 5 is the tin ball, press block 4 can wear a plurality of cushion blocks 43 and adjust its thickness, and when if the contact 51 of memory chip 5 is non-tin ball-type formula, promptly directly utilize press block 4 to compress memory chip 5, can effectively promote convenience and the scope of application of memory chip 5 when test.

See also Fig. 4, shown in 5, memory chip proving installation of the present utility model is when reality is used, for utilizing fixture 41 press block 4 to be locked on the lid 12 of ccontaining box body 1 earlier, and ccontaining box body 1 and electrically-conductive backing plate 2 placed on the circuit board 6, so that conductive rubber 22 is in contact with one another with circuit junction 61, and Shared socket 3 put into ccontaining box body 1, and when testing, memory chip 5 is positioned in the accommodation space 30 of Shared socket 3, and the contact 51 of memory chip 5 is in contact with one another with conductive rubber 22, this moment the clamping part 112 of pedestal 11 is fastened on the buckling groove 121 of lid 12, lid 12 can produce a pressure to press block 4, and force press block 4 to compress memory chip 5, and conductive rubber 22 can produce elastic deformation after being subjected to the compressing of memory chip 5, and respectively to the circuit junction 61 of the contact 51 that pastes memory chip 5 with circuit board 6, to allow the contact 51 of memory chip 5 be electric connection by the circuit junction 61 of conductive rubber 22 and circuit board 6, and can test memory chip 5, after finishing, device chip 5 tests to be stored can take out, so can promote the efficient of memory chip 5 tests, to solve the real slow excessively defective of test speed of inserting the dynamic test of formula.

And since memory chip proving installation of the present utility model when reality is used, the circuit junction 61 of the circuit board 6 of test usefulness can be patterns such as tin ball, Copper Foil, though different circuit junctions 61 have different thickness, but the utility model only need be changed the press block 4 of different-thickness, can produce the identical effect that compresses to memory chip 5, can effectively promote convenience and the scope of application of memory chip 5 when test.

Moreover, the Testing apparatus most important character is to be that frequency of utilization is quite frequent, so though conductive rubber 22 has elasticity, but can descend in frequent testing memory chip 5 back elasticity, cause memory chip 5 can't be effectively and the circuit junction 61 of circuit board 6 be electric connection, can on press block 4, increase adjustment piece 45 this moment and carry out the adjustment of thickness, can be adhesive tape and adjust piece 45, paster or tool increase the equivalent structure of adjusting piece thickness, so can increase the strength that compresses of press block 4 slightly, do not need the conductive rubber 22 that promptly more renews at once in conductive rubber 22 flexibility decrease, not only the serviceable life of conductive rubber 22 can be fully increased, and the testing cost of changing conductive rubber 22 can be reduced.

See also shown in Figure 6, this lid 12 is respectively equipped with clamping part 122 in both sides, and clamping part 122 is for combining with lid 12 by spring 123, and the clamping part 122 of lid 12 both sides is fastened on the buckling groove 111 of pedestal 11 both sides respectively, so can start lid 12 by both sides respectively, place the convenience of press block 4 and memory chip 5 when increasing test.

See also shown in Figure 7, different memory chip 5 has the different size size as can be seen from Figure, so in certain zone, but have common contact 51, so the utility model only need cooperate memory chip 5 sizes to change different Shared sockets 3, can allow the memory chip 5 of different size by circuit junction 61 conductings of conductive rubber 22, allow the applicability of memory chip proving installation of the present utility model more extensively see also Fig. 8 A to Fig. 8 G with circuit board 6.

By above narration as can be known, the utility model utilizes press block 4 to compress memory chip 5, and make conductive rubber 22 compressed back generation elastic deformation, allow the contact 51 of memory chip 5 be conducting state by the circuit junction 61 of conductive rubber 22 and circuit board 6, so that memory chip 5 is tested, it can promote the efficient of memory chip 5 tests, to solve the real slow excessively disappearance of test speed of inserting the dynamic test of formula, and circuit junction 61 at different-thickness, the utility model only need be changed the press block 4 of different-thickness, can produce the identical effect that compresses to memory chip 5.

And the situation of flexibility decrease can take place after along with frequent test in conductive rubber 22, only need to increase adjustment piece 45 on the press block 4 this moment and carry out the adjustment of thickness, and do not need the conductive rubber 22 that more renews, with the serviceable life of abundant increase conductive rubber 22, moreover, different Shared sockets 3 can be accommodated the memory chip 5 of different size, makes applicability of the present utility model more extensive.

Though specific embodiment of the present utility model has been described in above narration, note that above narration just is used for helping to understand enforcement of the present utility model, be not to be used to limit spirit of the present utility model, being familiar with can be under the announcement of this case instructions in this technical field person, in not breaking away from spiritual scope of the present utility model, make many differences but the modification of equivalence, therefore, scope of the present utility model is to be defined by described claim scope.

Claims

1. a memory chip proving installation is made up of ccontaining box body, electrically-conductive backing plate, Shared socket and press block, it is characterized in that,

This ccontaining box body is provided with pedestal and lid, and pedestal is breakthrough status up and down;

This electrically-conductive backing plate is arranged at the bottom of pedestal, and electrically-conductive backing plate is provided with a plurality of embedding slots, and is embedded with conductive rubber in embedding slot;

This Shared socket is arranged at electrically-conductive backing plate top, and Shared socket has the accommodation space that can accommodate default memory chip, and accommodation space can interlink with electrically-conductive backing plate;

This press block is contained in the accommodation space of Shared socket, and press block can compress default memory chip and makes itself and conductive rubber be electric connection.

2. memory chip proving installation as claimed in claim 1 is characterized in that, this lid is provided with drive-connecting shaft in a side and is connected with lid, and lid in addition side be provided with clamping part to be fastened on the buckling groove of pedestal.

3. memory chip proving installation as claimed in claim 1 is characterized in that this lid is respectively equipped with clamping part in both sides, and clamping part is to combine with lid by spring, and the clamping part of lid both sides is fastened on the buckling groove of pedestal both sides respectively.

4. memory chip proving installation as claimed in claim 1 is characterized in that the thickness of the conductive rubber that this electrically-conductive backing plate was embedded is greater than the thickness of electrically-conductive backing plate.

5. memory chip proving installation as claimed in claim 1 is characterized in that this Shared socket is provided with one or more accommodation space.

6. memory chip proving installation as claimed in claim 1 is characterized in that, this memory chip proving installation is provided with the adjustment piece of the thickness that can adjust press block.

7. memory chip proving installation as claimed in claim 6 is characterized in that, this adjustment piece is that adhesive tape, paster or tool increase the equivalent structure of adjusting piece thickness.

8. memory chip proving installation as claimed in claim 1 is characterized in that, this press block is provided with a plurality of perforation that can supply fixture to penetrate, and press block can be fixed on the lid of ccontaining box body by fixture.

9. memory chip proving installation as claimed in claim 1 is characterized in that, this memory chip proving installation is provided with the cushion block that can adjust press block thickness.

10. memory chip proving installation as claimed in claim 1 is characterized in that, this press block is provided with a plurality of open-works that can supply cushion block to penetrate.