CN2814263Y - A New semiconductor refrigerating device - Google Patents
A New semiconductor refrigerating device Download PDFInfo
- Publication number
- CN2814263Y CN2814263Y CN 200520059064 CN200520059064U CN2814263Y CN 2814263 Y CN2814263 Y CN 2814263Y CN 200520059064 CN200520059064 CN 200520059064 CN 200520059064 U CN200520059064 U CN 200520059064U CN 2814263 Y CN2814263 Y CN 2814263Y
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- CN
- China
- Prior art keywords
- hot side
- temperature sensor
- temperature
- new semiconductor
- refrigerating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a novel semiconductor refrigerating device which comprises a hot surface and a cold surface, wherein a temperature sensor which can sense the temperature of the hot surface is directly fixed on the hot surface. Because the temperature sensor is directly welded on the hot surface of the semiconductor refrigerating device, the temperature of the hot surface of the semiconductor refrigerating device can be accurately detected in a real-time mode.
Description
Technical field
The utility model relates to a kind of cooler, refers to a kind of new semiconductor refrigeration device especially.
Background technology
Shown in Fig. 4,5, usually, semiconductor cooler has a hot side and a huyashi-chuuka (cold chinese-style noodles) when energising work, in order to make the semiconductor cooler operate as normal, generally all need be at its hot side 11 equipped radiators, and go so that heat is dispersed in the environment.In addition, semiconductor cooler has a maximum operating temperature limit, and when the temperature of its hot side surpassed this limiting temperature, the solder joint of semiconductor cooler inside will melt, thereby forms the inefficacy that short circuit causes semiconductor cooler.Thereby, in the conductor refrigeration application system, generally all need to use a temperature sensor to come semiconductor cooler is carried out overtemperature protection.In the prior art, the radiator of this temperature sensor and hot side contacts, what temperature sensor was directly experienced like this is the temperature of radiator, therefore can not detect the true temperature of semiconductor cooler hot side in real time, that is to say, with the hot side true temperature certain error is arranged, cause measurement not accurate enough.
The utility model content
The purpose of this utility model is to provide a kind of new semiconductor refrigeration device that can detect hot-face temperature real-time and accurately.
For achieving the above object, technical solution of the present utility model is: a kind of new semiconductor refrigeration device, comprise a hot side and a huyashi-chuuka (cold chinese-style noodles), and directly be fixed with the temperature sensor that can experience its temperature at the hot side place.
Described hot side ceramic wafer size is big than huyashi-chuuka (cold chinese-style noodles), and is shaped on two solder joints on this ceramic wafer in advance, and described temperature sensor is welded on this solder joint place.
Described temperature sensor is the sheet type thermistor.
After adopting such scheme,, and be not to be welded on the radiator A because the utility model directly is welded on temperature sensor on the hot side of semiconductor cooler, therefore can be in real time and detect the hot-face temperature of semiconductor cooler exactly.
Description of drawings
Fig. 1 is a three-dimensional exploded view of the present utility model;
Fig. 2 is a three-dimensional combination figure of the present utility model;
Fig. 3 is an application structure schematic diagram of the present utility model;
Fig. 4 is the schematic diagram one of known semiconductor cooler application structure;
Fig. 5 is the schematic diagram two of known semiconductor cooler application structure.
The specific embodiment
As shown in Figure 1, 2, semiconductor cooler 1 described in the utility model comprises a hot side 11 and a huyashi-chuuka (cold chinese-style noodles) 12, directly be fixed with the temperature sensor that to experience its temperature at hot side 11 places, this temperature sensor can be sheet type thermistor 2 (NTC), because this temperature sensor directly contacts with hot side 11, can detect the temperature of semiconductor cooler 1 hot side 11 so real-time and accurately.
The concrete structure of the utility model embodiment is: the hot side 11 ceramic wafer sizes of semiconductor cooler 1 are strengthened, and on this ceramic wafer prefabricated two solder joints 111, sheet type thermistor 2 directly can be welded on hot side 11 ceramic wafers of semiconductor cooler 1 like this.
As shown in Figure 3, because the utility model directly is welded on temperature sensor on the hot side 11 of semiconductor cooler 1, and be not to be welded on the radiator A, therefore can be in real time and detect the hot-face temperature of semiconductor cooler exactly.
Claims (3)
1, a kind of new semiconductor refrigeration device comprises a hot side and a huyashi-chuuka (cold chinese-style noodles), it is characterized in that: directly be fixed with the temperature sensor that can experience its temperature at the hot side place.
2, a kind of new semiconductor refrigeration device as claimed in claim 1 is characterized in that: described hot side ceramic wafer size is big than huyashi-chuuka (cold chinese-style noodles), and is shaped on two solder joints on this ceramic wafer in advance, and described temperature sensor is welded on this solder joint place.
3, a kind of new semiconductor refrigeration device as claimed in claim 1 or 2, it is characterized in that: described temperature sensor is the sheet type thermistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520059064 CN2814263Y (en) | 2005-05-25 | 2005-05-25 | A New semiconductor refrigerating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520059064 CN2814263Y (en) | 2005-05-25 | 2005-05-25 | A New semiconductor refrigerating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2814263Y true CN2814263Y (en) | 2006-09-06 |
Family
ID=36949350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520059064 Expired - Fee Related CN2814263Y (en) | 2005-05-25 | 2005-05-25 | A New semiconductor refrigerating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2814263Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101534624B (en) * | 2008-03-14 | 2012-10-10 | 富准精密工业(深圳)有限公司 | Radiator combination |
| CN114775252A (en) * | 2022-03-31 | 2022-07-22 | 创维电器股份有限公司 | Condensation and dehumidification clothes drying equipment based on semiconductor and method thereof |
-
2005
- 2005-05-25 CN CN 200520059064 patent/CN2814263Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101534624B (en) * | 2008-03-14 | 2012-10-10 | 富准精密工业(深圳)有限公司 | Radiator combination |
| CN114775252A (en) * | 2022-03-31 | 2022-07-22 | 创维电器股份有限公司 | Condensation and dehumidification clothes drying equipment based on semiconductor and method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |