CN2760762Y - 氮化镓系发光二极管结构 - Google Patents
氮化镓系发光二极管结构 Download PDFInfo
- Publication number
- CN2760762Y CN2760762Y CNU2004200364438U CN200420036443U CN2760762Y CN 2760762 Y CN2760762 Y CN 2760762Y CN U2004200364438 U CNU2004200364438 U CN U2004200364438U CN 200420036443 U CN200420036443 U CN 200420036443U CN 2760762 Y CN2760762 Y CN 2760762Y
- Authority
- CN
- China
- Prior art keywords
- layer
- gallium nitride
- light
- type
- roughened
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910002601 GaN Inorganic materials 0.000 title claims abstract description 64
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 title claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000004065 semiconductor Substances 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 142
- 229910052738 indium Inorganic materials 0.000 claims description 7
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 229910003437 indium oxide Inorganic materials 0.000 claims description 3
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 3
- 229910001887 tin oxide Inorganic materials 0.000 claims description 3
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 2
- 239000002344 surface layer Substances 0.000 claims description 2
- 238000007788 roughening Methods 0.000 claims 5
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 claims 1
- 238000000605 extraction Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 9
- 239000010931 gold Substances 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000004020 luminiscence type Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 2
- 229910001195 gallium oxide Inorganic materials 0.000 description 2
- -1 indium gallium nitride Chemical class 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NWAIGJYBQQYSPW-UHFFFAOYSA-N azanylidyneindigane Chemical compound [In]#N NWAIGJYBQQYSPW-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- YQNQTEBHHUSESQ-UHFFFAOYSA-N lithium aluminate Chemical compound [Li+].[O-][Al]=O YQNQTEBHHUSESQ-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
Landscapes
- Led Devices (AREA)
Abstract
Description
Claims (5)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2004200364438U CN2760762Y (zh) | 2004-04-08 | 2004-04-08 | 氮化镓系发光二极管结构 |
DE202004012665U DE202004012665U1 (de) | 2004-04-08 | 2004-08-12 | Leuchtdiodenanordnung auf Basis einer Galliumnitrid-Halbleiterverbindung |
GB0419630A GB2413008B8 (en) | 2004-04-08 | 2004-09-03 | GaN-based light-emitting diode structure |
FR0452048A FR2868878B3 (fr) | 2004-04-08 | 2004-09-14 | STRUCTURE DE DIODE ELECTROLUMINESCENTE A BASE DE GaN |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2004200364438U CN2760762Y (zh) | 2004-04-08 | 2004-04-08 | 氮化镓系发光二极管结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2760762Y true CN2760762Y (zh) | 2006-02-22 |
Family
ID=34171197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2004200364438U Expired - Lifetime CN2760762Y (zh) | 2004-04-08 | 2004-04-08 | 氮化镓系发光二极管结构 |
Country Status (4)
Country | Link |
---|---|
CN (1) | CN2760762Y (zh) |
DE (1) | DE202004012665U1 (zh) |
FR (1) | FR2868878B3 (zh) |
GB (1) | GB2413008B8 (zh) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102117871A (zh) * | 2009-12-31 | 2011-07-06 | 华新丽华股份有限公司 | 增益发光装置的电注入效率和出光效率的方法 |
CN101232068B (zh) * | 2007-01-25 | 2011-10-19 | 株式会社东芝 | 半导体发光元件 |
US8067780B2 (en) | 2006-09-05 | 2011-11-29 | Epistar Corporation | Light emitting device and the manufacture method thereof |
CN101150156B (zh) * | 2006-09-22 | 2012-05-30 | 晶元光电股份有限公司 | 发光元件及其制造方法 |
CN101685842B (zh) * | 2008-09-25 | 2012-12-05 | 晶元光电股份有限公司 | 光电半导体装置 |
US8513688B2 (en) | 2009-12-02 | 2013-08-20 | Walsin Lihwa Corporation | Method for enhancing electrical injection efficiency and light extraction efficiency of light-emitting devices |
CN103456858A (zh) * | 2012-05-28 | 2013-12-18 | 新世纪光电股份有限公司 | 发光元件及其制作方法 |
CN103594582A (zh) * | 2013-10-26 | 2014-02-19 | 溧阳市东大技术转移中心有限公司 | 一种高出光效率的垂直型发光二极管 |
CN104851947A (zh) * | 2015-04-21 | 2015-08-19 | 北京邮电大学 | 一种带有表面糙化透光结构的led芯片及其制作方法 |
CN105051916A (zh) * | 2012-07-31 | 2015-11-11 | 欧司朗光电半导体有限公司 | 用于光电子器件的反射性的接触层系统及其制造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102956781B (zh) * | 2011-08-31 | 2015-03-11 | 新世纪光电股份有限公司 | 发光元件及其制作方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5869849A (en) * | 1995-10-05 | 1999-02-09 | Industry Technology Research Institute | Light-emitting diodes with high illumination |
US5789768A (en) * | 1997-06-23 | 1998-08-04 | Epistar Corporation | Light emitting diode having transparent conductive oxide formed on the contact layer |
US6207972B1 (en) * | 1999-01-12 | 2001-03-27 | Super Epitaxial Products, Inc. | Light emitting diode with transparent window layer |
DE19926958B4 (de) * | 1999-06-14 | 2008-07-31 | Osram Opto Semiconductors Gmbh | Lichtemissions-Halbleiterdiode auf der Basis von Ga (In, AL) P-Verbindungen mit ZnO-Fensterschicht |
-
2004
- 2004-04-08 CN CNU2004200364438U patent/CN2760762Y/zh not_active Expired - Lifetime
- 2004-08-12 DE DE202004012665U patent/DE202004012665U1/de not_active Expired - Lifetime
- 2004-09-03 GB GB0419630A patent/GB2413008B8/en not_active Expired - Fee Related
- 2004-09-14 FR FR0452048A patent/FR2868878B3/fr not_active Expired - Lifetime
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8664686B2 (en) | 2006-09-05 | 2014-03-04 | Epistar Corporation | Light emitting device and the manufacture method thereof |
US8067780B2 (en) | 2006-09-05 | 2011-11-29 | Epistar Corporation | Light emitting device and the manufacture method thereof |
CN101150156B (zh) * | 2006-09-22 | 2012-05-30 | 晶元光电股份有限公司 | 发光元件及其制造方法 |
CN101232068B (zh) * | 2007-01-25 | 2011-10-19 | 株式会社东芝 | 半导体发光元件 |
CN101685842B (zh) * | 2008-09-25 | 2012-12-05 | 晶元光电股份有限公司 | 光电半导体装置 |
US8513688B2 (en) | 2009-12-02 | 2013-08-20 | Walsin Lihwa Corporation | Method for enhancing electrical injection efficiency and light extraction efficiency of light-emitting devices |
CN102117871A (zh) * | 2009-12-31 | 2011-07-06 | 华新丽华股份有限公司 | 增益发光装置的电注入效率和出光效率的方法 |
CN103456858A (zh) * | 2012-05-28 | 2013-12-18 | 新世纪光电股份有限公司 | 发光元件及其制作方法 |
CN103456858B (zh) * | 2012-05-28 | 2016-09-14 | 新世纪光电股份有限公司 | 发光元件及其制作方法 |
CN105051916A (zh) * | 2012-07-31 | 2015-11-11 | 欧司朗光电半导体有限公司 | 用于光电子器件的反射性的接触层系统及其制造方法 |
CN105051916B (zh) * | 2012-07-31 | 2017-07-25 | 欧司朗光电半导体有限公司 | 用于光电子器件的反射性的接触层系统及其制造方法 |
CN103594582A (zh) * | 2013-10-26 | 2014-02-19 | 溧阳市东大技术转移中心有限公司 | 一种高出光效率的垂直型发光二极管 |
CN103594582B (zh) * | 2013-10-26 | 2016-04-27 | 溧阳市东大技术转移中心有限公司 | 一种高出光效率的垂直型发光二极管 |
CN104851947A (zh) * | 2015-04-21 | 2015-08-19 | 北京邮电大学 | 一种带有表面糙化透光结构的led芯片及其制作方法 |
CN104851947B (zh) * | 2015-04-21 | 2017-11-14 | 北京邮电大学 | 一种带有表面糙化透光结构的led芯片及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
DE202004012665U1 (de) | 2005-02-03 |
FR2868878B3 (fr) | 2006-03-24 |
GB2413008B (en) | 2006-06-28 |
GB2413008B8 (en) | 2007-01-15 |
GB0419630D0 (en) | 2004-10-06 |
FR2868878A3 (fr) | 2005-10-14 |
GB2413008A (en) | 2005-10-12 |
GB2413008A8 (en) | 2007-01-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: XUMING PHOTOELECTRICITY INC. Free format text: FORMER OWNER: JUXIN SCI-TECH CO., LTD. Effective date: 20121219 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20121219 Address after: Miaoli County, Taiwan, China Patentee after: Xuming Photoelectricity Inc. Address before: China Taiwan Taoyuan County Patentee before: Juxin Sci-Tech Co., Ltd. |
|
C17 | Cessation of patent right | ||
CX01 | Expiry of patent term |
Expiration termination date: 20140408 Granted publication date: 20060222 |