CN2715467Y - Covering board with stress-relieving design - Google Patents
Covering board with stress-relieving design Download PDFInfo
- Publication number
- CN2715467Y CN2715467Y CN 200420073210 CN200420073210U CN2715467Y CN 2715467 Y CN2715467 Y CN 2715467Y CN 200420073210 CN200420073210 CN 200420073210 CN 200420073210 U CN200420073210 U CN 200420073210U CN 2715467 Y CN2715467 Y CN 2715467Y
- Authority
- CN
- China
- Prior art keywords
- overlay
- circuit board
- board
- stress
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a covering board with stress-relieving design used for covering a circuit board which is provided with electronic circuits. When stress is pressed on the zigzag position of the circuit board, the circuit board is zigzagged. The covering board with stress-relieving design provided by the utility model is characterized in that the edge of the covering plate which is adjacent to the zigzag position is in wavy shape, and the circuit board is a soft plate which is one of a single-side plate, a double-side plate, a multi-layer plate and a soft and hard combining plate. The covering plate can be an insulating plate which is mode of liquid light-sensitive glue, polyimide, polyester or substituted materials. The covering plate can also be a reinforcing plate used for reinforcing the strength of the circuit board, and therefore, the circuit board does not break when the stress is pressed on the zigzag position of the circuit board.
Description
Technical field
The utility model relates to a kind of overlay, relates in particular to a kind of overlay with the design that eliminates stress.
Background technology
See also Figure 1A～1C, Figure 1A～1C is known in the schematic diagram that forms overlay on the circuit board.Shown in Figure 1A, have several electronic circuits 10 on the known circuit board 5.This circuit board 5 can be one of them soft board of single sided board, double sided board, multi-layer sheet and Rigid Flex.
If when needing protection electronic circuit 10, can be by on the circuit board 5 that covers for the overlay 15 of insulation board shown in Figure 1A, shown in Figure 1B, and the top edge of overlay 15 aligns with tortuous place 1.Or, when strengthening the intensity of circuit board 5 as if needs, can be by on the circuit board 5 that covers for the overlay 15 of stiffening plate shown in Figure 1A.Wherein, the overlay 15 that can be insulation board can be the liquid photoresists (Liquid Photo Imageable, LPI), polyimides (Polyimide, PI), polyester (Polyester) or other replaceable material form.The overlay 15 that can be stiffening plate mainly is the intensity in order to intensifier circuit plate 5, and can be polyimides (Polyimide, PI), poly-terephthaldehyde's diethylester (PET), FR-4 epoxy resin, polyester (Polyester), sheet metal or other replaceable adamant form.
Yet, if shown in Fig. 1 C, when imposing stress and desiring in complications place 1 with tortuous circuit board 5, the external form of the top edge of the overlay 15 that will be close to because of the complications place 1 with circuit board 5 is a straight line, so 1 concentrated this stress in the complications place causes circuit board 5 fractures easily.
The utility model content
Main purpose of the present utility model is to provide a kind of overlay with the design that eliminates stress, and by being wavy overlay with the edge external form, avoiding stress concentrations in the complications place, and causes circuit board to rupture from complications.
To achieve these goals, the utility model provides a kind of overlay with the design that eliminates stress, have on the circuit board of electronic circuit in order to cover one, when the tortuous place to this circuit board imposes stress, this circuit board will be by complications, it is characterized in that the edge external form that is adjacent to this overlay at this complications place is one wavy.
Aforesaid overlay, wherein this circuit board is a soft board, this soft board can be a single sided board, a double sided board, a multi-layer sheet and a Rigid Flex one of them.
Aforesaid overlay, wherein this overlay is an insulation board, this insulation board can be liquid photoresists (Liquid Photo Imageable, LPI), a polyimides (Polyimide, PI), a polyester (Polyester) or other replaceable material form.
Aforesaid overlay, wherein this overlay is a stiffening plate, this stiffening plate is in order to strengthen the intensity of this circuit board, and can be a polyimides (Polyimide, PI), poly-terephthaldehyde's diethylester (PET), a FR-4 epoxy resin, a polyester (Polyester), a sheet metal or other replaceable adamant form.
Aforesaid overlay, when wherein this overlay was this stiffening plate, this overlay can be covered on this circuit board with electronic circuit.
Aforesaid overlay, when wherein this overlay was this stiffening plate, this overlay can be covered on non-this circuit board with electronic circuit.
A kind of overlay with the design that eliminates stress that the utility model provides, this overlay mainly is to cover on the circuit board with electronic circuit.Because this overlay is wavy at the edge of the overlay that is adjacent to tortuous place, so, when the complications place to circuit board imposes stress, not therefore fracture of circuit board.
Can be further understood by following utility model detailed description and accompanying drawing about advantage of the present utility model and spirit.
Description of drawings
Figure 1A～1C is known in the schematic diagram that forms overlay on the circuit board.
Fig. 2 is the schematic diagram of first embodiment that the utlity model has the overlay of the design that eliminates stress.
Fig. 3 is the schematic diagram of second embodiment that the utlity model has the overlay of the design that eliminates stress.
Wherein, description of reference numerals is as follows:
1 tortuous place, 5 circuit boards
10 electronic circuits, 15,20,30 overlays
Embodiment
See also Fig. 2, Fig. 2 is the schematic diagram of first embodiment that the utlity model has the overlay of the design that eliminates stress.When if overlay 20 is insulation board, as shown in Figure 2, the overlay 20 that the utlity model has the design that eliminates stress is wavy in the edge external form that is adjacent to tortuous place 1.The overlay 20 of insulation board can be equally the liquid photoresists (Liquid Photo Imageable, LPI), polyimides (Polyimide, PI), polyester (Polyester) or other replaceable material form.
The utility model just is being based on the particular edge design for overlay 20 as shown in Figure 2, and can be at needs during from tortuous this circuit board 5 of complications 1, can be wavy because of the edge external form of overlay 20, avoid as known overlay 15 the stress concentrations in complications place 1, and cause circuit board 15 from complications 1 fracture.
See also Fig. 3, Fig. 3 is the schematic diagram of second embodiment that the utlity model has the overlay of the design that eliminates stress.When if overlay 30 is stiffening plate, as shown in Figure 3, the overlay 30 that the utlity model has the design that eliminates stress is wavy in the edge external form that is adjacent to tortuous place 1 equally.For the overlay 30 of stiffening plate mainly is a intensity in order to intensifier circuit plate 5, and can be polyimides (Polyimide, PI), poly-terephthaldehyde's diethylester (PET), FR-4 epoxy resin, polyester (Polyester), sheet metal or other replaceable adamant form.
Similarly, the utility model still is based on the particular edge design for overlay 30 as shown in Figure 3, and can be at needs during from tortuous this circuit board 5 of complications 1, can be wavy because of the edge external form of overlay 30, avoid as known overlay 15 the stress concentrations in complications place 1, and cause circuit board 15 from complications 1 fracture.
But, for the overlay 30 of stiffening plate and may not be certain to cover on as shown in Figure 3 the circuit board with electronic circuit 10 5, also it can be covered on the side of non-circuit board 5 with electronic circuit 10.
By the above detailed description of preferred embodiments, can know more and describe feature of the present utility model and spirit, and be not to come category of the present utility model is limited with the above-mentioned preferred embodiment that is disclosed.On the contrary, its objective is and to contain being arranged in the utility model scope of various changes and tool equality.
Claims (6)
1, a kind of overlay with the design that eliminates stress, have on the circuit board of electronic circuit in order to cover one, complications of this circuit board are located to impose stress, this circuit board is by complications, it is characterized in that the edge external form that is adjacent to this overlay at this complications place is one wavy.
2, overlay as claimed in claim 1 is characterized in that this circuit board is a soft board, this soft board be a single sided board, a double sided board, a multi-layer sheet and a Rigid Flex one of them.
3, overlay as claimed in claim 1 is characterized in that this overlay is an insulation board, and this insulation board is formed by liquid photoresists, a polyimides or a polyester material.
4, overlay as claimed in claim 1, it is characterized in that this overlay is a stiffening plate in order to the intensity that strengthens this circuit board, and this stiffening plate is formed by a polyimides, poly-terephthaldehyde's diethylester, a FR-4 epoxy resin, a polyester or a sheet metal adamant.
5, overlay as claimed in claim 1 is characterized in that this overlay is a stiffening plate, and this overlay is covered on this circuit board with electronic circuit.
6, overlay as claimed in claim 1 is characterized in that this overlay is a stiffening plate, and this overlay is covered on non-this circuit board with electronic circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420073210 CN2715467Y (en) | 2004-06-24 | 2004-06-24 | Covering board with stress-relieving design |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420073210 CN2715467Y (en) | 2004-06-24 | 2004-06-24 | Covering board with stress-relieving design |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2715467Y true CN2715467Y (en) | 2005-08-03 |
Family
ID=34874208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420073210 Expired - Fee Related CN2715467Y (en) | 2004-06-24 | 2004-06-24 | Covering board with stress-relieving design |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2715467Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110470160A (en) * | 2014-10-28 | 2019-11-19 | 科罗拉多州立大学董事会法人团体 | Hot ground plane based on polymer, micro manufacturing |
| CN110999545A (en) * | 2017-08-14 | 2020-04-10 | 住友电气工业株式会社 | Flexible printed circuit board |
| US11353269B2 (en) | 2009-03-06 | 2022-06-07 | Kelvin Thermal Technologies, Inc. | Thermal ground plane |
| US11598594B2 (en) | 2014-09-17 | 2023-03-07 | The Regents Of The University Of Colorado | Micropillar-enabled thermal ground plane |
| US11930621B2 (en) | 2020-06-19 | 2024-03-12 | Kelvin Thermal Technologies, Inc. | Folding thermal ground plane |
-
2004
- 2004-06-24 CN CN 200420073210 patent/CN2715467Y/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11353269B2 (en) | 2009-03-06 | 2022-06-07 | Kelvin Thermal Technologies, Inc. | Thermal ground plane |
| US11598594B2 (en) | 2014-09-17 | 2023-03-07 | The Regents Of The University Of Colorado | Micropillar-enabled thermal ground plane |
| CN110470160A (en) * | 2014-10-28 | 2019-11-19 | 科罗拉多州立大学董事会法人团体 | Hot ground plane based on polymer, micro manufacturing |
| CN110999545A (en) * | 2017-08-14 | 2020-04-10 | 住友电气工业株式会社 | Flexible printed circuit board |
| CN110999545B (en) * | 2017-08-14 | 2023-06-20 | 住友电气工业株式会社 | Flexible printed circuit board |
| US11930621B2 (en) | 2020-06-19 | 2024-03-12 | Kelvin Thermal Technologies, Inc. | Folding thermal ground plane |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Career Electronic (Kunshan) Co., Ltd. Assignor: Career Technology Mfg. Co., Ltd. Contract fulfillment period: 2006.10.20 to 2012.10.19 Contract record no.: 2008990000726 Denomination of utility model: Covering board with stress-relieving design Granted publication date: 20050803 License type: Exclusive license Record date: 20081014 |
|
| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2006.10.20 TO 2012.10.19; CHANGE OF CONTRACT Name of requester: JIALIANYI ELECTRONIC ( KUNSHAN ) CO., LTD. Effective date: 20081014 |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050803 Termination date: 20110624 |