TWI691878B - Portable electronic device and touch control module thereof - Google Patents
Portable electronic device and touch control module thereof Download PDFInfo
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- TWI691878B TWI691878B TW107144066A TW107144066A TWI691878B TW I691878 B TWI691878 B TW I691878B TW 107144066 A TW107144066 A TW 107144066A TW 107144066 A TW107144066 A TW 107144066A TW I691878 B TWI691878 B TW I691878B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
- G06F1/169—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being an integrated pointing device, e.g. trackball in the palm rest area, mini-joystick integrated between keyboard keys, touch pads or touch stripes
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
- G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
Abstract
Description
本發明係有關於一種觸控模組。更具體地來說,本發明有關於一種具有高分子複合材料(polymer composites)之電路板的觸控模組。The invention relates to a touch module. More specifically, the present invention relates to a touch module having a circuit board with polymer composites.
觸控板(touch pad)是一種常見於筆記型電腦的輸入介面,其中在觸控板內部通常設有金屬片以作為支撐結構。此外,前述金屬片往往也能夠用來作為屏蔽構件,以解決電磁干擾 (Electro-Magnetic Interference)和靜電放電(Electrostatic Discharge, ESD)等問題。有關前述金屬片之若干應用可見於中華民國公告第M285760號、第422364號以及中華民國公開第200931302號等專利案中。A touch pad (touch pad) is an input interface commonly found in notebook computers, in which a metal sheet is usually provided inside the touch pad as a support structure. In addition, the aforementioned metal sheet can also be used as a shielding member to solve problems such as Electro-Magnetic Interference and Electrostatic Discharge (ESD). Several applications related to the aforementioned metal sheets can be found in patent cases such as Republic of China Announcement Nos. M285760, 422364, and Republic of China Publication No. 200931302.
然而,傳統的金屬片不僅具有成本高昂和組裝精度不佳等問題,其重量也相當可觀,因此往往會增加觸控板的製造成本,且不利於達成電子產品的輕量化。有鑒於此,如何能避免傳統觸控板內部金屬片所產生的前述問題點,並促進電子產品的輕量化始成一重要之課題。However, the traditional metal sheet not only has the problems of high cost and poor assembly accuracy, but also has considerable weight. Therefore, the manufacturing cost of the touch panel is often increased, and it is not conducive to achieving weight reduction of electronic products. In view of this, how to avoid the aforementioned problems caused by the metal sheet inside the conventional touch panel and promote the weight reduction of electronic products has become an important issue.
為了解決上述習知之問題點,本發明一實施例提供一種觸控模組,包括一觸控板、一保護層、一電路板以及至少一鎖片,前述保護層設置於前述觸控板之一頂面,前述電路板設置於前述觸控板之一底面且含有高分子複合材料,其中前述鎖片嵌入前述電路板內部。In order to solve the above-mentioned problems, an embodiment of the present invention provides a touch module, including a touch panel, a protective layer, a circuit board and at least one locking plate, the protective layer is disposed on one of the touch panels On the top surface, the circuit board is disposed on a bottom surface of the touch panel and contains a polymer composite material, wherein the locking piece is embedded inside the circuit board.
於一實施例中,前述鎖片具有至少一卡勾,前述卡勾具有U字形結構並嵌入前述電路板內部。In an embodiment, the locking piece has at least one hook, and the hook has a U-shaped structure and is embedded inside the circuit board.
於一實施例中,前述鎖片具有一Z字形結構。In one embodiment, the locking plate has a zigzag structure.
於一實施例中,前述電路板含有熱固性樹脂。In one embodiment, the aforementioned circuit board contains thermosetting resin.
於一實施例中,前述電路板具有一FR-4基板,且前述鎖片透過表面黏著技術而固定於前述電路板之一底側表面。In one embodiment, the circuit board has an FR-4 substrate, and the locking piece is fixed to a bottom surface of the circuit board by surface bonding technology.
於一實施例中,前述保護層具有玻璃、玻璃纖維或聚對苯二甲酸乙二酯材質。In one embodiment, the protective layer is made of glass, fiberglass, or polyethylene terephthalate.
於一實施例中,前述觸控模組更包括一螺柱以及一螺絲,且前述鎖片呈平板狀,其中前述螺柱鎖固於前述電路板之一底側表面,且前述螺絲穿過前述鎖片並鎖固於前述螺柱上。In an embodiment, the touch module further includes a stud and a screw, and the locking piece is in the shape of a flat plate, wherein the stud is locked to a bottom surface of the circuit board, and the screw passes through the The locking piece is locked on the aforementioned stud.
於一實施例中,前述觸控模組更包括一長條形之可撓性件,且前述電路板形成有一凹槽,其中前述可撓性件嵌入前述電路板內部且橫跨前述凹槽。In one embodiment, the touch module further includes an elongated flexible member, and the circuit board is formed with a groove, wherein the flexible member is embedded inside the circuit board and spans the groove.
於一實施例中,前述可撓性件具有至少一卡勾,前述卡勾具有U字形結構並嵌入前述電路板內部。In one embodiment, the flexible member has at least one hook, and the hook has a U-shaped structure and is embedded inside the circuit board.
本發明一實施例更提供一種可攜式電子裝置,包括相互樞接之一輸入單元以及一顯示單元,其中前述輸入單元包括一上殼體、一下殼體以及如前所述之觸控模組,其中前述上殼體連接前述下殼體,且前述鎖片連接前述電路板以及前述上殼體。An embodiment of the present invention further provides a portable electronic device including an input unit and a display unit pivotally connected to each other, wherein the input unit includes an upper casing, a lower casing and the touch module as described above , Wherein the upper case is connected to the lower case, and the locking piece is connected to the circuit board and the upper case.
以下說明本發明實施例之可攜式電子裝置及其觸控模組。然而,可輕易了解本發明實施例提供許多合適的發明概念而可實施於廣泛的各種特定背景。所揭示的特定實施例僅僅用於說明以特定方法使用本發明,並非用以侷限本發明的範圍。The following describes a portable electronic device and its touch module according to embodiments of the present invention. However, it can be easily understood that the embodiments of the present invention provide many suitable inventive concepts and can be implemented in a wide variety of specific contexts. The specific embodiments disclosed are only used to illustrate the use of the present invention in a specific method, and are not intended to limit the scope of the present invention.
除非另外定義,在此使用的全部用語(包括技術及科學用語)具有與此篇揭露所屬之一般技藝者所通常理解的相同涵義。能理解的是這些用語,例如在通常使用的字典中定義的用語,應被解讀成具有一與相關技術及本揭露的背景或上下文一致的意思,而不應以一理想化或過度正式的方式解讀,除非在此特別定義。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the disclosure. It is understandable that these terms, such as those defined in commonly used dictionaries, should be interpreted to have a meaning consistent with the background or context of the relevant technology and this disclosure, and not in an idealized or excessively formal manner Interpretation, unless specifically defined here.
有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之一較佳實施例的詳細說明中,將可清楚的呈現。以下實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明並非用來限制本發明。The foregoing and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description with reference to one of the preferred embodiments of the drawings. The direction words mentioned in the following embodiments, for example: up, down, left, right, front or back, etc., are only for the directions referring to the attached drawings. Therefore, the directional terminology is used to illustrate rather than limit the invention.
首先請參閱第1圖,第1圖表示本發明一實施例之可攜式電子裝置100的示意圖。如第1圖所示,本實施例之可攜式電子裝置100例如為一筆記型電腦,其主要包含有一顯示單元10、一輸入單元20以及至少一樞軸H;舉例而言,前述顯示單元10可為一液晶顯示器且具有一顯示螢幕11,其可透過樞軸H而與輸入單元20相互樞接,以使顯示單元10可相對於輸入單元20旋轉。Please refer to FIG. 1 first. FIG. 1 shows a schematic diagram of a portable
從第1圖可以看出,前述輸入單元20具有相互連接之一上殼體21以及一下殼體22,其中在上殼體21的頂側設有一觸控模組30以及一鍵盤模組k,使用者在操作可攜式電子裝置100時,可透過前述觸控模組30以及鍵盤模組k輸入資料,或者控制顯示螢幕11上的游標;此外,當使用者結束操作而欲關閉可攜式電子裝置100時,則可將顯示單元10與輸入單元20疊合以方便收納。As can be seen from FIG. 1, the
接著請一併參閱第2~6圖,第2圖表示第1圖中之觸控模組30的爆炸圖,第3圖表示第2圖中之可撓性件34的放大圖,第4圖表示第2圖中之鎖片35的放大圖,第5、6圖則分別表示第1圖中之觸控模組30組合後於不同視角的立體圖。Then please refer to FIGS. 2-6 together, FIG. 2 shows an exploded view of the
如第2~6圖所示,本實施例之觸控模組30主要包括一保護層31、一觸控板32、一電路板33、一長條形之可撓性件34以及至少一鎖片35,其中保護層31覆蓋觸控板32的頂面,電路板33則固定於觸控板32的底面。As shown in FIGS. 2-6, the
應了解的是,前述可撓性件34以及鎖片35主要係用以連接前述電路板33和輸入單元20的上殼體21。在本實施例中,前述可撓性件34以及鎖片35可具有金屬材質,如此一來電路板33內部的接地線路便能透過可撓性件34或鎖片35而電性連接到輸入單元20的上殼體21。It should be understood that the aforementioned
前述保護層31可採用具有高結構強度之玻璃或玻璃纖維(carbon fiber)材質,然而其亦可採用具絕緣特性之聚對苯二甲酸乙二酯(polyethylene terephthalate, PET)材質。舉例而言,前述保護層31可採用杜邦公司(DuPont)所生產的麥拉薄膜(Mylar film),用以保護並電性隔離其下方的觸控板32。The
此外,為了達到觸控模組30的輕量化,本實施例中之電路板33係採用由高分子複合材料(polymer composites)加工製作而成的印刷電路板(Printed circuit board, PCB),其主要係由高結構強度之基板(例如FR-4基板)以及形成於其內部之金屬電路所構成。舉例而言,前述電路板33可含有銅箔(copper foil)、玻璃纖維(glass fiber)以及熱固性樹脂(thermosetting resin)等材質,其中前述熱固性樹脂例如為環氧樹脂(epoxy)。In addition, in order to reduce the weight of the
從第2、6圖中可以看出,在前述電路板33之一側形成有一凹槽331,其中可撓性件34橫跨前述凹槽331,且位於其兩端之U字形卡勾341係嵌入並固定於電路板33上的兩個狹縫332內;此外,在前述可撓性件34上更形成有至少一鎖固孔342,組裝時可透過螺絲等鎖固件穿過前述鎖固孔342,藉以將可撓性件34固定於輸入單元20的上殼體21。
As can be seen from FIGS. 2 and 6, a
應了解的是,由於前述可撓性件34具有可變形之特性,因此當使用者以手指朝下方(-Z軸方向)按壓並施加一壓力予前述保護層31時,保護層31、觸控板32以及電路板33會一起相對於輸入單元20的上殼體21下沉,並使位在電路板33下方之一圓盤狀之彈性體(未圖示)接觸到可撓性件34,其中前述彈性體例如為金屬彈片(metal dome)。
It should be understood that, because the
接著,當使用者釋放前述壓力後,前述彈性體和可撓性件34則可提供一彈性回復力,使得保護層31、觸控板32以及電路板33回復到原先的初始位置,藉以方便使用者透過觸控模組30執行點擊(click)的動作,並可提供使用者良好的按壓觸感(tactile feeling)。
Then, after the user releases the pressure, the elastic body and the
需特別說明的是,由於本實施例中的電路板33係以複合材料基板(例如FR-4基板)加工製作而成,如此一來不僅有利於將可撓性件34上之至少一卡勾341穩固地嵌入電路板33上的狹縫332內,更可直接透過表面黏著技術(Surface-mount technology,SMT)等自動化製程以提升可撓性件34與電路板33之間的組裝精度與結合強度,從而能大幅降低組裝成本、提升組裝效率並增進產品的良率。再者,由於複合材料基板的密度係較傳統金屬片的密度更小且重量更輕,因此本實施例尚兼具有促進電子產品輕量化之顯著功效。
It should be particularly noted that, since the
接著請一併參閱第2、4、6圖,本實施例中之鎖片35大致呈一Z字形結構,其主要含有一第一段部P1、一第二段部P2以及一第三段部P3(第4圖),且第三段部P3係連接第一段部P1以及第二段部P2。從第4圖中可以看出,在第一段部P1的兩側分別形成有一U字形之卡勾351,且在第二段部P2上則形成有至少一鎖固孔352,凸出於電路板33之一邊緣,組裝時可使前述卡勾351嵌入電路板33上的狹縫333(第2圖),並可透過螺絲等鎖固件穿過前述鎖固孔352,藉以將鎖片35之第二段部P2連接輸入單元20的上殼體21。Next, please refer to FIGS. 2, 4, and 6 together. In this embodiment, the
如前所述,由於本實施例中之電路板33係以複合材料基板(例如FR-4基板)加工製作而成,不僅可有利於將鎖片35上之至少一卡勾351穩固地嵌入電路板33內部,同時也能透過表面黏著技術(Surface-mount technology, SMT)等自動化製程以提升鎖片35與電路板33之間的組裝精度與結合強度,從而可大幅降低組裝成本、提升組裝效率並增進產品的良率。As mentioned above, since the
再請參閱第7圖,第7圖表示沿第6圖中之線段A1-A2的剖視圖。如第7圖所示,由於本實施例中之卡勾351係呈扁平狀且具有U字形結構,因此可在組裝時將其嵌入電路板33上的狹縫333內,其中卡勾351的寬度可等於或略大於狹縫333的寬度。舉例而言,組裝前可預先在電路板33之底側表面330的局部區域塗佈錫膏,然後將卡勾351嵌入電路板33底側的狹縫333,接著再透過表面黏著技術(Surface-mount technology, SMT)等自動化製程使鎖片35和電路板33中的導線(未圖示)電性連接。Please refer to FIG. 7 again, which shows a cross-sectional view along the line A1-A2 in FIG. 6. As shown in FIG. 7, since the
如前所述,本實施例主要係以含有高分子複合材料之電路板33取代傳統的金屬片,如此一來不僅在整體重量上可較傳統的觸控模組更輕,也能夠透過單一製程(例如表面黏著技術)而快速地將可撓性件34以及鎖片35一起固定在電路板33上,所以可具有大幅增加生產效率以及降低製造成本之顯著功效,此外也能增加可撓性件34、鎖片35和電路板33之間的結合強度,以有效地提升觸控模組30的可靠度與產品良率。As mentioned above, this embodiment mainly replaces the traditional metal sheet with a
再請參閱第8圖,第8圖表示本發明另一實施例之鎖片35固定於電路板33之底側表面330的剖視圖。需特別說明的是,為了避免前述Z字形之鎖片35在組裝過程中因為組立公差(assembly tolerance)而影響到電路板33和上殼體21之間的組裝精度,於本實施例中係改以平板狀之鎖片35’取代前述Z字形之鎖片35,且在鎖片35’並不需要形成前述卡勾351,其中鎖片35’會凸出於電路板33之一邊緣。Please refer to FIG. 8 again. FIG. 8 shows a cross-sectional view of another embodiment of the present invention where the
如第8圖所示,組裝時可先將一螺柱S1(threaded pillar)鎖固在電路板33的底側表面330,然後可利用螺絲S2穿過平板狀之鎖片35’,藉以將鎖片35’鎖固於螺柱S1的頂側,如此一來鎖片35’便能維持於單一高度上以確保其平整度。As shown in FIG. 8, a threaded pillar S1 (threaded pillar) may be locked on the
最後請參閱第9圖,第9圖表示本發明另一實施例之觸控模組40的爆炸圖。如第9圖所示,本實施例之觸控模組40主要係用以取代第1、2圖中的觸控模組30,其主要包含有一保護層41、一觸控板42、一電路板43以及至少一鎖片45。Finally, please refer to FIG. 9, which shows an exploded view of the
應了解的是,本實施例中的保護層41、觸控板42、電路板43以及鎖片45可以和第2圖所示的保護層31、觸控板32、電路板33、鎖片35採用相同的材質,惟本實施例中之觸控模組40並未設有如第2圖所示的可撓性件34,且本實施例中之電路板43並未形成有如第2圖所示的凹槽331。It should be understood that the
從第9圖中可以看出,保護層41係覆蓋於觸控板42的頂面,電路板43則是連接於觸控板42的底側表面。舉例而言,前述保護層41可採用具有高結構強度之玻璃或玻璃纖維(carbon fiber)材質,然而其亦可含有具絕緣特性之聚對苯二甲酸乙二酯(polyethylene terephthalate, PET)材質。在本實施例中,前述保護層31係採用杜邦公司(DuPont)所生產的麥拉薄膜(Mylar film),以保護並電性隔離其下方的觸控板42。As can be seen from FIG. 9, the
另一方面,前述電路板43則可為一印刷電路板(Printed circuit board, PCB),且其含有由複合材料所製成的高強度基板(例如FR-4基板)。舉例而言,前述電路板43可含有銅箔(copper foil)、玻璃纖維(glass fiber)以及熱固性樹脂(thermosetting resin)等材質,其中前述熱固性樹脂例如為環氧樹脂(epoxy)。On the other hand, the
由於本實施例中之電路板43係以複合材料基板(例如FR-4基板)加工所製成,如此一來可有利於將鎖片45兩側的卡勾451穩固地嵌入電路板43內部,同時也能有助於透過表面黏著技術(Surface-mount technology, SMT)等自動化製程以有效提升鎖片45與電路板43之間的組裝精度與結合強度,從而能大幅降低組裝成本、提升組裝效率並增進產品的良率。再者,由於複合材料基板的密度係較傳統金屬片的密度更小且重量更輕,因此尚兼具有促進電子產品輕量化之顯著功效。Since the
雖然本發明的實施例及其優點已揭露如上,但應該瞭解的是,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作更動、替代與潤飾。此外,本發明之保護範圍並未侷限於說明書內所述特定實施例中的製程、機器、製造、物質組成、裝置、方法及步驟,任何所屬技術領域中具有通常知識者可從本發明揭示內容中理解現行或未來所發展出的製程、機器、製造、物質組成、裝置、方法及步驟,只要可以在此處所述實施例中實施大抵相同功能或獲得大抵相同結果皆可根據本發明使用。因此,本發明之保護範圍包括上述製程、機器、製造、物質組成、裝置、方法及步驟。另外,每一申請專利範圍構成個別的實施例,且本發明之保護範圍也包括各個申請專利範圍及實施例的組合。Although the embodiments and advantages of the present invention have been disclosed above, it should be understood that any person with ordinary knowledge in the technical field can make changes, substitutions, and retouching without departing from the spirit and scope of the present invention. In addition, the scope of protection of the present invention is not limited to the processes, machines, manufacturing, material composition, devices, methods, and steps in the specific embodiments described in the specification. Anyone with ordinary knowledge in the technical field can disclose the content of the present invention It is understood that current or future developed processes, machines, manufacturing, material composition, devices, methods, and steps can be used according to the present invention as long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein. Therefore, the protection scope of the present invention includes the above processes, machines, manufacturing, material composition, devices, methods and steps. In addition, each patent application scope constitutes an individual embodiment, and the protection scope of the present invention also includes a combination of each patent application scope and embodiment.
雖然本發明以前述數個較佳實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可做些許之更動與潤飾。因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。此外,每個申請專利範圍建構成一獨立的實施例,且各種申請專利範圍及實施例之組合皆介於本發明之範圍內。Although the present invention is disclosed as the foregoing several preferred embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention belongs can make some changes and retouching without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined in the appended patent application. In addition, each patent application scope is constructed as an independent embodiment, and various combinations of patent application scopes and embodiments are within the scope of the present invention.
100:可攜式電子裝置 100: portable electronic device
10:顯示單元 10: display unit
11:顯示螢幕 11: Display screen
20:輸入單元 20: input unit
21:上殼體 21: Upper case
22:下殼體 22: Lower case
30:觸控模組 30: Touch module
31:保護層 31: protective layer
32:觸控板 32: Touchpad
33:電路板 33: circuit board
330:底側表面 330: bottom surface
331:凹槽 331: groove
332:狹縫 332: slit
333:狹縫 333: slit
34:可撓性件 34: Flexible piece
341:卡勾 341: Card hook
342:鎖固孔 342: Locking hole
35:鎖片 35: Lock tab
35’:鎖片 35’: Lock tab
351:卡勾 351: Card hook
352:鎖固孔 352: Locking hole
41:保護層 41: protective layer
42:觸控板 42: Touchpad
43:電路板 43: Circuit board
45:鎖片 45: Lock plate
451:卡勾 451: Card hook
H:樞軸 H: pivot
k:鍵盤模組 k: keyboard module
P1:第一段部 P1: The first section
P2:第二段部 P2: The second section
P3:第三段部 P3: The third section
S1:螺柱 S1: stud
S2:螺絲 S2: screw
第1圖表示本發明一實施例之可攜式電子裝置100的示意圖。 第2圖表示第1圖中之觸控模組30的爆炸圖。 第3圖表示第2圖中之可撓性件34的放大圖。 第4圖表示第2圖中之鎖片35的放大圖。 第5、6圖分別表示第1圖中之觸控模組30組合後於不同視角的立體圖。 第7圖表示沿第6圖中之線段A1-A2的剖視圖。 第8圖表示本發明另一實施例之鎖片35固定於電路板33之底側表面330的剖視圖。 第9圖表示本發明另一實施例之觸控模組40的爆炸圖。FIG. 1 shows a schematic diagram of a portable
30:觸控模組 30: Touch module
31:保護層 31: protective layer
32:觸控板 32: Touchpad
33:電路板 33: circuit board
330:底側表面 330: bottom surface
331:凹槽 331: groove
332:狹縫 332: slit
333:狹縫 333: slit
34:可撓性件 34: Flexible piece
341:卡勾 341: Card hook
342:鎖固孔 342: Locking hole
35:鎖片 35: Lock tab
351:卡勾 351: Card hook
352:鎖固孔 352: Locking hole
Claims (16)
Priority Applications (2)
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TW107144066A TWI691878B (en) | 2018-12-07 | 2018-12-07 | Portable electronic device and touch control module thereof |
CN201910025379.4A CN111290523B (en) | 2018-12-07 | 2019-01-11 | Portable electronic device and touch module thereof |
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TW107144066A TWI691878B (en) | 2018-12-07 | 2018-12-07 | Portable electronic device and touch control module thereof |
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TWI691878B true TWI691878B (en) | 2020-04-21 |
TW202022577A TW202022577A (en) | 2020-06-16 |
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Cited By (1)
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TWI776689B (en) * | 2021-02-02 | 2022-09-01 | 仁寶電腦工業股份有限公司 | Touchpad module |
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TW201710850A (en) * | 2015-09-14 | 2017-03-16 | 群光電子股份有限公司 | Touch pad assembly |
CN107817876A (en) * | 2017-11-24 | 2018-03-20 | 陕西再造故乡文化发展有限公司 | A kind of one body style touch pad fixing device |
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CN105280567B (en) * | 2014-06-19 | 2018-12-28 | 株式会社吉帝伟士 | Semiconductor package assembly and a manufacturing method thereof |
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TW201710850A (en) * | 2015-09-14 | 2017-03-16 | 群光電子股份有限公司 | Touch pad assembly |
CN107817876A (en) * | 2017-11-24 | 2018-03-20 | 陕西再造故乡文化发展有限公司 | A kind of one body style touch pad fixing device |
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TWI776689B (en) * | 2021-02-02 | 2022-09-01 | 仁寶電腦工業股份有限公司 | Touchpad module |
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