TW202022577A - Portable electronic device and touch control module thereof - Google Patents

Portable electronic device and touch control module thereof Download PDF

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Publication number
TW202022577A
TW202022577A TW107144066A TW107144066A TW202022577A TW 202022577 A TW202022577 A TW 202022577A TW 107144066 A TW107144066 A TW 107144066A TW 107144066 A TW107144066 A TW 107144066A TW 202022577 A TW202022577 A TW 202022577A
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circuit board
touch module
electronic device
portable electronic
hook
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TW107144066A
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Chinese (zh)
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TWI691878B (en
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白廷文
陳乾園
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宏碁股份有限公司
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Priority to TW107144066A priority Critical patent/TWI691878B/en
Priority to CN201910025379.4A priority patent/CN111290523B/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/169Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being an integrated pointing device, e.g. trackball in the palm rest area, mini-joystick integrated between keyboard keys, touch pads or touch stripes
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1615Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
    • G06F1/1616Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Position Input By Displaying (AREA)

Abstract

A touch control module is provided, including a touch pad, a protection layer, a circuit board, and at least a fixing sheet. The protection layer is disposed on a top surface of the touch pad, and the circuit board is disposed on a bottom surface of the touch pad. Specifically, the circuit board includes polymer composite material, and the fixing sheet is fixed to the circuit board and protrudes from an edge of the circuit board.

Description

可攜式電子裝置及其觸控模組Portable electronic device and its touch control module

本發明係有關於一種觸控模組。更具體地來說,本發明有關於一種具有高分子複合材料(polymer composites)之電路板的觸控模組。The invention relates to a touch control module. More specifically, the present invention relates to a touch module with a circuit board of polymer composites.

觸控板(touch pad)是一種常見於筆記型電腦的輸入介面,其中在觸控板內部通常設有金屬片以作為支撐結構。此外,前述金屬片往往也能夠用來作為屏蔽構件,以解決電磁干擾 (Electro-Magnetic Interference)和靜電放電(Electrostatic Discharge, ESD)等問題。有關前述金屬片之若干應用可見於中華民國公告第M285760號、第422364號以及中華民國公開第200931302號等專利案中。A touch pad is an input interface commonly found in notebook computers, in which a metal sheet is usually provided inside the touch pad as a supporting structure. In addition, the aforementioned metal sheet can often be used as a shielding member to solve problems such as Electro-Magnetic Interference (Electro-Magnetic Interference) and Electrostatic Discharge (ESD). Some applications of the aforementioned metal sheets can be found in the Republic of China Publication No. M285760, No. 422364 and the Republic of China Publication No. 200931302.

然而,傳統的金屬片不僅具有成本高昂和組裝精度不佳等問題,其重量也相當可觀,因此往往會增加觸控板的製造成本,且不利於達成電子產品的輕量化。有鑒於此,如何能避免傳統觸控板內部金屬片所產生的前述問題點,並促進電子產品的輕量化始成一重要之課題。However, the traditional metal sheet not only has problems such as high cost and poor assembly accuracy, but also has considerable weight. Therefore, it often increases the manufacturing cost of the touch panel and is not conducive to achieving lightweight electronic products. In view of this, how to avoid the aforementioned problems caused by the metal sheets inside the traditional touch panel and promote the lightweight of electronic products has become an important issue.

為了解決上述習知之問題點,本發明一實施例提供一種觸控模組,包括一觸控板、一保護層、一電路板以及至少一鎖片,前述保護層設置於前述觸控板之一頂面,前述電路板設置於前述觸控板之一底面且含有高分子複合材料,其中前述鎖片嵌入前述電路板內部。In order to solve the above-mentioned conventional problems, an embodiment of the present invention provides a touch module, including a touch panel, a protective layer, a circuit board, and at least one locking piece, the protective layer is disposed on one of the aforementioned touch panels On the top surface, the circuit board is arranged on a bottom surface of the touch panel and contains a polymer composite material, wherein the lock piece is embedded in the circuit board.

於一實施例中,前述鎖片具有至少一卡勾,前述卡勾具有U字形結構並嵌入前述電路板內部。In one embodiment, the lock piece has at least one hook, and the hook has a U-shaped structure and is embedded in the circuit board.

於一實施例中,前述鎖片具有一Z字形結構。In one embodiment, the aforementioned locking piece has a zigzag structure.

於一實施例中,前述電路板含有熱固性樹脂。In one embodiment, the aforementioned circuit board contains a thermosetting resin.

於一實施例中,前述電路板具有一FR-4基板,且前述鎖片透過表面黏著技術而固定於前述電路板之一底側表面。In one embodiment, the circuit board has an FR-4 substrate, and the lock plate is fixed to a bottom surface of the circuit board through surface adhesion technology.

於一實施例中,前述保護層具有玻璃、玻璃纖維或聚對苯二甲酸乙二酯材質。In one embodiment, the aforementioned protective layer is made of glass, glass fiber or polyethylene terephthalate.

於一實施例中,前述觸控模組更包括一螺柱以及一螺絲,且前述鎖片呈平板狀,其中前述螺柱鎖固於前述電路板之一底側表面,且前述螺絲穿過前述鎖片並鎖固於前述螺柱上。In one embodiment, the touch module further includes a stud and a screw, and the locking plate is in the shape of a flat plate, wherein the stud is locked on a bottom surface of the circuit board, and the screw passes through the The locking piece is locked on the aforementioned stud.

於一實施例中,前述觸控模組更包括一長條形之可撓性件,且前述電路板形成有一凹槽,其中前述可撓性件嵌入前述電路板內部且橫跨前述凹槽。In one embodiment, the touch module further includes a strip-shaped flexible member, and the circuit board is formed with a groove, wherein the flexible member is embedded in the circuit board and crosses the groove.

於一實施例中,前述可撓性件具有至少一卡勾,前述卡勾具有U字形結構並嵌入前述電路板內部。In one embodiment, the flexible member has at least one hook, and the hook has a U-shaped structure and is embedded in the circuit board.

本發明一實施例更提供一種可攜式電子裝置,包括相互樞接之一輸入單元以及一顯示單元,其中前述輸入單元包括一上殼體、一下殼體以及如前所述之觸控模組,其中前述上殼體連接前述下殼體,且前述鎖片連接前述電路板以及前述上殼體。An embodiment of the present invention further provides a portable electronic device, including an input unit and a display unit pivotally connected to each other, wherein the input unit includes an upper casing, a lower casing, and the aforementioned touch module , Wherein the upper casing is connected to the lower casing, and the locking plate is connected to the circuit board and the upper casing.

以下說明本發明實施例之可攜式電子裝置及其觸控模組。然而,可輕易了解本發明實施例提供許多合適的發明概念而可實施於廣泛的各種特定背景。所揭示的特定實施例僅僅用於說明以特定方法使用本發明,並非用以侷限本發明的範圍。The portable electronic device and its touch control module according to embodiments of the present invention will be described below. However, it can be easily understood that the embodiments of the present invention provide many suitable inventive concepts and can be implemented in a wide variety of specific backgrounds. The specific embodiments disclosed are only used to illustrate the use of the present invention in a specific way, and are not used to limit the scope of the present invention.

除非另外定義,在此使用的全部用語(包括技術及科學用語)具有與此篇揭露所屬之一般技藝者所通常理解的相同涵義。能理解的是這些用語,例如在通常使用的字典中定義的用語,應被解讀成具有一與相關技術及本揭露的背景或上下文一致的意思,而不應以一理想化或過度正式的方式解讀,除非在此特別定義。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings commonly understood by the general artisans to whom the disclosure belongs. It is understandable that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant technology and the background or context of this disclosure, and not in an idealized or overly formal way Interpretation, unless specifically defined here.

有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之一較佳實施例的詳細說明中,將可清楚的呈現。以下實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明並非用來限制本發明。The foregoing and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description with reference to one of the preferred embodiments of the drawings. Directional terms mentioned in the following embodiments, for example: up, down, left, right, front or back, etc., are only for directions referring to additional drawings. Therefore, the directional terminology is used to illustrate rather than limit the invention.

首先請參閱第1圖,第1圖表示本發明一實施例之可攜式電子裝置100的示意圖。如第1圖所示,本實施例之可攜式電子裝置100例如為一筆記型電腦,其主要包含有一顯示單元10、一輸入單元20以及至少一樞軸H;舉例而言,前述顯示單元10可為一液晶顯示器且具有一顯示螢幕11,其可透過樞軸H而與輸入單元20相互樞接,以使顯示單元10可相對於輸入單元20旋轉。First, please refer to FIG. 1. FIG. 1 is a schematic diagram of a portable electronic device 100 according to an embodiment of the present invention. As shown in Fig. 1, the portable electronic device 100 of this embodiment is, for example, a notebook computer, which mainly includes a display unit 10, an input unit 20, and at least one pivot H; for example, the aforementioned display unit 10 can be a liquid crystal display and has a display screen 11 that can be pivotally connected to the input unit 20 through a pivot H, so that the display unit 10 can rotate relative to the input unit 20.

從第1圖可以看出,前述輸入單元20具有相互連接之一上殼體21以及一下殼體22,其中在上殼體21的頂側設有一觸控模組30以及一鍵盤模組k,使用者在操作可攜式電子裝置100時,可透過前述觸控模組30以及鍵盤模組k輸入資料,或者控制顯示螢幕11上的游標;此外,當使用者結束操作而欲關閉可攜式電子裝置100時,則可將顯示單元10與輸入單元20疊合以方便收納。It can be seen from Figure 1 that the aforementioned input unit 20 has an upper casing 21 and a lower casing 22 that are connected to each other. A touch module 30 and a keyboard module k are provided on the top side of the upper casing 21. When operating the portable electronic device 100, the user can input data through the aforementioned touch module 30 and keyboard module k, or control the cursor on the display screen 11; in addition, when the user ends the operation and wants to close the portable In the case of the electronic device 100, the display unit 10 and the input unit 20 can be stacked to facilitate storage.

接著請一併參閱第2~6圖,第2圖表示第1圖中之觸控模組30的爆炸圖,第3圖表示第2圖中之可撓性件34的放大圖,第4圖表示第2圖中之鎖片35的放大圖,第5、6圖則分別表示第1圖中之觸控模組30組合後於不同視角的立體圖。Next, please refer to Figures 2 to 6. Figure 2 shows an exploded view of the touch module 30 in Figure 1, Figure 3 shows an enlarged view of the flexible member 34 in Figure 2, and Figure 4 Shows an enlarged view of the lock plate 35 in Figure 2, and Figures 5 and 6 respectively show a three-dimensional view of the touch module 30 in Figure 1 after being combined with different viewing angles.

如第2~6圖所示,本實施例之觸控模組30主要包括一保護層31、一觸控板32、一電路板33、一長條形之可撓性件34以及至少一鎖片35,其中保護層31覆蓋觸控板32的頂面,電路板33則固定於觸控板32的底面。As shown in Figures 2 to 6, the touch module 30 of this embodiment mainly includes a protective layer 31, a touch pad 32, a circuit board 33, a long flexible member 34, and at least one lock The sheet 35, in which the protective layer 31 covers the top surface of the touch panel 32, and the circuit board 33 is fixed on the bottom surface of the touch panel 32.

應了解的是,前述可撓性件34以及鎖片35主要係用以連接前述電路板33和輸入單元20的上殼體21。在本實施例中,前述可撓性件34以及鎖片35可具有金屬材質,如此一來電路板33內部的接地線路便能透過可撓性件34或鎖片35而電性連接到輸入單元20的上殼體21。It should be understood that the aforementioned flexible member 34 and the lock piece 35 are mainly used to connect the aforementioned circuit board 33 and the upper casing 21 of the input unit 20. In this embodiment, the aforementioned flexible member 34 and the lock piece 35 may be made of metal material, so that the ground circuit inside the circuit board 33 can be electrically connected to the input unit through the flexible piece 34 or the lock piece 35 20的上壳21。 20的上壳21.

前述保護層31可採用具有高結構強度之玻璃或玻璃纖維(carbon fiber)材質,然而其亦可採用具絕緣特性之聚對苯二甲酸乙二酯(polyethylene terephthalate, PET)材質。舉例而言,前述保護層31可採用杜邦公司(DuPont)所生產的麥拉薄膜(Mylar film),用以保護並電性隔離其下方的觸控板32。The aforementioned protective layer 31 can be made of glass or carbon fiber with high structural strength, but it can also be made of polyethylene terephthalate (PET) with insulating properties. For example, the protective layer 31 may be a Mylar film produced by DuPont to protect and electrically isolate the touch panel 32 below it.

此外,為了達到觸控模組30的輕量化,本實施例中之電路板33係採用由高分子複合材料(polymer composites)加工製作而成的印刷電路板(Printed circuit board, PCB),其主要係由高結構強度之基板(例如FR-4基板)以及形成於其內部之金屬電路所構成。舉例而言,前述電路板33可含有銅箔(copper foil)、玻璃纖維(glass fiber)以及熱固性樹脂(thermosetting resin)等材質,其中前述熱固性樹脂例如為環氧樹脂(epoxy)。In addition, in order to achieve the lighter weight of the touch module 30, the circuit board 33 in this embodiment adopts a printed circuit board (PCB) made of polymer composites. It is composed of a high-strength substrate (such as FR-4 substrate) and a metal circuit formed inside it. For example, the aforementioned circuit board 33 may contain materials such as copper foil, glass fiber, and thermosetting resin, where the aforementioned thermosetting resin is, for example, epoxy.

從第2、6圖中可以看出,在前述電路板33之一側形成有一凹槽331,其中可撓性件34橫跨前述凹槽331,且位於其兩端之U字形卡勾341係嵌入並固定於電路板33上的兩個狹縫332內;此外,在前述可撓性件34上更形成有至少一鎖固孔342,組裝時可透過螺絲等鎖固件穿過前述鎖固孔342,藉以將可撓性件34固定於輸入單元20的上殼體21。It can be seen from Figures 2 and 6, that a groove 331 is formed on one side of the circuit board 33, wherein the flexible member 34 spans the groove 331, and the U-shaped hooks 341 are located at both ends of the groove 331. Embedded and fixed in the two slits 332 on the circuit board 33; in addition, at least one locking hole 342 is formed on the aforementioned flexible member 34, which can be inserted through the aforementioned locking hole by a screw or other locking member during assembly 342, thereby fixing the flexible member 34 to the upper housing 21 of the input unit 20.

應了解的是,由於前述可撓性件34具有可變形之特性,因此當使用者以手指朝下方(-Z軸方向)按壓並施加一壓力予前述保護層31時,保護層31、觸控板32以及電路板33會一起相對於輸入單元20的上殼體21下沉,並使位在電路板33下方之一圓盤狀之彈性體(未圖示)接觸到可撓性件341,其中前述彈性體例如為金屬彈片(metal dome)。It should be understood that because the aforementioned flexible member 34 has a deformable characteristic, when the user presses downward (-Z axis direction) with a finger and applies a pressure to the aforementioned protective layer 31, the protective layer 31, touch The board 32 and the circuit board 33 will sink together relative to the upper housing 21 of the input unit 20, and a disc-shaped elastic body (not shown) located below the circuit board 33 will contact the flexible member 341, The aforementioned elastic body is, for example, a metal dome.

接著,當使用者釋放前述壓力後,前述彈性體和可撓性件34則可提供一彈性回復力,使得保護層31、觸控板32以及電路板33回復到原先的初始位置,藉以方便使用者透過觸控模組30執行點擊(click)的動作,並可提供使用者良好的按壓觸感(tactile feeling)。Then, when the user releases the aforementioned pressure, the aforementioned elastic body and flexible member 34 can provide an elastic restoring force, so that the protective layer 31, the touch panel 32 and the circuit board 33 return to their original initial positions, thereby facilitating use The user executes a click action through the touch module 30, and can provide the user with a good tactile feeling.

需特別說明的是,由於本實施例中的電路板33係以複合材料基板(例如FR-4基板)加工製作而成,如此一來不僅有利於將可撓性件34上之至少一卡勾341穩固地嵌入電路板33上的狹縫332內,更可直接透過表面黏著技術(Surface-mount technology, SMT)等自動化製程以提升可撓性件34與電路板33之間的組裝精度與結合強度,從而能大幅降低組裝成本、提升組裝效率並增進產品的良率。再者,由於複合材料基板的密度係較傳統金屬片的密度更小且重量更輕,因此本實施例尚兼具有促進電子產品輕量化之顯著功效。It should be particularly noted that, since the circuit board 33 in this embodiment is manufactured by processing a composite material substrate (such as an FR-4 substrate), this is not only beneficial for fixing at least one hook on the flexible member 34 341 is firmly embedded in the slit 332 on the circuit board 33, and can directly improve the assembly accuracy and combination between the flexible part 34 and the circuit board 33 through automated manufacturing processes such as Surface-mount technology (SMT) Strength, which can greatly reduce assembly costs, improve assembly efficiency and increase product yield. Furthermore, since the density of the composite material substrate is lower than that of the traditional metal sheet and the weight is lighter, this embodiment also has a significant effect of promoting the lightweight of electronic products.

接著請一併參閱第2、4、6圖,本實施例中之鎖片35大致呈一Z字形結構,其主要含有一第一段部P1、一第二段部P2以及一第三段部P3(第4圖),且第三段部P3係連接第一段部P1以及第二段部P2。從第4圖中可以看出,在第一段部P1的兩側分別形成有一U字形之卡勾351,且在第二段部P2上則形成有至少一鎖固孔352,凸出於電路板33之一邊緣,組裝時可使前述卡勾351嵌入電路板33上的狹縫333(第2圖),並可透過螺絲等鎖固件穿過前述鎖固孔352,藉以將鎖片35之第二段部P2連接輸入單元20的上殼體21。Please refer to Figures 2, 4, and 6 together. The lock plate 35 in this embodiment is roughly in a zigzag structure, which mainly includes a first section P1, a second section P2, and a third section. P3 (Figure 4), and the third stage P3 connects the first stage P1 and the second stage P2. As can be seen from Figure 4, a U-shaped hook 351 is formed on both sides of the first section P1, and at least one locking hole 352 is formed on the second section P2, protruding from the circuit On one edge of the board 33, the hooks 351 can be inserted into the slits 333 on the circuit board 33 (Figure 2) during assembly, and the locking holes 352 can be inserted through the locking members such as screws, so that the locking plate 35 The second section P2 is connected to the upper case 21 of the input unit 20.

如前所述,由於本實施例中之電路板33係以複合材料基板(例如FR-4基板)加工製作而成,不僅可有利於將鎖片35上之至少一卡勾351穩固地嵌入電路板33內部,同時也能透過表面黏著技術(Surface-mount technology, SMT)等自動化製程以提升鎖片35與電路板33之間的組裝精度與結合強度,從而可大幅降低組裝成本、提升組裝效率並增進產品的良率。As mentioned above, since the circuit board 33 in this embodiment is made of a composite material substrate (such as an FR-4 substrate), it is not only beneficial to embed at least one hook 351 on the lock plate 35 firmly into the circuit Inside the board 33, it can also improve the assembly accuracy and bonding strength between the lock plate 35 and the circuit board 33 through automated processes such as surface-mount technology (SMT), which can greatly reduce assembly costs and improve assembly efficiency And improve the yield of products.

再請參閱第7圖,第7圖表示沿第6圖中之線段A1-A2的剖視圖。如第7圖所示,由於本實施例中之卡勾351係呈扁平狀且具有U字形結構,因此可在組裝時將其嵌入電路板33上的狹縫333內,其中卡勾351的寬度可等於或略大於狹縫333的寬度。舉例而言,組裝前可預先在電路板33之底側表面330的局部區域塗佈錫膏,然後將卡勾351嵌入電路板33底側的狹縫333,接著再透過表面黏著技術(Surface-mount technology, SMT)等自動化製程使鎖片35和電路板33中的導線(未圖示)電性連接。Please refer to Figure 7 again. Figure 7 shows a cross-sectional view along the line A1-A2 in Figure 6. As shown in Figure 7, since the hook 351 in this embodiment is flat and has a U-shaped structure, it can be inserted into the slit 333 on the circuit board 33 during assembly. The width of the hook 351 is It may be equal to or slightly larger than the width of the slit 333. For example, before assembling, solder paste can be applied to a local area of the bottom side surface 330 of the circuit board 33 in advance, and then the hooks 351 can be inserted into the slits 333 on the bottom side of the circuit board 33, and then surface mount technology (Surface- Automated manufacturing processes such as mount technology, SMT) electrically connect the lock plate 35 and the wires (not shown) in the circuit board 33.

如前所述,本實施例主要係以含有高分子複合材料之電路板33取代傳統的金屬片,如此一來不僅在整體重量上可較傳統的觸控模組更輕,也能夠透過單一製程(例如表面黏著技術)而快速地將可撓性件34以及鎖片35一起固定在電路板33上,所以可具有大幅增加生產效率以及降低製造成本之顯著功效,此外也能增加可撓性件34、鎖片35和電路板33之間的結合強度,以有效地提升觸控模組30的可靠度與產品良率。As mentioned above, this embodiment mainly replaces the traditional metal sheet with the circuit board 33 containing polymer composite material. As a result, not only the overall weight can be lighter than the traditional touch module, but it can also be manufactured through a single process. (Such as surface adhesion technology) and quickly fix the flexible member 34 and the lock plate 35 on the circuit board 33 together, so it can greatly increase the production efficiency and reduce the manufacturing cost, and it can also increase the flexible member. 34. The bonding strength between the lock plate 35 and the circuit board 33 can effectively improve the reliability of the touch module 30 and the product yield.

再請參閱第8圖,第8圖表示本發明另一實施例之鎖片35固定於電路板33之底側表面330的剖視圖。需特別說明的是,為了避免前述Z字形之鎖片35在組裝過程中因為組立公差(assembly tolerance)而影響到電路板33和上殼體21之間的組裝精度,於本實施例中係改以平板狀之鎖片35’取代前述Z字形之鎖片35,且在鎖片35’並不需要形成前述卡勾351,其中鎖片35’會凸出於電路板33之一邊緣。Please refer to FIG. 8 again. FIG. 8 shows a cross-sectional view of the lock plate 35 fixed to the bottom surface 330 of the circuit board 33 according to another embodiment of the present invention. It should be particularly noted that, in order to prevent the aforementioned Z-shaped lock plate 35 from affecting the assembly accuracy between the circuit board 33 and the upper housing 21 due to assembly tolerances during the assembly process, the present embodiment is modified A flat plate-shaped lock piece 35' is used to replace the aforementioned Z-shaped lock piece 35, and the aforementioned hook 351 is not required to be formed on the lock piece 35', and the lock piece 35' will protrude from an edge of the circuit board 33.

如第8圖所示,組裝時可先將一螺柱S1(threaded pillar)鎖固在電路板33的底側表面330,然後可利用螺絲S2穿過平板狀之鎖片35’,藉以將鎖片35’鎖固於螺柱S1的頂側,如此一來鎖片35’便能維持於單一高度上以確保其平整度。As shown in Figure 8, when assembling, a threaded pillar (S1) can be locked on the bottom surface 330 of the circuit board 33, and then the screw S2 can be used to pass through the plate-shaped locking piece 35' to lock the lock The piece 35' is locked on the top side of the stud S1, so that the lock piece 35' can be maintained at a single height to ensure its flatness.

最後請參閱第9圖,第9圖表示本發明另一實施例之觸控模組40的爆炸圖。如第9圖所示,本實施例之觸控模組40主要係用以取代第1、2圖中的觸控模組30,其主要包含有一保護層41、一觸控板42、一電路板43以及至少一鎖片45。Finally, please refer to FIG. 9, which shows an exploded view of the touch module 40 according to another embodiment of the present invention. As shown in Figure 9, the touch module 40 of this embodiment is mainly used to replace the touch module 30 in Figures 1 and 2, which mainly includes a protective layer 41, a touch pad 42, and a circuit. The board 43 and at least one locking piece 45.

應了解的是,本實施例中的保護層41、觸控板42、電路板43以及鎖片45可以和第2圖所示的保護層31、觸控板32、電路板33、鎖片35採用相同的材質,惟本實施例中之觸控模組40並未設有如第2圖所示的可撓性件34,且本實施例中之電路板43並未形成有如第2圖所示的凹槽331。It should be understood that the protective layer 41, the touch pad 42, the circuit board 43, and the lock plate 45 in this embodiment can be the same as the protective layer 31, the touch pad 32, the circuit board 33, and the lock plate 35 shown in FIG. The same material is used, but the touch module 40 in this embodiment is not provided with a flexible member 34 as shown in FIG. 2, and the circuit board 43 in this embodiment is not formed as shown in FIG.的notch 331.

從第9圖中可以看出,保護層41係覆蓋於觸控板42的頂面,電路板43則是連接於觸控板42的底側表面。舉例而言,前述保護層41可採用具有高結構強度之玻璃或玻璃纖維(carbon fiber)材質,然而其亦可含有具絕緣特性之聚對苯二甲酸乙二酯(polyethylene terephthalate, PET)材質。在本實施例中,前述保護層31係採用杜邦公司(DuPont)所生產的麥拉薄膜(Mylar film),以保護並電性隔離其下方的觸控板42。It can be seen from FIG. 9 that the protective layer 41 covers the top surface of the touch panel 42, and the circuit board 43 is connected to the bottom surface of the touch panel 42. For example, the aforementioned protective layer 41 can be made of glass or carbon fiber with high structural strength, but it can also contain polyethylene terephthalate (PET) with insulating properties. In this embodiment, the aforementioned protective layer 31 uses Mylar film produced by DuPont to protect and electrically isolate the touch panel 42 below it.

另一方面,前述電路板43則可為一印刷電路板(Printed circuit board, PCB),且其含有由複合材料所製成的高強度基板(例如FR-4基板)。舉例而言,前述電路板43可含有銅箔(copper foil)、玻璃纖維(glass fiber)以及熱固性樹脂(thermosetting resin)等材質,其中前述熱固性樹脂例如為環氧樹脂(epoxy)。On the other hand, the aforementioned circuit board 43 can be a printed circuit board (PCB), and it contains a high-strength substrate (such as an FR-4 substrate) made of composite materials. For example, the aforementioned circuit board 43 may contain materials such as copper foil, glass fiber, and thermosetting resin, where the aforementioned thermosetting resin is, for example, epoxy.

由於本實施例中之電路板43係以複合材料基板(例如FR-4基板)加工所製成,如此一來可有利於將鎖片45兩側的卡勾451穩固地嵌入電路板43內部,同時也能有助於透過表面黏著技術(Surface-mount technology, SMT)等自動化製程以有效提升鎖片45與電路板43之間的組裝精度與結合強度,從而能大幅降低組裝成本、提升組裝效率並增進產品的良率。再者,由於複合材料基板的密度係較傳統金屬片的密度更小且重量更輕,因此尚兼具有促進電子產品輕量化之顯著功效。Since the circuit board 43 in this embodiment is made of a composite material substrate (for example, FR-4 substrate), it is advantageous for the hooks 451 on both sides of the lock plate 45 to be firmly embedded in the circuit board 43. At the same time, it can also help to effectively improve the assembly accuracy and bonding strength between the lock plate 45 and the circuit board 43 through automated processes such as Surface-mount technology (SMT), which can greatly reduce assembly costs and improve assembly efficiency. And improve the yield of products. Moreover, since the density of the composite material substrate is lower than that of the traditional metal sheet and the weight is lighter, it also has a significant effect of promoting the lightweight of electronic products.

雖然本發明的實施例及其優點已揭露如上,但應該瞭解的是,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作更動、替代與潤飾。此外,本發明之保護範圍並未侷限於說明書內所述特定實施例中的製程、機器、製造、物質組成、裝置、方法及步驟,任何所屬技術領域中具有通常知識者可從本發明揭示內容中理解現行或未來所發展出的製程、機器、製造、物質組成、裝置、方法及步驟,只要可以在此處所述實施例中實施大抵相同功能或獲得大抵相同結果皆可根據本發明使用。因此,本發明之保護範圍包括上述製程、機器、製造、物質組成、裝置、方法及步驟。另外,每一申請專利範圍構成個別的實施例,且本發明之保護範圍也包括各個申請專利範圍及實施例的組合。Although the embodiments of the present invention and its advantages have been disclosed as above, it should be understood that any person with ordinary knowledge in the technical field can make changes, substitutions and modifications without departing from the spirit and scope of the present invention. In addition, the scope of protection of the present invention is not limited to the manufacturing processes, machines, manufacturing, material composition, devices, methods and steps in the specific embodiments described in the specification. Anyone with ordinary knowledge in the technical field can disclose the content from the present invention. It is understood that the current or future developed processes, machines, manufacturing, material composition, devices, methods, and steps can be used according to the present invention as long as they can perform substantially the same functions or obtain substantially the same results in the embodiments described herein. Therefore, the protection scope of the present invention includes the above-mentioned manufacturing process, machine, manufacturing, material composition, device, method and step. In addition, each patent application scope constitutes an individual embodiment, and the protection scope of the present invention also includes each patent application scope and a combination of embodiments.

雖然本發明以前述數個較佳實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可做些許之更動與潤飾。因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。此外,每個申請專利範圍建構成一獨立的實施例,且各種申請專利範圍及實施例之組合皆介於本發明之範圍內。Although the present invention is disclosed in the foregoing several preferred embodiments, they are not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains can make changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to those defined by the attached patent application scope. In addition, the scope of each patent application constitutes an independent embodiment, and the combination of the scope of various patent applications and the embodiments falls within the scope of the present invention.

100:可攜式電子裝置 10:顯示單元 11:顯示螢幕 20:輸入單元 21:上殼體 22:下殼體 30:觸控模組 31:保護層 32:觸控板 33:電路板 330:底側表面 331:凹槽 332:狹縫 333:狹縫 34:可撓性件 341:卡勾 342:鎖固孔 35:鎖片 35’:鎖片 351:卡勾 352:鎖固孔 41:保護層 42:觸控板 43:電路板 45:鎖片 451:卡勾 H:樞軸 k:鍵盤模組 P1:第一段部 P2:第二段部 P3:第三段部 S1:螺柱 S2:螺絲 100: Portable electronic device 10: Display unit 11: display screen 20: Input unit 21: Upper shell 22: Lower shell 30: Touch module 31: protective layer 32: Touchpad 33: circuit board 330: bottom side surface 331: groove 332: Slit 333: slit 34: Flexible parts 341: Card Hook 342: Lock Hole 35: lock piece 35’: Lock plate 351: Card Hook 352: lock hole 41: protective layer 42: Touchpad 43: circuit board 45: lock piece 451: card hook H: pivot k: keyboard module P1: The first section P2: The second section P3: The third paragraph S1: Stud S2: Screw

第1圖表示本發明一實施例之可攜式電子裝置100的示意圖。 第2圖表示第1圖中之觸控模組30的爆炸圖。 第3圖表示第2圖中之可撓性件34的放大圖。 第4圖表示第2圖中之鎖片35的放大圖。 第5、6圖分別表示第1圖中之觸控模組30組合後於不同視角的立體圖。 第7圖表示沿第6圖中之線段A1-A2的剖視圖。 第8圖表示本發明另一實施例之鎖片35固定於電路板33之底側表面330的剖視圖。 第9圖表示本發明另一實施例之觸控模組40的爆炸圖。FIG. 1 shows a schematic diagram of a portable electronic device 100 according to an embodiment of the invention. Figure 2 shows an exploded view of the touch module 30 in Figure 1. Fig. 3 shows an enlarged view of the flexible member 34 in Fig. 2. Fig. 4 shows an enlarged view of the lock piece 35 in Fig. 2. Figures 5 and 6 respectively show three-dimensional views of the touch module 30 in Figure 1 at different viewing angles after being combined. Fig. 7 shows a cross-sectional view along the line A1-A2 in Fig. 6. FIG. 8 shows a cross-sectional view of a lock plate 35 fixed to the bottom surface 330 of the circuit board 33 according to another embodiment of the present invention. FIG. 9 shows an exploded view of a touch module 40 according to another embodiment of the present invention.

30:觸控模組 30: Touch module

31:保護層 31: protective layer

32:觸控板 32: Touchpad

33:電路板 33: circuit board

330:底側表面 330: bottom side surface

331:凹槽 331: groove

332:狹縫 332: Slit

333:狹縫 333: slit

34:可撓性件 34: Flexible parts

341:卡勾 341: Card Hook

342:鎖固孔 342: Lock Hole

35:鎖片 35: lock piece

351:卡勾 351: Card Hook

352:鎖固孔 352: lock hole

Claims (18)

一種觸控模組,包括: 一觸控板; 一保護層,設置於該觸控板之一頂面; 一電路板,設置於該觸控板之一底面且含有高分子複合材料;以及 至少一鎖片,固定於該電路板上並凸出於該電路板之一邊緣。A touch module includes: a touch panel; a protective layer arranged on a top surface of the touch panel; a circuit board arranged on a bottom surface of the touch panel and containing a polymer composite material; and at least A lock piece is fixed on the circuit board and protrudes from an edge of the circuit board. 如申請專利範圍第1項所述之觸控模組,其中該鎖片具有至少一卡勾,該卡勾具有U字形結構並嵌入該電路板內部。According to the touch module described in the first item of the patent application, the lock piece has at least one hook, and the hook has a U-shaped structure and is embedded in the circuit board. 如申請專利範圍第1項所述之觸控模組,其中該鎖片具有一Z字形結構。In the touch module described in the first item of the patent application, the lock piece has a zigzag structure. 如申請專利範圍第1項所述之觸控模組,其中該電路板含有熱固性樹脂。According to the first item of the scope of patent application, the touch control module, wherein the circuit board contains thermosetting resin. 如申請專利範圍第1項所述之觸控模組,其中該電路板包含一FR-4基板,且該鎖片透過表面黏著技術而固定於該電路板之一底側表面。In the touch module described in claim 1, wherein the circuit board includes an FR-4 substrate, and the lock plate is fixed to a bottom surface of the circuit board through surface adhesion technology. 如申請專利範圍第1項所述之觸控模組,其中該保護層具有玻璃、玻璃纖維或聚對苯二甲酸乙二酯材質。According to the first item of the patent application, the protective layer is made of glass, glass fiber or polyethylene terephthalate. 如申請專利範圍第1項所述之觸控模組,其中該觸控模組更包括一螺柱以及一螺絲,且該鎖片呈平板狀,其中該螺柱鎖固於該電路板之一底側表面,且該螺絲穿過該鎖片並鎖固於該螺柱上。The touch module according to claim 1, wherein the touch module further includes a stud and a screw, and the locking piece is in the shape of a flat plate, and the stud is locked to one of the circuit boards The bottom side surface, and the screw passes through the lock piece and is locked on the stud. 如申請專利範圍第1項所述之觸控模組,其中該觸控模組更包括一長條形之可撓性件,且該電路板形成有一凹槽,其中該可撓性件嵌入該電路板內部且橫跨該凹槽。As for the touch module described in claim 1, wherein the touch module further includes a long flexible member, and the circuit board is formed with a groove, wherein the flexible member is embedded in the Inside the circuit board and across the groove. 如申請專利範圍第8項所述之觸控模組,其中該可撓性件具有至少一卡勾,該卡勾具有U字形結構並嵌入該電路板內部。As for the touch module described in item 8 of the scope of patent application, the flexible member has at least one hook, and the hook has a U-shaped structure and is embedded in the circuit board. 一種可攜式電子裝置,包括: 一輸入單元,包括一上殼體、一下殼體以及一如申請專利範圍第1項所述之觸控模組,其中該上殼體連接該下殼體,且該鎖片連接該電路板以及該上殼體;以及 一顯示單元,樞接該輸入單元。A portable electronic device includes: an input unit, including an upper casing, a lower casing, and a touch module as described in the first item of the scope of patent application, wherein the upper casing is connected to the lower casing, And the lock piece is connected to the circuit board and the upper casing; and a display unit is pivotally connected to the input unit. 如申請專利範圍第10項所述之可攜式電子裝置,其中該鎖片具有至少一卡勾,該卡勾具有U字形結構並嵌入該電路板內部。For the portable electronic device described in claim 10, the lock piece has at least one hook, and the hook has a U-shaped structure and is embedded in the circuit board. 如申請專利範圍第10項所述之可攜式電子裝置,其中該鎖片具有一Z字形結構。In the portable electronic device described in item 10 of the scope of patent application, the lock piece has a zigzag structure. 如申請專利範圍第10項所述之可攜式電子裝置,其中該電路板含有熱固性樹脂。The portable electronic device described in item 10 of the scope of patent application, wherein the circuit board contains a thermosetting resin. 如申請專利範圍第10項所述之可攜式電子裝置,其中該電路板包含一FR-4基板,且該鎖片透過表面黏著技術而固定於該電路板之一底側表面。In the portable electronic device described in claim 10, the circuit board includes an FR-4 substrate, and the lock plate is fixed to a bottom surface of the circuit board through surface adhesion technology. 如申請專利範圍第10項所述之可攜式電子裝置,其中該保護層具有玻璃、玻璃纖維或聚對苯二甲酸乙二酯材質。For the portable electronic device described in item 10 of the scope of patent application, wherein the protective layer is made of glass, glass fiber or polyethylene terephthalate. 如申請專利範圍第10項所述之可攜式電子裝置,其中該觸控模組更包括一螺柱以及一螺絲,且該鎖片呈平板狀,其中該螺柱鎖固於該電路板之一底側表面,且該螺絲穿過該鎖片並鎖固於該螺柱上。For the portable electronic device described in claim 10, the touch module further includes a stud and a screw, and the lock piece is in the shape of a flat plate, wherein the stud is locked on the circuit board A bottom side surface, and the screw passes through the lock piece and is locked on the stud. 如申請專利範圍第10項所述之可攜式電子裝置,其中該觸控模組更包括一長條形之可撓性件,且該電路板形成有一凹槽,其中該可撓性件嵌入該電路板內部且橫跨該凹槽。For the portable electronic device described in claim 10, the touch module further includes a long flexible member, and the circuit board is formed with a groove, wherein the flexible member is embedded The circuit board is inside and across the groove. 如申請專利範圍第17項所述之可攜式電子裝置,其中該可撓性件具有至少一卡勾,該卡勾具有U字形結構並嵌入該電路板內部。For the portable electronic device described in claim 17, wherein the flexible member has at least one hook, and the hook has a U-shaped structure and is embedded in the circuit board.
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