CN2713637Y - 散热器 - Google Patents

散热器 Download PDF

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Publication number
CN2713637Y
CN2713637Y CN200420071681.2U CN200420071681U CN2713637Y CN 2713637 Y CN2713637 Y CN 2713637Y CN 200420071681 U CN200420071681 U CN 200420071681U CN 2713637 Y CN2713637 Y CN 2713637Y
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China
Prior art keywords
radiator
annular groove
mentioned
radiating fin
heat
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Expired - Fee Related
Application number
CN200420071681.2U
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English (en)
Inventor
李学坤
夏万林
陈葆春
李能斌
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN200420071681.2U priority Critical patent/CN2713637Y/zh
Priority to US11/135,171 priority patent/US7190588B2/en
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Publication of CN2713637Y publication Critical patent/CN2713637Y/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种散热器，是由多个散热鳍片相互扣合而成，每一散热鳍片具有一散热本体，该散热本体两端分别弯折形成一折边，上述两折边的前缘适当位置相向冲设凸出形成至少一对扣耳，对应该扣耳的散热本体上与折边弯折方向反向的冲设凸出形成环槽，通过相邻散热鳍片的扣耳与环槽相扣合使上述多个散热鳍片紧密连接成一体。本实用新型散热器的结构稳固，散热鳍片之间不易脱落或变形。

Description

散热器
【技术领域】
本实用新型涉及一种散热器，尤其是指一种对发热电子元件散热用的散热器。
【背景技术】
随着电脑产业的快速发展，中央处理器等电子元件处理能力不断的升级，其散热用的散热模组也随着多样化。此过程中所使用的散热器也在不断的改良，如最初的铝挤或剖沟成形的一体式散热器，后来由多数单片散热鳍片分别与基座焊接或插入形成的散热器，以及由金属薄片连续弯折并与基座结合形成的散热器等。如图1所示，是现有技术中的一种散热器示意图，该散热器30采用呈ㄈ形截面的若干散热鳍片32相互扣接连结而成。这些散热鳍片32具有一本体，该本体上下端设有折边34，每一折边34上设有凹孔36，在凹孔36前缘延伸形成一凸片38，该凸片38进一步冲设有凸点39。一散热鳍片32的凸片38插设在相邻散热鳍片32的凹孔36内，其凸点39可挡止在散热鳍片32的本体上，从而结合形成一整体散热器30。这种散热器30虽然可以一整体进行焊接等加工，但由于凸片38与折边34之间连接处较细薄，降低了凸片38的强度，当受外界施力时，容易向外变形而容易脱离相邻散热鳍片32的本体两端的卡止，而且施以反向作用力时，凸片38的凸点39也易脱离凹孔36，从而使得整个散热鳍片32的结合方式有欠稳固。
【发明内容】
本实用新型的目的在于提供一种结构稳固的鳍片组合式散热器。
本实用新型散热器，是由多个散热鳍片相互扣合而成，每一散热鳍片具有一散热本体，该散热本体两端分别弯折形成一折边，上述两折边的前缘适当位置相向冲设凸出形成至少一对扣耳，对应该扣耳的散热本体上与折边弯折方向反向的冲设凸出形成环槽，通过相邻散热鳍片的扣耳与环槽相扣合使上述多个散热鳍片紧密连接成一体。
与现有技术相比，本实用新型散热器由于扣耳直接设于折边上，散热鳍片通过其扣耳插设于相邻散热鳍片的环槽内而实现连接，因此相邻散热鳍片不易因外力因素而脱落或变形，具有组合稳固可靠的优点。
下面参照附图结合实施例对本实用新型作进一步的说明。
【附图说明】
图1是现有技术中一散热器的示意图。
图2是本实用新型散热器的散热鳍片的立体组合图。
图3是本实用新型单个散热鳍片的另一角度的立体图。
【具体实施方式】
请参阅图2和图3，本实用新型散热器10是由多个散热鳍片12相互扣合组成，该散热器10可直接贴设在发热元件(图未示)表面，也可贴设在一导热板(图未示)上，再通过导热板与发热元件接触。
每一散热鳍片12具有一平板状散热本体14，该散热本体14的两端同向分别弯折出一折边16。这些散热鳍片12一端的折边16连续形成一平面，以与导热板或发热元件贴合。上述两折边16的前缘适当位置分别相向冲设凸出形成二梯形的扣耳18，该扣耳18平行于散热本体14，对应该扣耳18的散热本体14上，与折边16弯折方向反向地冲设凸出形成环槽20，上述扣耳18可容置于环槽20内，该环槽20可为一半封闭环槽，也可为一上下具开口的环槽。
组装时，后一散热鳍片12的扣耳18插设在前一散热鳍片12的对应环槽20内，从而使得后一散热鳍片12与前一散热鳍片12紧密扣合，形成一堆叠鳍片式散热器10。

Claims (6)

1.一种散热器，是由多个散热鳍片相互扣合而成，每一散热鳍片具有一散热本体，该散热本体两端分别弯折形成一折边，其特征在于：上述两折边的前缘适当位置相向冲设凸出形成至少一对扣耳，对应该扣耳的散热本体上与折边弯折方向反向的冲设凸出形成环槽，通过相邻散热鳍片的扣耳与环槽相扣合使上述多个散热鳍片紧密连接成一体。
2.如权利要求1所述的散热器，其特征在于：上述散热鳍片一端折边可连续形成供与发热元件或导热板接触的一平面。
3.如权利要求1所述的散热器，其特征在于：上述扣耳呈梯形，与散热本体平行。
4.如权利要求1所述的散热器，其特征在于：上述扣耳可容置于环槽内。
5.如权利要求1所述的散热器，其特征在于：上述环槽为半封闭环槽。
6.如权利要求1所述的散热器，其特征在于：上述环槽为上下具开口的环槽。
CN200420071681.2U 2004-07-13 2004-07-13 散热器 Expired - Fee Related CN2713637Y (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200420071681.2U CN2713637Y (zh) 2004-07-13 2004-07-13 散热器
US11/135,171 US7190588B2 (en) 2004-07-13 2005-05-23 Heat-dissipating fin assembly for heat sink

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101662918B (zh) * 2008-08-27 2012-10-10 富准精密工业(深圳)有限公司 散热装置
CN103185328A (zh) * 2011-12-27 2013-07-03 陈世明 散热装置及其制造方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7304851B2 (en) * 2005-06-21 2007-12-04 Yuh-Cheng Chemical Ltd. Heat sink and its fabrication method
US7531270B2 (en) 2006-10-13 2009-05-12 Enerdel, Inc. Battery pack with integral cooling and bussing devices
TW200847908A (en) * 2007-05-28 2008-12-01 Delta Electronics Inc Heat dissipating fin assembly and assembling method thereof
US7677298B2 (en) * 2007-07-17 2010-03-16 Chin-Hsing Horng Jointing structure of a heat dissipating fin
US20090060679A1 (en) * 2007-08-31 2009-03-05 Chin-Hsing Horng Fastening apparatus of a heat radiator
JP2011503800A (ja) * 2007-11-07 2011-01-27 エナーデル、インク 温度制御装置を有する電池アセンブリ
US20090128443A1 (en) * 2007-11-15 2009-05-21 Chin-Hsing Horng Fixing device of a radiator sheet
TWM337722U (en) * 2007-12-04 2008-08-01 Asia Vital Components Co Ltd Heat dissipation fins
CN101610659B (zh) * 2008-06-20 2011-12-28 富准精密工业(深圳)有限公司 散热器
US7733653B1 (en) * 2008-12-20 2010-06-08 Yuan Deng Metals Industrial Co. Ltd Heat radiating member mounting structure

Family Cites Families (10)

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Publication number Priority date Publication date Assignee Title
TW526949U (en) * 2001-06-08 2003-04-01 Tai Yuan Expl Co Ltd An innovative structure of heat dissipation piece
US6449160B1 (en) * 2001-07-25 2002-09-10 Tzu Mien Tsai Radiation fin assembly for heat sink or the like
US6474407B1 (en) * 2001-12-12 2002-11-05 Delta Electronics Inc. Composite heat sink with high density fins and assembling method for the same
US6655448B1 (en) * 2002-05-16 2003-12-02 Hai-Ching Lin Radiator with heat dissipation pieces connected in series
US6595275B1 (en) * 2002-07-02 2003-07-22 Waffer Technology Corp. Heat sink assembly
US6651733B1 (en) * 2002-10-16 2003-11-25 Sunonwealth Electric Machine Industry Co., Ltd. Heat sink
US6644386B1 (en) * 2002-12-03 2003-11-11 A-Chu Chang Engaging mechanism for heat-dissipating member
US6772828B1 (en) * 2003-02-28 2004-08-10 Li-Chuan Chen Cooling fin assembly
US6754079B1 (en) * 2003-04-18 2004-06-22 Hung-Chun Chang KD heat sink fins
TW570497U (en) 2003-05-09 2004-01-01 Hon Hai Prec Ind Co Ltd Heat sink having combined fins

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101662918B (zh) * 2008-08-27 2012-10-10 富准精密工业(深圳)有限公司 散热装置
CN103185328A (zh) * 2011-12-27 2013-07-03 陈世明 散热装置及其制造方法

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US20060012961A1 (en) 2006-01-19

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