CN2692835Y - Radiator with heat conducting tube - Google Patents
Radiator with heat conducting tube Download PDFInfo
- Publication number
- CN2692835Y CN2692835Y CN 200420047977 CN200420047977U CN2692835Y CN 2692835 Y CN2692835 Y CN 2692835Y CN 200420047977 CN200420047977 CN 200420047977 CN 200420047977 U CN200420047977 U CN 200420047977U CN 2692835 Y CN2692835 Y CN 2692835Y
- Authority
- CN
- China
- Prior art keywords
- heat conducting
- heat pipe
- conducting tube
- heat
- radiating fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a radiator with heat conducting tube (heatpipe). The radiator is provided with a radiation fin set, and the radiation fin set is provided with more than one radiation fin laminated together. The equal radiation fins are provided with through holes which are opposite and keep certain space. A heat conducting tube is sheathed in the equal through holes. The bottom of the heat conducting tube is flat to make the radiation fin set be arranged on a heating chip processor when the radiator with heat conducting tube is used. Because the bottom of the heat conducting tube is flat, the bottom of the heat conducting tube is made to stick to the chip processor directly to make the energy generated by the chip processor penetrate the conduction of the bottom of the heat conducting tube directly. The energy is conducted to the radiation fin set quickly and uniformly to reduce the contact heat resistance, and therefore, the purpose of rapid radiation is achieved.
Description
Technical field
The utility model relates to a kind of heat abstractor of tool heat pipe, this device mainly is that the heat pipe bottom design is flat, touch at the chip processor that generates heat and this heat pipe can directly be pasted,, and can conduct to rapidly on the radiating fin group by heat pipe with the minimizing thermal resistance.
Background technology
Generally commonly use the structure of heat radiation, please refer to shown in Fig. 1,2,3, its structure is provided with a radiating fin group 100, this radiating fin group 100 is made up of the radiating fin 110 that plurality of layers stacks, be equipped with the heat pipe 120 that runs through more than wherein on these radiating fins 110, and the bottom that these heat pipes 120 are closed is welded with a substrate (block) 130, this substrate (block) 130 is a flat board, this kind device construction has following shortcoming in use:
1. because of its substrate (block) 130 is fixed together by welding manner and heat pipe 120, so the manufacturing formality is loaded down with trivial details, and can increase manufacturing cost.
2. have a substrate (block) 130 because of its heat pipe 120; so when using; heat pipe 120 can't directly touch chip processor 200; so the heat that chip processor 200 is produced must just can conduct on the heat pipe 120 via substrate (block) 130; but because of substrate (block) 130 has certain height; as shown in Figure 2; and and 120 of heat pipes have space a; so; regular meeting causes heat retention 120 of substrate (block) 130 and heat pipes; can't conduct to rapidly on the heat pipe 120, cause the increase that slowly reaches contact heat resistance of heat radiation.
Summary of the invention
For improving the above-mentioned various shortcomings of commonly using device construction, the creator is through the permanent research and experiment of making great efforts, finally development and Design goes out a kind of conduction by heat pipe, can be directly with heat that chip processor produced, bottom by heat pipe is directly conducted on the radiating fin group, not only built-up time and cost can be saved, and the heat abstractor of the tool heat pipe of radiating effect can be increased.
Main purpose of the present utility model, be to provide a kind of heat abstractor of tool heat pipe, this device is provided with a radiating fin group, this radiating fin group is provided with a heat pipe that slightly is the U type, this heat pipe bottom also is flat, and this upwardly extending branch in heat pipe both sides and pass a radiating fin group, this radiating fin group is provided with the radiating fin that is layered laminate more than and keeps certain interval, when using with order, the radiating fin group directly can be placed on the chip processor of heating, can directly firmly abut on the chip processor and make heat pipe be the flat bottom, so that the heat that chip processor produced sees through the conduction of heat pipe at once, evenly conduct on the radiating fin group rapidly, reducing contact heat resistance, and then reach the purpose of quick heat radiating.
Another purpose of the present utility model is to provide a kind of heat abstractor of tool heat pipe, and its heat pipe is flat, and makes the area of dissipation amplification, and then reaches the purpose of quick heat radiating.
Description of drawings
Fig. 1 is a schematic perspective view of commonly using device.
Fig. 2 is a front elevational schematic of commonly using device.
Fig. 3 is a schematic side view of commonly using device.
Fig. 4 is a perspective exploded view of the present utility model.
Schematic perspective view when Fig. 5 makes up for the utility model.
Sectional schematic diagram when Fig. 6 implements for the utility model.
Schematic cross-section when Fig. 7 implements for the utility model.
Fig. 8 is another embodiment schematic diagram of the present utility model.
The figure number explanation of main element:
Radiating fin group 10
Radiating fin 11
Embodiment
For enabling to the purpose of this utility model, shape constructing apparatus feature and effect thereof, make further understanding and understand, cooperate graphicly now for embodiment, be described in detail as follows:
See also Fig. 4, shown in 5, the utility model is a kind of heat abstractor of tool heat pipe, this device is provided with a radiating fin group 10, this radiating fin group 10 is provided with radiating fin stacked together more than 11, these radiating fins 11 can be the continuous shape that along continuous straight runs extends, as shown in Figure 4, or for disconnecting discontinuous shape, as shown in Figure 8,11 of these radiating fins also keep certain spacing, and these radiating fins 11 are provided with relatively and the perforation 12 that keeps a determining deviation, these perforation directly are equipped with a heat pipe 20 that is flat in 12, these heat pipe 20 bottoms are flat, and this heat pipe 20 is provided with an inlet 21 in the open end, use for the working fluid (Workingfluid of heat pipe) of filling heat-conductive pipe.
Please refer to Fig. 4,5,6, shown in 7, when using with order, radiating fin group 10 can be placed on the chip processor 30 of heating, and be flat because of heat pipe 20 bottoms, and make heat pipe 20 bottoms can directly abut on the chip processor 30, so that the heat that chip processor 30 is produced, directly see through the conduction of heat pipe 20, evenly conduct to rapidly on the radiating fin group 10, to reduce contact heat resistance, and then reach the purpose of quick heat radiating, more because of heat pipe 20 is flat, contact width b is bigger, so, the area of the chip processor that circular heat pipe touches that can commonly use is big, and then increases heat-transfer rate.
In sum, the utility model belongs at first creation at the contoured article constructing apparatus, and can improve The various shortcomings of located by prior art can be promoted effect in the use, close in practicality, fill part and meet novel special Sharp important document is a desirable creation in fact.
Claims (3)
1. the heat abstractor of a tool heat pipe is characterized in that, this device includes:
One radiating fin group, this radiating fin group are provided with above stacked vertical radiating fin together, and these radiating fins are provided with relatively and the perforation that keeps a determining deviation;
One heat pipe, it is flat, and is set in the perforation of radiating fin group, and this heat pipe bottom is flat.
2. the heat abstractor of tool heat pipe as claimed in claim 1 is characterized in that, radiating fin is the continuous shape that along continuous straight runs extends.
3. the heat abstractor of tool heat pipe as claimed in claim 1 is characterized in that, radiating fin is for disconnecting discontinuous shape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200420047977 CN2692835Y (en) | 2004-04-08 | 2004-04-08 | Radiator with heat conducting tube |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200420047977 CN2692835Y (en) | 2004-04-08 | 2004-04-08 | Radiator with heat conducting tube |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2692835Y true CN2692835Y (en) | 2005-04-13 |
Family
ID=34776216
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200420047977 Expired - Fee Related CN2692835Y (en) | 2004-04-08 | 2004-04-08 | Radiator with heat conducting tube |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2692835Y (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116454041A (en) * | 2023-04-20 | 2023-07-18 | 天芯电子科技(江阴)有限公司 | Chip packaging structure adopting wire bonding process and preparation method thereof |
-
2004
- 2004-04-08 CN CN 200420047977 patent/CN2692835Y/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116454041A (en) * | 2023-04-20 | 2023-07-18 | 天芯电子科技(江阴)有限公司 | Chip packaging structure adopting wire bonding process and preparation method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |