CN2762513Y - Radiating plate heat sink - Google Patents
Radiating plate heat sink Download PDFInfo
- Publication number
- CN2762513Y CN2762513Y CN 200420120474 CN200420120474U CN2762513Y CN 2762513 Y CN2762513 Y CN 2762513Y CN 200420120474 CN200420120474 CN 200420120474 CN 200420120474 U CN200420120474 U CN 200420120474U CN 2762513 Y CN2762513 Y CN 2762513Y
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- China
- Prior art keywords
- temperature
- plate body
- heat
- uniforming plate
- fin
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Abstract
The utility model relates to a temperature homogenizing plate heat sink, which is arranged at a heating component of a computer. The utility model comprises a temperature homogenizing plate body and a plurality of fin bodies, wherein the temperature homogenizing plate body forms an L shape and comprises an upper plate body and a lower plate body, and a hollow containing cavity is formed between the upper plate body and the lower plate body; each fin body is provided with a bar-shaped through hole, and temperature homogenizing plate body is connected in the through holes in series; thereby, the temperature homogenizing plate body and each fin body have large area contact, the heat conduction speed is high, the heat generated by the heating component can be rapidly conducted out, thereby, the heat conduction efficiency and the heat radiating efficiency of the heat sink can be increased.
Description
Technical field
The utility model relates to a kind of temperature-uniforming plate radiator, relates in particular on a kind of heat generating component that is arranged on computer, the heat that heat generating component produced can be derived rapidly, thereby increase the heat-conducting effect of radiator and the temperature-uniforming plate radiator of radiating efficiency.
Background technology
Known electronic building brick utilizes characteristics such as heat pipe heat radiation, heat pipe have that the capacity of heat transmission is strong, heat transfer rate is fast, pyroconductivity is high, in light weight, simple in structure and multipurpose usually, can transmit a large amount of heat, and not consume electric power.Therefore heat pipe is fit to the radiating requirements of electronic product very much, so the heat pipe radiator that the research and development heat pipe is formed in conjunction with fin has become the important topic that solves heat radiation.
Known heat pipe radiator, as shown in Figure 1, mainly include a base 10a, a plurality of heat pipe 20a and a plurality of fin 30a, wherein, base 10a is an en plaque, the end face of base 10a attaches with the end of each heat pipe 20a and contacts, and the other end of each heat pipe 20a then is serially connected on each fin 30a.During use base 10a is arranged on the heat generating component 40a, when heat generating component 40a running produced heat, described heat conducted on each heat pipe 20a and the fin 30a through base 10a again, thereby realized the dissipation of heat.
Though known heat pipe radiator has the effect of heat radiation, yet because each heat pipe 20a only is line contact or small size contact with contacting of base 10a and each fin 30a, the heat that heat generating component 40a is produced conducts on each fin 30a from base 10a, the time that is spent is quite long, thereby causes the heat-conducting effect of described radiator and radiating efficiency not good.
Because the defective that exists in the above-mentioned known technology, the design people relies on and to be engaged in the sector experience for many years, concentrates on studies and cooperates actual utilization, in line with excelsior spirit, active research improvement proposes a kind of reasonable in design and effectively improve the utility model of above-mentioned defective finally.
Content of the present invention
Main purpose of the present utility model, be to provide a kind of temperature-uniforming plate radiator, it makes the temperature-uniforming plate body have large-area the contact with each fin, and heat conduction velocity is fast, the heat that heat generating component produced can be derived rapidly, thus the heat-conducting effect and the radiating efficiency of increase radiator.
For purpose shown in realizing, a kind of temperature-uniforming plate radiator of the present utility model is arranged on the heat generating component of computer, includes a temperature-uniforming plate body and a plurality of fin.Wherein said temperature-uniforming plate body is one " L " font, and it comprises a upper plate body and a lower body, is formed with a hollow reservoir between described upper plate body and lower body; And described each fin is provided with bar shaped perforation, and described temperature-uniforming plate body is serially connected in wherein, and then achieves the above object.
Brief description of drawings
Fig. 1 is the structural representation of known heat pipe radiator;
Fig. 2 is a three-dimensional exploded view of the present utility model;
Fig. 3 is a combination schematic diagram of the present utility model;
Fig. 4 is a user mode cutaway view of the present utility model;
Fig. 5 is the utility model opposite side user mode cutaway view;
Fig. 6 is the user mode cutaway view of another embodiment of the utility model.
In the accompanying drawing, the list of parts of each label representative is as follows:
10a-base 20a-heat pipe
30a-fin 40a-heat generating component
10-temperature-uniforming plate body 11-upper plate body
12-lower body 13-hollow reservoir
14-heat pipe 15-capillary structure
16-supporter 20-fin
21-perforation 211-flange
22-runner 23-heat-conducting medium
The 30-heat generating component
Embodiment
In order to make those skilled in the art can further understand feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing, accompanying drawing only provide with reference to and explanation, be not to be used for limiting the utility model.
Fig. 2, Fig. 3 are respectively three-dimensional exploded view of the present utility model and combination schematic diagram.The utility model provides a kind of temperature-uniforming plate radiator, is arranged on the heat generating component of computer, includes a temperature-uniforming plate body 10 and a plurality of fin 20.
Temperature-uniforming plate body 10 is one " L " font, and it comprises a upper plate body 11 and a lower body 12, and upper plate body 11 is a bending plate, lower body 12 then by four side plates around being connected on the base plate, and it carried out bending process form.When upper plate body 11 covers when being connected on the lower body 12, be formed with a hollow reservoir 13 (as shown in Figure 4) at upper plate body 11 and 12 of lower bodies, be provided with a plurality of heat pipes 14 in hollow reservoir 13, the above and below of each heat pipe 14 attaches with the inwall of upper plate body 11 and lower body 12 respectively and contacts.
The centre of each fin 20 offers bar shaped perforation 21, and an end of temperature-uniforming plate body 10 is serially connected in wherein.And perforation 21 peripheries of each fin 20 extend respectively and are provided with flange 211, the flange 211 of each fin 20 can be fitted and connected respectively on the surface of temperature-uniforming plate body 10, and be formed with a runner 22 at two any 20 adjacent of fins.
Can be during combination with urgent being pressed on the temperature-uniforming plate body 10 of perforation 21 orders of each fin 20, or at surface coated one heat-conducting medium 23 (as shown in Figure 4) of temperature-uniforming plate body 10 (or flange 211 inwalls), heat-conducting medium 23 can be heat-conducting cream or tin cream, increases the effect of combining closely of the flange 211 of temperature-uniforming plate body 10 and each fin 20; So, form a temperature-uniforming plate radiator.
Fig. 4, Fig. 5 are respectively user mode cutaway view of the present utility model and another routine user mode cutaway view.During use, the bottom surface of the lower body 12 of temperature-uniforming plate body 10 is attached on the heat generating component 30 (as central processing unit), when heat generating component 30 runnings produce heat, lower body 12 directly absorbs the heat of heat generating component 30, then evenly conduct to again on each heat pipe 14 in the temperature-uniforming plate body 10, and utilize the gas phase of liquid in the heat pipe 14 to change, and heat is transmitted to fast the top place of temperature-uniforming plate body 10, utilize temperature-uniforming plate body 10 to contact and reach heat conduction velocity faster, promptly heat is conducted on each fin 20 with the large tracts of land of 20 of each fins; So, increase the heat-conducting effect and the radiating efficiency of radiator.
In addition, can be in a side of temperature-uniforming plate body 10, and runner 22 directions of corresponding each fin 20, a fan (figure does not show) is set.Utilize the fan blow flow, and air-flow is guided to runner 22 places of 20 of each fins, the heat that will hoard 22 of each fin 20 and runners blows out, thereby reaches better radiating effect.
Fig. 6 is the user mode cutaway view of another embodiment of the utility model.In the hollow reservoir 13 of temperature-uniforming plate body 10,, also can in hollow reservoir 13, be provided with capillary structure 15 and supporter 16, and inject working fluid, then carry out encapsulation process again except that being provided with a plurality of heat pipes 14 as above-mentioned embodiment; Wherein supporter 16 can be a heat pipe.
In sum, temperature-uniforming plate radiator of the present utility model can effectively improve the many disadvantages of known technology, the heat that heat generating component produced can be derived rapidly, and the heat of increase radiator passes effect and radiating efficiency.And do not see before the utility model application that publication is also unexposed to be used, meet requirements such as novel novelty of patent and creativeness, file an application according to Patent Law.
The above only is a preferred embodiment of the present utility model, be not so promptly limit claim of the present utility model, the equivalent structure transformation that every utilization the utility model specification and accompanying drawing content are done, directly or indirectly be used in other relevant technical field, all in like manner be included in the claim of the present utility model.
Claims (9)
1. a temperature-uniforming plate radiator is characterized in that, comprising:
One temperature-uniforming plate body is one " L " font, and described temperature-uniforming plate body is formed with a hollow reservoir;
A plurality of fins, described each fin are provided with bar shaped perforation, and described temperature-uniforming plate body is serially connected in wherein.
2. temperature-uniforming plate radiator according to claim 1 is characterized in that described temperature-uniforming plate body comprises a upper plate body and a lower body.
3. temperature-uniforming plate radiator according to claim 2 is characterized in that being formed with described hollow reservoir between described upper plate body and lower body, is provided with a plurality of heat pipes in the described hollow reservoir.
4. temperature-uniforming plate radiator according to claim 3 is characterized in that described each heat pipe contacts with the inwall attaching of upper plate body and lower body respectively.
5. temperature-uniforming plate radiator according to claim 1 is characterized in that being provided with capillary structure, supporter and working fluid in the hollow reservoir of described temperature-uniforming plate body.
6. temperature-uniforming plate radiator according to claim 5 is characterized in that described supporter is a heat pipe.
7. temperature-uniforming plate radiator according to claim 1 is characterized in that the perforation periphery extension of described each fin is provided with flange.
8. temperature-uniforming plate radiator according to claim 1 is characterized in that described radiator further includes a heat-conducting medium, and described heat-conducting medium is located between temperature-uniforming plate body and described each fin.
9. temperature-uniforming plate radiator according to claim 8 is characterized in that described heat-conducting medium is any of heat-conducting cream or tin cream.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420120474 CN2762513Y (en) | 2004-12-22 | 2004-12-22 | Radiating plate heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420120474 CN2762513Y (en) | 2004-12-22 | 2004-12-22 | Radiating plate heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2762513Y true CN2762513Y (en) | 2006-03-01 |
Family
ID=36095628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420120474 Expired - Fee Related CN2762513Y (en) | 2004-12-22 | 2004-12-22 | Radiating plate heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2762513Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102810521A (en) * | 2011-05-31 | 2012-12-05 | 奇鋐科技股份有限公司 | Temperature-equalizing plate and manufacturing method thereof |
| CN105277020A (en) * | 2015-10-30 | 2016-01-27 | 成都标建铝业有限公司 | Aluminum sunflower radiator |
| CN115360568A (en) * | 2022-08-25 | 2022-11-18 | 湖北华中长江光电科技有限公司 | Heat transfer device, laser module, laser array system and design method |
-
2004
- 2004-12-22 CN CN 200420120474 patent/CN2762513Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102810521A (en) * | 2011-05-31 | 2012-12-05 | 奇鋐科技股份有限公司 | Temperature-equalizing plate and manufacturing method thereof |
| CN102810521B (en) * | 2011-05-31 | 2015-08-19 | 奇鋐科技股份有限公司 | Equalizing plate structure and manufacture method thereof |
| CN105277020A (en) * | 2015-10-30 | 2016-01-27 | 成都标建铝业有限公司 | Aluminum sunflower radiator |
| CN115360568A (en) * | 2022-08-25 | 2022-11-18 | 湖北华中长江光电科技有限公司 | Heat transfer device, laser module, laser array system and design method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060301 Termination date: 20121222 |