CN2676409Y

CN2676409Y - Radiator carriage and radiating device employing same carriage

Info

Publication number: CN2676409Y
Application number: CN 200420014849
Authority: CN
Inventors: 刘德军
Original assignee: Handa Precision Electronic Technology (shunde) Co Ltd
Current assignee: Mitac Precision Technology Shunde Ltd
Priority date: 2004-01-16
Filing date: 2004-01-16
Publication date: 2005-02-02
Anticipated expiration: 2014-01-16

Abstract

The utility model discloses a radiator carriage and radiating device employing the same carriage which is used for an electronic element. The radiator carriage comprises a frame. The middle of the frame is provided with a frame opening which is used for exposing the surface of the electronic element. A plurality of extension bodies are extended outwards from the frame. The extension bodies are provided with buckling and holding structures. The size of the radiator carriage can be effectively decreased by adopting the structure so that the area occupied by the radiator carriage on the circuit board is decreased. So the arrangements of the circuit board and the other electronic elements and electronic circuits are benefited.

Description

Radiator bracing frame and use the heat abstractor of this bracing frame

Technical field

The utility model relates to a kind of bracing frame and uses the heat abstractor of this bracing frame, has related to a kind of heat abstractor that cooperates the radiator bracing frame of heat-generating electronic elements and use this bracing frame in particular.

Background technology

As everyone knows, electronic component all produces heat when work, and the frequency of work is high more, and the heat of generation is just many relatively more.Central processing unit with computer is that example illustrates.Quickening along with the central processing unit arithmetic speed, the heat that produces during work just increases, in order to make central processing unit keep normal work, so need dispose the bigger radiator of heat radiation power it is lowered the temperature, and radiator generally is fastened on the radiator bracing frame by fastener to central processing unit.

Normally used central processing unit radiator bracing frame is that the bottom surface is a square framework, and open one in the middle of the framework for the surface exposed frame mouth of central processing unit, and a pilot hole has been opened in four corners of the bottom of framework respectively and four corners of framework extend upward buckling structure (such as button hole) respectively.Radiator is general mainly to be made up of heat radiation copper billet, fin and radiator fan, when central processing unit and radiator combination, by fastener with firm being fastened on the bracing frame and making the firm surface that is attached to central processing unit of copper billet of dispelling the heat of radiator.

But adopting traditional framework is the bracing frame of tetragonal structure, the area that takies on circuit board of bracing frame is bigger in use, and the electronic component on the circuit board must be arranged in the outer zone of framework of bracing frame, because circuit board space is limited, the bracing frame area occupied is excessive may to make troubles for arranging of other electron component on the circuit board, if some heat-generating electronic elements are arranged too closely on the circuit board, it is bad and influence the overall performance of circuit board to produce heat radiation; Simultaneously, fix bracing frame, take all factors into consideration the distribution of electronic circuit on the circuit board, so the excessive circuit that also can have influence on the circuit board of bracing frame distributes owing to will through hole be set on circuit board;

And, electronic installation has towards short and small, portable trend development, and volume excessive, take that the too much radiator bracing frame in space is that the global design that does not meet electronic installation requires on the corresponding circuit board, make troubles also can for the solution of heat dissipation problem of electronic component of the height heating of electronic installation inside.

Summary of the invention

The utility model provides a kind of radiator bracing frame of less board area and heat abstractor that uses this bracing frame of taking.

Implement radiator bracing frame of the present utility model and comprise a framework, and framework middle part has the surface exposed frame mouth of electronic component, wherein said framework extends outward several ennations, and ennation be provided with buckling structure.

Implement heat abstractor of the present utility model, this heat abstractor comprises bracing frame and radiator, and wherein bracing frame comprises a framework, and the framework middle part has the surface exposed frame mouth of electronic component, described framework extends outward several ennations, and ennation be provided with buckling structure.

Adopted technique scheme, the disclosed radiator bracing frame of the utility model is owing to adopted framework to extend outward the structure of ennation, therefore can effectively reduce the area that framework takies in the concrete enforcement on circuit board, for other electron component on the circuit board arrange and the electronic circuit branch of circuit board etc. has brought facility.

Description of drawings

Fig. 1 is the isometric front view of the utility model radiator bracing frame.

Fig. 2 is the reverse side stereogram of radiator bracing frame shown in Figure 1.

Fig. 3 is to use the three-dimensional exploded view of the heat abstractor of the utility model radiator bracing frame.

Fig. 4 is the three-dimensional assembly diagram of heat abstractor shown in Figure 3.

Embodiment

Be described in detail below in conjunction with the specific embodiment of accompanying drawing radiator bracing frame of the present utility model.

Fig. 1 and Fig. 2 are the stereograms of the utility model radiator bracing frame.Bracing frame 10 comprises that the middle part has the framework 110 and the outward extending ennation 120 thereof of frame mouth 114, framework 110 is a quadrangle, and ennation 120 stretches out along the diagonal of framework 110 respectively, wherein opened pilot hole 130 on the ennation 120, and the end of ennation 120 extends upward location-plate 140, has buckling structure 141 (buckling structure 141 is a button hole in the present embodiment) on this location-plate 140.All there is upwardly extending wall reinforcement at the outer edge of framework 110 and ennation 120, is used for strengthening the mechanical strength of whole bracing frame 10.As shown in Figure 2, the framework 110 of bracing frame 10 is an integral planar with ennation 120.And on ennation 120, be respectively arranged with the middle part and have the pad pin 150 of mesopore 151, and the center of mesopore 151 is that center with corresponding pilot hole 130 is consistent.When implementing, several pad pin 150 are provided with highly unanimity, to guarantee the planarization of whole bracing frame 10.

Be to use the solid assembling schematic diagram of the heat abstractor of bracing frame of the present utility model as shown in Figure 3.Radiator 40 is made up of groups of fins 410 and heat pipe 420, can be a fixing integral body.Wherein Fa Re electronic component 60 is assembled on the circuit board 30, and the solution of heat sink conception is to attach heat radiation copper billet 401 by the surface at electronic component 60, heat conducts to radiator 40 by heat radiation copper billet 401, and heat just can distribute heat by the groups of fins 410 of radiator 40.Bottom at radiator 40 can be fixed in a certain position by fastener 50, and wherein, in Fig. 3, fastener 50 has several clasps 501, promptly can be with radiator 40 firm being fastened on the bracing frame 10 by clasp 501.20 is the fast-assembling clasp nail in Fig. 3, he can be assemblied in the pilot hole 130 of bracing frame 10, and pass through the pad mesopore 151 of pin 150 and the fixing hole 301 of circuit board 30,150 strong points of several pad pin with bracing frame 10, with the dismountable relevant position that is assemblied in circuit board 30 of bracing frame 10 energy, this fit is easy to use, the reliability height.

Fig. 4 is the three-dimensional assembly diagram of heat abstractor shown in Figure 3.Wherein can adjust the length of the clasp 501 of fastener 50 according to concrete enforcement, perhaps being equipped with buckling structure 141 on the location-plate 140 on the bracing frame 10 waits to adjust at the height on the location-plate 140 radiator 40 is fastened on dynamics on the bracing frame 10, to guarantee that radiator 40 can compress the surface that is attached to electronic component 60 that heat radiation copper billet 401 makes its close and firm closely, realizes good heat sinking function.

The pilot hole of the bracing frame of prior art is positioned at the quadrangle of framework, so the area of framework is relatively large; And bracing frame 10 of the present utility model has changed mentality of designing in the past, employing is extended ennation 120 from framework, and pilot hole 130 and buckling structure 141 all are arranged on the design on the ennation 120, the size of the framework 110 of bracing frame 10 is compared greatly than prior art and has been reduced like this, thereby effectively reduced the area occupied of bracing frame 10 on circuit board 30, can provide more spaces, more convenient for the branch and the arranging of electronic circuit of other electron component on the circuit board.

Certainly, the shape of the framework of bracing frame of the present utility model can be set to circle or polygon according to the shape difference of concrete electronic component, the surface exposed of frame confession electronic component opened at its middle part, and the ennation on the bracing frame then extends outside framework respectively more uniformly; Certainly, the required mechanical dynamics of bearing of bracing frame selects to adopt the high material of mechanical strength to make this bracing frame in the time of also can be according to concrete enforcement, such as alloy etc.

Claims

1. a radiator bracing frame comprises a framework, and framework middle part has the surface exposed frame mouth of electronic component, and it is characterized in that: described framework extends outward several ennations, and ennation be provided with buckling structure.

2. radiator bracing frame as claimed in claim 1 is characterized in that: described ennation extends upward location-plate, and described buckling structure is positioned on the location-plate.

3. radiator bracing frame as claimed in claim 1 or 2 is characterized in that: described buckling structure is a button hole.

4. radiator bracing frame as claimed in claim 1 or 2 is characterized in that: be respectively arranged with pilot hole on the described ennation.

5. radiator bracing frame as claimed in claim 4 is characterized in that: described ennation is provided with several pad pin with mesopore, and the mesopore center of this pad pin is consistent with the center of corresponding pilot hole respectively.

6. radiator bracing frame as claimed in claim 1 or 2 is characterized in that: described framework is a quadrangle.

7. radiator bracing frame as claimed in claim 6 is characterized in that: described ennation stretches out along the diagonal of framework respectively.

8. heat abstractor, comprise bracing frame and radiator, wherein bracing frame comprises a framework, and the framework middle part has the surface exposed frame mouth of electronic component, it is characterized in that: described framework extends outward several ennations, and ennation be provided with buckling structure.

9. heat abstractor as claimed in claim 8 is characterized in that: described framework is a quadrangle.

10. heat abstractor as claimed in claim 8 is characterized in that: described ennation stretches out along the diagonal of framework respectively.