CN2606871Y - Semiconductor refrigerator - Google Patents

Abstract

A semiconductor refrigerator with a semiconductor refrigeration device as core cold resource adopt heat radiator integrated with a heat radiation wing patch, a heat pipe and a mother board metal, a semiconductor refrigeration device, a heat conductive utensil and a connection skeleton to form a refrigeration cassette mechanism of good heat conductive, sealing and heat insulation internally, while form a frame structure of bad heat conductive elastic externally, thereby forming reasonably refrigeration and heat insulation. A heat absorbing plate or device is formed into a five elements refrigeration assembly, thereby avoiding temperature difference weaken due to injury of semiconductor refrigeration device material caused by heat stress and deformation without cold bridge and heat leakage and guaranteeing high performance of products and reliability of standardized large batch production.

Description

Semiconductor freezer

The utility model relates to the utensil that a kind of family expenses or similar family expenses carry out refrigeration by consumed power, especially adopt semiconductor cooler as the core low-temperature receiver and the semiconductor freezer of name thus.

At present, known semiconductor freezer one class is for adopting the snakelike heat-pipe radiator of iron wire grid formula, its major defect is to satisfy the required area of dissipation of semiconductor cooler reality of work, cause the refrigeration result can not reach degree with practical value, its minor defect is the refrigeration part to be divided into two with heat insulating part to cooperatively interact and separate system with failing, therefore can not standardization large-scale production, be the standardization large-scale production afterwards, split into refrigeration part and heat insulating part by force, but have to produce a heating tube working medium evaporation, condensation, the working medium box that reflux cycle is used, or have to produce a heating tube and cross, working medium absorbs the heat-absorbing block of heat, the former is under the limitation that can not satisfy the required area of dissipation of semiconductor cooler reality of work, the temperature rise of working medium box, pressure and thermal deformation thereof that working medium produces, be enough to make the working face at the core position of the semiconductor cooler that matches to bear thermal stress and thermal deformation repeatedly, this just produces many bad results at random, mainly be to make the semiconductor cooler material damage that can not bear differential deformation and cause its temperature difference to decay rapidly, there is blow-by in addition, defectives such as thermal insulation difference and assembly process process difference, the latter can not form optimum handing-over mouth with heat-absorbing block and body of thermal insulating box, easily form cold bridge and make semiconductor cooler be subjected to connection stress from radiator and two aspects of heat dump, and be subjected to gravity and shear, both all cause the unreliability of batch process front and back, all can not guarantee the life-span of product, another kind of for adopting the extrusion molding gilled radiator, its defective also be can not satisfy the semiconductor cooler reality of work required area of dissipation, thereby only be suitable for making the both cooling and heating case that uses on the automobile below 18 liters,, not the semiconductor freezer of real meaning generally only as insulation.

The purpose of this utility model provides a kind of characteristic that produces the high-power heat of high heat flux when working at semiconductor cooler, adopt radiating fin, heat pipe, motherboard is welded to each other the metal-integral radiator of formation, at first possess fully satisfy the semiconductor cooler reality of work required area of dissipation, semiconductor freezer is possessed under the prerequisite of practical refrigerating temperature and refrigeration speed thereof, except that original erection stress, other thermal stress and thermal deformation thereof and radiator, connecting framework, semiconductor cooler, the heat conduction ware, connection stress between the five elements of this formation conductor refrigeration of heat dump is not extended in it, promptly in semiconductor cooler core low-temperature receiver, do not extend, cause semiconductor cooler in this subrange of connecting framework, to be in muchly in the permanent steady dynamic balance, avoided thermal stress and thermal deformation and connection stress and gravity to shear the semiconductor cooler material damage that causes fully and the temperature difference that causes decay, successfully the refrigeration part being divided into two with heat insulating part simultaneously cooperatively interacts and separate system, form sealed, thermally insulated, no cold bridge, do not have the heat of leakage, when increasing substantially freezing capacity, guaranteed the reliability of standard batch production and the life-span of product yet.

The purpose of this utility model is achieved in that a kind of employing radiating fin, heat pipe, motherboard is welded to each other the metal-integral radiator of formation, fully satisfy the required area of dissipation of semiconductor cooler reality of work possessing, semiconductor freezer is possessed under the prerequisite of practical refrigerating temperature and refrigeration speed thereof, at first assemble mutually by the motherboard of good heat conduction plasticity and the connecting framework of the flexible likeness in form window frame of bad heat conduction shape on the radiator, promptly undertaken in the fastening process by the pilot hole of inlaying on screw and the motherboard that is embedded on the connecting framework, within it, the heat conduction ware of good thermal conductivity is inlayed with the window of connecting framework by assembling step thereon and is connected, the hot side of semiconductor cooler is bonding or be welded on the hot conducting surface of radiator motherboard, the huyashi-chuuka (cold chinese-style noodles) of semiconductor cooler is bonded on the cold conducting surface of heat conduction ware, the heat-absorbent surface of heat conduction ware protrudes from the window of connecting framework, be fastened to suitable degree equably by radiator motherboard and connecting framework thus, with radiating fin, heat pipe, motherboard is welded to each other the metal-integral radiator of formation, semiconductor cooler, the heat conduction ware, connecting framework four key elements, inherent formation in good thermal conductivity and the good thermoplastic structure that is in permanent steady erection stress muchly, be not subjected to because of the different influence of different materials coefficient of thermal expansion, and fill with heat-insulating material in all spaces in the connecting framework window frame, formation is sealed, thermally insulated refrigeration movement to semiconductor cooler, the frame structure of bad thermal conductivity of external formation and flexible no cold bridge, the different influence of different materials coefficient of thermal expansion is applied on the window frame of the bad heat conduction of bearing capacity and flexible connecting framework, be that thermal stress and thermal deformation and connection stress are applied in the external elastic edge of refrigeration movement, last key element heat dump is only connected with the heat-absorbent surface of heat conduction ware from the window protrusion of connecting framework in body of thermal insulating box, constitute the refrigeration assembly of five elements, the assembling that is the refrigeration assembly of five elements is finished by radiator motherboard and connecting framework, get rid of semiconductor cooler fully and be subjected to connection stress from radiator and two aspects of heat dump, with connecting framework four sides is the embedding position of installation, back side panel or other side plate at the body of thermal insulating box of refrigerator are machine core board, the sagging step of inlaying with the radiator motherboard is arranged on machine core board, the movement frame of inlaying with the embedding position is arranged on the step that sink, as the interface that the refrigeration movement is installed at body of thermal insulating box, when the refrigeration movement is packed on the machine core board of body of thermal insulating box, the embedding position of connecting framework is embedded in the interface of movement frame, the radiator motherboard is embedded in the sagging step of machine core board, be motherboard and machine core board, connecting framework forms with the assembling of movement frame inlays the structure that cooperates in twos, make the weight of whole refrigeration movement inlay the frame mode solution of carrying the radiator motherboard by the step that sink, semiconductor cooler is not sheared by gravity fully, the electric controller that connects refrigeration again, semiconductor freezer is reasonably formed the refrigeration assembly and two of body of thermal insulating box cooperatively interact and separate system, between embedding position and interface, there is rational fit-up gap, in the fit-up gap, fill by bonding agent with cushioning effect, embed the position, interface, bonding agent is non-conductor, do not produce Lou heat, form the optimum handing-over mouth of two systems thus, on the body of thermal insulating box around the machine core board, have and the extraneous air vent that communicates, the stress jumpy that such structure causes the lasting stress that slowly changes that erection stress and annual range of temperature thereof cause and the semiconductor cooler work temperature difference can immediately outwards be distributed on the motherboard of vast area and have in the external edge than the connecting framework of large space, semiconductor cooler only has in the less bonded area and internal space thereof relatively, except that original erection stress, other thermal stress and thermal deformation and connection stress and gravity do not extend in it, cause to be in for a long time in this subrange of semiconductor cooler in the permanent steady dynamic balance.

Owing to adopt such scheme, semiconductor freezer possesses practical refrigeration performance, avoided thermal stress and thermal deformation and connection stress and gravity to shear the semiconductor cooler material damage that causes fully and the temperature difference that causes decay, reasonably forming refrigeration cooperatively interacts and system independently with adiabatic two, no cold bridge, do not have the heat of leakage, thereby guaranteed the reliability of standard batch production and the performance and the life-span of product.

Below in conjunction with accompanying drawing and embodiment the utility model is further specified.

Fig. 1 is the utility model refrigeration assembly five elements explosive view.

Fig. 2 is the utility model refrigeration assembly five elements installation diagram.

Fig. 3 is the utility model embodiment exploded view.

Fig. 4 is the utility model embodiment installation diagram.

Among the figure: 1, radiating fin 2, heat pipe 3, motherboard 4, radiator 5, hot conducting surface 6, semiconductor cooler 7, hot side 8, huyashi-chuuka (cold chinese-style noodles) 9, heat conduction ware 10, cold conducting surface 11, heat-absorbent surface 12, assembling step 13, connecting framework 14, window 15, inlay screw 16, pilot hole 17, heat dump 18, heat-insulating material 19, embed position 20, body of thermal insulating box 21, machine core board 22, step 23 sink, movement frame 24, interface 25, bonding agent 26, air vent

The structural relation of the utility model refrigeration assembly five elements as shown in Figure 1: by radiating fin (1), heat pipe (2), the metal-integral radiator (4) that motherboard (3) is welded to each other formation is the first element, semiconductor cooler (6) is second key element, its hot side (7) is bonding or be welded on the hot conducting surface (5) of radiator motherboard, heat conduction ware (9) is three elements, its cold conducting surface (10) is bonded on the huyashi-chuuka (cold chinese-style noodles) (8) of semiconductor cooler, in the relative one side of the cold conducting surface of heat conduction ware is heat-absorbent surface (11), around heat-absorbent surface, be assembling step (12), match to merge with window (14) and protrude by window as the connecting framework (13) of the 4th key element, the screw (15) of inlaying on the connecting framework matches with pilot hole (16) on the radiator motherboard and links and above four key elements are fastened, be that heat dump (17) is assemblied on the heat-absorbent surface of heat conduction ware at last with five elements, constitute the structural relation of refrigeration assembly five elements thus.

The utility model refrigeration assembly five elements assembling as shown in Figure 2: undertaken fastening by the pilot hole of inlaying on screw (15) and the motherboard (16) that is embedded on the connecting framework, under the fastening of connecting framework (13), with radiating fin (1), heat pipe (2), motherboard (3) is welded to each other the metal-integral radiator (4) and semiconductor cooler (6) of formation, heat conduction ware (9) four key elements form the refrigeration movement, have living space in connecting framework is filled by heat-insulating material (18), semiconductor cooler is formed sealed, thermally insulated integral body, at last heat dump (17) being assemblied in the heat conduction ware protrudes on the heat-absorbent surface of connecting framework window, form the assembly structure of refrigeration assembly five elements thus, i.e. the assembling of the refrigeration assembly of five elements is finished by radiator motherboard and connecting framework.

The decomposition of the utility model embodiment refrigeration assembly and body of thermal insulating box as shown in Figure 3: by radiating fin (1), heat pipe (2), motherboard (3) is welded to each other the metal-integral radiator (4) of formation, semiconductor cooler, the heat conduction ware, the refrigeration movement that connecting framework (13) four key elements form, with connecting framework four sides is the embedding position (19) of installation, back side panel at the body of thermal insulating box (20) of refrigerator is machine core board (21), the sagging step of inlaying with the radiator motherboard (22) is arranged on machine core board, the movement frame of inlaying with the embedding position (23) is arranged on the step that sink, as the interface (24) that movement is installed at body of thermal insulating box, when the refrigeration movement is packed on the machine core board of body of thermal insulating box, the embedding position of connecting framework is embedded in the interface of movement frame, the radiator motherboard is embedded in the sagging step of machine core board, be motherboard and machine core board, connecting framework forms with the assembling of movement frame inlays the structure that cooperates in twos, make the weight of whole refrigeration movement inlay the frame mode solution of carrying the radiator motherboard by the step that sink, semiconductor cooler is not sheared by gravity fully, the electric controller that connects heat dump and refrigeration again, semiconductor freezer is reasonably formed the refrigeration assembly and two of body of thermal insulating box cooperatively interact and separate system, between embedding position and interface, there is rational fit-up gap, in the fit-up gap, fill by bonding agent with cushioning effect, embed the position, interface, bonding agent is non-conductor, do not produce Lou heat, form the optimum handing-over mouth of two systems thus, air vent (26) is arranged around the body of thermal insulating box machine core board.

The utility model embodiment general assembly as shown in Figure 4: by radiating fin (1), heat pipe (2), motherboard (3) is welded to each other the metal-integral radiator (4) of formation, together with semiconductor cooler (6), heat conduction ware (9), the refrigeration movement that connecting framework (13) four key elements form, embedding position by connecting framework is embedded in the interface of movement frame (23), the radiator motherboard is embedded in the sagging step (22) of machine core board (21), there is rational fit-up gap between position and the interface and fills embedding by the bonding agent with cushioning effect (25), in body of thermal insulating box (20), heat dump (17) is assemblied in the heat conduction ware to be protruded on the heat-absorbent surface of connecting framework window, constitute the refrigeration assembly of five elements, the electric controller that connects refrigeration is again finished the general assembly of refrigeration assembly and body of thermal insulating box two systems thus.

When energising work, heat in the body of thermal insulating box is absorbed by heat dump, heat is concentrated by the heat-absorbent surface of heat conduction ware and is delivered to cold conducting surface by the heat conduction ware, huyashi-chuuka (cold chinese-style noodles) at cold conducting surface of heat conduction ware and semiconductor cooler carries out heat exchange and by semiconductor cooler heat actively is delivered to its hot side, carry out heat exchange and heat is passed through motherboard at the hot side of semiconductor cooler and the hot conducting surface of radiator motherboard, heat pipe promptly reaches in numerous radiating fins and by air vent and is dispersed in the external environment, so carry out the refrigeration processes of electron heat pump type, reach the refrigeration temperature difference with practical value and the purpose of refrigeratory capacity by consumed power.

Claims (15)

1, a kind of family expenses or similar family expenses adopt the semiconductor freezer of semiconductor cooler as the core low-temperature receiver, it is characterized in that: adopt radiating fin (1), heat pipe (2), motherboard (3) is welded to each other the metal-integral radiator (4) of formation, at first assemble mutually by the motherboard of good heat conduction plasticity on the radiator and the connecting framework (13) of the flexible likeness in form window frame of bad heat conduction shape, promptly undertaken in the fastening process by the pilot hole of inlaying on screw (15) and the motherboard (16) that is embedded on the connecting framework, within it, the heat conduction ware (9) of good thermal conductivity is inlayed with the window (14) of connecting framework by assembling step (12) thereon and is connected, the hot side (7) of semiconductor cooler (6) is bonding or be welded on the hot conducting surface (5) of radiator motherboard, the huyashi-chuuka (cold chinese-style noodles) of semiconductor cooler (8) is bonded on the cold conducting surface (10) of heat conduction ware, the heat-absorbent surface of heat conduction ware (11) protrudes from the window of connecting framework, so be fastened to suitable degree equably by radiator motherboard and connecting framework, with radiating fin, heat pipe, motherboard is welded to each other the metal-integral radiator of formation, semiconductor cooler, the heat conduction ware, connecting framework four key elements, inherent formation in good thermal conductivity and the good thermoplastic structure that is in permanent steady erection stress muchly, and the institute in the connecting framework window frame has living space with heat-insulating material (18) filling, formation is sealed, thermally insulated refrigeration movement to semiconductor cooler, the frame structure of bad thermal conductivity of external formation and flexible no cold bridge, last key element heat dump (17) is only connected with the heat-absorbent surface of heat conduction ware from the window protrusion of connecting framework in body of thermal insulating box (20), constitute the refrigeration assembly of five elements, the assembling that is the refrigeration assembly of five elements is finished by radiator motherboard and connecting framework, with connecting framework four sides is the embedding position (19) of installation, back side panel or other side plate at the body of thermal insulating box of refrigerator are machine core board (21), the sagging step of inlaying with the radiator motherboard (22) is arranged on machine core board, the movement frame of inlaying with the embedding position (23) is arranged on the step that sink, as the interface (24) that the refrigeration movement is installed at body of thermal insulating box, when the refrigeration movement is packed on the machine core board of body of thermal insulating box, the embedding position of connecting framework is embedded in the interface of movement frame, the radiator motherboard is embedded in the sagging step of machine core board, motherboard and machine core board, connecting framework forms with the assembling of movement frame inlays the structure that cooperates in twos, the weight that promptly forms whole refrigeration movement is inlayed the structure of carrying the radiator motherboard by the step that sink, the electric controller that connects refrigeration again, semiconductor freezer is reasonably formed the refrigeration assembly and two of body of thermal insulating box cooperatively interact and separate system, between embedding position and interface, there is rational fit-up gap, in the fit-up gap, fill by the bonding agent with cushioning effect (25), embed the position, interface, bonding agent is non-conductor, do not produce Lou heat, form the optimum handing-over mouth of two systems thus, on the body of thermal insulating box around the machine core board, have and the extraneous air vent (26) that communicates.

2, semiconductor freezer according to claim 1 is characterized in that adopting radiating fin (1), heat pipe (2), motherboard (3) to be welded to each other the metal-integral radiator (4) of formation.

3, semiconductor freezer according to claim 1, it is characterized in that connecting framework (13) assembling mutually, promptly undertaken fastening by being embedded in interlocking screw (15) on the connecting framework and the pilot hole (16) on the motherboard by motherboard with the flexible likeness in form window frame of the bad heat conduction shape of good heat conduction plasticity on the radiator.

4, semiconductor freezer according to claim 1, the heat conduction ware (9) that it is characterized in that good thermal conductivity is inlayed with the window (14) of connecting framework by assembling step (12) thereon and is connected.

5, semiconductor freezer according to claim 1, it is characterized in that the hot side (7) of semiconductor cooler (6) is bonding or be welded on the hot conducting surface (5) of radiator motherboard, the huyashi-chuuka (cold chinese-style noodles) of semiconductor cooler (8) is bonded on the cold conducting surface (10) of heat conduction ware, and the heat-absorbent surface of heat conduction ware (11) protrudes from the window of connecting framework.

6, semiconductor freezer according to claim 1 is characterized in that have living space in the connecting framework window frame filled with heat-insulating material (18).

7, semiconductor freezer according to claim 1, it is characterized in that radiating fin, heat pipe, motherboard being welded to each other the metal-integral radiator (4) of formation, semiconductor cooler (6), heat conduction ware (9), connecting framework (13) four key elements, to form semiconductor cooler be sealed, thermally insulated refrigeration movement.

8, semiconductor freezer according to claim 1, it is characterized in that radiating fin, heat pipe, motherboard are welded to each other metal-integral radiator, semiconductor cooler, heat conduction ware, connecting framework four key elements of formation, inherent good thermal conductivity and the good thermoplastic structure that is in the steady erection stress of perseverance muchly, the frame structure of bad thermal conductivity of external formation and flexible no cold bridge of forming.

9, semiconductor freezer according to claim 1 is characterized in that heat dump (17) only connects with the heat-absorbent surface (11) of heat conduction ware from the window protrusion of connecting framework, constitutes the refrigeration assembly of five elements in body of thermal insulating box (20).

10, semiconductor freezer according to claim 1 is characterized in that the assembling of the refrigeration assembly of five elements is finished by radiator motherboard and connecting framework.

11, semiconductor freezer according to claim 1 is characterized in that the embedding position (19) of connecting framework four sides for installing.

12, semiconductor freezer according to claim 1, the back side panel or other side plate that it is characterized in that the body of thermal insulating box of refrigerator are machine core board (21), the sagging step of inlaying with the radiator motherboard (22) is arranged on machine core board, the movement frame of inlaying with the embedding position (23) is arranged, as the interface (24) that the refrigeration movement is installed at body of thermal insulating box on the step that sink.

13, semiconductor freezer according to claim 1, the embedding position (19) that it is characterized in that connecting framework is embedded in the interface (24) of movement frame, radiator motherboard (3) is embedded in the sagging step interior (22) of machine core board (21), motherboard forms with the assembling of movement frame with machine core board, connecting framework inlays the structure that cooperates in twos, and the weight that promptly forms whole refrigeration movement is inlayed the structure of carrying the radiator motherboard by the step that sink.

14, semiconductor freezer according to claim 1, it is characterized in that between embedding position (19) and interface (24), having rational fit-up gap, in the fit-up gap, fill by the bonding agent with cushioning effect (25), embedding position, interface, bonding agent are non-conductor, do not produce Lou heat, form the optimum handing-over mouth of two systems thus.

15, semiconductor freezer according to claim 1 is characterized in that having on the body of thermal insulating box around the machine core board and the extraneous air vent (26) that communicates.

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