CN2268232Y

CN2268232Y - Semi-conductor temp.-regulating equipment

Info

Publication number: CN2268232Y
Application number: CN 96242246
Authority: CN
Inventors: 吴智泉
Original assignee: Shenzhen Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 1996-10-22
Filing date: 1996-10-22
Publication date: 1997-11-19
Anticipated expiration: 2006-10-22

Abstract

The utility model relates to a semiconductor temperature adjusting device (40), comprising a heat rejection component (401), a supporting plate (405), a semiconductor component (406), a heat sink (407), a heat insulation layer (408) and a cold storing bar section (409). The heat rejection component is a root stacking structure, a rib-shaped heat rejection ribs designed according to the maximum heat efficiency and pad strips of the heat rejection component are penetrated and stacked on a draw rod layer by layer, heat conducting grease is spread between all of touching heat transferring layer surfaces for enhancing heat conductivity between ribs, both ends of the heat rejection component are provided with pressing plates, the heat rejection component is pressed and stacked by nuts on both ends of the draw rod, and the semiconductor component adopts a plane double-row malposed type structure. The utility model can be used for machine frames of electronic communication devices having temperature controlled refrigerating requirements.

Description

The semiconductor temperature equipment

The utility model relates to semiconductor refrigerating technology, relates more specifically to large-capacity semiconductor refrigeration/firing equipment.

Cooling technique of semiconductor is at deep cooling, instrument and meter, aspect extensive application such as affaires: have advantages such as low noise, friction parts because of it, be specially adapted to the big electronic communication equipment of the strong device density of vibration sensing; Because of its heating/refrigeration operating mode easy switching, needing to be particularly useful for the outdoor equipment of work under dual working conditions again; Also because of its simple structure, technological requirement is low, need not special equipment and a large amount of mould, in being particularly suitable for, small-scale customization production.But then, because being contact, conductor refrigeration conducts heat, thermal source is concentrated, bigger hot junction caloric value and lower refrigerating efficiency have limited the application of cooling technique of semiconductor in big capacity refrigeration field, especially for the air cooling application scenario of anhydrous cool condition, do not see hundreds of watts of practical high power semi-conductor refrigeration products so far as yet.

Fig. 1 shows at present the typical structure than a kind of small semiconductor refrigerator of widespread usage.It is made up of hot junction aluminium section bar fin 1, backing plate 2, semiconductor devices 3, heat sink 4, heat insulation filling bed 5, substrate 6, cold-storage type material 7 etc.Fig. 2 shows the device plane layout structure in the semiconductor cooler shown in Figure 1, and its cooling is adopted exposure formula natural air cooling or adopted the force air cooling of external fan to device 3 hot junctions.This structure is because more along heat-transfer path thermal resistance item, and the heat-sinking capability of section bar 1 is limited, so high-power refrigeration system is not had practical value.

Fig. 3 shows a kind of traditional high density fin-tube type radiator structure, though this structure has bigger area of dissipation to be only applicable to the heat radiation of liquid refrigerant, is not abutted against the semiconductor cooler that touches heat transfer if be suitable for.

In a word, the subject matter of large-capacity semiconductor refrigerator is how to solve the conduction and the heat radiation of high density hot-fluid, thereby improves refrigerating efficiency and make it practicability.

The purpose of this utility model be the problems referred to above that overcome prior art provide the high and heat dissipation capacity of a kind of heat conduction efficiency greatly, be applicable to the large-capacity semiconductor temperature equipment of the electronic communication equipment that temperature control refrigeration requires.

For achieving the above object, semiconductor temperature equipment of the present utility model comprises radiating subassembly, support plate, semiconductor devices, heat sink, thermal insulation layer and cold-storage type material, its characteristics are: described radiating subassembly is the root stepped construction, its rib shape is successively worn by the radiated rib of maximum thermal efficiency design and filler strip and is folded on a pull bar, be coated with thermal grease conduction between each transmission of heat by contact aspect, to strengthen the intercostal thermal conductivity; Assembly two ends increased pressure board is with the nut at the pull bar two ends lamination that holds down assembly.Described semiconductor devices adopts dislocation type structure between the row of plane.

The utility model semiconductor temperature equipment also comprises main ventilating fan group and mends wind fan, lamina tecti, heat insulation lead-in, heat insulating washer, by described cover plate, described two side guides and individual air stream passage of described (rib root) filler strip structure, hot blast is extracted out by described main ventilating fan group, forms eddy current with the internal heat air in the space that prevents to be cooled; Described benefit wind fan is positioned at described refrigerator top, arranges device local repair wind backward to improve the heat dissipation environment of back row's cooler, makes the radiating condition of forward and backward row's device in a basic balance.

Described semiconductor devices cold junction to reduce surperficial thermal contact resistance item, prevents the parasitic temperature difference by heat sink direct contact cold-storage type material, and its hot junction then sees through the perforate of described support plate and the radiating subassembly bottom of grinding and polishing connects, and all scribbles thermal grease conduction between each faying face.

Fill in the interlayer of semiconductor devices two ends with heat-insulating material, periphery also adopts the phenolic laminated sheet encapsulation of low thermal conductivity, to prevent the hot reflux of radiator bottom to the cold junction section bar.

Because the design feature and the ancillary method of the above-mentioned stacked radiating subassembly that the utility model adopted, it is more to make the utility model overcome the similar device thermal resistance of prior art item, defectives such as the section bar heat-sinking capability is limited, 4～10 times of can be reached by common section bar of the hot validity coefficient of fin are brought up to 36 times, thereby can be used for having in the electronic communication equipment machine frame of temperature control refrigeration requirement.Zero load test shows to the utility model equipment model machine (400W), the temperature control that this equipment satisfies outdoor type electronic equipment equal energy operate as normal when hot summer or severe winter substantially requires: be placed on the thick cystosepiment of ground 25mm, even 1 hour cold junction section bar space temperature of work reaches 0 ℃ of equalization point when environment temperature is 23 ℃; Place no thermal source, volume is to record on 93 liters the sealing wood packing box time: 27 ℃ of environment temperatures, the 1 hour the temperature inside the box of working reaches 11～12 ℃.

Now be described with reference to the accompanying drawings basic structure of the present utility model and an embodiment, in the accompanying drawing:

Fig. 1 is a kind of structural representation of conventional semiconductors refrigerator;

Fig. 2 is the plane figure schematic diagram of semiconductor devices in the semiconductor cooler shown in Figure 1;

Fig. 3 is the schematic diagram of traditional fin-tube type radiator structure;

Fig. 4 is the structural representation of the utility model temperature equipment;

Fig. 5 is the schematic layout pattern of the semiconductor devices of the utility model temperature equipment;

Fig. 6 is the structural representation of heat sink assembly 401 in the temperature equipment shown in Figure 4;

Fig. 7 is each position of opening schematic diagram of support plate 405 in the presentation graphs 4;

Fig. 8 is that the enlarged diagram in a hole in each perforate 701 shown in Figure 7 shows how the device hot junction of the utility model refrigerator sees through the situation that this perforate contacts with radiating subassembly;

Fig. 9 is an installation profile schematic diagram of using an outdoor type telecommunications equipment cabinet of the utility model temperature equipment;

Same parts is represented with identical or corresponding label in all accompanying drawings.

Referring to Fig. 4, this illustrates the basic structure of the utility model model machine 40, as seen from the figure, the utility model refrigerator comprises stacked radiating subassembly 401, main ventilating fan group 402, mends wind fan 403, lamina tecti 404, support plate 405, cooler 406, heat sink 407, thermal insulation layer 408, cold-storage type material 409, heat insulation lead-in 410, connect screw 411, heat insulating washer 412, wherein semiconductor devices 406 adopts the double dislocation type in planes as shown in Figure 5 to arrange.

Fig. 6 shows the core component of the utility model refrigerator---the structural representation of the stacked radiating subassembly 401 of root, referring to this figure, radiated rib 601 is successively worn with filler strip 602 and is folded on pull bar 603, interlayer is coated with thermal grease conduction to strengthen the intercostal thermal conductivity, radiating subassembly 401 two ends are added with pressing plate 604, with the nut at the pull bar 603 two ends lamination that holds down assembly.For further improving thermal conductivity, described assembly bottom is milled, is ground through combination, local again grinding and polishing, and in addition, the radiated rib surface adopts oxide treatments to improve the fin thermal emissivity rate.

Have the perforate of position as shown in Figure 7 among Fig. 4 on the support plate 405, again in conjunction with Fig. 8, just can know understanding, the semiconductor devices hot junction is that the perforate 701 that how to see through support plate 405 connects mutually with the radiating subassembly bottom of polishing, all scribble thermal grease conduction between each composition surface, the hot and cold two ends of semiconductor compress device and heat sinkly connect by stretching screw.

Referring to Fig. 9, this illustrates the scheme of installation of an example using the utility model temperature equipment.The outdoor type access network equipment 90 that the utility model equipment is equipped with in expression among the figure wherein temperature equipment 40 adopts the semiconductor devices of 8 50W altogether, two groups totally 9 its power consumptions of fan be about 480W, the about 46kg of equipment 40 gross weights, contour dimension 670W * 222H * 354D.

Claims

1, a kind of semiconductor temperature equipment, comprise radiating subassembly, fan, support plate, semiconductor cooler, heat sink, thermal insulation layer and cold-storage type material, it is characterized in that: described radiating subassembly is the root stepped construction, its radiated rib (601) and filler strip (602) are successively worn and are folded on pull bar (603), compress described assembly lamination by the fixture at pull bar two ends.

2, semiconductor temperature equipment as claimed in claim 1, it is characterized in that: described cooler is the plane alternating expression and arranges, described support plate leaves perforate in the relevant position of described cooler, connects so that the hot junction of described cooler sees through the bottom of this perforate and described radiating subassembly.

3, semiconductor temperature equipment as claimed in claim 2 is characterized in that: the cold junction of described cooler directly contacts by described heat sink and described cold-storage type material.

4, as the semiconductor temperature equipment of claim 2 or 3, it is characterized in that: the bottom that the hot junction of described radiating subassembly and described cooler connects is through grinding and polishing.

5, semiconductor temperature equipment as claimed in claim 4 is characterized in that: described fan comprises main ventilating fan group (402) of taking out hot blast and the flow process of blowing a cold wind over benefit wind fan (403), with the radiating condition of the described equipment of further improvement.

6, semiconductor temperature equipment as claimed in claim 4 is characterized in that: described radiated rib (601) is crossed through oxide treatments.

7, semiconductor temperature equipment as claimed in claim 6 is characterized in that: be filled with hard polyurethane foam plastic in the described thermal insulation layer, its periphery encapsulates with the low phenolic laminated sheet of thermal conductivity factor.

8, semiconductor temperature equipment as claimed in claim 7 is characterized in that: described temperature equipment also comprises and is used to connect the cold and hot two ends of semiconductor devices and compresses device and heat sink fixture.

9, semiconductor temperature equipment as claimed in claim 8 is characterized in that: described fixture is a nut, and described fixture is a stretching screw.

10, semiconductor temperature equipment as claimed in claim 9, it is characterized in that: described nut and screw all are added with the heat insulating washer of being made by the low thermal conductivity material.