CN2600917Y - Direct heat-conducting insulating wafer type commutation device water cooling device - Google Patents

Abstract

A water cooling device with direct heat-diffusing insulators for rectifying devices applies a heat-diffusing mode of direct contact by directly sticking the two faces of heat-diffusing ceramic plates onto the outer surface of wiring bus bar and the radiator of semiconductor power elements, wherein the heat-diffusing ceramic plate is directly attached on the smooth outer surfaces and is directly positioned between the wiring bus bar and the radiator, with one side directly attached to corresponding surface of the radiator and the other side directly attached to corresponding surface of the wiring bus bar; temperature gradient from the wiring bus bar to the radiator is 3 to 5 degrees centigrade; thickness of the ceramic plate is 2 to 3 millimeters; the utility model provides two groups of water-cooling radiators, each group comprising three radiator modules welded by tubes as a whole; as for water channel layout, the utility model provides a water inlet and a water outlet for single-cycle cooling through two branches. Such a layout can reduce temperature gradient of the heat-diffusing ceramic plate to enhance the heat-diffusing effect; besides, axial dimensions of the overall heat dissipation system can be shortened to reduce the weight, which is very important for movable equipments, especially rail vehicles.

Description

A kind of direct heat conductive isolation sheet type rectifying device water cooling plant

One, technical field

The utility model belongs to a kind of cooling heat dissipation method and device of power semiconductor, is meant especially to adopt mode and the device of thermal conductive ceramic plate as the water-cooled of power semiconductor insulating thermal conductor.

Two, technical background

Along with the power grade of power semiconductor, the raising of switching frequency, promptly improving constantly of the loss of device and density of heat flow rate is also more and more higher to the cooling requirement of device.Different by the cooling principle of the radiator that directly contacts with semiconductor device and coolant are broadly divided into several types such as air, oil, fluorine Lyons and water.In these cooling patterns, each have their own characteristics and range of application, according to the production of each company, application habit, production technology reach the corresponding cooling of various cooling system application study degree decisions.As in AC drive locomotive, Japan's heat pipes that adopt, Europe oil cooling, boiling cooling and the water-cooleds of adopting more more, but total target is consistent, even the power semiconductor junction temperature below the allowable value, adopts air-cooled at it, because the conductive coefficient of its air is lower, cooling rate is slow, and the structure of air cooling equipment is huge in addition, big (the natural air cooled noiseless of noise, but want the cube big), therefore strict at volume, weight, the application scenario that density of heat flow rate is big is not adopted air-cooled basically.The maximum characteristics of oil cooling are that coolant is non-conductive, and cooling effectiveness is higher, but contaminated environment, and the danger of burning, application difficult are arranged.Boiling cooling and heat pipe cooling heat dissipation efficient height, but use more complicated.The another kind of type of cooling is exactly a water-cooled, and water is a kind of superior coolant, has good heat-transfer, and thermal capacity is big, to the characteristic of environment friendliness, is widely used in fields such as automobile, the energy, chemical industry.At present, in the heat radiation of power semiconductor, the water cooling radiating mode has become a kind of development trend.But, limited the application of water-cooling pattern in the big current commutates of middle and high pressure field because light water can conduct electricity.With water be medium when the power rectifier device cools off, need solve the problem of two aspects simultaneously, the Insulation Problems of first water and device, second it is heat conduction reinforced problem.In recent years, begin to adopt the water-cooled heat conductive insulating parts of thermal conductive ceramic plate abroad as power semiconductor.Thermal conductive ceramic plate has high-termal conductivity and the dual performance of high insulation; can be delivered to the heat that produces in the power semiconductor running in the cooling water effectively; make full use of the heat transfer property of water; can make full use of the high dielectric property of potsherd again; avoid the conductive characteristic of cooling water; realize the insulation of main circuit and cooling water, protection operator's personal safety.Adopt thermal conductive ceramic plate, can effectively reduce the volume and weight of water-cooled rectifying device, simultaneously,, both reduced requirement, can reduce running cost again cooling water owing to cancelled additional deionization apparatus.

The thermal conductive ceramic plate of existing water-cooled rectifying device is encapsulated in the immobilising device, the thermal conductive ceramic plate both sides compress with copper billet, be encapsulated in element internal, though, press-fit conveniently, can on the other hand though like this pottery sheet is had certain firm effect, both increased the axial dimension of thermal conductive ceramic device, increase the thermal resistance of thermally conductive pathways again, made the radiating effect of entire device lower, caused the advantage of thermal conductive ceramic plate heat dispersion not fully played.In addition, it all is to adopt adjustable pipe to connect mode that the pipeline of existing thermal conductive ceramic chip water-cooled rectifying device connects each other, has the possibility of leaking, and makes also that in addition the physical dimension of whole device is bigger than normal, so all be necessary in these areas to be improved.

Three, summary of the invention

The purpose of this utility model is the deficiency at existing thermal conductive ceramic chip water cooling plant, proposes the independent direct conduction type thermal conductive ceramic chip water cooling plant as an insulation heat transfer device of a kind of thermal conductive ceramic plate.

According to the technical scheme that the purpose of this utility model proposed be, adopt the directly radiating mode of contact, the two sides of thermal conductive ceramic plate directly is attached to respectively on the outer surface of the wiring busbar of power semiconductor component and radiator, directly fit by smooth surface, radiator is 0.2-0.8 μ m with the surface smoothness that is connected busbar and thermal conductive ceramic plate composition surface, the surface smoothness of thermal conductive ceramic plate is 0.2-0.8 μ m, and thermal conductive ceramic plate is directly installed between radiator and the wiring busbar, its one side directly is attached on corresponding of the radiator, another side then directly is attached to and connects on corresponding of the busbar, is 3-5 ℃ from connecting busbar to the temperature gradient of radiator.The material of thermal conductive ceramic plate is ALN 〉=93%, and all the other are additive; Hardness is Mohs 6-7 level, resistivity 〉=10 ¹⁵Ω .cm, conductive coefficient 〉=80W/MK, proof voltage power frequency 10kV, 1min do not have puncture and scintillation, and the thickness of potsherd is 2-3mm.Adopt this layout, can reduce the temperature gradient of thermal conductive ceramic device itself, strengthen radiating effect, can shorten the axial dimension of entire heat dissipation system simultaneously again, the weight of alleviator.This point is for the operational outfit of motion, special is very important to rail locomotive, water-cooled rectifying device according to the designed heat conductive isolation sheet type of the radiating mode of this direct contact, be with semiconductor element, thermal conductive ceramic plate, connect busbar, radiator and press-fit part etc. and combine (generally being) by a bridge-type functional module combination, many rows arrange, semiconductor element adopts the single face cooling, it is characterized in that thermal conductive ceramic plate is connected busbar with water-filled radiator and power semiconductor be directly contact, totally two groups of water-filled radiators, every group of radiator used by three heat spreader modules and is connected to form an integral body with the pipe weldering, arranges each one of intake-outlet in the water route, be divided into two branch road single cycle coolings, can make the resulting cooling raio of rectifying device more even like this.

The mode that adopts this thermal conductive ceramic plate and radiator and rectifying device directly to contact, can shorten the axial dimension of entire heat dissipation device greatly, can make that like this axial dimension of whole device dwindles, simultaneously owing to taking radiator cooling tube directly to be welded to connect between row and row, can reduce distance between row and row so greatly, thereby make whole rectifying device all obtain reduction from two aspects, so just can alleviate the volume of whole rectifying device greatly, adopt Aluminium Radiator and press-fit part, the radiating efficiency height can make that installation weight farthest reduces.Make the miniaturization of power device to realize, simultaneously, owing to adopted two branch road single cycle cooling systems, make the cooling of each device become more even, reduced device to be heated and the uneven phenomenon that deforms, so the utility model can be widely used in the cooling of power semiconductor device.

Four, accompanying drawing and explanation

Fig. 1 carries but structure principle chart for the utility model;

Fig. 2 specifically implements structural front view for the utility model;

Fig. 3 specifically implements the structure vertical view for the utility model;

Fig. 4 specifically implements the structure left view for the utility model.

Among the figure: the 1-thermal conductive ceramic plate, 2-semiconductor power components and parts, 3-connects busbar, the 4-radiator, 5-radiator and thermal conductive ceramic plate contact-making surface, 6-busbar and thermal conductive ceramic contact-making surface, 7-cooling water gateway, 8-cooling water gateway, 9-installing rack, 10-radiator cooling tube connector, 11-semiconductor power device, 12-semiconductor power device, the 13-radiator, the 14-radiator, 15-thermal conductive ceramic plate, 16-thermal conductive ceramic plate, 17-is frame plate fixedly, 18-is frame plate fixedly, 19-bolt, 20-radiator, the 22-radiator, the 23-radiator, 24-connects busbar, and 25-connects busbar.

Five, embodiment

Fig. 1 is a schematic diagram of the present utility model, according to the design embodiment that proposes of the present utility model is thermal conductive ceramic plate (1), semiconductor power components and parts (2), connect busbar (3), and radiator (4) directly fits together, earlier bright and clean processing is carried out on the two sides of thermal conductive ceramic plate, make its surface smoothness reach 0.2-0.8 μ m, and it is directly installed on radiator and is connected between the busbar, its one side directly is attached on corresponding of the radiator, another side then directly is attached to and connects on corresponding of the busbar, makes that be 3-5 ℃ (heat radiation power 1000W) from connecting busbar to the temperature gradient of radiator.

Fig. 2, Fig. 3, Fig. 4 has provided a specific embodiment of the present utility model, from accompanying drawing as can be seen, the utility model comprises thermal conductive ceramic plate 1, semiconductor power components and parts 2, connect busbar 3, radiator 4, installing rack 9 and radiator cooling tube connector 10, it is characterized in that device described in the utility model is with two semiconductor power devices 11,12 are one group axially is close to arrangement, two device outsides respectively are provided with a radiator 13,14, at radiator 13,14 are connected busbar 24 with semiconductor power device, directly clamped thermal conductive ceramic plate 15 between 25,16, and according to the setting of functional module body according to two power devices, one row, the ordering of implementation multiple row, and constitute the functional module of a complete band cooling device, again at the two ends of every row with fixing frame plate 17,18 fix whole device by bolt 19.The material of thermal conductive ceramic plate is ALN 〉=93%, and all the other are additive; Hardness is Mohs 6-7 level, resistivity 〉=10 ¹⁵Ω .cm, conductive coefficient 〉=80W/MK, proof voltage power frequency 10kV, 1rain do not have puncture and scintillation, and the thickness of potsherd is 2-3mm.Use principle of the present invention the axial dimension of semiconductor power device assembly can be shortened greatly.All adopt for the cooling water pipe between each row radiator and to be welded to connect, and cooling water is two circulation line coolings, the cooling of one road cooling water pipe be in proper order by radiator 21 to 22 again to 13, get back to delivery port from the bottom of device then, another road then be by radiator 23 to 20 again to 14, also get back to delivery port then from the device bottom.

Claims (5)

1, a kind of direct heat conductive isolation sheet type rectifying device water cooling plant, comprise thermal conductive ceramic plate (1), semiconductor power components and parts (2), connect busbar (3), radiator (4), installing rack (9) and radiator cooling tube connector (10), the thermal conductive ceramic plate that it is characterized in that described device is connected busbar and directly helps and touch with water-filled radiator and power semiconductor, with two semiconductor power devices (11), (12) be one group and axially be close to arrangement, two device outsides respectively are provided with a radiator (13), (14), in radiator (13), (14) be connected busbar (24) with semiconductor power device, (25) directly clamped thermal conductive ceramic plate (15) between, (16), and be row according to two power devices according to the setting of functional module body, the ordering of implementation multiple row, and constitute the functional module of a complete band cooling device, again at the two ends of every row with fixing frame plate (17), (18) by bolt (19) whole device is fixed.

2, a kind of direct heat conductive isolation sheet type rectifying device water cooling plant as claimed in claim 1, it is characterized in that two sides with thermal conductive ceramic plate directly is attached to respectively on the outer surface of the connection busbar of power semiconductor component and radiator, directly fit by smooth surface, radiator is 0.2-0.8 μ m with the surface smoothness that is connected busbar and thermal conductive ceramic plate composition surface, the surface smoothness on the two sides of thermal conductive ceramic plate is 0.2-0.8 μ m, and thermal conductive ceramic plate is directly installed on radiator and is connected between the busbar, its one side directly is attached on corresponding of the radiator, another side then directly is attached to and connects on corresponding of the busbar, and the temperature gradient from the semiconductor power components and parts to radiator is 3-5 ℃.

3, a kind of direct heat conductive isolation sheet type rectifying device water cooling plant as claimed in claim 1 or 2, the hardness that it is characterized in that thermal conductive ceramic plate is Mohs 6-7 level, resistivity 〉=10 ¹⁵Ω .cm, conductive coefficient 〉=80W/WK, proof voltage power frequency 10kV, 1min do not have puncture and scintillation, and the thickness of potsherd is 2-3mm.

4, a kind of direct heat conductive isolation sheet type rectifying device water cooling plant as claimed in claim 1 or 2, it is characterized in that totally two groups of water-filled radiators, every group of radiator used by three heat spreader modules and is connected to form an integral body with the pipe weldering, arrange in the water route, each one of intake-outlet is divided into two branch road single cycle coolings.

5, a kind of direct heat conductive isolation sheet type rectifying device water cooling plant as claimed in claim 1 or 2, it is characterized in that cooling water is two circulation line coolings, the cooling of one road cooling water pipe in proper order by radiator (21) to (22) again to (13), get back to delivery port from the bottom of device then, another road then by radiator (23) to (20) again to (14), then also from the device bottom get back to delivery port.