CN2599487Y - Working medium direct-immersion temp. differential electric refrigeration device - Google Patents
Working medium direct-immersion temp. differential electric refrigeration device Download PDFInfo
- Publication number
- CN2599487Y CN2599487Y CNU022933840U CN02293384U CN2599487Y CN 2599487 Y CN2599487 Y CN 2599487Y CN U022933840 U CNU022933840 U CN U022933840U CN 02293384 U CN02293384 U CN 02293384U CN 2599487 Y CN2599487 Y CN 2599487Y
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- heat
- working medium
- thermoelectric
- hot junction
- radiator
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Abstract
The utility model provides a thermoelectric cooling device with a refrigerant direct dipping process, consisting of a thermoelectric cooler, a radiator and refrigerant. The heat-exchanging chamber in the radiator in the base plate of the hot end of the thermoelectric cooler is a sealed one, in which is input heat conducting refrigerant. The heat conducting refrigerant dips directly into the base plate of the hot end of the thermoelectric cooler and the heat produced on the base plate of the hot end transfers into the entire radiator by way of the refrigerant to be exchanged. Traditional heat exchanging technology of plane attaching leads to a gradient temperature difference due to attachment to thermal resistance. While the utility model avoids the problem and lessens the affect to the service life of the thermoelectric cooler caused by thermo-stress distortion. And the reliability, the cooling efficiency and the overall refrigerating capacity of the thermoelectric cooler are improved.
Description
Technical field
The utility model relates to thermoelectric (al) cooling and field of heat transfer, specifically is a kind of self circulation of working medium heat transfer type thermoelectric (al) cooling device.
Background technology
Because the area of thermoelectric refrigerator own is little, heat flow density is bigger, and it is very important to adopt heat-pipe radiator that heat transfer technology of heat pipe develops that the high efficiency of transmission of heat has been play a part, and is widely used in the thermoelectric (al) cooling product.At present, the thermoelectric refrigerator hot-side heat dissipation has three kinds of forms: 1, fit by plane of evaporation cavity and thermoelectric refrigerator hot junction and conduct heat, evaporation cavity interior working medium gas, liquid state are also deposited this kind gas-liquid phase transition (heat pipe) heat transfer type.2, fit with the thermoelectric refrigerator hot junction in a plane that is full of in utilizing in the heat exchanging chamber of working medium, and the working medium of heat exchanging chamber is walked heat by external force (as pump) fluxion strap and carried out heat exchange, and typical water circulation is dispelled the heat and promptly belonged to this type of; 3, fit in the entity solid conductor plane and thermoelectric refrigerator hot junction, utilize the metal solid thermal conductive resin, dispel the heat by fan, and this kind mode is most widely used in the thermoelectric (al) cooling product.More than three kinds of radiating modes one common ground is arranged is exactly that plane and thermoelectric refrigerator hot junction by radiator fits, increased the thermal contact resistance of binding face, cause the diabatic process thermograde poor, heat conduction efficiency is reduced.
Summary of the invention
The purpose of this utility model is to address the above problem, and a kind of working medium direct-immersion type thermoelectric (al) cooling device is provided.The thermograde of eliminating the thermal contact resistance formation in the conventional plane applying heat transfer technology is poor, and the minimizing thermal stress deformation improves the reliability of thermoelectric (al) cooling device to the influence in thermoelectric refrigerator life-span, improves refrigerating efficiency, improves the refrigerating capacity of whole device.
The purpose of this utility model is achieved in that a kind of working medium direct-immersion type thermoelectric (al) cooling device, comprise thermoelectric refrigerator, radiator and working medium, Heat Room in the radiator of the hot junction substrate of thermoelectric refrigerator constitutes an airtight cavity, heat-conducting work medium is arranged in the cavity, this heat-conducting work medium directly immerses thermoelectric refrigerator hot junction substrate, and the heat that produces on this hot junction substrate reaches entire radiator by heat-conducting work medium and carries out heat exchange.
The side of the substrate in the thermoelectric refrigerator hot junction of described direct immersion working medium is provided with wing.
The side of the substrate in the thermoelectric refrigerator hot junction of described direct immersion working medium is the plane.
Heat-conducting work medium in the described radiator Heat Room cavity all immerses thermoelectric refrigerator hot junction substrate.
Heat-conducting work medium in the described radiator Heat Room cavity partly immerses thermoelectric refrigerator hot junction substrate.
Working medium in the described radiator Heat Room cavity is singlet working medium.
Working medium in the described radiator Heat Room cavity is gas, liquid two-phase working substance.
The utility model has following actively useful effect:
Structure of the present utility model is: thermoelectric refrigerator hot junction substrate (being generally AL2O3 ceramic substrate or aluminium base) partly constitutes an airtight cavity with the radiator Heat Room, heat-conducting work medium in the cavity directly immerses thermoelectric refrigerator hot junction substrate, and the heat that produces on the substrate of hot junction during thermoelectric refrigerator work reaches entire radiator by heat-conducting work medium.Because heat-conducting work medium and thermoelectric refrigerator hot junction substrate directly immerse, during thermoelectric refrigerator energising work, the heat that the hot junction substrate produces is directly taken away by working medium, therefore eliminate thermoelectric refrigerator hot junction substrate and radiator plane in the aforementioned plane applying radiator structure and fitted that to reach the thermograde that is formed in heat transfer process by this thermal contact resistance poor for the thermal contact resistance that produces, thereby improved heat transfer efficiency.Working medium directly immerses, and gets rid of the applying degree problem of having filled in traditional mechanical planarization bonding structure, and the hot junction thermal stress deformation has improved the reliability of thermoelectric (al) cooling device to the life-span influence that thermoelectric refrigerator causes when having reduced thermoelectric refrigerator work.
In the said structure, directly immerse and wing can be set on the thermoelectric refrigerator hot junction substrate of working medium to increase heat exchange area.Simultaneously under the precondition that gas-liquid phase transition operating pressure and airtight cavity sealing allow in the hot junction substrate bears radiator Heat Room cavity, working medium can gas, liquid two-phase and deposit in the radiator heat exchange cavity, both heat-conducting work medium partly immersed the hot junction substrate, utilize gas, liquid to become (heat pipe) principle during work and efficiently transmit heat, both utilized heat transfer technology of heat pipe, eliminated simultaneously in the heat transfer technology of heat pipe thermal contact resistance and thermal stress deformation again the life-span influence of thermoelectric refrigerator.If the hot junction substrate can not bear the gas-liquid phase transition operating pressure, then can only be full of liquid refrigerant in the radiator Heat Room cavity.
Because working medium directly immerses thermoelectric refrigerator hot junction substrate, during thermoelectric refrigerator work, heat transfer efficiency is the highest on the substrate of hot junction, there is not thermal contact resistance in the conventional plane applying heat transfer technology, and reduced thermal stress deformation the thermoelectric refrigerator life-span has been influenced, improve the reliability of thermoelectric (al) cooling device, but also improved the refrigerating capacity and the refrigerating efficiency of thermoelectric (al) cooling device.
Description of drawings
Fig. 1 is the structural representation of the utility model one embodiment;
Fig. 2 is the structural representation that the utility model is used for the embodiment of refrigerating box;
Fig. 3 is the structure cutaway view of thermoelectric refrigerator one embodiment among Fig. 2;
Fig. 4 is the structure cutaway view (band wing) of another embodiment of thermoelectric refrigerator among Fig. 2.
The specific embodiment
Accompanying drawing number;
1. radiator 2. thermoelectric refrigerators 3. casing heat insulation layers
4. the wing of 5. thermoelectric refrigerator hot junctions, thermoelectric refrigerator hot junction welding
6. heat-conducting work medium 7. radiator Heat Rooms
Please refer to Fig. 1, Fig. 2, the utility model is a kind of working medium direct-immersion type thermoelectric (al) cooling device, comprise thermoelectric refrigerator, radiator and working medium, Heat Room 7 in the radiator 1 of the hot junction substrate 4 of thermoelectric refrigerator constitutes an airtight cavity, heat-conducting work medium 6 is arranged in the cavity, this heat-conducting work medium directly immerses thermoelectric refrigerator hot junction substrate 4, and the heat that produces on this hot junction substrate reaches entire radiator 1 by heat-conducting work medium 6 and carries out heat exchange.
Please refer to Fig. 4, the side of the substrate 4 in the thermoelectric refrigerator hot junction of described direct immersion working medium is provided with wing 5.
Please refer to Fig. 3, the side of the substrate 4 in the thermoelectric refrigerator hot junction of described direct immersion working medium also can be the plane.
Heat-conducting work medium 6 in the described radiator Heat Room cavity 7 all immerses thermoelectric refrigerator hot junction substrate 4.
Heat-conducting work medium 6 in the described radiator Heat Room cavity 7 also can partly immerse thermoelectric refrigerator hot junction substrate 4.
Working medium 6 in the described radiator Heat Room cavity 7 is singlet (gaseous state or liquid state) working medium.
Working medium 6 in the described radiator Heat Room cavity 7 for also can gas, the liquid two-phase working substance.
In Fig. 1, the Heat Room part constitutes an airtight cavity 7 by welding manner in the hot junction substrate 4 of thermoelectric refrigerator and the radiator, and thermoelectric refrigerator hot junction substrate contacts with heat-conducting work medium 6 all or part of direct immersions in the cavity as side of vaporization chamber.The heat that produces on the thermoelectric refrigerator hot junction substrate 4 reaches entire radiator by heat-conducting work medium 6 and carries out heat exchange.Thermoelectric refrigerator hot junction substrate can be with wing (as Fig. 4) to increase heat exchange area.Because heat-conducting work medium and thermoelectric refrigerator hot junction substrate directly immerse, the heat that produces on the substrate of hot junction is directly taken away by working medium, has therefore eliminated thermoelectric refrigerator hot junction substrate and the thermal contact resistance of radiator plane applying generation and the thermograde layer that is formed in heat transfer process by this thermal contact resistance in the conventional plane applying radiator structure.Working medium directly immerses, and has abandoned the applying degree problem in traditional mechanical planarization bonding structure.The hot junction thermal stress deformation improves the reliability and the refrigerating efficiency of thermoelectric (al) cooling device, and has increased refrigerating capacity the life-span influence that thermoelectric refrigerator causes when having reduced thermoelectric refrigerator work.
Claims (7)
1. working medium direct-immersion type thermoelectric (al) cooling device, comprise thermoelectric refrigerator, radiator and working medium, it is characterized in that: the Heat Room (7) in the radiator (1) of the hot junction substrate (4) of thermoelectric refrigerator constitutes an airtight cavity, heat-conducting work medium (6) is arranged in the cavity, this heat-conducting work medium directly immerses thermoelectric refrigerator hot junction substrate (4), and the heat that produces on this hot junction substrate reaches entire radiator (1) by heat-conducting work medium (6) and carries out heat exchange.
2. working medium direct-immersion type thermoelectric (al) cooling device as claimed in claim 1 is characterized in that: the side of the substrate (4) in the thermoelectric refrigerator hot junction of described direct immersion working medium is provided with wing (5).
3. working medium direct-immersion type thermoelectric (al) cooling device as claimed in claim 1 is characterized in that: the side of the substrate (4) in the thermoelectric refrigerator hot junction of described direct immersion working medium is the plane.
4. working medium direct-immersion type thermoelectric (al) cooling device as claimed in claim 1 is characterized in that: the heat-conducting work medium (6) in the described radiator Heat Room cavity (7) all immerses thermoelectric refrigerator hot junction substrate (4).
5. working medium direct-immersion type thermoelectric (al) cooling device as claimed in claim 1 is characterized in that: heat-conducting work medium (6) part in the described radiator Heat Room cavity (7) immerses thermoelectric refrigerator hot junction substrate (4).
6. working medium direct-immersion type thermoelectric (al) cooling device as claimed in claim 1 is characterized in that: the working medium (6) in the described radiator Heat Room cavity (7) is singlet working medium.
7. working medium direct-immersion type thermoelectric (al) cooling device as claimed in claim 1 is characterized in that: the working medium (6) in the described radiator Heat Room cavity (7) is gas, liquid two-phase working substance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU022933840U CN2599487Y (en) | 2002-12-20 | 2002-12-20 | Working medium direct-immersion temp. differential electric refrigeration device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU022933840U CN2599487Y (en) | 2002-12-20 | 2002-12-20 | Working medium direct-immersion temp. differential electric refrigeration device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2599487Y true CN2599487Y (en) | 2004-01-14 |
Family
ID=34151800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU022933840U Expired - Lifetime CN2599487Y (en) | 2002-12-20 | 2002-12-20 | Working medium direct-immersion temp. differential electric refrigeration device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2599487Y (en) |
-
2002
- 2002-12-20 CN CNU022933840U patent/CN2599487Y/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Effective date of abandoning: 20060201 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |