CN214336706U - Data center chip-level cooling device based on pulsating heat pipe - Google Patents

Abstract

The application provides a data center chip level cooling device based on pulsating heat pipe, the device includes: a condenser; the pulsating heat pipe is bent to form an evaporation end, a heat insulation section and a condensation end; the heat insulation section is arranged between the evaporation end and the condensation end; the condenser is arranged above the chip and used for conducting heat generated by the chip to the evaporation end, the condenser consists of an upper cover plate and a lower cover plate, and the pulsating heat pipe at the evaporation end is packaged between the upper cover plate and the lower cover plate of the condenser; and a gap between the condenser and the evaporation end of the pulsating heat pipe is filled with a high-heat-conductivity material. Therefore, efficient cooling of the high-power chip of the data center is achieved, the optimal operation temperature is achieved, stable and reliable operation of the data center is guaranteed, the data center is more energy-saving and green, and development of big data and the internet is further promoted.

Description

Data center chip-level cooling device based on pulsating heat pipe

Technical Field

The application relates to the technical field of chip cooling, in particular to a data center chip-level cooling device based on a pulsating heat pipe.

Background

With the rapid development of computer and internet technologies, the construction of data centers is continuously developed, and integration and power-up provide new challenges for achieving stable operation of low-energy-consumption and high-efficiency cooling of global data centers. The traditional data center cooling adopts a precision air conditioner to cool a machine room, namely, equipment and chips in the machine room are cooled through air cooling. Along with the continuous increase of data center thermal current density, the liquid cooling technique is adopted, has to adopt the submergence formula liquid cooling, is about to the direct and high thermal current density chip contact of coolant liquid, also has to adopt indirect liquid cooling, adopts the liquid cooling to take away the heat through carrying out the microchannel setting at the chip end. The heat pipe is also applied to data center heat dissipation due to its high thermal conductivity, and there are many separate heat pipes, and there are also few heat pipe ends for chip level cooling.

The traditional cooling mode of the precise air conditioner adopts mechanical vapor compression type air cooling, and has the problems of huge energy consumption, low air heat exchange coefficient, long distance between a cold source and a heat source, uneven heat dissipation and the like. The air heat exchange coefficient is insufficient, the distance between a cold source and a heat source is insufficient, the heat dissipation is uneven, the power of the air conditioner is further increased, the electric quantity consumption is increased, the energy utilization rate (PUE) value of the data center is too high, and a vicious circle is formed. The pure air-conditioning type air-cooling technology is the most mature and simple, but the energy is the least energy-saving, the temperature controllability is the worst, and the stable operation capability of a machine room is the worst. The liquid cooling efficiency is high, the heat conducting performance is improved, and particularly, the heat conducting capacity is improved by 2-3 orders of magnitude when gas-liquid two-phase heat transfer occurs. However, for electronic equipment, particularly for a data center chip, liquid cooling has a liquid leakage problem, once a liquid working medium leaks to cause that the data center cannot operate, the problem of sealing and leakage prevention needs to be considered, the complexity of an equipment pipeline is increased, and the cost is increased. Meanwhile, the circulation of liquid cooling needs power driving, which also leads to the increase of PUE value and is not green enough for energy saving. The heat pipe system can realize high-efficiency heat conduction without external energy, has good energy efficiency and cooling capacity, and has no interference to indoor environment. At present, the heat pipes applied in the data center are mainly separated heat pipes, and a small part of the heat pipes are traditional pipe type heat pipes. On the one hand, the existing heat pipe can not penetrate into the heat source end of the chip to directly dissipate heat, the chip and the heat pipe can be in close contact, the cooling performance of the chip is further improved, on the other hand, the efficiency of the traditional heat pipe is not as good as that of the pulsating heat pipe, and meanwhile, the structural size of the traditional heat pipe and the matching of the heat source end of the chip and other aspects have further optimization space. In the related art, a pulsating heat pipe is adopted to cool a chip, but the circulating winding and fan matching mode is only suitable for cooling the chip in a personal computer, and the heat dissipation and use requirements of a high-power chip of a data center cannot be met.

Disclosure of Invention

The present application is directed to solving, at least to some extent, one of the technical problems in the related art.

Therefore, the purpose of the application is to provide a data center chip-level cooling device based on a pulsating heat pipe, the device is used for data center chip-level heat management, high-power chips can be guaranteed to efficiently and stably operate within a normal temperature range, the energy consumption of a data center is reduced, and the stable and reliable operation of the data center is guaranteed.

In order to achieve the above object, the present application provides a data center chip-scale cooling device based on a pulsating heat pipe, comprising:

a condenser; the pulsating heat pipe is bent to form an evaporation end, a heat insulation section and a condensation end;

the insulated section is disposed between the evaporator end and the condenser end;

the condenser is arranged above the chip and used for conducting heat generated by the chip to the evaporation end, the condenser consists of an upper cover plate and a lower cover plate, and the pulsating heat pipe of the evaporation end is packaged between the upper cover plate and the lower cover plate of the condenser.

Further, the heat insulation sections are bent to form a stepped structure with upper and lower height differences.

Furthermore, on one side of the heat insulation section close to the evaporation end, the pulsating heat pipe is bent to form a step-shaped structure with different heights, and the heat insulation section is higher than the evaporation end.

Furthermore, the upper cover plate and the lower cover plate of the condenser are provided with grooves with the same size as the evaporation end of the pulsating heat pipe.

Further, the pulsating heat pipe of the heat insulation section is provided with a liquid filling port.

Furthermore, the pulsating heat pipe is formed by bending a capillary tube, the evaporation end and the condensation end of the pulsating heat pipe are flattened capillary tubes, the inner walls of the capillary tubes are smooth metal tubes, and the capillary tubes are made of metal or metal alloy.

Furthermore, the working medium of the pulsating heat pipe is selected according to the working temperature range of the high-power chip and comprises a single solution of water and ethanol or a mixed solution of nano-particle fluid.

Further, the geometric size of the pulsating heat pipe is determined according to the packaging size of the chip, the heat flux density and the working temperature requirement.

Further, a gap between the condenser and the evaporation end of the pulsating heat pipe is filled with a high-heat-conductivity material, including heat-conductive silicone grease or liquid metal.

Furthermore, the condensation end is connected with a secondary heat dissipation device connected outside the data center rack.

The data center chip-level cooling device based on the pulsating heat pipe has the following advantages:

(1) extremely high heat transfer efficiency. The highest heat transfer efficiency of the pulsating heat pipe can reach 90 percent, while the heat transfer efficiency of the traditional heat pipe is usually 60 to 70 percent, which is far more than the modes of air cooling and single-phase liquid cooling, and ensures the high-efficiency heat dissipation of the chip;

(2) high resistance to burn-out. Once the traditional heat pipe is overloaded and dried, the whole heat pipe cannot work normally, the pulsating heat pipe is provided with a plurality of circulation sections, if the traditional heat pipe is dried, the drying phenomenon occurs in a single or a plurality of evaporation pipe sections, and then the pulsating heat pipe is gradually diffused to the whole evaporation end, so that the effect of delaying the drying is achieved;

(3) the temperature uniformity of the pulsating heat pipe is excellent. The pulsating heat pipe formed by bending the capillary tube forms good pulsating circulating heat transfer inside, and the evaporation end can achieve better temperature uniformity through the transfer of sensible heat and latent heat, so that the uniform cooling of a heating source is realized;

(4) good adaptability and safety. The working mode of the pulsating heat pipe can change according to the change of the heat flow of the chip, and within a certain range, the larger the heat flow is, the better the circulation flow performance is, the higher the heat transfer efficiency is, and compared with liquid cooling, the pulsating heat pipe has no leakage risk, and is safe and reliable;

(5) the structure is simple, variable and compact. The pulsating heat pipe is in a long capillary shape, can be bent, flattened and the like according to working requirements, can flexibly change the structure, and can achieve the radiating effect of compact structure and high integration due to the small pipe diameter of the pulsating heat pipe;

(6) low manufacturing cost and good economical efficiency. The pulsating heat pipe is a smooth pipe, the device can be completed by adopting conventional means such as milling, vacuumizing and welding in manufacturing engineering, the batch production is easy, external energy sources are not needed to drive in the using process, and the data center PUE is lower and more green.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic diagram of a pulsating heat pipe based data center chip-scale cooling device according to an embodiment of the present application;

FIG. 2 is a schematic view of an evaporator end, an adiabatic section, and a condenser end according to one embodiment of the present application;

FIG. 3 is a schematic diagram of a pulsating heat pipe based data center chip scale cooling arrangement according to another embodiment of the present application;

FIG. 4 is a schematic view of an evaporator end, an adiabatic section, and a condenser end according to another embodiment of the present application;

FIG. 5 is a flow chart of a method for manufacturing a pulsating heat pipe based data center chip scale cooling device according to one embodiment of the present application.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application.

The data center chip-scale cooling device based on the pulsating heat pipe proposed according to the embodiment of the present application is described below with reference to the accompanying drawings.

FIG. 1 is a schematic structural diagram of a pulsating heat pipe based data center chip-scale cooling device according to an embodiment of the present application.

FIG. 2 is a schematic view of an evaporator end, an adiabatic section, and a condenser end according to one embodiment of the present application.

As shown in fig. 1 and 2, the pulsating heat pipe based data center chip scale cooling device comprises: a condenser; the pulsating heat pipe is bent to form an evaporation end, a heat insulation section and a condensation end.

An insulated section is disposed between the evaporator end and the condenser end.

The condenser is arranged above the chip and used for conducting heat generated by the chip to the evaporation end, the condenser consists of an upper cover plate and a lower cover plate, and the pulsating heat pipe at the evaporation end is packaged between the upper cover plate and the lower cover plate of the condenser.

It can be understood that the pulsating heat pipe is a novel heat transfer device with a simple structure, the working medium in the pulsating heat pipe absorbs heat to form an air plug, the heat is released to form a liquid plug, the heat transfer is realized through the sensible heat and the latent heat of phase change of the working medium and the oscillation between the air plug and the liquid plug, and the heat transfer effect of the pulsating heat pipe is better than that of the traditional heat pipe.

Further, in an embodiment of the present application, the pulsating heat pipe may be bent at the intermediate heat-insulating section to form a stepped structure with a difference in height, as shown in fig. 3 and 4.

In fig. 3, the pulsating heat pipe is bent to form a stepped structure with different heights on the side of the heat insulation section close to the evaporation end, and the heat insulation section is higher than the evaporation end.

It can be understood that the stepped pulsating heat pipe can further improve the antigravity performance, promote the pulsating circulation and improve the heat transfer performance.

The stepped structure is not limited to the above-mentioned embodiments, and the pulsating heat pipe may be bent according to actual conditions, so that spatial interference of electronic components inside the data center server may be avoided.

As shown in fig. 1, the pulsating heat pipe is formed by bending a capillary tube, and the evaporation end and the condensation end of the pulsating heat pipe are flattened capillary tubes. The capillary tube is a metal tube with a smooth inner wall, and the material of the capillary tube can be copper, aluminum and other metals or metal alloys.

The pulsating heat pipe of the heat insulation section is provided with a liquid filling port, and working media of the pulsating heat pipe are selected according to the working temperature range of the high-power chip and can be single solution such as water, ethanol and the like or mixed solution of nano-particle fluid.

The geometric dimension of the pulsating heat pipe is determined according to the packaging size, the heat flux density and the working temperature requirement of a specific high-power chip.

The condenser is determined according to a specific pulsating heat pipe structure and mainly comprises an upper cover plate and a lower cover plate, wherein the upper cover plate and the lower cover plate are respectively provided with a groove with the same size as the evaporation end of the pulsating heat pipe, and the condenser formed by the upper cover plate and the lower cover plate and the evaporation end of the pulsating heat pipe are packaged together.

The gap between the condenser and the evaporation end of the pulsating heat pipe is filled with a high-heat-conductivity material which can be heat-conducting silicone grease or liquid metal.

Furthermore, the condensation end is connected with a secondary heat dissipation device connected outside the data center rack.

Specifically, the power chip generates heat, the heat is conducted to the evaporation end of the pulsating heat pipe through the condenser, the heat is quickly transferred away from the chip by utilizing the excellent heat conduction performance of the pulsating heat pipe, the heat is finally transferred to the condensation end, and the heat is taken away through the secondary heat dissipation device connected with the outside of the data center rack, so that the quick heat dissipation of the high-power chip is realized, and the efficient operation of the chip is ensured.

It should be noted that, the specific capillary material and the structural size of the pulsating heat pipe, and the type of the working medium can be changed and selected according to the heat dissipation and actual operation requirements of the high-power chip of the specific data center, and the heat dissipation mode of the condensation end of the pulsating heat pipe can flexibly select the modes of the separated heat pipe, the liquid cooling, the fan and the like according to the actual data center conditions, which is not particularly limited in the present application.

FIG. 5 is a flow chart of a method for manufacturing a pulsating heat pipe based data center chip scale cooling device according to one embodiment of the present application.

As shown in fig. 5, the manufacturing method of the pulsating heat pipe based data center chip-scale cooling device comprises the following steps:

s1, selecting a capillary tube with required diameter, total length and material, cleaning, decontaminating and drying, and then sleeving protective sleeves on two ends of the capillary tube;

and S2, bending the capillary tube by using a bending press according to the designed three-dimensional structure, flattening the capillary tubes at the evaporation end and the condensation end, and reserving a liquid filling port at the outermost periphery of the heat insulation section.

S3, two metal blocks with certain thickness and the size equivalent to that of the packaged high-power chip are taken, the surface of the metal block is grooved by a micro milling method, the groove size is equivalent to that of an evaporation end capillary, and oil removal cleaning is carried out after grooving is finished, so that the operation of an upper cover plate and a lower cover plate of the condenser is finished.

And S4, after the evaporation end is coated with a high-heat-conductivity material, the evaporation end is matched and pressed with the upper cover plate and the lower cover plate of the condenser, and then the condenser and the pulsating heat pipe are fixedly connected by adopting a welding method.

And S5, the pulsating heat pipe is firstly vacuumized and then filled with liquid through the four-way valve, and the liquid filling port is soldered and sealed after the liquid filling is finished, so that the whole heat dissipation device is manufactured.

According to the data center chip-level cooling device based on the pulsating heat pipe, which is provided by the embodiment of the application, the data center chip-level heat management is realized, and the heat generated by the operation of the high-power chip is rapidly led out through the pulsating heat pipe, so that the high-power chip is ensured to efficiently and stably operate within a normal temperature range, the energy consumption of the data center is reduced, and the stable and reliable operation of the data center is ensured.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.

Claims (10)

1. A data center chip scale cooling device based on pulsating heat pipes is characterized by comprising: a condenser; the pulsating heat pipe is bent to form an evaporation end, a heat insulation section and a condensation end;

the insulated section is disposed between the evaporator end and the condenser end;

the condenser is arranged above the chip and used for conducting heat generated by the chip to the evaporation end, the condenser consists of an upper cover plate and a lower cover plate, and the pulsating heat pipe of the evaporation end is packaged between the upper cover plate and the lower cover plate of the condenser.

2. The apparatus of claim 1, wherein the adiabatic section is bent to form a stepped structure having a difference in height.

3. The device of claim 2, wherein the pulsating heat pipe is bent to form a stepped structure with a height difference on the side of the heat-insulating section close to the evaporation end, and the heat-insulating section is higher than the evaporation end.

4. The apparatus of claim 1, wherein the condenser has upper and lower cover plates each having a groove corresponding to the size of the evaporation end of the pulsating heat pipe.

5. The apparatus of claim 1, wherein the pulsating heat pipe of the adiabatic section is provided with a liquid fill port.

6. The device of claim 1, wherein the pulsating heat pipe is formed by bending a capillary tube, the evaporation end and the condensation end of the pulsating heat pipe are flattened capillary tubes, the capillary tube is a metal tube with a smooth inner wall, and the material of the capillary tube comprises metal or metal alloy.

7. The device of claim 1, wherein the working medium of the pulsating heat pipe is selected according to the working temperature range of the high-power chip, and comprises a single solution of water and ethanol or a nanoparticle fluid mixed solution.

8. The apparatus of claim 1, wherein the geometry of the pulsating heat pipe is determined based on the package size of the chip, the heat flux density, and the operating temperature requirements.

9. The apparatus of claim 1, wherein a gap between the condenser and the evaporator end of the pulsating heat pipe is filled with a high thermal conductivity material comprising a thermally conductive silicone grease or a liquid metal.

10. The apparatus of claim 1, wherein the condensation end is coupled to a secondary heat sink coupled to an exterior of the data center rack.

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