CN2596552Y

CN2596552Y - Heat exchanger

Info

Publication number: CN2596552Y
Application number: CN 02250848
Authority: CN
Inventors: 李学坤; 李磊; 赖振田
Original assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2002-12-27
Filing date: 2002-12-27
Publication date: 2003-12-31
Anticipated expiration: 2012-12-27

Abstract

The utility model relates to a heat exchanger for cooling electronic components, which comprises a groove body and a cover plate tightly covered on the groove body. The groove body is provided with a basal plate and two pairs of side plates perpendicular to the basal plate, wherein one pair of side plates are provided with a liquid inlet and a liquid outlet for cooling liquid to enter and flow out. In the groove body, two corresponding side plates are provided with a plurality of ribbed plates of at equal intervals. The ribbed plates form a passage which penetrates through the groove body, and a plurality of heat dispersing posts are arranged among the ribbed plates. The ribbed plates and the heat dispersing posts of the heat exchanger can enlarge the heat exchanging area. Simultaneously, the passage with an approximately uniform width penetrates through the inner part of the groove body, so cooling liquid can uniformly flow through the whole space in the heat exchanger in order to achieve the purpose of effective heat dispersion.

Description

Heat-exchange device

[technical field]

The utility model is about a kind of heat-exchange device, is meant a kind of heat-exchange device that is used for cooling electronic components especially.

[background technology]

Be accompanied by the constantly development of electronic information industry, the running frequency of electronic component (for example CPU) and speed are in continuous lifting.Yet high-frequency high-speed will make the heat of electronic component generation more and more, and temperature is also more and more higher, and the performance when the electronic component operation in serious threat can normal operation, in time discharge a large amount of heats that electronic component produced in order to ensure electronic component.Therefore, industry adopts various cooling device, and the heat that makes electronic component produce at first is transmitted on the cooling device, in various modes the heat on the cooling device is distributed, thereby reaches the purpose of cooling electronic components.

The Taiwan patent announcement discloses a kind of cooling device No. 486237, sees also Fig. 3, and this cooling device comprises a square tank 22 and a heat radiation cover plate 21.Be provided with the cooling water channel 24 that is outside spiral helicine ribs 23 and forms in this tank 22 by this ribs 23.These cooling water channel 24 centers are water intake ends 241 of cooling water, and its end then is the water side 242 of cooling water.Heat radiation cover plate 21 just can closely cover tank 22 and form an airtight cooling device.This heat radiation cover plate 21 is provided with water inlet pipe 211 and outlet pipe 212.This water inlet pipe 211 is just in time directly over the water intake end 241 of this cooling water channel 24, and outlet pipe 212 is directly over the water side 242 of cooling water channel 24.Cooling water enters the water intake end 241 of cooling water channel 24 from water inlet pipe 211, and screw flows to the water side 242 of cooling water channel 24 outward again, flows out and heat is taken away from outlet pipe 212 at last, thereby reach the purpose of cooling electronic components.

Yet the contact area of whole cooling device and cooling water is limited, and the heat exchange area of cooling water is very little; And because the cooling water channel 24 of tank 22 is shapes in the shape of a spiral, so the water velocity of cooling water diverse location in tank 22 is inconsistent, its water velocity is the fastest at the water inlet pipe place, yet the water inlet pipe place is the position at heater element place, can cause the heat exchange deficiency if water velocity is too fast, if water flow velocity is spent and then can be caused cooling water overstand in tank slowly, cause the water temperature increase finely not dispel the heat, even cooling water is stranded in the tank and can not flows, and causes whole failure of apparatus to have a strong impact on the heat radiation of electronic component.

[summary of the invention]

The heat-exchange device that the purpose of this utility model is to provide a kind of effective cooling electronic components, has big heat exchange area and cooling fluid is evenly flowed.

The purpose of this utility model is achieved through the following technical solutions: the utility model heat-exchange device comprises a cell body, a cover plate, an inlet and a liquid outlet, described cover plate tightening seal covers described cell body, be provided with some equally spaced floors in the described cell body, and surround a passage that runs through cell body, be provided with some thermal columns in this passage, described inlet and liquid outlet communicate with this passage, make cooling fluid can pass in and out heat-exchange device.

Compared with prior art, the passage of the utility model heat-exchange device is through whole heat-exchange device inside, and width of channel is roughly the same, thereby cooling fluid can evenly be flowed through, and institute has living space in this cooling device; Be provided with some thermal columns between the floor simultaneously, thereby increased the heat exchange area of cooling fluid effectively, have the advantage of efficiently radiates heat.

With reference to the accompanying drawings, in conjunction with the embodiments the utility model is further described.

[description of drawings]

Fig. 1 is the stereogram of the utility model heat-exchange device.

Fig. 2 is the three-dimensional exploded view of the utility model heat-exchange device.

Fig. 3 is the three-dimensional exploded view of existing heat-exchange device.

[embodiment]

See also Fig. 1, the utility model heat-exchange device comprises a cell body 10 and a cover plate 30.Cover plate 30 can closely cover cell body 10 just and form the close heat-exchange device of an envelope.Cell body 10 is provided with for cooling fluid and enters the inlet 102 of heat-exchange device and supply cooling fluid to flow out the liquid outlet 104 of heat-exchange device.

See also Fig. 2, cell body 10 bottoms are a substrate 11.Four corners of substrate 11 are respectively equipped with a through hole 112, can be by screw (figure does not show) stationary heat switch.One surface of substrate 11 can be fitted on the electronic component (figure does not show), and its another relative surface upwards vertically extends two pairs of side plates 122, and these two pairs of side plates 122 surround a square framework jointly with substrate 11.Obviously, can surround circle, various geometries such as trapezoidal from the substrate 11 vertically extending side plate that makes progress.

Wherein, the inboard of a pair of side plate that is parallel to each other 122 has extended some parallel floors 132 in opposite directions, at interval.These floor 132 spacings are equal substantially, and the height of these floors 132 equates with the height of side plate 122.Each side plate 122 extended floor 132 leaves certain spacing with another relative side plate 122 inboards, and this spacing is roughly suitable with the spacing between the floor 132.Floor 132 this arrange can so that in cell body 10,

substrate

11 and 30 formation of cover plate flow in wherein a passage 142 for cooling fluid.Passage 142 turns back repeatedly and through whole heat-exchange device, makes cooling fluid can flow through the entire inner space of heat-exchange device 122 of the biside plates that is provided with floor 132.The both ends of passage 142 are communicated with inlet 102 and liquid outlet 104 respectively.Inlet 102, liquid outlet 104 are located on the different side plate 122 among Fig. 2, and certainly, inlet 102 and liquid outlet 104 also can be located on the same side plate 122, and the number that need only change floor 132 gets final product.

Be provided with in the passage 142 from substrate 11 to cover plate 30 vertically extending some thermal columns 15.These thermal columns 15 can be the cylinders of cylinder, prism or other shape, only are schematically illustrated as cylinder among Fig. 2.In addition, the height of these thermal columns 15 is equal to or less than the height of side plate 122 and floor 132.

In use, the heat that electronic component produces conducts to floor 132 and thermal column 15 through substrate 11, and these floors 132 and thermal column 15 can increase the heat exchange area with cooling fluid, thereby reduce the temperature on the substrate 11 effectively.On the other hand, cooling fluid constantly enters heat-exchange device from inlet 102, the passage 142 and carry out flowing out from liquid outlet 104 after the heat exchange of flowing through with heat-exchange device, thus the torrid zone is gone out heat-exchange device.And because passage 142 connects whole cell body 10, and the width of passage 142 is roughly the same, cooling fluid can be flowed with roughly the same speed by the diverse location in heat-exchange device, thereby make that heat radiation is more abundant, even.

Claims

1. heat-exchange device, comprise a cell body, a cover plate, an inlet and a liquid outlet, described cover plate tightening seal covers described cell body, it is characterized in that: be provided with some floors in the described cell body, and surround a passage, be provided with some thermal columns, described inlet and liquid outlet in the described passage, communicate with described passage, make cooling fluid to pass in and out.

2. heat-exchange device as claimed in claim 1 is characterized in that: described cell body comprises a base plate and two pairs of side plates, and these side plates and base plate surround a square framework.

3. heat-exchange device as claimed in claim 1 is characterized in that: described cell body comprises that a base plate and surrounds the side plate of circular framework.

4. as claim 2 or 3 described heat-exchange devices, it is characterized in that: described floor equates with the height of cell body side plate.

5. heat-exchange device as claimed in claim 1 is characterized in that: described inlet and liquid outlet are located at the two ends of described passage respectively.

6. heat-exchange device as claimed in claim 2 is characterized in that: described floor is to extend at interval in opposite directions from pair of side plates wherein respectively, and with another relative side plate inboard leave with floor between the spacing that equates of spacing.

7. heat-exchange device as claimed in claim 3 is characterized in that: described floor is to extend at interval in opposite directions from the circumference inboard.

8. heat-exchange device as claimed in claim 7 is characterized in that: described floor and the inwall of circumference leave with floor between the spacing that equates of spacing.

9. heat-exchange device as claimed in claim 8 is characterized in that: the height of described thermal column is less than the height of side plate.

10. heat-exchange device as claimed in claim 9 is characterized in that: the height of described these thermal columns equals the height of side plate.