CN2591774Y - Radiator device with thermal conducting tube at base - Google Patents
Radiator device with thermal conducting tube at base Download PDFInfo
- Publication number
- CN2591774Y CN2591774Y CN 02290808 CN02290808U CN2591774Y CN 2591774 Y CN2591774 Y CN 2591774Y CN 02290808 CN02290808 CN 02290808 CN 02290808 U CN02290808 U CN 02290808U CN 2591774 Y CN2591774 Y CN 2591774Y
- Authority
- CN
- China
- Prior art keywords
- heat
- base
- radiator
- heat pipe
- conducting tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The utility model relates to a radiator device with a heat conducting tube at a base, which comprises a radiator main body (1), a radiator fan (2) and the heat conducting tube (3), wherein, the bottom part of the radiator main body (1) is provided with the base (12), and the heat conducting tube (3) is installed in a groove (11) of the base (12) in an embedded way. The utility model has the advantages of ideal heat radiating effect and convenient use. The base of the radiator directly contacted with an electronic component is provided with the heat conducting tube, the heat conducting tube is a high efficiency heat conducting component, and has very high heat conductivity. On the one hand, the heat conducting tube which can absorb the heat quantity of the electronic component in time is arranged in the groove at the base of the radiator, on the other hand, the heat quantity can be uniformly conducted to the radiator main body along the direction of the heat conducting tube; therefore, the effect that the heat quantity of the electronic component is radiated in high efficiency is achieved.
Description
Technical field
The utility model belongs to a kind of heat sink arrangement of electronic devices and components, belongs to the high efficiency and heat radiation apparatus of integrated circuit especially.
Prior art
Existing heat-radiating device of electric component, generally be to be on the flat seat board surface one a plurality of radiating fins are set, this radiator is sticked on electronic devices and components, the thermal conductivity of borrowing radiator itself to be had, with heat by electronic devices and components surface band from, and reach distribute heat and cooling purpose by this radiating fin.In addition,, generally can on radiator fins, directly set firmly a radiator fan for the diversion of accelerated heat, borrow air-flow that radiator fan produces with heat rapidly by band on the radiating fin from.
The heat conductivility of tradition aluminium extruded type radiator is not very good, and the efficient of radiator base absorption electronic devices and components heating is not high on the one hand; On the other hand, radiator base can not in time conduct heat to entire radiator; Cause heat to concentrate on the middle part of radiator more, influence the radiating efficiency of radiator; The thermolysis of entire radiator is not fully played.The radiating effect that radiator can reach is difficult to realistic user demand.And new electronic devices and components are constantly developing and are improving, and its speed of service is more and more faster, and the heat that is produced is also more and more, and existing heat spreader structures can't obtain desirable radiating effect.
Summary of the invention
The utility model is the heat sink arrangement that proposes a kind of base band heat pipe for the above-mentioned deficiency that overcomes prior art, its radiating effect ideal, easy to use.Have heat pipe with the foot of radiator that electronic devices and components directly contact, heat pipe is a kind of efficient heat transfer components and parts, has high thermal conductivity.The heat pipe of arranged parallel in the foot of radiator groove can absorb the heating of electronic devices and components on the one hand in time, can balancedly be transmitted to radiator body on along the heat pipe direction heat again on the other hand; Thereby reach effect to the electronic devices and components high efficiency and heat radiation.
The purpose of this utility model can reach by taking following technical measures:
Manufacture and design a kind of heat sink arrangement of base band heat pipe, comprise radiator body and radiator fan; Described radiator body bottom is provided with base; It is characterized in that: also comprise heat pipe; This heat pipe assembly is in the groove of base.
Description of drawings
Fig. 1 is the heat sink arrangement general structure schematic diagram of the utility model base band heat pipe.
Embodiment
Below in conjunction with accompanying drawing in detail embodiment of the present utility model is described in detail.
A kind of heat sink arrangement of base band heat pipe comprises radiator body 1 and radiator fan 2; Radiator body 1 bottom is provided with base 12; It is characterized in that: also comprise heat pipe 3; These heat pipe 3 assemblies are in the groove 11 of base 12.Heat pipe is a kind of efficient heat transfer components and parts, has high thermal conductivity.Heat pipe makes water or methyl alcohol or acetone etc. as heat-exchange medium; The gasification phase transformation that utilizes the medium absorbs heat from the heat absorption district; Media band after the gasification the heat release zone that heat is transferred to the other end rapidly; In heat release zone, media enters the phase transformation that takes place in the capillary to liquefy and discharges heat; Media after the liquefaction from heat release zone via capillary flow resorption hot-zone, thereby finish a duty cycle.Because have excellent heat conductivility, heat pipe 3 can in time absorb the heating of electronic devices and components, and heat is reached the two ends of base 12 rapidly along the heat pipe direction; Radiator body 1 also can directly absorb the part heating of electronic devices and components simultaneously, and entire radiator body 1 can be given full play to the heat radiation function simultaneously like this; The heat that more effectively thermal source is produced in the unit interval conducts out, and the air-flow that drives of fin and the radiator fan by radiator body 1 diffuses to heat in the ambient air and goes in time, thereby reaches the effect to the electronic devices and components high efficiency and heat radiation.
Described heat pipe 3 has two to three.In actual applications, the quantity of heat pipe can be adjusted according to the heat radiation needs; Among the part embodiment, the quantity of heat pipe 3 is two to three; Can be more when needing.
Described heat pipe 3 is on described base 12 and is arranged in parallel.
Between the described heat pipe 3 is 1/2nd of described groove 11 width at interval.The interval of proper width can provide reliable protection to heat pipe, also helps heat simultaneously and is transmitted to quickly on the radiator body 1 from heat pipe.
Described base 12 is rectangles; Heat pipe 3 is arranged along the diagonal of described base 12 or the parallel lines in a sideline.
The length of the length of described heat pipe 3 and described groove 11 is complementary.Too short heat pipe is unfavorable for giving full play to the excellent heat conducting performance of heat pipe; Make full use of the length of groove 11, the length of heat pipe 3 and the length of groove 11 are complementary, more help the performance of heat pipe heat conductivility.
Claims (6)
1, a kind of heat sink arrangement of base band heat pipe comprises radiator body (1) and radiator fan (2); Described radiator body (1) bottom is provided with base (12); It is characterized in that:
Also comprise heat pipe (3); This heat pipe (3) assembly is in the groove (11) of base (12).
2, heat sink arrangement according to claim 1 is characterized in that:
Described heat pipe (3) has two to three.
3, heat sink arrangement according to claim 2 is characterized in that:
Described heat pipe (3) is on described base (12) and is arranged in parallel.
4, heat sink arrangement according to claim 3 is characterized in that:
Between the described heat pipe (3) is 1/2nd of described groove (11) width at interval.
5, according to claim 1 or 4 described heat sink arrangements, it is characterized in that:
Described base (12) is a rectangle; Described heat pipe (3) is arranged along the diagonal of described base (12) or the parallel lines in a sideline.
6, heat sink arrangement according to claim 5 is characterized in that:
The length of the length of described heat pipe (3) and described groove (11) is complementary.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02290808 CN2591774Y (en) | 2002-12-06 | 2002-12-06 | Radiator device with thermal conducting tube at base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02290808 CN2591774Y (en) | 2002-12-06 | 2002-12-06 | Radiator device with thermal conducting tube at base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2591774Y true CN2591774Y (en) | 2003-12-10 |
Family
ID=33749874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02290808 Expired - Lifetime CN2591774Y (en) | 2002-12-06 | 2002-12-06 | Radiator device with thermal conducting tube at base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2591774Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100463593C (en) * | 2006-05-16 | 2009-02-18 | 珍通科技股份有限公司 | Method for combining rolled hot pipe with heat-transfer foundation support |
| CN105258539A (en) * | 2015-10-09 | 2016-01-20 | 东莞汉旭五金塑胶科技有限公司 | Radiator |
| CN107534030A (en) * | 2015-02-27 | 2018-01-02 | 莱尔德电子材料(深圳)有限公司 | Radiator and correlation technique including heat pipe |
-
2002
- 2002-12-06 CN CN 02290808 patent/CN2591774Y/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100463593C (en) * | 2006-05-16 | 2009-02-18 | 珍通科技股份有限公司 | Method for combining rolled hot pipe with heat-transfer foundation support |
| CN107534030A (en) * | 2015-02-27 | 2018-01-02 | 莱尔德电子材料(深圳)有限公司 | Radiator and correlation technique including heat pipe |
| CN107534030B (en) * | 2015-02-27 | 2020-04-03 | 莱尔德电子材料(深圳)有限公司 | Heat sink including heat pipe and related methods |
| CN105258539A (en) * | 2015-10-09 | 2016-01-20 | 东莞汉旭五金塑胶科技有限公司 | Radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20121206 Granted publication date: 20031210 |