CN2590176Y - Fin of radiating equipment having heat conductive tube - Google Patents
Fin of radiating equipment having heat conductive tube Download PDFInfo
- Publication number
- CN2590176Y CN2590176Y CN 02289893 CN02289893U CN2590176Y CN 2590176 Y CN2590176 Y CN 2590176Y CN 02289893 CN02289893 CN 02289893 CN 02289893 U CN02289893 U CN 02289893U CN 2590176 Y CN2590176 Y CN 2590176Y
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- CN
- China
- Prior art keywords
- heat
- fin
- radiator
- heat pipe
- heat conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a radiator device, a fin of which is provided with a heat conductive tube. The utility model comprises a radiator main body (1), a radiator fan (2) and the heat conductive tube (3), wherein, the radiator main body is provided with the fin (11), and the heat conductive tube (3) is installed and inserted in the fin (11). Heat quantity is rapidly transmitted to fins arranged at the peripheral point of the radiator along the direction of the heat conductive tube through utilizing the effective heat conductive capability of a heat radiating tube installed and inserted in the fin of a radiator to balance the heat radiating load of the heat radiating fins. The heat radiating efficiency of the radiator device is enhanced; therefore, heat radiating efficiency for electronic components in high efficiency is achieved.
Description
Technical field
The utility model belongs to a kind of heat sink arrangement of electronic devices and components, belongs to the high efficiency and heat radiation apparatus of integrated circuit especially.
Prior art
Existing heat-radiating device of electric component, generally be to be on the flat seat board surface one several radiating fins are set, this radiator is sticked on electronic devices and components, the thermal conductivity of borrowing radiator itself to be had, with heat by electronic devices and components surface band from, and reach distribute heat and cooling purpose by this radiating fin.In addition,, generally can on radiator fins, directly set firmly a radiator fan for the diversion of accelerated heat, borrow air-flow that radiator fan produces with heat rapidly by band on the radiating fin from.
The heat conductivility of tradition aluminium extruded type radiator is not very good, the heating of electronic devices and components can not in time be transmitted to entire radiator equably, cause heat to concentrate on the middle part of radiator more, the heat load of radiating fin central area is apparently higher than the neighboring area.Centre fin bottom temp can't reduce rapidly, and other position fins fully do not play thermolysis.This phenomenon has influenced the integral heat sink efficient of radiator, and the thermolysis of entire radiator is not fully played.The radiating effect that radiator can reach is difficult to realistic user demand.And new electronic devices and components are constantly developing and are improving, and its speed of service is more and more faster, and the heat that is produced is also more and more, and existing heat spreader structures can't obtain desirable radiating effect.
Summary of the invention
The utility model is the heat sink arrangement that proposes a kind of fin band heat pipe for the above-mentioned deficiency that overcomes prior art, the radiating tube of assembly in radiator fins utilizes its efficient heat transfer performance, heat is transmitted to the fin at the peripheral position of radiator rapidly along the heat pipe direction, the heat radiation load of balance radiating fin, the radiating efficiency of raising heat sink arrangement; Thereby reach effect to the electronic devices and components high efficiency and heat radiation.
The purpose of this utility model can reach by taking following technical measures:
The heat sink arrangement of design, a kind of fin band heat pipe of manufacturing comprises radiator body and radiator fan; Described radiator body is provided with fin; It is characterized in that: also comprise heat pipe; This heat pipe assembly is in described fin.
Description of drawings
Fig. 1 is the heat sink arrangement general structure schematic diagram of the utility model fin band heat pipe.
Fig. 2 is the three-dimensional cutaway view of described heat sink arrangement radiator body along the heat pipe direction.
Embodiment
Below in conjunction with accompanying drawing in detail embodiment of the present utility model is described in detail.
A kind of heat sink arrangement of fin band heat pipe comprises radiator body 1 and radiator fan 2; Described radiator body is provided with fin 11; It is characterized in that: also comprise heat pipe 3; These heat pipe 3 assemblies are in described fin 11.Heat pipe is a kind of efficient heat transfer components and parts, has high thermal conductivity.Heat pipe makes water or methyl alcohol or acetone etc. as heat-exchange medium; The gasification phase transformation that utilizes the medium absorbs heat from the heat absorption district; Media band after the gasification the heat release zone that heat is transferred to the other end rapidly; In heat release zone, media enters the phase transformation that takes place in the capillary to liquefy and discharges heat; Media after the liquefaction from heat release zone via capillary flow resorption hot-zone, thereby finish a duty cycle.The radiator body bottom that directly contacts with electronic devices and components absorbs the heating of electronic devices and components, and heat is transmitted to fin 11.The heat pipe 3 of assembly in fin 11 can be transmitted to fin 11 peripheries rapidly along the heat pipe direction with heat owing to have excellent heat conductivility, the heat radiation load of balance fin; Thereby avoid heat to concentrate on the fin in centre more, influence the phenomenon of heat sink arrangement integral heat sink efficient.Setting of the present utility model makes entire radiator body 1 can give full play to the heat radiation function simultaneously, the heat that more effectively thermal source is produced in the unit interval conducts out, and the air-flow that drives of the fin 11 by radiator body 1 and radiator fan diffuses to heat in the ambient air and goes in time, thereby reaches the effect to the electronic devices and components high efficiency and heat radiation.
Described heat pipe 3 has two to three.In actual applications, the quantity of heat pipe can be adjusted according to the heat radiation needs; Among the part embodiment, the quantity of heat pipe 3 is two to three.
Described heat pipe 3 is in described fin 11 and is arranged in parallel.
Described heat pipe 3 is parallel to the bottom surface 12 of radiator body 1, and or at an angle oblique vertical with the orientation of fin 11.Heat pipe 3 can be connected with more fin; Thereby more effectively utilize the thermal conductivity of heat pipe, the heat radiation load of balance fin 11.
Claims (4)
1, a kind of heat sink arrangement of fin band heat pipe comprises radiator body (1) and radiator fan (2); Described radiator body is provided with fin (11); It is characterized in that:
Also comprise heat pipe (3); This heat pipe (3) assembly is in described fin (11).
2, heat sink arrangement according to claim 1 is characterized in that:
Described heat pipe (3) has two to three.
3, heat sink arrangement according to claim 2 is characterized in that:
Described heat pipe (3) is in described fin (11) and is arranged in parallel.
4, according to claim 1 or 3 described heat sink arrangements, it is characterized in that:
Described heat pipe (3) is parallel to the bottom surface (12) of radiator body (1), and or at an angle oblique vertical with the orientation of fin (11).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 02289893 CN2590176Y (en) | 2002-12-11 | 2002-12-11 | Fin of radiating equipment having heat conductive tube |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 02289893 CN2590176Y (en) | 2002-12-11 | 2002-12-11 | Fin of radiating equipment having heat conductive tube |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2590176Y true CN2590176Y (en) | 2003-12-03 |
Family
ID=33749314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 02289893 Expired - Lifetime CN2590176Y (en) | 2002-12-11 | 2002-12-11 | Fin of radiating equipment having heat conductive tube |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2590176Y (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101782228A (en) * | 2010-04-08 | 2010-07-21 | 艾迪光电(杭州)有限公司 | Liquid cooling type high-power LED lamp |
-
2002
- 2002-12-11 CN CN 02289893 patent/CN2590176Y/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101782228A (en) * | 2010-04-08 | 2010-07-21 | 艾迪光电(杭州)有限公司 | Liquid cooling type high-power LED lamp |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CX01 | Expiry of patent term |
Expiration termination date: 20121211 Granted publication date: 20031203 |