CN2588539Y - Adhesive stick type LED - Google Patents
Adhesive stick type LED Download PDFInfo
- Publication number
- CN2588539Y CN2588539Y CN02261593U CN02261593U CN2588539Y CN 2588539 Y CN2588539 Y CN 2588539Y CN 02261593 U CN02261593 U CN 02261593U CN 02261593 U CN02261593 U CN 02261593U CN 2588539 Y CN2588539 Y CN 2588539Y
- Authority
- CN
- China
- Prior art keywords
- light
- epoxy resin
- board
- emitting diode
- copper film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to an adhesive sheet type light-emitting diode, which is characterized in that a transparent copper film epoxy resin board (a transparent copper clad board) is taken as a base board, and a pair of electrodes used for outer connection is carved on the base board; a light-emitting diode chip is directly packed between the pair of electrodes used for outer connection on the copper film epoxy resin board, the surface of the light-emitting diode chip is packed by an epoxy resin layer, and microminiature adhesive sheet type resistors can be arranged in the electrodes used for outer connection. Due to the adoption of the transparent copper film epoxy resin board (a transparent copper clad board) as the base board, the utility model can causing light to penetrate through the base board, and the light emission and the large light emitting angles of two surfaces of a copper film part are eliminated. Simultaneously, since the electrodes are arranged on the same plane, a plurality of units can be directly interconnected by soft conducting wires, the utility model has large flexible angles, integral height is reduced, and the disadvantage that a pipe pin is easy to break during bending process when a common light-emitting diode is used for manufacture.
Description
Technical field
The utility model relates to a kind of flat type LED.
Technical background
The disclosed technology of Chinese patent ZL01131330.7 " flat type LED and manufacture method thereof " is: it comprises the base that possesses face one side that is installed in main printed circuit board, extend and connect the body part that is arranged on the hole on the main printed circuit board and disposes from above-mentioned base, be arranged on this body part and at the luminous luminous component of another face one side of main printed circuit board.On base, be provided with to be connected and use electrode with the pair of outer of luminous component electrical connection.Luminous component is with resin-sealed sealing.As an example, when base being installed to the back side one side of main printed circuit board, the configuration luminous component make be configured in main printed circuit board on liquid crystal to carry on the back the light conducting direction of irradiation consistent.It is mainly used in background light, can not the two sides printing opacity, and also be three-dimensional the placement.
Summary of the invention
The purpose of this utility model provide a kind of copper stent and luminescence chip be the plane place, be applicable to neon light, can the two sides printing opacity, flat type LED that lighting angle is big.
For achieving the above object, the utility model adopts following technical scheme: be substrate with transparent material copper film epoxy resin board (transparent copper clad plate) promptly, on substrate, carve pair of outer connection electrode, the pair of outer that light-emitting diode chip for backlight unit directly is encapsulated on the copper film epoxy resin board connects with between the electrode, seal with epoxy resin layer on the surface of light-emitting diode chip for backlight unit part, externally connects and can establish the SMD resistance of built-in microminiature with electrode.
Because having adopted transparent material copper film epoxy resin board (transparent copper clad plate) in the technique scheme is substrate, can allow the light transmission substrate remove copper film part lighting at two sides like this, lighting angle is big; Simultaneously because electrode in one plane, makes a plurality of unit interconnect can directly link to each other with flexible conductor, flexible angle is very big, reduces whole height, has overcome to bend the defective that pin fractures easily when making of common light-emitting diode.
Description of drawings
The structural representation of accompanying drawing 1 copper film epoxy resin board
Specific embodiment describes embodiment of the present utility model in detail below in conjunction with accompanying drawing
As shown in Figure 1, the 1st, copper film epoxy resin base board, 2 (2 ') they are to connect with electrode, the 3rd, light-emitting diode chip for backlight unit, the 4th, epoxy resin layer, the 5th, the SMD resistance of microminiature
Embodiment one: as shown in Figure 1, the utility model is a substrate 1 by using copper film epoxy resin board (transparent copper clad plate), on substrate 1, adopt the technology of printed circuit board (PCB) carve a pair of connection with electrode 2,2 ', with light-emitting diode chip for backlight unit 3 directly be encapsulated on the copper film epoxy resin board 1 a pair of connection with electrode 2,2 ' between, seal with epoxy resin layer 4 on the surface of light-emitting diode chip for backlight unit 3 parts, can establish the SMD resistance 5 of built-in microminiature in connection with electrode 2 (2 ').
Can be directly when each unit of the utility model interconnects link to each other with flexible conductor, flexible angle is very big, the defective that pin fractures easily when having overcome with common light-emitting diode making.Light can have been removed copper film part lighting at two sides through substrate, lighting angle is big, is the desirable light emitting source of modern neon light.
Claims (2)
1, a kind of paster type light emitting type, it comprises substrate (1), electrode (2), light-emitting diode chip for backlight unit (3), epoxy resin layer (4) composition, it is characterized in that: go up the technology that adopts printed circuit board (PCB) at transparent copper film epoxy resin (transparent copper clad plate) substrate (1) and carve a pair of connection electrode (2), (2 '), light-emitting diode chip for backlight unit (3) directly is encapsulated in a pair of connection on the copper film epoxy resin board (1) with between electrode (2), (2 '), and seal with epoxy resin layer (4) on the surface of light-emitting diode chip for backlight unit (3) part.
2, paster type light emitting type according to claim 1 is characterized in that: connect hold with electrode (2) or (2 ') can be provided with the SMD resistance of microminiature (5) with outside be connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN02261593U CN2588539Y (en) | 2002-11-12 | 2002-11-12 | Adhesive stick type LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN02261593U CN2588539Y (en) | 2002-11-12 | 2002-11-12 | Adhesive stick type LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2588539Y true CN2588539Y (en) | 2003-11-26 |
Family
ID=33728338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN02261593U Expired - Fee Related CN2588539Y (en) | 2002-11-12 | 2002-11-12 | Adhesive stick type LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2588539Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008017207A1 (en) * | 2006-08-02 | 2008-02-14 | Helio Optoelectronics Corporation | A light emitting diode circuit having a plurality of critical voltages and a light emitting diode device |
| CN101533784B (en) * | 2008-03-12 | 2011-06-15 | 亿光电子工业股份有限公司 | Light emitting diode encapsulating structure and production method thereof |
| CN103682060A (en) * | 2012-09-14 | 2014-03-26 | 展晶科技(深圳)有限公司 | Light-emitting diode lamp source device |
-
2002
- 2002-11-12 CN CN02261593U patent/CN2588539Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008017207A1 (en) * | 2006-08-02 | 2008-02-14 | Helio Optoelectronics Corporation | A light emitting diode circuit having a plurality of critical voltages and a light emitting diode device |
| CN101533784B (en) * | 2008-03-12 | 2011-06-15 | 亿光电子工业股份有限公司 | Light emitting diode encapsulating structure and production method thereof |
| CN103682060A (en) * | 2012-09-14 | 2014-03-26 | 展晶科技(深圳)有限公司 | Light-emitting diode lamp source device |
| CN103682060B (en) * | 2012-09-14 | 2016-09-21 | 展晶科技(深圳)有限公司 | Light-emitting diode lamp source device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20031126 Termination date: 20101112 |