CN2570982Y - Circular heat sinking unit - Google Patents
Circular heat sinking unit Download PDFInfo
- Publication number
- CN2570982Y CN2570982Y CN 02234265 CN02234265U CN2570982Y CN 2570982 Y CN2570982 Y CN 2570982Y CN 02234265 CN02234265 CN 02234265 CN 02234265 U CN02234265 U CN 02234265U CN 2570982 Y CN2570982 Y CN 2570982Y
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- Prior art keywords
- circular
- radiator
- heat sinking
- geometrical clamp
- cylinder
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Abstract
The utility model relates to a circular heat sinking device. The utility model comprises a fixing clip and a circular heat sinking device which is arranged on the fixing clip, wherein, both sides of the fixing clip are symmetrically provided with inwards bent hooks and are fixed on the surface of a heating device of a printed circuit board through the hooks, the top surface of the fixing clip is provided with a central circular hole with internal screw threads, the circular heat sinking device comprises a plurality of parallel heat sinking pieces and a cylinder on the root of the circular heat sinking device. The circumferential surface of the cylinder is provided with external screw threads which correspond to the internal screw threads of the fixing clip. The cylinder can be rotatablely fixed in the central circular hole of the fixing chip. The bottom surface of the cylinder is closely contacted with the surface of the heating device. The utility model has the advantages of simple installation and convenient dismounting and maintenance. The utility model can directly replace the heat sinking devices of the existing sealed sinking devices of CBGA and CCGA.
Description
Technical field
The utility model relates to the heat dissipation technology of electronic product, more particularly, relates to a kind of Circular heat sinking unit.
Background technology
In electronic product, Application Of Radiator is very extensive, it is the critical elements that is concerning that can electronic product operate as normal, therefore requires the radiating efficiency height of radiator, require simultaneously radiator and being connected of heater element reliable, easy for installation, repair demolition is easy.
More and more higher and microminiaturized day by day along with the integrated level of heater members such as chip, make its heat radiation difficulty more, especially for the super high power device of circuit board top.According to using increasing present situation with CBGA (porcelain blocking grid array) and CCGA (the porcelain envelope is leant on grid array) for the super high power device of main packing forms on the present circuit board, traditional conventional radiator is difficult to satisfy high density, powerful requirement, if the heat dissipation design problem less than solution, will sacrifice the Performance And Reliability of product.
One, about the fixing means of radiator, there are adhesive fixation, screw method, spring clip fixation etc. several at present, introduce the characteristics of the whole bag of tricks below respectively:
1, adhesive fixation
The step of adhesive fixation comprises: clean two splicing faces and dry; Gluedd joint a gluing of face, another side is coated with curing agent; Splicing face is relative and apply suitable pressure, keeps 15 minutes.There is following shortcoming in this fixing means:
1-1, may come off because of the influence of gravity.
As shown in Figure 1, because circuit board 1 vertical usually installation when operation, this moment, the weight of radiator 3 made glue-line 4 be subjected to the effect of a stress P all the time, and radiator 3 might be peeled off from circuit board.
The influence that 1-2, calorific intensity change
The chemical composition of heat-conducting glue is generally acrylic resin modified, as shown in Figure 2, its calorific intensity reduces with the rising of working temperature, as can be seen from the figure, the adhesion strength of the glue-line that has cured begins to descend at about 40 ℃, and its adhesion strength only is 20% of a green strength when arriving 100 ℃.Result according to statistics, in thermal design, the working temperature of power module is controlled at about 100 ℃; The working temperature of signal processor is controlled at about 70-100 ℃; The working temperature of resolution element is greater than 100 ℃.Long-term work under so high temperature, its adhesion strength is lower, and under the acting in conjunction of above-mentioned stress P, radiator exists the trend that comes off all the time.
1-3, influence of air bubbles
As shown in Figure 3; in the process of bonding radiator; usually can stay the pore 5 that varies in size, owing to these pores form at normal temperatures, when heater members 2 work in glue-line 4 inside; the pore pressure inside also raises; this elevated pressure also makes the cohesive force of glue-line descend, thereby has increased the possibility that radiator comes off, and the more important thing is because the existence of bubble; increase the thermal resistance of heat-conducting glue, thereby reduced the radiating efficiency of radiator.
In addition, the release agent in the chip encapsulation material has harmful effect to the viscosity of adhesive, and the coefficient of expansion of adhesive and radiator does not match also can lower between the two cohesive force.
As seen, the weak point of adhesive fixation is that adhesive strength is uncontrollable, and radiator has the possibility of coming off, and the operating time is long, reprocesses difficulty.
2, screw method
This is a kind of tradition fixing means commonly used, is generally used for fixing large-scale radiator, particularly uses more on power module.As shown in Figure 4, concrete grammar is to insert screw 6 between radiator 3 and printed circuit board (PCB) 1, screws in nut 7 and tightens at the other end, and radiator is fixed on the printed circuit board (PCB), for increasing radiating effect, also can between heater members 2 and radiator 3, fill heat-conducting silicone grease 8.
The advantage of this method is that fixation is reliable, and is easy for assembly, disassembly and maintenance.Shortcoming is: fixing operation inconvenience is difficult for leveling; Inapplicable going up at PCBA (assembled printed circuit boards) fixed, and take more layout district; The uncontrollable pressure that is applied on the heater members has the potential risk that crushes heater members.
3, insulation expand tube fixation
As shown in Figure 5, this method is passed through to insert insulation expansion pipe 9 on radiator 3, and makes it to stretch with stretching printed circuit board (PCB) 1, inserts expandable nail 10 then, can also fill heat-conducting silicone grease 8 or heat conduction with phase change glue between heater members and radiator.Compress by spring 11 in this method, can not apply the improper heater members 2 that damages by pressure because of pressure.On the other hand, it is fixing more convenient, easier arrangement fixing hole during design.But when the CAD layout, require fixing hole is placed on the heater members axial symmetry line, so the still uncontrollable pressure that is applied on the heater members also has the potential risk that crushes heater members.
4, spring clip fixation
As shown in Figure 6, this method is fixed on radiator 3 on heater members 2 and the printed circuit board (PCB) 1 firmly by two stainless steel jump rings 13, also is filled with Heat Conduction Material 8 between radiator and heater members.The weak point of this fixing means is, need reserve 3 fixing holes when CAD designs, and has also reduced wiring space, has increased the difficult wiring of CAD.
Two, about the structure of radiator, commonly used at present has panel radiator, pin type radiator and tower heat sink etc. several, introduces its design feature below respectively:
1, panel radiator, its structure be wear radiated rib, another side is the solid metal body on plane.Its weak point is fixing difficulty, and weight is big, is difficult for satisfying the fall-down test requirement; And the radiating efficiency of Unit Weight is lower, and the duty area is big, reprocesses difficulty.
2, pin type radiator, its structure are to wear a large amount of aciculiform thermal columns (hedgehog shape), and another side is the metallic object on plane.Its weak point is fixing difficulty, reprocesses difficulty.
3, tower heat sink, its structure are that one side is the multilayer fin of stack, and another side is the metallic object on plane.Its weak point is fixing difficulty equally, reprocesses difficulty.
The utility model content
The technical problems to be solved in the utility model is, above-mentioned shortcoming at prior art provides a kind of Circular heat sinking unit, is applicable to that with CBGA and CCGA be the high power device of main packing forms, and installation and convenient disassembly can not cause damage to heater members and circuit board.
The technical solution of the utility model is as follows, construct a kind of Circular heat sinking unit, comprise geometrical clamp and dress circular radiator thereon, it is characterized in that, bilateral symmetry at described geometrical clamp is provided with the hook that bends inwards, can be fixed on the surface of heater members on the printed circuit board (PCB) by described hook, its end face is provided with tapped center hole; Described circular radiator comprises the fin that multi-disc is parallel and the cylinder of root thereof, the periphery of described cylinder is provided with the external screw thread corresponding with the internal thread of described geometrical clamp, in the rotatable center hole that is fixed on described geometrical clamp, its bottom surface is closely contacted with the surface of described heater members.
In Circular heat sinking unit described in the utility model, be provided with a torsion hole in the top center of described circular radiator, insert when torque screwdriver rotates and described circular radiator can be screwed in the center hole of described geometrical clamp.Two-sided heat-conducting glue also is equipped with in the cylinder bottom surface of described circular radiator, can be with the surface of circular radiator strong bond at heater members.
Heat abstractor of the present utility model is installed simple, can directly substitute the radiator of existing CBGA, CCGA encapsulation heater members; And dismantle easy to maintenancely, can not cause the damage of integrated circuit and circuit board.
The utility model is described in further detail below in conjunction with drawings and Examples.
Description of drawings
Fig. 1 is the schematic diagram that the fixing radiator of available technology adopting adhesive is subjected to gravity effect;
Fig. 2 is the temperature variant schematic diagram of the calorific intensity of adhesive;
Fig. 3 is that heat-conducting glue solidifies the schematic diagram that the back forms bubble;
Fig. 4 is the schematic diagram of available technology adopting screw radiator;
Fig. 5 is the schematic diagram of available technology adopting expansion tube fixed heat sink;
Fig. 6 is the schematic diagram of available technology adopting spring clip fixed heat sink;
Fig. 7 is the schematic diagram of the Circular heat sinking unit in the utility model when cooperating with heater members;
Fig. 8 is the upward view of the geometrical clamp among Fig. 7;
Fig. 9 is the partial sectional view of geometrical clamp;
Figure 10 is the cutaway view that the circular radiator of four circular heatsinks is arranged in the utility model;
Figure 11 is the vertical view of circular radiator shown in Figure 10;
Figure 12 is the schematic diagram of pressure test in the utility model.
Embodiment
1, geometrical clamp
In the preferred embodiment of the present utility model, the structure of geometrical clamp such as Fig. 7,8,9,10 are to shown in Figure 11, geometrical clamp in the utility model is made with the high strength Reinforced Nylon 66 of high temperature resistant (greater than 130 ℃), is used to catch on the porcelain plate of CBGA, and fixes circular radiator by screw thread.
As can be seen from the figure, be provided with the hook 21 that bends inwards, whole geometrical clamp can be fixed on the surface of heater members 2 on the printed circuit board (PCB) 1, be provided with the center hole of band internal thread 22 at the center of geometrical clamp by this hook 21 in the bilateral symmetry of geometrical clamp 20.
Two, circular radiator
In the preferred embodiment of the present utility model, the structure of circular radiator 15 such as Fig. 7,12 and shown in Figure 13, the root of this circular radiator is a column structure, top is the parallel circular heatsink of multi-disc 16, is provided with and the external screw thread 17 that can cooperate with the internal thread 22 of geometrical clamp 20 at the periphery of cylinder; Top center at circular radiator also is provided with a torsion hole 18.This circular radiator can be fixed in the center hole of geometrical clamp 20 by its cylinder rotation, rotates if insert torque screwdriver again, circular radiator 15 can be continued to screw in the center hole of geometrical clamp.
Circular radiator of the present utility model is made with metallic aluminium, and the surface adopts anodic oxidation to dye the black heat radiation that is beneficial to.The volume of radiator too conference impacts the encapsulation and the structure of product, and circular radiator delicate structure of the present utility model, volume are little, in light weight, with regard to its volume, have bigger free area of dissipation ratio.And its structure also has the effect of baffler, and with other radiator of volume, it has higher radiating efficiency relatively.
According to the needs of product, can design multiple size, for example wherein the diameter of circular heatsink can be 1 inch, 1.5 inches or 2 inches, the quantity of circular heatsink can be 4, also can be as shown in figure 14 3.
Three, heat-conducting glue
In the utility model, consider that circular radiator and contacting of CBGA packaged integrated circuits surface are the rigidity contacts, thermal resistance therebetween is bigger, in order to improve heat conductivility, should add Heat Conduction Material between circular radiator and integrated circuit surface.Because one start screw does not have self-lock ability,, except the heat conduction function, can also prevent that the circular radiator screw thread from getting loose so two-sided heat-conducting glue 8 is adopted in decision.Through the test authentication, can preferentially adopt BP105 double-sided insulation heat-conducting glue, T404 is standby.
Four, install and fix
As shown in Figure 7, earlier geometrical clamp 20 is contained in heater members 2 surfaces on the printed circuit board (PCB) 1, again circular radiator is revolved in the center hole that 15 root screws in geometrical clamp, insert the torsion hole that circular radiator revolves 15 tops with torque screwdriver, continue inwardly rotation, revolve till 15 bottom surface is pressed on the surface of heater members 2 up to circular radiator.
Five, pressure measurement method
For circular radiator of the present utility model, can adopt following method to carry out pressure measxurement, be CMT2502 electronics pulling experiment machine as shown in figure 12 through repacking, offer the screwed hole identical on its support 31 with the center hole of geometrical clamp, circular radiator 15 is contained on the support 31, the torsion hole of inserting circular radiator with torque screwdriver 32 rotates up, racking strain transducer 30, strain transducer produces deformation, its deformation signal outputs to and produces corresponding data variation on the computer 34, these data are exactly extruding force, because the rigidity of strain transducer is very big, so can assert the strain transducer rigid body that is as the criterion.Increase torsion gradually, note the strain transducer suffered pressure corresponding with each readable scale of torque screwdriver, the result that will write down makes form at last, when actual installation, can find the approximate pressure of circular radiator to heater members by the reading that rotary torsion is criticized.Because strain transducer still has certain deformation, the pressure that records with this method can be slightly larger than true pressure.
Claims (5)
1, a kind of Circular heat sinking unit, comprise geometrical clamp and dress circular radiator thereon, it is characterized in that, bilateral symmetry at described geometrical clamp is provided with the hook that bends inwards, can be fixed on the surface of heater members on the printed circuit board (PCB) by described hook, its end face is provided with tapped center hole; Described circular radiator comprises the fin that multi-disc is parallel and the cylinder of root thereof, the periphery of described cylinder is provided with the external screw thread corresponding with the internal thread of described geometrical clamp, in the rotatable center hole that is fixed on described geometrical clamp, its bottom surface is closely contacted with the surface of described heater members.
2, Circular heat sinking unit according to claim 1 is characterized in that, is provided with a torsion hole in the top center of described circular radiator, inserts when torque screwdriver rotates described circular radiator to be screwed in the center hole of described geometrical clamp.
3, Circular heat sinking unit according to claim 2 is characterized in that, two-sided heat-conducting glue also is equipped with in the cylinder bottom surface of described circular radiator, can be with the surface of circular radiator strong bond at heater members.
4, Circular heat sinking unit according to claim 3 is characterized in that, described geometrical clamp is that resistant to elevated temperatures high strength Reinforced Nylon 66 is made.
5, Circular heat sinking unit according to claim 3 is characterized in that, the fin of described circular radiator also is circular, and its diameter can be 1 inch, 1.5 inches or 2 inches, and the quantity of described circular heatsink can be 3 or 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02234265 CN2570982Y (en) | 2002-05-01 | 2002-05-01 | Circular heat sinking unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02234265 CN2570982Y (en) | 2002-05-01 | 2002-05-01 | Circular heat sinking unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2570982Y true CN2570982Y (en) | 2003-09-03 |
Family
ID=33709143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02234265 Expired - Fee Related CN2570982Y (en) | 2002-05-01 | 2002-05-01 | Circular heat sinking unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2570982Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006122505A1 (en) * | 2005-05-18 | 2006-11-23 | Jen-Shyan Chen | Integrated circuit packaging and method of making the same |
| CN101363368B (en) * | 2008-06-18 | 2011-12-14 | 绍兴平国电子科技有限公司 | Integration unit of air control shutter and controller and method for manufacturing same |
| CN102938997A (en) * | 2011-08-16 | 2013-02-20 | 鸿富锦精密工业（深圳）有限公司 | Heat dissipation device |
-
2002
- 2002-05-01 CN CN 02234265 patent/CN2570982Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006122505A1 (en) * | 2005-05-18 | 2006-11-23 | Jen-Shyan Chen | Integrated circuit packaging and method of making the same |
| CN101363368B (en) * | 2008-06-18 | 2011-12-14 | 绍兴平国电子科技有限公司 | Integration unit of air control shutter and controller and method for manufacturing same |
| CN102938997A (en) * | 2011-08-16 | 2013-02-20 | 鸿富锦精密工业（深圳）有限公司 | Heat dissipation device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: JUXIN SCIENCE CO., LTD. Free format text: FORMER OWNER: HUAWEI TECHNOLOGY CO., LTD. Effective date: 20080815 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20080815 Address after: No. 2 Xincheng Road, Songshan science and Technology Industrial Zone, Guangdong, Dongguan Province, China: 523808 Patentee after: Juxin Technology Co., Ltd. Address before: Department of intellectual property, HUAWEI customer service center building, 1 Shenzhen Road, Nanshan District science and Technology Park, Guangdong, China, 518057 Patentee before: Huawei Technologies Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20030903 Termination date: 20100501 |