CN218831040U

CN218831040U - Resistance to compression type heat conduction silica gel gasket

Info

Publication number: CN218831040U
Application number: CN202122687326.4U
Authority: CN
Inventors: 陈建; 龚正燕; 陈春梅; 陈志兰
Original assignee: Shenzhen Zhiyuantai Silicone Rubber Products Co ltd
Current assignee: Shenzhen Zhiyuantai Silicone Rubber Products Co ltd
Priority date: 2021-11-04
Filing date: 2021-11-04
Publication date: 2023-04-07
Anticipated expiration: 2031-11-04

Abstract

The utility model belongs to the technical field of the silica gel gasket, a resistance to compression type heat conduction silica gel gasket is disclosed, including first silicon pad, two silicon slabs are installed to the bottom symmetry of first silicon pad, two one side that first silicon pad was kept away from to the one end of silicon slab is installed the second silicon pad, the heat conduction hole has all been seted up to a side table wall of first silicon pad and second silicon pad, all be provided with the diamond piece around first silicon pad and the second silicon pad, the draw-in groove has all been seted up to a side table wall of first silicon pad and second silicon pad, the utility model discloses set up first silicon pad and second silicon pad, still be provided with the silicon slab of connection between two silicon pads, improved radiating continuity, the diamond piece of setting can improve composite pad's lateral wall bulk rigidity, ensures under the heavy object is exerted and presses down, the phenomenon that can not appear collapsing, has guaranteed the heat-sinking capability under different service environment.

Description

Resistance to compression type heat conduction silica gel gasket

Technical Field

The utility model belongs to the technical field of the silica gel gasket, concretely relates to resistance to compression type heat conduction silica gel gasket.

Background

The heat-conducting silica gel is a high-end heat-conducting compound, can not be solidified, can not conduct electricity, can avoid risks such as circuit short circuit and the like due to the characteristic of no electricity, is a single-component, heat-conducting and room-temperature-curing organic silicon bonding sealing gum, is crosslinked and cured by releasing low molecules through condensation reaction of moisture in the air, is a high-performance elastomer after vulcanization, has excellent cold and hot alternation resistance, aging resistance and electric insulation performance, has excellent moisture resistance, shock resistance, corona resistance, electric leakage resistance and chemical medium resistance, does not swell and has good adhesion to most of metal and non-metal materials, and has high bonding performance and super heat-conducting effect which are the best heat-conducting solution when a CPU, a GPU and a radiator are contacted at present.

However, there are some defects in the current compound heat conduction silica gel gasket in the market at present in the use, for example, the texture of heat conduction silica gel is comparatively soft, when using in the electronic product, can lead to its phenomenon that appears deformation because of the pressure application of heavy object sometimes, and heat conduction silica gel after the deformation takes place, its heat conductivility can receive great loss, influences subsequent radiating effect.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a resistance to compression type heat conduction silica gel gasket to solve current silica gel gasket's use hardness problem.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a resistance to compression type heat conduction silica gel gasket, includes first silicon pad, two silicon boards are installed to the bottom symmetry of first silicon pad, two one side that first silicon pad was kept away from to the one end of silicon board is installed second silicon pad, the heat conduction hole has all been seted up to one side table wall of first silicon pad and second silicon pad, all be provided with the diamond piece around first silicon pad and the second silicon pad, a draw-in groove has all been seted up to one side table wall of first silicon pad and second silicon pad, the diamond piece is close to one side table wall of draw-in groove and installs the fixture block, the fixture block is connected with the draw-in groove block.

Preferably, a copper sheet is arranged between the first silicon pad and the second silicon pad and is divided into an upper sheet and a lower sheet, a copper column is arranged between the upper sheet and the lower sheet, a cavity is formed in the copper column, and a silica gel rod is arranged in the cavity.

Preferably, a supporting sheet is installed at the top of the second silicon pad, a plurality of supporting blocks are installed at the top of the supporting sheet, and one sides of one ends of the supporting blocks, which are far away from the supporting sheet, are fixedly installed at the bottom of the lower sheet.

Preferably, the bottom of the first silicon pad is provided with a fixing sheet, and a honeycomb aluminum plate is arranged between the fixing sheet and the upper sheet.

Preferably, circular holes are formed in the surface wall of one side of each of the two silicon plates, and a copper pipe is installed on one side of the inner wall of each circular hole.

Preferably, a plurality of radiating grooves are formed in the surface wall of one side of the copper sheet, and a plurality of radiating holes are formed in the radiating grooves.

Compared with the prior art, the utility model, following beneficial effect has:

(1) The utility model discloses set up first silicon pad and second silicon pad, still be provided with the silicon slab of connection between two silicon pads, improved radiating continuity, the diamond piece of setting can improve composite pad's lateral wall bulk rigidity, ensures to exert under the heavy object, and the phenomenon that can not appear collapsing has guaranteed the heat-sinking capability under different service environment.

(2) The utility model discloses set up the copper sheet, the copper sheet setting is between first silicon pad and second silicon pad, can strengthen the inside heat conductivility of composite pads piece, also can strengthen composite pads piece's whole rigidity simultaneously, and the use of backing sheet cooperation supporting shoe of setting can promote the whole atress ability of second silicon pad, and the stationary blade cooperation honeycomb aluminum plate's of setting use can promote composite pads piece's whole heat conduction speed, improves the atress performance of first silicon pad.

Drawings

FIG. 1 is a schematic view of the present invention;

fig. 2 is a top view of the present invention;

fig. 3 is a sectional view of the present invention.

In the figure: 1. a first silicon pad; 2. a silicon plate; 3. a second silicon pad; 4. a heat conduction hole; 5. a diamond sheet; 6. a clamping block; 7. a copper sheet; 8. a copper pillar; 9. a silica gel rod; 10. a support sheet; 11. a support block; 12. a fixing sheet; 13. a honeycomb aluminum plate; 14. a copper tube; 15. a heat sink; 16. and (4) heat dissipation holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides the following technical solutions: the utility model provides a resistance to compression type heat conduction silica gel gasket, including first silicon pad 1, two silicon boards 2 are installed to the bottom symmetry of first silicon pad 1, one side that first silicon pad 1 was kept away from to the one end of two silicon boards 2 is installed second silicon pad 3, heat conduction hole 4 has all been seted up to one side table wall of first silicon pad 1 and second silicon pad 3, all be provided with diamond piece 5 around first silicon pad 1 and second silicon pad 3, the draw-in groove has all been seted up to one side table wall of first silicon pad 1 and second silicon pad 3, diamond piece 5 is close to one side table wall of draw-in groove and installs fixture block 6, fixture block 6 is connected with the draw-in groove block, still be provided with the silicon board 2 of connection between two silicon pads, the radiating continuity has been improved, the diamond piece 5 that sets up can improve composite pad's lateral wall bulk rigidity, ensure to exert the pressure in the heavy object, the phenomenon of collapsing can not appear.

In this embodiment, preferably, a copper sheet 7 is arranged between the first silicon pad 1 and the second silicon pad 3, the copper sheet 7 is divided into an upper sheet and a lower sheet, a copper column 8 is installed between the upper sheet and the lower sheet, a cavity is arranged inside the copper column 8, a silica gel rod 9 is arranged inside the cavity, and the copper sheet 7 is arranged between the first silicon pad 1 and the second silicon pad 3, so that the heat conduction performance inside the composite gasket can be enhanced, and the overall rigidity of the composite gasket can also be enhanced.

In this embodiment, preferably, the supporting sheet 10 is installed at the top of the second silicon pad 3, the supporting sheets 11 are installed at the top of the supporting sheet 10, one sides of the supporting sheets 10, which are far away from one ends of the supporting sheets 11, are fixedly installed at the bottom of the lower sheet, and the supporting sheets 10 are used in cooperation with the supporting sheets 11, so that the overall stress capability of the second silicon pad 3 can be improved.

In this embodiment, preferably, the bottom of the first silicon pad 1 is provided with a fixing plate 12, a honeycomb aluminum plate 13 is arranged between the fixing plate 12 and the upper plate, and the fixing plate 12 is matched with the honeycomb aluminum plate 13 to improve the overall heat conduction speed of the composite gasket and improve the stress performance of the first silicon pad 1.

In this embodiment, preferably, a circular hole is formed in a surface wall of one side of each of the two silicon plates 2, the copper pipe 14 is installed on one side of an inner wall of the circular hole, the circular hole improves the heat transfer rate, and the circular hole can provide a supporting force for the circular hole while performing heat conduction.

In this embodiment, preferably, a plurality of heat dissipation grooves 15 are formed in a surface wall of one side of the copper sheet 7, a plurality of heat dissipation holes 16 are formed inside the heat dissipation grooves 15, the heat dissipation holes 16 can improve the overall heat dissipation capability of the copper sheet 7, and the heat dissipation grooves 15 facilitate heat propagation.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a resistance to compression type heat conduction silica gel gasket, includes first silicon pad (1), its characterized in that: two silicon pads (2) are installed to the bottom symmetry of first silicon pad (1), two one side that first silicon pad (1) was kept away from to the one end of silicon pad (2) is installed second silicon pad (3), heat conduction hole (4) have all been seted up to one side table wall of first silicon pad (1) and second silicon pad (3), all be provided with diamond piece (5) around first silicon pad (1) and second silicon pad (3).

2. The pressure-resistant heat-conducting silica gel gasket according to claim 1, wherein: the clamping groove has been all seted up to a side table wall of first silicon pad (1) and second silicon pad (3), diamond piece (5) are close to a side table wall of clamping groove and install fixture block (6), fixture block (6) are connected with the clamping groove block, be provided with copper sheet (7) between first silicon pad (1) and second silicon pad (3), copper sheet (7) divide into piece and lower piece, go up the piece and install copper post (8) down between the piece, the inside of copper post (8) is provided with the cavity, the inside of cavity is provided with silica gel stick (9).

3. The pressure-resistant heat-conducting silica gel gasket according to claim 2, wherein: a supporting sheet (10) is installed at the top of the second silicon pad (3), a plurality of supporting blocks (11) are installed at the top of the supporting sheet (10), and one sides, far away from the supporting sheet (10), of one ends of the supporting blocks (11) are fixedly installed at the bottom of the lower sheet.

4. The pressure-resistant heat-conducting silica gel gasket according to claim 2, wherein: the bottom of first silicon pad (1) is installed stationary blade (12), be provided with honeycomb aluminum plate (13) between stationary blade (12) and the last piece.

5. The pressure-resistant heat-conducting silica gel gasket according to claim 1, wherein: round holes are formed in the surface wall of one side of each of the two silicon plates (2), and a copper pipe (14) is installed on one side of the inner wall of each round hole.

6. The pressure-resistant heat-conducting silica gel gasket according to claim 2, wherein: a plurality of heat dissipation grooves (15) are formed in the surface wall of one side of the copper sheet (7), and a plurality of heat dissipation holes (16) are formed in the heat dissipation grooves (15).