CN2567653Y - CPU heat-sink system - Google Patents

CPU heat-sink system Download PDF

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Publication number
CN2567653Y
CN2567653Y CN 02272782 CN02272782U CN2567653Y CN 2567653 Y CN2567653 Y CN 2567653Y CN 02272782 CN02272782 CN 02272782 CN 02272782 U CN02272782 U CN 02272782U CN 2567653 Y CN2567653 Y CN 2567653Y
Authority
CN
China
Prior art keywords
cpu
computer casing
side plate
fan
lateral plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 02272782
Other languages
Chinese (zh)
Inventor
陈允隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN 02272782 priority Critical patent/CN2567653Y/en
Application granted granted Critical
Publication of CN2567653Y publication Critical patent/CN2567653Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a CPU heat-radiating system. In the utility model, a mainboard is locked and fixed to a first lateral plate in a computer casing body, and a CPU module is fixed to the mainboard; an electric-source supplying device and a system fan are arranged on a second lateral plate adjacent to the first lateral plate; a fan is arranged on a third lateral plate which is corresponding to the first lateral plate, and the fan can be locked and fixed to the third lateral plate by screw nails; a plurality of through holes are perforated on a fourth lateral plate which is corresponding to the second lateral plate. Cold air can enters the computer casing body through the through holes on the fourth lateral plate of the computer casing body, and with the aid of the fan on the third lateral plate, the cold air and hot air in the computer casing body are rapidly mixed, so a radiator is cooled; then the air in the computer casing body is exhausted by the system fan, so heat quantity generated by a CPU can be rapidly radiated to the air around the computer casing body.

Description

The CPU cooling system
[technical field]
The utility model is about a kind of excellent in heat dissipation effect and can reduces the CPU cooling system that motherboard is loaded.
[background technology]
Traditional C PU is installed on the motherboard, and its calculating process produces a large amount of heats, and CPU can in time cool off in order to make, normal operation, and industry is installing one heating radiator on CPU usually, thereby and installs a radiator fan on heating radiator the heat of its generation is discharged.
Yet, along with the CPU arithmetic speed is accelerated, the heat that it produced increases thereupon, and for solving heat dissipation problem, needed heating radiator is increasing, radiator fan also increases thereupon, the weight of heating radiator and radiator fan must increase, and motherboard will bear the excessive loads that heating radiator and radiator fan bring, and produces distortion, have a strong impact on combining of CPU and motherboard, even make that CPU can't normal operation.
See also Fig. 4, if remove the fan of heating radiator 52, the heat that CPU produces can make the heating radiator ambient air produce heat transfer free convection, still, the coefficient of heat transfer of heat transfer free convection is very low as can be known from the convection heat transfer principle, can't satisfy the radiating requirements of CPU at all.Though system's wind 20 that the system fan 80 of computer casing produces can make hot-air and cool ambient air exchange in the computer casing, yet the laminar layer of this system's wind is bigger, its heat exchange effect is not very good yet.
[summary of the invention]
The purpose of this utility model is to provide a kind of excellent in heat dissipation effect and can reduces the CPU cooling system of motherboard load.
The purpose of this utility model is achieved through the following technical solutions: the utility model CPU cooling system in computer casing on first side plate locking one motherboard, fix a CPU module on this motherboard; Second side plate adjacent with this first side plate is provided with power supply unit and system fan; Three side plate relative with this first side plate is provided with a fan, and this fan can be by the screw lock so on the 3rd side plate; Offer some through holes on the 4th side plate relative with this second side plate.Cold air can enter in the computer casing by the through hole on computer casing the 4th side plate, by the fan on the 3rd side plate that the hot and cold air in the computer casing is mixed fast, thereby cooling radiator, by system fan the air in this computer casing is discharged, the heat that makes CPU produce can be dispersed into rapidly in this computer casing ambient air again.
Compared with prior art, the utility model CPU cooling system is by the fan running on computer casing the 3rd side plate, hot and cold air in the computer casing is mixed fast, thereby make the temperature in the computer casing reach consistent fast, well cooling radiator, thereby this CPU cooling system has excellent in heat dissipation effect and can reduce the advantage of motherboard load.
With reference to the accompanying drawings, in conjunction with the embodiments the utility model is further described.
[description of drawings]
Fig. 1 is the stereographic map of the utility model CPU cooling system.
Fig. 2 is the exploded view of the utility model CPU cooling system the 3rd side plate and fan.
Fig. 3 is the stream condition synoptic diagram in the utility model CPU cooling system computer casing.
Fig. 4 is the air-flow synoptic diagram in traditional computer casing.
[embodiment]
See also Fig. 1, the utility model CPU cooling system comprises a computer casing 10, a motherboard 30, a CPU module 50, a power supply unit 70, system fan 80 and a fan 90.
This computer casing 10 roughly is a rectangular parallelepiped, has four side plates.This motherboard 30 can be by screw locking on first side plate (figure does not indicate) of this computer casing 10; This CPU module 50 comprises a heating radiator 52, a CPU and a connector (figure indicate), and wherein, this CPU is fixed on this connector, and this heating radiator 52 is close to the CPU upper surface, and this heating radiator 50 and this connector all are fixed on this motherboard 30.Be equiped with power supply unit 70 and system fan 80 in second side plate 12 appropriate locations adjacent with this first side plate.Be fixed with a fan 90 in the 3rd side plate 14 appropriate locations relative with this first side plate, this fan 90 has a pedestal 92, and this pedestal 92 is " Y " type substantially; Offer corresponding screw 15 on the 3rd side plate 14, this fan 90 can be by screw 94 lockings on the 3rd side plate 14 (as shown in Figure 2).Offer some through holes 18 on the 4th side plate 16 of the computer casing 10 relative, make cold wind can enter in the computer casing 10 with system fan 80.
When computer system operated, heating radiator 52 was distributed to heat near it in air, and this air themperature raises; Cold air enters in the computer casing by the through hole 18 on the 4th side plate 16, by the fan 90 on the 3rd side plate 14 that these hot and cold air are mixed fast, make its temperature reach consistent, the hot-air discharge that will mix then by the fan of system fan 80 on this second side plate 12 and power supply unit 70 (figure indicates), thereby cooling radiator 52, the heat that makes CPU produce can be dispersed into rapidly in these computer casing 10 ambient airs.
Please consult Fig. 3 together, when fan 90 runnings, produce certain air-flow 40, force the air in the computer casing 10 to carry out forced-convection heat transfer, and can make system's wind bundle 20 laminar layers formation disturbed flow condition that is damaged, thereby increased the convection transfer rate in the computer casing 10, more effectively cooled off CPU.

Claims (7)

1. CPU cooling system, comprise: a computer casing, one motherboard, one CPU module, one power supply unit, an at least one system fan and a fan, wherein this computer casing is a rectangular parallelepiped, have first, two, three, four side plates, this first side plate and the 3rd side plate are oppositely arranged, this second side plate and the 4th side plate are oppositely arranged, and the 4th side plate offers some cool ambient air that can make can enter the interior through hole of this computer casing, this motherboard, be installed on first side plate of this computer casing, this CPU module can be fixed on this motherboard, this power supply unit, be installed on second side plate of this computer casing, these system fan, be installed on this computer casing second side plate, it is characterized in that: on the 3rd side plate of this computer casing, be equiped with the fan that makes the cold and hot air rapid mixing in the computer casing.
2. CPU cooling system as claimed in claim 1 is characterized in that: this CPU module comprises a heating radiator, a CPU and a connector.
3. CPU cooling system as claimed in claim 2 is characterized in that: this CPU is fixed on this motherboard by connector.
4. CPU cooling system as claimed in claim 3 is characterized in that: this heating radiator fits tightly at this CPU upper surface.
5. CPU cooling system as claimed in claim 1 is characterized in that: this fan has a pedestal that is " Y " type.
6. CPU cooling system as claimed in claim 1 is characterized in that: offer some screws on the 3rd side plate.
7. CPU cooling system as claimed in claim 1 is characterized in that: this pedestal system by screw locking on the 3rd side plate.
CN 02272782 2002-08-24 2002-08-24 CPU heat-sink system Expired - Fee Related CN2567653Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 02272782 CN2567653Y (en) 2002-08-24 2002-08-24 CPU heat-sink system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 02272782 CN2567653Y (en) 2002-08-24 2002-08-24 CPU heat-sink system

Publications (1)

Publication Number Publication Date
CN2567653Y true CN2567653Y (en) 2003-08-20

Family

ID=33737411

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 02272782 Expired - Fee Related CN2567653Y (en) 2002-08-24 2002-08-24 CPU heat-sink system

Country Status (1)

Country Link
CN (1) CN2567653Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102436287A (en) * 2010-09-29 2012-05-02 联想(北京)有限公司 Portable mobile terminal
US9007757B2 (en) 2010-03-30 2015-04-14 Beijing Lenovo Software Ltd. Information processing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9007757B2 (en) 2010-03-30 2015-04-14 Beijing Lenovo Software Ltd. Information processing device
CN102436287A (en) * 2010-09-29 2012-05-02 联想(北京)有限公司 Portable mobile terminal

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20030820