CN2558081Y - Heat sink assembly - Google Patents
Heat sink assembly Download PDFInfo
- Publication number
- CN2558081Y CN2558081Y CN 02271167 CN02271167U CN2558081Y CN 2558081 Y CN2558081 Y CN 2558081Y CN 02271167 CN02271167 CN 02271167 CN 02271167 U CN02271167 U CN 02271167U CN 2558081 Y CN2558081 Y CN 2558081Y
- Authority
- CN
- China
- Prior art keywords
- heat
- heat dissipation
- dissipation base
- base
- fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Disclosed is a heat dissipation device combination, comprising a heat dissipation base, a heat dissipation bottom plate, heat dissipation fins arranged on the bottom plate, a plurality of U-shaped thermal pipes, a fan fixation base and a fan. A cavity chamber is arranged in the heat dissipation base and is filled with working liquid. A plurality of U-shaped thermal tubes are fixed arranged on one side of the heat dissipation base. The heat dissipation bottom plate on which the heat dissipation fins are arranged is contained in the heat dissipation base. Through holes are arranged on the heat dissipation fins for the other end of the U-shaped thermal to be inserted into; the fan is fixed on a combination by the fan fixation base. The combination is constructed by the heat dissipation base, the heat dissipation base plate, the heat dissipation fins arranged on the bottom of the bottom base and the thermal tubes. The heat dissipated from the CUP is evenly distributed because of the heat dissipation device combination and the heat dissipation speed is increased; thereby, the effect of even and fast heat dissipation is realized.
Description
[technical field]
The utility model is about a kind of heat abstractor combination, particularly about a kind of heat abstractor combination that can evenly dispel the heat rapidly.
[background technology]
Along with electronic industry constantly develops, the microprocessor speed of service constantly promotes.But the heat that high-frequency high-speed produces microprocessor is more and more, and the performance and the stability of microprocessor operation in serious threat, is a large amount of heats of guaranteeing the normal operation of microprocessor energy, must use heat abstractor in time to get rid of microprocessor to be produced.
Common heat abstractor combination, as No. the 89214786th, 89213022, Taiwan patent application etc., these patents include a radiator, and this radiator comprises a heat dissipation base and is welded in radiating fin on this base, this heat dissipation base is the entity metal and does not have the heat pipe cooperation that radiating rate is slow.Industry is for promoting radiating effect, heat pipe is added in the radiator, these heat abstractors comprise a heat dissipation metal base, radiating fin, heat pipe and fan, as No. the 089205047th, Taiwan patent application, by the effect of heat pipe quickened heat dissipation base and radiating fin between heat transferred, but, lean on the conduction heat conduction of metal between this heat dissipation base and CPU, and directly do not contact between radiating fin and heat dissipation base, its heat concentrates on the heating tape place of CPU, it is inhomogeneous easily to cause dispelling the heat, thereby influences the integral heat sink effect, and then influences the normal operation of central processing unit.
[summary of the invention]
The purpose of this utility model is to provide a kind of heat abstractor combination that can evenly dispel the heat rapidly.
The purpose of this utility model realizes by following technical proposal: the utility model heat abstractor combination comprises a heat dissipation base, a radiating bottom plate and is located at radiating fin, plurality of U-shaped heat pipe, a fan holder and a fan on the radiating bottom plate.Be provided with in this heat dissipation base a chamber and in be filled with hydraulic fluid, the affixed plurality of U-shaped heat pipe of this heat dissipation base one side, this heat dissipation base ccontaining radiating bottom plate in top and be located at radiating fin on this radiating bottom plate, these radiating fins are provided with through hole and plug for the opposite side of U-shaped heat pipe; This fan can by the fan holder be fixed in this radiating seat, radiating bottom plate and be located at radiating fin on this base plate and the combination of these heat pipes on.The heat that this heat abstractor combination can make CPU shed evenly distributes, and has improved radiating rate, thereby reaches the effect of evenly dispelling the heat rapidly.
Compared with prior art, the utility model heat abstractor combination has adopted heat pipe to combine with heat dissipation base and radiating fin, and the mode that also is connected with heat dissipation base of radiating fin, reaches the effect of evenly dispelling the heat rapidly.
[description of drawings]
Fig. 1 is the three-dimensional exploded view of the utility model heat abstractor combination.
Fig. 2 is the three-dimensional exploded view of the radiator of the utility model heat abstractor combination.
Fig. 3 is the three-dimensional combination figure of the utility model heat abstractor combination.
[embodiment]
See also Fig. 1 and Fig. 2, the combination of this creation heat abstractor comprises a heat dissipation base 12, a radiating bottom plate 16 and is located at the radiating fin 18 on this radiating bottom plate, some heat pipes 14, a fan holder 30 and a fan 50.This heat dissipation base 12, radiating bottom plate 16 and radiating fin 18 one-tenth cooling bases 17 capable of being combined, this cooling base 17 can be combined into radiator 10 with heat pipe 14.
This heat dissipation base 12 is provided with a chamber 122, is filled with first hydraulic fluid (figure does not show) of tool good heat exchange performance in this chamber 122, and is provided with first capillary structure (figure does not show) in these chamber 122 internal faces.One sidewall of this heat dissipation base 12 is provided with some coupling holes 121, this heat dissipation base 12 both sides identical with these coupling hole 121 bearing of trends have buckle slot (not label), this heat abstractor are made up (figure does not show) on the microprocessor surface that is fastened on the circuit board for fastener (figure does not show).This heat pipe 14 is the short U-shaped of a side, its short side is fixed in the coupling hole 121 of heat dissipation base 12, be filled with second hydraulic fluid (figure does not show) of tool good heat exchange performance in this heat pipe 14, and be provided with second capillary structure (figure does not show) in inner wall surface thereof.When the shorter lateral sides of such of this heat pipe 14 stretches into certain-length and is fixed in the coupling hole 121, radiating bottom plate 16 lids place heat dissipation base 12 radiating bottom plates 16 lids to place chamber 122 tops of heat dissipation base 12, and make these radiating bottom plate 16 airtight first hydraulic fluids and heat pipe 14 1 ends in the chamber 122 of heat dissipation base 12, and the L shaped radiating fin 18 that is arranged in parallel on this radiating bottom plate 16, this heat dissipation base 12, radiating bottom plate 16 and radiating fin 18 form cooling base 17.In addition, all be provided with a circular hole on each radiating fin 18,, plug than long side with another of heating tube 14 with corresponding formation one lengthwise through hole 20.Stretching in the fixed via 20 of heat pipe 14 than long side; Thereby heat pipe 14 is formed this radiator 10 with this cooling base 17.
The appropriate location that the framework of this fan 50 is four jiaos is provided with perforation 52, wears for screw (figure does not show).
This fan holder 30 comprises a matrix 32, these matrix 32 central authorities set out a circular hole 34, this matrix 32 offers locking hole 36 in end appropriate position, the angle of circular hole 34, the both sides of this matrix 32 are extended side plate 38 respectively downward vertically, this side plate 38 bottoms setpoint distance at interval are provided with some straight joints 42, and these side plate 38 bottoms are located respectively level near two ends and extended inwardly and fix sheet 40.
See also Fig. 3, during assembling, be set in this fan holder 30 on the radiating fin 18 of this radiator 10 from the top earlier, and heat pipe 14 correspondences that make this radiator 10 are placed in the straight joint 42 of this fan holder 10, and the fixing sheet 40 of this fan holder 30 is fastened in the bottom of the heat dissipation base 12 of radiator 10, radiator 10 just is incorporated into one with fan holder 30, then fan 50 is placed fan holder 30 tops, make its perforation 52 aim at the locking hole 36 of this fan holder 30, and this fan 50 is fixed in one with holder 30 by screw (figure do not show), can make this radiator 10 combined integrated with this fan holder 30 and fan 50.At this moment, an end of heat pipe 14 is through 18 of radiating fins, and the other end is fixed in a side of heat dissipation base 12.When heat reached the heat dissipation base 12 of radiator 10 by thermal source, heat not only can directly reach on the radiating fin 18, and can reach on the radiating fin 18 by the heat pipe 14 that can carry out heat exchange rapidly, and then by radiating fin 18 heat radiations.Because having quickened the heat of radiating fin 18 and 12 of heat dissipation bases, the extra means of heat pipe 14 circulates, and first hydraulic fluid (figure does not show) effect owing to 12 of heat dissipation bases, make the heat of heat dissipation base evenly distribute, and then evenly carry out heat conduction rapidly by heat pipe and make the combination of this heat abstractor reach evenly radiating effect rapidly.
Claims (7)
1. heat abstractor combination, comprise a heat dissipation base, a radiating bottom plate and some heat pipes, it is characterized in that: this heat dissipation base has a chamber, and what one side is provided with the coupling hole that communicates with chamber, this radiating bottom plate is provided with radiating fin, these radiating fins are provided with through hole, this radiating bottom plate can cooperate with this heat dissipation base with seal operation liquid in heat dissipation base, one end of these heat pipes is fixed in the coupling hole of this heat dissipation base, and its other end wears in the through hole that is inserted on the radiating fin.
2. heat abstractor combination as claimed in claim 1 is characterized in that: be provided with capillary structure in the chamber of this heat dissipation base, and the hydraulic fluid in it has good heat exchange performance.
3. heat abstractor combination as claimed in claim 1, it is characterized in that: these heat pipes take the shape of the letter U.
4. heat abstractor combination as claimed in claim 2 is characterized in that: be filled with heat exchange performance good operation liquid in this heat pipe, and its inside is provided with capillary structure.
5. heat abstractor combination as claimed in claim 1 is characterized in that: this heat dissipation base, radiating bottom plate and some heat pipes one-tenth one radiator capable of being combined.
6. heat abstractor combination as claimed in claim 5 is characterized in that: this heat abstractor combination further comprises a fan and a fan holder that this fan can be fixed on the radiator.
7. heat abstractor as claimed in claim 6 combination, it is characterized in that: this fan holder comprises a matrix and biside plate, this side plate bottom is provided with and is used for some straight joints of ccontaining heat pipe.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 02271167 CN2558081Y (en) | 2002-06-17 | 2002-06-17 | Heat sink assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 02271167 CN2558081Y (en) | 2002-06-17 | 2002-06-17 | Heat sink assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2558081Y true CN2558081Y (en) | 2003-06-25 |
Family
ID=33736078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 02271167 Expired - Fee Related CN2558081Y (en) | 2002-06-17 | 2002-06-17 | Heat sink assembly |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2558081Y (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7073568B2 (en) | 2003-12-26 | 2006-07-11 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device |
CN100343611C (en) * | 2003-12-31 | 2007-10-17 | 奇鋐科技股份有限公司 | Structure and fabricating method for radiating module |
CN100444362C (en) * | 2005-10-14 | 2008-12-17 | 富准精密工业(深圳)有限公司 | Radiator |
CN100544568C (en) * | 2006-07-12 | 2009-09-23 | 富准精密工业(深圳)有限公司 | Heat abstractor |
CN103165548A (en) * | 2011-12-14 | 2013-06-19 | 鸿富锦精密工业(深圳)有限公司 | Radiator |
CN103629851A (en) * | 2013-12-04 | 2014-03-12 | 中国科学院光电技术研究所 | Air-cooling and liquid-cooling dual-purpose radiator |
CN105992496A (en) * | 2015-02-12 | 2016-10-05 | 谷静 | Radiator |
CN106224918A (en) * | 2016-09-07 | 2016-12-14 | 佛山市飞成金属制品有限公司 | A kind of uniform-temperature plate heat dissipating device |
-
2002
- 2002-06-17 CN CN 02271167 patent/CN2558081Y/en not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7073568B2 (en) | 2003-12-26 | 2006-07-11 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device |
CN100343611C (en) * | 2003-12-31 | 2007-10-17 | 奇鋐科技股份有限公司 | Structure and fabricating method for radiating module |
CN100444362C (en) * | 2005-10-14 | 2008-12-17 | 富准精密工业(深圳)有限公司 | Radiator |
CN100544568C (en) * | 2006-07-12 | 2009-09-23 | 富准精密工业(深圳)有限公司 | Heat abstractor |
CN103165548A (en) * | 2011-12-14 | 2013-06-19 | 鸿富锦精密工业(深圳)有限公司 | Radiator |
CN103629851A (en) * | 2013-12-04 | 2014-03-12 | 中国科学院光电技术研究所 | Air-cooling and liquid-cooling dual-purpose radiator |
CN105992496A (en) * | 2015-02-12 | 2016-10-05 | 谷静 | Radiator |
CN106224918A (en) * | 2016-09-07 | 2016-12-14 | 佛山市飞成金属制品有限公司 | A kind of uniform-temperature plate heat dissipating device |
CN106224918B (en) * | 2016-09-07 | 2024-05-14 | 佛山市飞成金属制品有限公司 | Heat dissipation device for temperature equalization plate |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100517665C (en) | Heat-pipe radiating apparatus | |
CN2736925Y (en) | Heat sink | |
CN100343985C (en) | Heat dissipating device | |
CN101193531B (en) | Heat radiator | |
CN100562230C (en) | Heat-pipe radiating apparatus | |
JP2001102509A (en) | Heat sink device | |
CN2558081Y (en) | Heat sink assembly | |
CN101861082A (en) | Heat radiating device | |
WO2023010836A1 (en) | Heat dissipation module and electronic device | |
CN2681342Y (en) | Heat sink using heat pipe | |
CN101203120A (en) | Heat radiating device | |
CN1842265B (en) | Heat pipe radiator | |
CN100584170C (en) | Radiating device | |
CN101078949B (en) | Radiator | |
US20050045313A1 (en) | Heat sink | |
CN204786272U (en) | Adopt radiating high -power LED lamps and lanterns radiator of liquid metal | |
CN101754654A (en) | Heat transfer substrate and heat dissipation device provided with same | |
CN101420834B (en) | Heat Radiation device | |
CN200959709Y (en) | Capillary microchannel phase-variable heat-combined cooler of single-phase microchannel convection | |
CN114641188A (en) | Built-in temperature-uniforming plate with heat radiation structure | |
CN101155495B (en) | Micro-channel single phase convection and capillary groove phase inversion heat combined cooling method and device | |
CN210042684U (en) | Rack that heat dissipation is good | |
CN2494038Y (en) | Heat-tube heat sink assembly | |
CN2548395Y (en) | Radiating fin structure improvement | |
CN2535841Y (en) | Computer radiator |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20030625 |