CN106224918B - Heat dissipation device for temperature equalization plate - Google Patents
Heat dissipation device for temperature equalization plate Download PDFInfo
- Publication number
- CN106224918B CN106224918B CN201610807724.6A CN201610807724A CN106224918B CN 106224918 B CN106224918 B CN 106224918B CN 201610807724 A CN201610807724 A CN 201610807724A CN 106224918 B CN106224918 B CN 106224918B
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- China
- Prior art keywords
- heat
- heat dissipation
- temperature
- conductor
- heat conductor
- Prior art date
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 36
- 239000004020 conductor Substances 0.000 claims abstract description 54
- 229910052751 metal Inorganic materials 0.000 claims abstract description 51
- 239000002184 metal Substances 0.000 claims abstract description 51
- 230000005855 radiation Effects 0.000 claims abstract description 18
- 238000001816 cooling Methods 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 6
- 230000011664 signaling Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 description 6
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a heat dissipation device of a temperature equalization plate, which comprises a first temperature equalization plate, a heat dissipation assembly, a shell, a heat dissipation fan and a power supply, wherein the heat dissipation assembly is arranged on the first temperature equalization plate; the first metal heat conductor and the metal heat conducting net are connected to form a first accommodating space, and the first sintered capillary tissue is fixed in the first accommodating space; the outer surface of the first metal heat conductor is provided with a heating body; the heat radiation component comprises a heat conductor and heat radiation fins, the heat conductor is fixed on the outer surface of the metal heat conduction net, and the heat radiation fins are fixed on the heat conductor; the first temperature equalizing plate, the heat radiating assembly and the power supply are all arranged in the shell, and the shell is provided with a mounting hole and a heat radiating hole; the cooling fan is installed on the mounting hole and is electrically connected with the power supply. According to the invention, the heat emitted by the heating body is subjected to two-dimensional uniform heat dissipation through the first temperature equalizing plate, the residual heat is conducted to the heat dissipation assembly, the heat is further dissipated by the heat dissipation assembly, the heat after passing through the heat dissipation assembly is dissipated through the heat dissipation fan, and the heat is discharged to the outside through the heat dissipation hole, so that a good heat dissipation effect is realized.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a heat dissipation device of a temperature equalization plate.
Background
Currently, industrial lamps, such as spot lamps, often employ LEDs as light sources. The LED is popular to the public because of high light efficiency, small light attenuation, long service life and environmental protection. The research strength is increased in various industries, so that the high-power LED technology and technique are developed rapidly.
However, high-power LED lighting also has a bottleneck that the material luminous efficiency is insufficient and the heat dissipation technology cannot break through, so that the service life of the LED lighting is affected. At present, heat pipes are adopted for heat conduction to realize heat dissipation in many heat dissipation technologies, but the heat pipes belong to one-dimensional linear heat conduction, and the heat dissipation effect is not ideal in front of high-power LEDs or other high-power devices. And other heat dissipation devices adopting the results of heat conduction lamp covers and the like have common effects.
Disclosure of Invention
The invention aims to provide a heat dissipation device for a temperature equalization plate, which can realize rapid and uniform heat dissipation for a heating element.
In order to achieve the above purpose, the invention adopts the following technical scheme:
A heat dissipating device of a temperature equalizing plate comprises a first temperature equalizing plate, a heat dissipating component, a shell, a heat dissipating fan and a power supply; the first temperature equalizing plate comprises a first metal heat conductor, a metal heat conducting net and a first sintering capillary tissue, wherein the first metal heat conductor and the metal heat conducting net are connected to form a first accommodating space, and the first sintering capillary tissue is fixed in the first accommodating space; the outer surface of the first metal heat conductor is provided with a heating body; the heat radiation component comprises a heat conductor and heat radiation fins, the heat conductor is fixed on the outer surface of the metal heat conduction net, and the heat radiation fins are fixed on the heat conductor; the first temperature equalizing plate, the heat radiating assembly and the power supply are all arranged in the shell, the shell is provided with a mounting hole and a plurality of heat radiating holes, and the mounting hole and the heat radiating holes are all positioned above the heat radiating fins; the cooling fan is installed on the mounting hole and is electrically connected with the power supply.
Preferably, the solar cell module further comprises a second temperature equalizing plate, wherein the second temperature equalizing plate comprises a second metal heat conductor, a second sintered capillary tissue and a third metal heat conductor, the second metal heat conductor and the third metal heat conductor are connected to form a second accommodating space, and the second sintered capillary tissue is fixed in the second accommodating space; the second metal heat conductor is fixed on the outer surface of the metal heat conducting net, and the heat conductor is fixed on the third metal heat conductor.
Preferably, the second sintered capillary structure is a copper-aluminum sintered structure.
Preferably, the shell is internally provided with a temperature sensor and a singlechip, the power supply, the temperature sensor and the cooling fan are all connected with the singlechip, the temperature sensor is used for detecting the temperature in the shell and sending a temperature signal to the singlechip, and the singlechip is used for controlling the cooling fan to be started when judging that the temperature in the shell is higher than a preset value according to the temperature signal and controlling the working voltage of the cooling fan according to the temperature signal.
Preferably, the first sintered capillary structure is a copper-aluminum sintered structure.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the heat emitted by the heating body is subjected to two-dimensional uniform heat dissipation through the first temperature equalizing plate, after the heat is dissipated through the first temperature equalizing plate, the rest heat is conducted to the heat dissipation assembly, the heat is further dissipated through the heat dissipation assembly, the heat after passing through the heat dissipation assembly is dissipated through the heat dissipation fan, and the heat is discharged to the outside through the heat dissipation hole, so that a good heat dissipation effect is realized.
Drawings
Fig. 1 is an assembly schematic diagram of a heat dissipating device with a temperature equalization plate according to an embodiment of the invention.
Fig. 2 is a split schematic diagram of a heat dissipation structure of a temperature equalization plate according to a first embodiment of the present invention;
Fig. 3 is a split schematic diagram of a heat dissipating device with a temperature equalization plate according to a second embodiment of the present invention.
Wherein, 1, the shell; 11. a mounting hole; 2. a first temperature equalizing plate; 21. a first metal heat conductor; 22. a metal heat conducting net; 23. a first sintered capillary structure; 3. a heat dissipation assembly; 31. a heat conductor; 32. a heat radiation fin; 4. a heat radiation fan; 5. a second temperature equalizing plate; 51. a second metal heat conductor; 52. a third metal heat conductor; 53. and sintering the capillary tissue.
Detailed Description
The invention will be further described with reference to the accompanying drawings and detailed description below:
Embodiment one:
Referring to fig. 1 and 2, the present invention provides a heat dissipating device of a temperature equalizing plate, which includes a first temperature equalizing plate 2, a heat dissipating assembly 3, a housing 1, a heat dissipating fan 4, and a power source (not shown). Wherein, first samming board 2, radiator unit 3 and power are all installed inside shell 1. The heat radiation fan 4 is mounted on the housing 1.
Specifically, the first temperature equalizing plate 2 includes a first metal heat conductor 21, a metal heat conducting net 22, and a first sintered capillary tissue 23, where the first metal heat conductor 21 and the metal heat conducting net 22 are connected to form a first accommodating space, and the first sintered capillary tissue 23 is fixed in the first accommodating space; the outer surface of the first metal heat conductor 21 is provided with a heating element. The heat dissipation principle of the first temperature equalization plate 2 is gas-liquid circulation, the first accommodating space is a vacuum cavity, liquid at the bottom of the vacuum cavity is quickly evaporated into gas after receiving heat dissipated by the heating body, the gas rises to be in contact with the metal heat conducting net 22, the metal heat conducting net 22 is a condensation end of the first temperature equalization plate 2 relative to the first metal heat conducting body 21, the gas is cooled into liquid after condensation of the condensation end, and the liquid flows back to the bottom through the first sintering capillary tissue 23. Of course, since the condensing end is provided with a net structure, part of the gas moves upwards through the mesh to contact with other parts and then becomes liquid reflux.
The heat radiation component 3 comprises a heat conductor 31 and heat radiation fins 32, wherein the heat conductor is fixed on the outer surface of the metal heat conduction net 22, and the heat radiation fins 32 are fixed on the heat conductor 31; the first temperature equalizing plate 2, the heat radiating assembly 3 and the power supply are all arranged in the shell 1, the shell 1 is provided with a mounting hole 11 and a plurality of heat radiating holes, the mounting hole 11 and the heat radiating holes are all positioned above the heat radiating fins 32, and the heat radiating holes are preferentially arranged at the positions opposite to the mounting hole 11; the cooling fan 4 is mounted on the mounting hole 11, and the cooling fan 4 is electrically connected with the power supply.
The gas which continuously rises through the meshes rises to the bottom surface of the heat conductor, heat is transferred to the heat conductor 31, precooling is changed into liquid, the heat conductor 31 transfers and disperses the heat through the heat radiation fins 32, and finally, the heat is further radiated through the heat radiation fan 4, so that a good heat radiation function is realized.
The first sintered capillary structure 23 of the present embodiment is a copper-aluminum sintered structure. The first metal heat conductor 21 is a copper heat conductor or an aluminum heat conductor.
Further, a temperature sensor (not shown) and a single chip microcomputer (not shown) are further arranged in the shell 1, the power supply, the temperature sensor and the cooling fan 4 are all connected with the single chip microcomputer, the temperature sensor is used for detecting the temperature in the shell 1 and sending a temperature signal to the single chip microcomputer, and the single chip microcomputer is used for controlling the cooling fan 4 to be started when judging that the temperature in the shell 1 is higher than a preset value according to the temperature signal and controlling the working voltage of the cooling fan 4 according to the temperature signal.
The temperature condition in the shell 1 can be detected in real time through the temperature sensor, so that the singlechip controls the opening or closing of the cooling fan 4 according to different temperatures, and simultaneously controls the power of the cooling fan 4 to save power consumption and effectively dissipate heat.
Embodiment two:
Referring to fig. 3, the difference between the present embodiment and the first embodiment is that the present embodiment further includes a second temperature equalizing plate 5, and the second temperature equalizing plate 5 includes a second metal heat conductor 51, a second sintered capillary tissue 53, and a third metal heat conductor 52, where the second metal heat conductor 51 and the third metal heat conductor 52 are connected to form a second accommodating space, and the second sintered capillary tissue 53 is fixed in the second accommodating space; the second metal heat conductor 51 is fixed to the outer surface of the wound metal heat conducting net 22, and the heat conductor is fixed to the third metal heat conductor 52.
Through the setting of second samming board 5, can further dispel the heat to the heat that does not get rid of at first samming board 2 can accomplish the hot and cold circulation basically after the heat dissipation of second samming board 5, better saving radiator fan 4's consumption.
Correspondingly, the second sintered capillary structure 53 is also a copper-aluminum sintered structure.
It will be apparent to those skilled in the art from this disclosure that various other changes and modifications can be made which are within the scope of the invention as defined in the appended claims.
Claims (2)
1. The heat dissipation device of the temperature equalization plate is characterized by comprising a first temperature equalization plate, a heat dissipation assembly, a shell, a heat dissipation fan and a power supply; the first temperature equalizing plate comprises a first metal heat conductor, a metal heat conducting net and a first sintering capillary structure, wherein the first metal heat conductor and the metal heat conducting net are connected to form a first accommodating space, and the first sintering capillary structure is fixed in the first accommodating space; the outer surface of the first metal heat conductor is provided with a heating body; the heat radiation component comprises a heat conductor and heat radiation fins, the heat conductor is fixed on the outer surface of the metal heat conduction net, and the heat radiation fins are fixed on the heat conductor; the first temperature equalizing plate, the heat radiating assembly and the power supply are all arranged in the shell, the shell is provided with a mounting hole and a plurality of heat radiating holes, and the mounting hole and the heat radiating holes are all positioned above the heat radiating fins; the cooling fan is arranged on the mounting hole and is electrically connected with the power supply;
The second temperature equalizing plate comprises a second metal heat conductor, a second sintered capillary tissue and a third metal heat conductor, wherein the second metal heat conductor and the third metal heat conductor are connected to form a second accommodating space, and the second sintered capillary tissue is fixed in the second accommodating space; the second metal heat conductor is fixed on the outer surface of the metal heat conducting net, and the heat conductor is fixed on the third metal heat conductor;
The temperature sensor is used for detecting the temperature in the shell and sending a temperature signal to the singlechip, and the singlechip is used for controlling the start of the cooling fan when the temperature in the shell is judged to be higher than a preset value according to the temperature signal and controlling the working voltage of the cooling fan according to the temperature signal;
the first sintered capillary structure is a copper-aluminum sintered structure.
2. The cold plate heat sink of claim 1, wherein the second sintered capillary structure is a copper aluminum sintered structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610807724.6A CN106224918B (en) | 2016-09-07 | 2016-09-07 | Heat dissipation device for temperature equalization plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610807724.6A CN106224918B (en) | 2016-09-07 | 2016-09-07 | Heat dissipation device for temperature equalization plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106224918A CN106224918A (en) | 2016-12-14 |
| CN106224918B true CN106224918B (en) | 2024-05-14 |
Family
ID=58075251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610807724.6A Active CN106224918B (en) | 2016-09-07 | 2016-09-07 | Heat dissipation device for temperature equalization plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106224918B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2558081Y (en) * | 2002-06-17 | 2003-06-25 | 鸿富锦精密工业（深圳）有限公司 | Heat sink assembly |
| CN2762347Y (en) * | 2004-12-22 | 2006-03-01 | 珍通科技股份有限公司 | Temp. equalization plate |
| CN201563335U (en) * | 2009-11-27 | 2010-08-25 | 唯耀科技股份有限公司 | Uniform-temperature plate heat dissipating device |
| CN202797089U (en) * | 2012-01-14 | 2013-03-13 | 诸建平 | Novel heat tube type LED (light emitting diode) radiating device |
| CN202884731U (en) * | 2012-11-15 | 2013-04-17 | 深圳市德力普光电有限公司 | Active cooling LED (light-emitting diode) high shed lamp |
| CN104181949A (en) * | 2014-09-02 | 2014-12-03 | 航天长峰朝阳电源有限公司 | Intelligent power cooling device |
| CN206018544U (en) * | 2016-09-07 | 2017-03-15 | 佛山市飞成金属制品有限公司 | A kind of uniform-temperature plate heat dissipating device |
| CN207983926U (en) * | 2018-03-06 | 2018-10-19 | 新郑市益群塑料制品有限公司 | A kind of circulating cooling system for injection-moulding device |
-
2016
- 2016-09-07 CN CN201610807724.6A patent/CN106224918B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2558081Y (en) * | 2002-06-17 | 2003-06-25 | 鸿富锦精密工业（深圳）有限公司 | Heat sink assembly |
| CN2762347Y (en) * | 2004-12-22 | 2006-03-01 | 珍通科技股份有限公司 | Temp. equalization plate |
| CN201563335U (en) * | 2009-11-27 | 2010-08-25 | 唯耀科技股份有限公司 | Uniform-temperature plate heat dissipating device |
| CN202797089U (en) * | 2012-01-14 | 2013-03-13 | 诸建平 | Novel heat tube type LED (light emitting diode) radiating device |
| CN202884731U (en) * | 2012-11-15 | 2013-04-17 | 深圳市德力普光电有限公司 | Active cooling LED (light-emitting diode) high shed lamp |
| CN104181949A (en) * | 2014-09-02 | 2014-12-03 | 航天长峰朝阳电源有限公司 | Intelligent power cooling device |
| CN206018544U (en) * | 2016-09-07 | 2017-03-15 | 佛山市飞成金属制品有限公司 | A kind of uniform-temperature plate heat dissipating device |
| CN207983926U (en) * | 2018-03-06 | 2018-10-19 | 新郑市益群塑料制品有限公司 | A kind of circulating cooling system for injection-moulding device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106224918A (en) | 2016-12-14 |
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