CN2552213Y - Packaging structure for optical assembly - Google Patents

Abstract

The utility model provides a packaging structure for optical components. The utility model is applicable for the surface sticking technology, and includes an installation structure and a cover body. The installation structure includes a fundus with an upper surface and a lower surface, and a plurality of welding pads. The fundus is made of the ceramic material by a low temperature co-fired technique, the welding pads are arranged on the upper and the lower surfaces of the fundus, and the welding pads on the upper and the lower surfaces of the fundus are electrically connected through the fundus. A semi-conductor optical device is arranged on the top of the fundus, the semi-conductor optical device is electrically connected with the welding pads on the upper surface of the fundus through a wire, and then the electrical connection of the semi-conductor optical device and the welding pads on the lower surface is realized. The cover body includes a cavity part, and a photoconductive connecting part communicating with the cavity part. The cavity part is matched with the upper surface of the fundus and contained in the fundus partially; so that the semi-conductor optical device is sealed and protected, and the signal light can be transmitted outwards or the signal light transmitted from outside can be received.

Description

The encapsulating structure of optical module

[technical field]

The utility model is the encapsulating structure about a kind of optical module, especially a kind of encapsulating structure that is applicable to the optical module of high-density packages and high-frequency operation.

[background technology]

Along with the progress of society and the continuous development of science and technology, the semiconductor laser as the electro-optical signal conversion is widely used in and obtains, transmits and store message, and it generally includes a laser diode and a light detects diode.Finish these practical applications, also need some necessary circuit such as drive circuit, control circuit and some auxiliary circuits, reach some particular utility, also need other particular electrical circuit support, and development along with circuit integration, many circuit are integrated on the substrate, promptly usually said PCB circuit board; Because it is all relatively more fragile that laser diode and light detect diode, the extraneous mechanical shock and the influence of humidity all can make its unstable properties.Be protection laser diode and light detection diode; usually need laser diode and light detection diode are encapsulated; this reaches the problem that electrically communicates with regard to existing the semiconductor laser and the external circuitry that how to make after the encapsulation, and the problem that adopts what kind of semiconductor laser encapsulating structure just can better match with the external circuitry plate.

Please refer to Fig. 1; United States Patent (USP) the 5th; 812; disclose an individual laser package structure No. 582; it comprises the jar shape encapsulation 50 of a laser module 60 and an encapsulation laser module 60; this jar shape encapsulation 50 comprises a base 51 and a seal cover 52, and this base 51 and seal cover 52 cooperate formation one confined space in order to protection laser module 60.Base 51 is to be made of metal, and is generally in the form of annular discs, and it provides an installation surface so that laser module 60 to be installed.This base 51 further offers a plurality of through holes 53 and has a plurality of pins 54, these a plurality of pins 54 are interspersed in these a plurality of through holes 53 and fill gap therebetween and realize being electrically insulated by glass capsulation, connect laser modules 60 and a plurality of pins 54 to realize electrically connecting with external circuit by lead 61.

Sealing lid 52 further is provided with a glass window 521,60 emitted laser of laser module can be transferred to photoconduction or other optics by this window 521.

This individual laser package structure can realize fixing protection, sealing and the function that electrically connects substantially; but; it is by the electric connection of a plurality of pins realization laser modules and external circuit, and its pin and lead are all longer, can parasitic, derive stronger inductance and electric capacity in high-frequency operation.In present these epoch to the speed high request, frequency of operation requires more and more higher, and the parasitism of generation, derive inductance and electric capacity become big so that influences the service behaviour of laser aid.Secondly, along with integrated circuit under high density, small size development trend, encapsulation technology is to the also corresponding improve of the requirement of integrated level and littleization of volume, when the individual laser package integrated level higher, when needing to realize that plurality purpose intraware and external circuit electrically connect, the prior art just must increase number of pins, and it can further increase the volume of individual laser package.And pin too secret meeting increases parasitic, derive inductance and electric capacity, also occurs short circuit phenomenon in the operation easily.In addition, this individual laser package structure packing is also inconvenient.

[utility model content]

The purpose of this utility model is to provide a kind of encapsulating structure of optical module, and it is suitable for high-density packages and high-frequency operation, can effectively overcome short circuit.

The purpose of this utility model is achieved in that the encapsulating structure that a kind of optical module is provided, and comprises a mounting structure and a cover body.This mounting structure comprises substrate and a plurality of weld pad on the upper and lower surface of a tool, its upper and lower surface is provided with these a plurality of weld pads, and electrically connect, base upper portion is laid semiconductor optical device, by the weld pad of electric lead electric connection semiconductor optical device and upper surface, electrically connect with a plurality of weld pads of realizing semiconductor optical device and lower surface.This cover body comprises that a chamber portion is connected the end with the photoconduction that connects with it, and this chamber portion matches with the upper surface of this substrate, with this semiconductor optical device of seal protection, and can realize outside transmission signal light or receive the extraneous signal light that imports into.

Compared with prior art, the utlity model has following advantage: connect in the encapsulating structure of the utility model optical module adopts and replace traditional pin, be suitable for high-frequency operation and can be not parasitic, derive stronger inductance and electric capacity so that influence the service behaviour of laser aid, can effectively overcome short circuit, and the more convenient packing of product.

[description of drawings]

Fig. 1 is the profile of existing individual laser package structure.

Fig. 2 is the stereogram of the encapsulating structure of the utility model optical module.

Fig. 3 is the exploded view of the encapsulating structure of Fig. 2 optical module.

Fig. 4 is the mounting structure perspective view of the encapsulating structure of the utility model optical module.

[embodiment]

Please refer to Fig. 2 and Fig. 3, is the stereogram and the decomposition view of the encapsulating structure of the utility model optical module.The encapsulating structure 10 of optical module of the present utility model comprises a mounting structure 20 and a cover body 30.Please be simultaneously with reference to Fig. 4, this mounting structure 20 comprises a plurality of weld pads 21 (shown in the present embodiment 8) and a substrate 40.This substrate 40 is to be made by low temperature co-fired (LTCC) technology by ceramic material, promptly need circuit or device with electric conducting material printshop on a plurality of thin layers of ceramic, carry out through hole by numerical control drilling machine or laser, carry out the through hole printing again, the thin layers of ceramic that prints repeatedly under pressurization low temperature sintering form as one, thereby realize interconnection between each thin layers of ceramic.This electric conducting material can be copper or aluminium, also can be the golden or silver-colored of high conductivity, and this ceramic material can adopt aluminium nitride, aluminium oxide, the price of two kinds of ceramic materials is all lower, but the relative aluminium oxide of the conductive coefficient of aluminium nitride is higher, and thermal diffusivity is preferable, so the substrate in the present embodiment 40 adopts aluminium nitride materials to make, and it comprises fixing seat 41 and bottom 42.This fixing seat 41 has a plurality of through holes 411 (shown in the figure 4), and be printed with electric conducting material in this through hole 411, this fixing seat 41 roughly becomes discoid, wherein an installation surface 412 (upper surface of substrate 40) is in order to install semiconductor optical device such as laser aid or optical detection device (figure does not show), to produce signal light or to receive signal light.Bottom 42 is a square shape, have a upper surface and a lower surface, it comprises first bottom 421 and second bottom 422, this first bottom 421 and second bottom 422 have first surface 4211 respectively, 4221 and second surface 4212,4222 (the upper surfaces of first surface 4221 these bottoms 42 of formation of second bottom 422, the second surface 4212 of first bottom 421 forms the lower surface of this substrate 40), in addition, this two bottom 421,422 all have a plurality of through holes 4213,4223, be printed with electric conducting material in these a plurality of through holes 4213 and in 4223, the through hole 411 of relative fixing seat 41, print many electric leads 45 ' and 45 respectively at the first surface 4211 of first bottom 421 and the first surface 4221 of second bottom 422, form a cloth wire frame, each electric lead all has two ends, an end of the electric lead 45 of second bottom, the 422 first surfaces 4221 printing conductive material in the through hole 411 of correspondence and electrical communication fixing seat 41 respectively wherein, the other end are the printing conductive materials that is communicated with in the through hole 4223 of this second bottom 422; Second surface 4222 pressing mutually of the first surface 4211 of first bottom 421 and second bottom 422, and an end of its electric lead 45 ' and the through hole 4223 of second bottom 422 aligns and with its inner printing conductive material electrical communication, the other end forms a line along an edge of first bottom 421, and be connected with the printing conductive material in the through hole 4213 of first bottom 421, wherein there are two through holes 4213 to be positioned at the two ends Jiao Chu at this edge, the steadiness when being connected with the external circuitry plate to strengthen.

A plurality of weld pads 21, make (shown in the present embodiment 8) by electric conducting material such as tin, aim at the through hole 411,4213 of the upper surface of this base low 40 and lower surface respectively and fix, by base low 40 electrically in connect, and reach the weld pad 21 pad property connections on its upper and lower surface.The weld pad 21 of substrate 40 lower surfaces and external circuitry plate (figure does not show) upward corresponding pad are connected and form electric connection.

By electric lead (figure do not show) semiconductor optical device is electrically connected to the weld pad 21 of substrate 40 upper surfaces, connects in the pad by weld pad 21 and substrate 40 and reach electrically conducting of semiconductor optical device and external circuitry plate.

This cover body 30 and mounting structure 20 are sealed and matched, to seal and to protect this semiconductor optical device.This cover body 30 comprises lens subassembly 31, package 32 and housing 33, and this package 32 is that a metal material is made, and roughly becomes a jar shape, and an opening 321 is arranged at its top; This lens subassembly 31 comprises an annulus retaining piece 312 and is immobilizated in the lens 311 at its center; be affixed on the top of package 32 in this lens subassembly 31; and lens 311 and opening 321 are aimed at and are sealed and matched; signal light is collimated and converges; this package 32 and mounting structure 20 match, and it is located in the substrate 40, are sealed and matched with bottom 42 upper surfaces; the confined space of fixing seat 41 is held in formation one fully, with this semiconductor optical device of complete seal protection.This housing 33, a chamber portion 331 that tool one can hold this package 32 fully and an end 332 that is connected with photoconduction (as optical fiber) that this chamber portion 331 connects are so that the portions of light that semiconductor optical device is launched transfers out this encapsulating structure to extraneous photoconduction or receive the external signal light that imports into through lens 311 collimations, after focusing on.

During encapsulation, semiconductor optical device is placed on substrate 40 upper surfaces, with the weld pad 21 on electric lead electric connection semiconductor optical device and substrate 40 upper surfaces, the package 32 that will have lens subassembly 31 subsequently covers at substrate 40 and closely cooperates with bottom 42 upper surfaces, fix this package 32 with viscose glue then, at last chamber portion 331 covers of housing 33 are held this package 32, and be fixed on bottom 42 upper surfaces, so can finish the encapsulation of the optical module of a suitable surface adhering technology.During application, the weld pad 21 of substrate 40 lower surfaces and circuit board are electrically connected packaged optical module.

Be appreciated that ground, can only substitute first bottom 421 and second bottom 422 with a bottom.Certainly, the bottom of the encapsulating structure of the utility model optical module also can be made of the multi-layer ceramics film, the electric lead of printing and through hole can be distributed in this multi-layer ceramics and connect in realizing electrically, and it also can be integrated in other assembly that originally was distributed in the external circuitry plate between this multi-layer ceramics film.

Claims (10)

1. the encapsulating structure of an optical module, it comprises a mounting structure and a cover body, this mounting structure comprises that one has the substrate on upper and lower surface, this upper surface is placed with semiconductor optical device, this cover body comprises a chamber portion that is sealed and matched with mounting structure and is connected the end with photoconduction that chamber portion connects, it is characterized in that this mounting structure further comprises a plurality of weld pads, these a plurality of weld pads are placed in the upper and lower surface of this substrate and electrically communicate, and place the weld pad of lower surface to be positioned at an edge of this substrate.

2. the encapsulating structure of optical module as claimed in claim 1 is characterized in that this semiconductor optical device electrically connects by electric lead and weld pad.

3. the encapsulating structure of optical module as claimed in claim 1, it is characterized in that this substrate is to be made by low temperature heat conduction ceramic material, it comprises fixing seat and bottom, and this bottom has a upper surface and a lower surface, this fixing seat be placed in upper surface and with the bottom pressing.

4. the encapsulating structure of optical module as claimed in claim 1 is characterized in that this semiconductor optical device is a laser aid or an optical detection device.

5. the encapsulating structure of optical module as claimed in claim 1 is characterized in that this substrate has printing electric lead and a plurality of through hole of many Gen Neilian.

6. the encapsulating structure of optical module as claimed in claim 5 is characterized in that being printed with electric conducting material in these a plurality of through holes, and it is reached electrically by these many electric leads and communicates.

7. the encapsulating structure of optical module as claimed in claim 6 is characterized in that these a plurality of through holes and the electrical intercommunication of these a plurality of weld pads.

8. the encapsulating structure of optical module as claimed in claim 1 is characterized in that this cover body comprises an open-topped package of a tool and a lens subassembly.

9. the encapsulating structure of optical module as claimed in claim 8 is characterized in that being attached in this lens subassembly the top of this package, and it comprises lens, and this opening of this lens alignment.

10. the encapsulating structure of optical module as claimed in claim 8 is characterized in that this lens subassembly further comprises the annulus retaining piece of these lens of fixing.

Images