CN2510996Y - High-speed heat-conducting device with liquid-gas change-over - Google Patents

High-speed heat-conducting device with liquid-gas change-over Download PDF

Info

Publication number
CN2510996Y
CN2510996Y CN 01266118 CN01266118U CN2510996Y CN 2510996 Y CN2510996 Y CN 2510996Y CN 01266118 CN01266118 CN 01266118 CN 01266118 U CN01266118 U CN 01266118U CN 2510996 Y CN2510996 Y CN 2510996Y
Authority
CN
China
Prior art keywords
inner concave
high speed
transfer device
gas phase
speed heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 01266118
Other languages
Chinese (zh)
Inventor
王天来
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HUAFU SCIENCE-TECHNOLOGY Co Ltd
Original Assignee
HUAFU SCIENCE-TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HUAFU SCIENCE-TECHNOLOGY Co Ltd filed Critical HUAFU SCIENCE-TECHNOLOGY Co Ltd
Priority to CN 01266118 priority Critical patent/CN2510996Y/en
Application granted granted Critical
Publication of CN2510996Y publication Critical patent/CN2510996Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Abstract

The utility model discloses a high-speed heat conduction device with gas-liquid conversion, which is proposed for providing a computer component which can effectively improve heat dissipation efficiency, the utility model includes an upper plate, a lower plate, and a fan combined on the outer surface of the upper plate; the upper and the lower plates which are integrally formed by heat conduction materials using die forms compact combination condition; the corresponding surfaces of the upper and the lower plates are concavely arranged to be the internal concave of a closed hollow inner chamber, the internal concave is provided with the capillary structure of a capillary groove; the inner chamber can be filled with action liquid through the capillary groove, and the vacuumized filling hole is connected with the external; the outer surface of the upper plate is provided with a plurality of heat dissipation rectangular fins.

Description

The high speed heat-transfer device of tool liquid gas phase conversion
Technical field
The utility model belongs to machine element, particularly a kind of high speed heat-transfer device of tool liquid gas phase conversion.
Background technology
The frequency of computer cpu (CPU) is higher, the heat that is produced during its running is relatively higher, and the rising of temperature, the electronic building brick sensitivity of computer is reduced even influence its useful life, therefore, how to promote the usefulness of heat abstractor, then become the problem of a research with the normal operation of keeping CPU.
Cooling measure to CPU is too numerous to enumerate, haply having the heating panel of parallel fin, or cooperates setting with fan, can promote in the hope of the effect that makes heat radiation.
As shown in figure 13, the hot plate radiator of commonly using 60 is the top that places CPU thermal source 70, and collocation has a fan 80, to improve heat-sinking capability.This known radiator 60 is to be made by pressing method with heat-conducting, and its upper surface is formed with the radiating fin 62 of plurality of parallel to increase its area of dissipation.
Yet, the operating frequency of the CPU of a new generation has reached more than the G Hz, Pentium 4 processors as Intel (Intel) company new listing, the heat that is produced during its running far surpasses various processor in the past, so only applying in conjunction with the radiating mode of radiator 60 structures of fan 80 of commonly using used, in addition improved necessity is arranged in fact.
Summary of the invention
The purpose of this utility model provides a kind of high speed heat-transfer device of tool liquid gas phase conversion of effective raising radiating efficiency.
The utility model comprises upper plate, lower plate and is assembled in the fan of upper plate outer surface; Utilize mould to be intimate-association state with the integrated upper and lower plate of heat-conducting; Upper and lower plate apparent surface is arranged with the inner concave that constitutes airtight hollow interior chamber, is provided with capillary structure into capillary groove in inner concave; Inner room is filled action liquid and evacuated pack hole is in communication with the outside to use in it; The upper plate outer surface is provided with a plurality of radiating fins.
Wherein:
Being arranged at a plurality of radiating fins of upper plate outer surface is and is arranged in parallel.
Being arranged on the upper and lower plate inner concave capillary groove that constitutes capillary structure is and is arranged in parallel.
Be arranged at a plurality of radiating fins of upper plate outer surface and be radial arrangement.
Two diagonal of upper and lower plate inner concave separate into inner concave four above inner concave zones respectively; The inner concave zone is the isosceles triangle zone on base for outer ledge, forms a plurality of capillary structures perpendicular to inner concave zone outer ledge capillary groove respectively in each inner concave zone.
The cross section of capillary groove is rectangular.
The cross section of capillary groove is trapezoidal.
The cross section of capillary groove is triangular in shape.
Pack hole is arranged at the lower plate outer surface.
Pack hole is arranged at the upper plate outer surface.
Because the utility model comprises upper plate, lower plate and is assembled in the fan of upper plate outer surface; Utilize mould to be intimate-association state with the integrated upper and lower plate of heat-conducting; Upper and lower plate apparent surface is arranged with the inner concave that constitutes airtight hollow interior chamber, is provided with capillary structure into capillary groove in inner concave; Inner room is filled action liquid and evacuated pack hole is in communication with the outside to use in it; The upper plate outer surface is provided with a plurality of radiating fins.During use, the utility model is directly placed the top of CPU thermal source with its lower plate, when producing heat when the CPU running, heat can be sent to the utility model up according to the direction of arrow, so that the action liquid of filling in inner room flashes to steam and is full of inner room, owing to be arranged at the air flow heat radiation that upper plate outer surface radiating fin forms by fan, cause its temperature lower, so steam can be replied in the upper plate inner concave and is condensed into liquid state, and the action liquid that condenses can reflux towards thermal source by capillarity system.So, just can cooperate the principle of capillarity, heat energy can be conducted stow away from heat fast by the phase-state change circulation in inner room of action liquid; And by fan, the heat that is produced when CPU is operated follows heat dissipation direction and is able to arrange fast loose.Effectively improve radiating efficiency, thereby reach the purpose of this utility model.
Description of drawings
Fig. 1, be the utility model structural representation stereogram.
Fig. 2, be the utility model decomposition texture schematic isometric.
Fig. 3, be A-A cutaway view among Fig. 2.
Fig. 4, be B portion partial enlarged drawing among Fig. 3 (for rectangle groove capillary structure).
Fig. 5, be B portion partial enlarged drawing among Fig. 3 (for trapezoidal groove capillary structure).
Fig. 6, be B portion partial enlarged drawing among Fig. 3 (for triangular groove capillary structure).
Fig. 7, be the utility model structural representation stereogram (capillary groove perpendicular to inner concave zone outer ledge).
Fig. 8, be the utility model decomposition texture schematic isometric.
Fig. 9, be C-C cutaway view among Fig. 7.
Figure 10, be the upper and lower plate decomposition texture of the utility model schematic isometric (capillary groove perpendicular to inner concave zone outer ledge).
Figure 11, for the utility model structural representation stereogram (pack hole is arranged on the upper plate).
Figure 12, be the utility model action liquid action diagrammatic side view.
Figure 13, heat spreader structures schematic isometric for commonly using.
Embodiment
As Fig. 1, Fig. 2, shown in Figure 3, the high speed heat-transfer device 1 of the utility model tool liquid gas phase conversion comprises upper plate 10, lower plate 20 and fan 40.
Upper and lower plate 10,20 is to utilize mould with heat-conducting, as heat conduction good metal or alloy one semisolid injection molding or die casts such as copper, magnesium, aluminium.Upper and lower plate 10,20 facing surfaces are arranged with the inner concave 12,22 that constitutes airtight hollow interior chamber 30.
As shown in Figure 4, be the capillary structure that forms the square-section capillary groove 120,220 that is arranged in parallel on inner concave 12,22; As shown in Figure 5, be to form the trapezoid cross section capillary groove 120 ' of being arranged in parallel, 220 ' capillary structure on inner concave 12,22; As shown in Figure 6, on inner concave 12,22, be to form the triangular-section capillary groove 120 that is arranged in parallel ", 220 " capillary structure.
Be formed with a plurality of radiating fins 16 that are arranged in parallel that are in upper plate 10 outer surfaces 14.Lower plate 20 outer surfaces 24 are provided with the pack hole 26 that runs through.The making of type method can't be squeezed to commonly use by this structure system.
Upper and lower plate 10,20 is to be assembled with welding, spot welding, ultrasonic waves or other combination modes of sticking to be intimate-association state, to form airtight hollow interior chamber 30.And fill the action liquid and it is evacuated to inner room 30 by the pack hole 26 of lower plate 20 outer surfaces 24; After filling an amount of action liquid in the inner room 30 and being evacuated, be about to pack hole 26 sealings.For the action liquid of filling is to have to meet the liquid that cold reduction characteristic is met in thermal evaporation, as pure water, methyl alcohol, toluene, propyl alcohol or refrigerant etc.Fan 40 is assembled in radiating fin 16 tops that upper plate 10 outer surfaces 14 form.
As Fig. 7, Fig. 8, Fig. 9, shown in Figure 10, the upper plate 10a outer surface 14a of the high speed heat-transfer device 1a of the utility model tool liquid gas phase conversion goes up and forms the radiating fin 16a that is radial arrangement, and in formation of radiating fin 16a central authorities and the corresponding assembling grove 160a of fan 40a, fan 40a is assembled among the assembling grove 160a of radiating fin 16a central authorities.
Respectively inner concave 12a, 22a are separated into four above inner concave zones 121a, 221a on two diagonal of upper and lower plate 10a, 20a inner concave 12a, 22a.Inner concave zone 121a, 221a are that outer ledge is the isosceles triangle zone on base, form a plurality of capillary structures perpendicular to inner concave zone 121a, 221a outer ledge capillary groove 120a, 220a in inner concave zone 121a, 221a.
As shown in figure 11, using to inner room 30 of the high speed heat-transfer device 1b of the utility model tool liquid gas phase conversion filled the outer surface 14b that moves liquid and its evacuated pack hole 15b is arranged at upper plate 10b.
As shown in figure 12, during use, with the utility model with its lower plate 20 (20a, 20b) directly place the top of CPU thermal source 1A, when producing heat when the CPU running, because it is last, lower plate 10,20 (10a, 10b, 20a, be to make 20b) with heat-conducting, heat can be sent to the utility model up according to the direction of arrow, so that the action liquid of filling in the inner room 30 flashes to steam 1B and is full of inner room 30, owing to be arranged at upper plate 10 (10a, 10b) outer surface 14 (14a, 14b) radiating fin 16 dispels the heat by the air flow that fan 30 forms, cause its temperature lower, so steam 1B can be in upper plate 10 (10a, 10b) answer is condensed into liquid state in the inner concave 12, and the action liquid that condenses can reflux towards thermal source 1A by capillarity system.So, just can cooperate the principle of capillarity, heat energy can be conducted stow away from heat 1A fast by the phase-state change circulation in inner room 30 of action liquid; And by fan 40, the heat that is produced when CPU is operated follows heat dissipation direction 1D and is able to arrange fast loose.
Commonly using heat abstractor is that the mat heat exchange pattern is progressively diffused to heat energy radiating fin and arranged diffusing by thermal source, because the existence of diffusion thermal resistance, so not all radiating fin is the energy efficiently radiates heat all, the temperature distribution state of heat abstractor presents inhomogeneously in when running, and radiating efficiency is reduced.The utility model cooperates radiating fin by the phase-state change circulation of action liquid, and temperature distribution state is very even when running, and all radiating fins all can effectively be brought into play heat radiation, and can reach best radiating effect.

Claims (10)

1, a kind of high speed heat-transfer device of tool liquid gas phase conversion, it comprises upper plate, lower plate and is assembled in the fan of upper plate outer surface; It is characterized in that the described mould that utilizes is intimate-association state with the integrated upper and lower plate of heat-conducting; Upper and lower plate apparent surface is arranged with the inner concave that constitutes airtight hollow interior chamber, is provided with capillary structure into capillary groove in inner concave; Inner room is filled action liquid and evacuated pack hole is in communication with the outside to use in it; The upper plate outer surface is provided with a plurality of radiating fins.
2, the high speed heat-transfer device of tool liquid gas phase according to claim 1 conversion is characterized in that the described a plurality of radiating fins of upper plate outer surface that are arranged at are and are arranged in parallel.
3, the high speed heat-transfer device of tool liquid gas phase according to claim 1 conversion is characterized in that the described capillary groove that constitutes capillary structure on the upper and lower plate inner concave that is arranged at is and is arranged in parallel.
4, the high speed heat-transfer device of tool liquid gas phase conversion according to claim 1 is characterized in that the described a plurality of radiating fins of upper plate outer surface that are arranged at are radial arrangement.
5, the high speed heat-transfer device of tool liquid gas phase according to claim 1 conversion is characterized in that respectively inner concave being separated into four above inner concave zones on two diagonal of described upper and lower plate inner concave; The inner concave zone is the isosceles triangle zone on base for outer ledge, forms a plurality of capillary structures perpendicular to inner concave zone outer ledge capillary groove respectively in each inner concave zone.
6, according to the high speed heat-transfer device of claim 3 or 5 described tool liquid gas phase conversions, it is characterized in that the cross section of described capillary groove is rectangular.
7, according to the high speed heat-transfer device of claim 3 or 5 described tool liquid gas phase conversions, it is characterized in that the cross section of described capillary groove is trapezoidal.
8, according to the high speed heat-transfer device of claim 3 or 5 described tool liquid gas phase conversions, it is characterized in that the cross section of described capillary groove is triangular in shape.
9, the high speed heat-transfer device of tool liquid gas phase conversion according to claim 1 is characterized in that described pack hole is arranged at the lower plate outer surface.
10, the high speed heat-transfer device of tool liquid gas phase conversion according to claim 1 is characterized in that described pack hole is arranged at the upper plate outer surface.
CN 01266118 2001-10-24 2001-10-24 High-speed heat-conducting device with liquid-gas change-over Expired - Fee Related CN2510996Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 01266118 CN2510996Y (en) 2001-10-24 2001-10-24 High-speed heat-conducting device with liquid-gas change-over

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 01266118 CN2510996Y (en) 2001-10-24 2001-10-24 High-speed heat-conducting device with liquid-gas change-over

Publications (1)

Publication Number Publication Date
CN2510996Y true CN2510996Y (en) 2002-09-11

Family

ID=33672846

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 01266118 Expired - Fee Related CN2510996Y (en) 2001-10-24 2001-10-24 High-speed heat-conducting device with liquid-gas change-over

Country Status (1)

Country Link
CN (1) CN2510996Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104684357A (en) * 2015-01-15 2015-06-03 山东超越数控电子有限公司 Novel radiator
CN107820378A (en) * 2017-11-10 2018-03-20 河南森源电气股份有限公司 Heat abstractor and photovoltaic DC-to-AC converter for power model in photovoltaic DC-to-AC converter

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104684357A (en) * 2015-01-15 2015-06-03 山东超越数控电子有限公司 Novel radiator
CN107820378A (en) * 2017-11-10 2018-03-20 河南森源电气股份有限公司 Heat abstractor and photovoltaic DC-to-AC converter for power model in photovoltaic DC-to-AC converter

Similar Documents

Publication Publication Date Title
CN1877241A (en) Combined capillary structure for heat transfer assembly
CN101048056A (en) Radiator and its manufacturing method, electronic equipment with radiator
CN2896808Y (en) Water-cooling radiating device and water cooling head
CN100557367C (en) A kind of large power plate integral type phase change heat-radiation method and radiator
CN2510996Y (en) High-speed heat-conducting device with liquid-gas change-over
CN1913137A (en) Cooling mould set
CN2720633Y (en) Radiating device
CN2478166Y (en) Radiator structure
CN2500070Y (en) Radiator device
CN200980219Y (en) A dense junction structure of foot in radiator with heat pipe
CN114510135B (en) Uniform temperature plate with good heat conduction and heat dissipation effects
CN2518144Y (en) Integrated efficiency radiator
CN2681336Y (en) Heat sink
CN2705893Y (en) Phase changing heat radiator
CN2483756Y (en) Biphase current conducting radiator for CPU
CN2681215Y (en) A computer heat sink
CN2699477Y (en) Heat-pipe radiator construction
CN2833889Y (en) CPU radiator with high performance
CN2548395Y (en) Radiating fin structure improvement
CN1777355A (en) Liquid-cooled column-type heat tube radiator
CN2681335Y (en) Heat sink
CN2775837Y (en) Aluminum-copper combined integrated circuit heat radiator using heat pipe technology
CN2765439Y (en) Temperature equalized plate radiator
CN2553514Y (en) Improved radiator
CN2829085Y (en) Integral heat pipe radiator

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee