CN2503606Y - Heat sink base - Google Patents
Heat sink base Download PDFInfo
- Publication number
- CN2503606Y CN2503606Y CN01255348U CN01255348U CN2503606Y CN 2503606 Y CN2503606 Y CN 2503606Y CN 01255348 U CN01255348 U CN 01255348U CN 01255348 U CN01255348 U CN 01255348U CN 2503606 Y CN2503606 Y CN 2503606Y
- Authority
- CN
- China
- Prior art keywords
- centerbody
- hole
- radiator base
- copper
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a heat radiator base seat which comprises an aluminum main body and a copper center body, a through hole is arranged at the center of the main body, the center body is slightly larger than the through hole, the center body is pressed in the through hole, during the pressing process, interference cutting is performed, and then the center body is forged, to ensure that the center body generates radial plastic distortion to be tightly combined with the main body.
Description
[technical field]
The utility model is about a kind of radiator base, is provided with the radiator base of a copper centerbody with being meant a kind of middle no medium especially.
[background technology]
Many electronic components produce a large amount of heats when operation, if these heats are discharged untimelyly, and will be totally unfavorable to the electronic component reliability of operation.For this reason, be everlasting one of the mounted on surface of electronic component of industry is used for the radiator of timely distribute heat.
Existing radiator normally is made up of aluminum or aluminum alloy pedestal and some radiating fins of being contained on the radiator base, by of the applying of these base bottom surface central authorities with electronic component, the heat transferred that electronic component is produced is distributed by radiating fin to the end face of whole pedestal again.Yet the pedestal of this radiator is to be made by the less aluminum or aluminum alloy of conductive coefficient, therefore is difficult to be delivered to fully, apace by the heat that its bottom center produces electronic component the end face of whole pedestal.
For this reason, the industry higher radiator base 2 of heat transfer property as depicted in figs. 1 and 2, this radiator base 2 mainly is made up of an aluminium matter body 3 and a copper coin 4.The bottom center of this body 3 is provided with a groove 5, and this copper coin 4 is to be welded in the groove 5 of body 3 by a tin paste layer 6.Utilize copper coin 4 heat that electronic component produces to be reached the end face of radiator base 2 with the electronic component applying.Yet this radiator base 2 is welded in copper coin 4 in the groove 5 by tin paste layer 6, and the conductive coefficient of tin (67w/cm.k) is more much lower than the conductive coefficient (being respectively 359w/cm.k, 207w/cm.k) of copper, aluminium, this just is equivalent to add a high thermal resistance between aluminium matter body 3 and copper coin 4 boundary layer greatly reduces the heat-conducting effect at pedestal 2 bottom copper-surfaced plates 4.
[summary of the invention]
The purpose of this utility model is a kind of middle no medium is provided to be provided with the high-efficiency radiator pedestal of a copper centerbody.
The purpose of this utility model is achieved through the following technical solutions: the utility model radiator base mainly comprises an aluminium matter body and a copper centerbody, and this aluminium matter body center has a through hole, and this copper centerbody is slightly larger than this through hole.This copper centerbody is pressed in the through hole of aluminium matter body, and in the process that is pressed into, carries out interference cutting, forge and press this copper centerbody again, make it produce radial plastic deformation and be closely linked with this aluminium matter body.
Owing to adopted technique scheme, the utility model radiator base has following advantage: logical peraluminous body and copper centerbody directly combine, removed with soldering in conjunction with the high thermal resistance boundary layer that is produced, when copper centerbody fitted on the electronic component, the heat that can fully electronic component be produced passed to the end face of aluminium matter body fast.
The utility model will be further described in conjunction with the embodiments with reference to the accompanying drawings.
[description of drawings]
Fig. 1 is the three-dimensional exploded view of existing radiator base.
Fig. 2 is the three-dimensional combination figure of existing radiator base.
Fig. 3 is the three-dimensional exploded view of the utility model radiator base.
Fig. 4 is the three-dimensional combination figure of the utility model radiator base.
[embodiment]
See also Fig. 3 and Fig. 4, the utility model radiator base 10 is fitted on the electronic component (figure does not show), assembles and transmit the heat of electronic component generation, and it mainly comprises an aluminium matter body 11 and one copper centerbody 12.
These body 11 central authorities are provided with a through hole 111, this centerbody 12 is slightly larger than this through hole 111, and by following two steps centerbody 12 is embedded in the through holes 111: the first step is pressed into this centerbody 12 in this through hole 111, and carries out the interference cutting in the process that is pressed into; Second step, forge and press this centerbody 12, make it produce radial plastic deformation and be closely linked with this body 11.Utilize the applying on bottom surface 121 with the surface of electronic component of this centerbody 12, the heat that electronic component produces can be delivered to fully, apace the end face 112 of entire radiator pedestal 10.
Claims (5)
1. a radiator base comprises that one is provided with the body and a centerbody of through hole, it is characterized in that: this centerbody be no medium be combined in the through hole of body, and the heat transfer property of this centerbody is better than the heat transfer property of body.
2. radiator base as claimed in claim 1 is characterized in that: this body is that aluminum material is made.
3. radiator base as claimed in claim 1 or 2 is characterized in that: this through hole is positioned at the central authorities of this body.
4. radiator base as claimed in claim 1 is characterized in that: this centerbody is that copper material is made.
5. radiator base as claimed in claim 1, it is characterized in that: this centerbody is that interference fit is pressed in the through hole of this body, and in the process that is pressed into, carry out interference cutting, make this centerbody produce radial plastic deformation and realize not combining with having medium through forging and pressing again with this body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN01255348U CN2503606Y (en) | 2001-08-23 | 2001-08-23 | Heat sink base |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN01255348U CN2503606Y (en) | 2001-08-23 | 2001-08-23 | Heat sink base |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2503606Y true CN2503606Y (en) | 2002-07-31 |
Family
ID=33664493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN01255348U Expired - Lifetime CN2503606Y (en) | 2001-08-23 | 2001-08-23 | Heat sink base |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2503606Y (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101018467B (en) * | 2006-02-11 | 2010-05-26 | 富准精密工业(深圳)有限公司 | Heat radiator |
CN103196119A (en) * | 2013-04-26 | 2013-07-10 | 广州市莱帝亚照明科技有限公司 | Light emitting diode (LED) spot lamp |
CN103447753A (en) * | 2013-09-05 | 2013-12-18 | 美尔森电气保护系统(上海)有限公司 | Method for inlaying copper plate in aluminum bottom plate |
CN109561638A (en) * | 2018-12-18 | 2019-04-02 | 东莞市金太阳精密技术有限责任公司 | A kind of aluminium edge copper base and its processing method |
-
2001
- 2001-08-23 CN CN01255348U patent/CN2503606Y/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101018467B (en) * | 2006-02-11 | 2010-05-26 | 富准精密工业(深圳)有限公司 | Heat radiator |
CN103196119A (en) * | 2013-04-26 | 2013-07-10 | 广州市莱帝亚照明科技有限公司 | Light emitting diode (LED) spot lamp |
CN103196119B (en) * | 2013-04-26 | 2015-08-05 | 广州市莱帝亚照明科技有限公司 | A kind of LED spotlight |
CN103447753A (en) * | 2013-09-05 | 2013-12-18 | 美尔森电气保护系统(上海)有限公司 | Method for inlaying copper plate in aluminum bottom plate |
CN103447753B (en) * | 2013-09-05 | 2016-06-15 | 美尔森电气保护系统(上海)有限公司 | A kind of method inlaying copper coin on aluminum soleplate |
CN109561638A (en) * | 2018-12-18 | 2019-04-02 | 东莞市金太阳精密技术有限责任公司 | A kind of aluminium edge copper base and its processing method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CX01 | Expiry of patent term |
Expiration termination date: 20110823 Granted publication date: 20020731 |