CN101018467B - Heat radiator - Google Patents
Heat radiator Download PDFInfo
- Publication number
- CN101018467B CN101018467B CN200610033587A CN200610033587A CN101018467B CN 101018467 B CN101018467 B CN 101018467B CN 200610033587 A CN200610033587 A CN 200610033587A CN 200610033587 A CN200610033587 A CN 200610033587A CN 101018467 B CN101018467 B CN 101018467B
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- CN
- China
- Prior art keywords
- radiator
- substrate
- processing unit
- radiating fin
- central processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The heat radiation device for CPU and its peripheral devices comprises: a primary radiator including a base with primary cooling fins, and an accessory radiator including a substrate with some accessory cooling fins. Wherein, it overlaps the base and substrate to make the accessory fins around the primary ones. This invention is compact and well adaptation.
Description
[technical field]
The present invention relates to a kind of heat abstractor, particularly a kind of heat abstractor that is used for cooling off simultaneously a plurality of electronic components.
[background technology]
Along with computer technology constantly develops, electronic component (especially central processing unit) running frequency and speed are in continuous lifting.The heat that high-frequency high-speed also makes electronic component produce increases thereupon, makes its temperature constantly raise, and then influences the performance when moving, and can normally move for guaranteeing electronic component, must in time discharge the big calorimetric that electronic component produced.
Usually, industry uses simple metal single radiator that electronic component is dispelled the heat, this radiator comprises a base and the some radiating fins that are located on the base, this base end face is level and smooth entity metal, be sticked on the central processing unit surface to absorb the heat of its generation, dispel the heat to being uploaded to radiating fin through base again.Along with the central processing unit speed of service is more and more faster, its heating is more concentrated, adds that electronic component increases around the central processing unit, and its caloric value is also in continuous increase, thus need to central processing unit and on every side electronic component dispel the heat simultaneously.Yet only rely on the single radiator be attached at central processing unit can't satisfy simultaneously to central processing unit and the electronic component demand of dispelling the heat simultaneously on every side thereof.
For this reason, industry adopts the radiator desire that a larger volume is provided to cover central processing unit and electronic component on every side thereof, reaches simultaneously to all electronic element radiating purposes.But weight is big, load is big because volume causes greatly for radiator at this moment, and is subjected to the central processing unit densely covered little restriction in space of electronic component on every side, and suitability is relatively poor; If at central processing unit and on every side electronic component one radiator is set separately respectively, then fitting operation is loaded down with trivial details, wastes time and energy.
[summary of the invention]
In view of this, be necessary to provide a kind of compact conformation, can satisfy a main electronic component and the heat abstractor of electronic element radiating on every side thereof simultaneously.
The heat abstractor of the embodiment of the invention is in order to central processing unit and electronic element radiating on every side thereof, comprise that a main radiator and is from radiator, this main radiator comprises a pedestal and is arranged on main radiating fin on the pedestal, should comprise with the substrate that is sticked of electronic component around the central processing unit and be arranged on some on the substrate from radiator from the radiating fin group, the pedestal of described main radiator with from the substrate stacked of radiator, around being set around main radiating fin from the radiating fin group, the bottom of described main radiator base is provided with a lug boss that is sticked with central processing unit, described lug boss passes from the substrate of radiator and protrudes out substrate surface, fits tightly corresponding to the lower surface of described substrate from radiating fin group position and the electronic component around the central processing unit.
This execution mode compared with prior art, main radiator partly is stacked in from radiator among the present invention, compact conformation, main radiating fin and winding can satisfy central processing unit and the electronic component demand of dispelling the heat simultaneously on every side thereof from the radiating fin group around it, suitability is good.
[description of drawings]
Fig. 1 is the three-dimensional exploded view of heat abstractor of the present invention.
Fig. 2 is the three-dimensional combination figure of Fig. 1.
Fig. 3 is the inverted three-dimensional combination figure of Fig. 2.
[embodiment]
See also Fig. 2, heat abstractor of the present invention is in order to central processing unit and electronic element radiating on every side thereof.This heat abstractor comprise a main radiator 10 and bottom thereof stacked thereon from radiator 20.
In conjunction with consulting Fig. 1 and Fig. 3, this main radiator 10 comprises a pedestal 12, these pedestal 12 upper surfaces are provided with some main radiating fins 14, and pedestal 12 bottoms are provided with the discoid protuberance 122 of fitting with central processing unit, and this pedestal is respectively equipped with a square feet 120 for 12 4 jiaos.Each feet 120 is provided with a circular orifice 124.Comprise a square substrate 22 and be arranged on around the substrate 22 and facing each other from radiator 20 from radiating fin group 24, these substrate 22 central authorities are provided with a circular open 26, corresponding to the pedestal 12 bottom protrusion portions 122 of described main radiator 10,22 4 jiaos of screws 224 that are provided with the aperture 124 of corresponding above-mentioned main radiator 10 of this substrate.
The lug boss 122 of described main radiator 10 passes opening 26 from radiator 20 substrates 22 central processing unit that is sticked, four feets 120 on main radiator 10 pedestals 12 are close to respectively from four jiaos of radiator 20 substrates 22 upper surfaces, screw pass in turn aperture 124 on the pedestal 12, the screw 224 on the substrate 22 with main radiator 10 be connected and fixed from radiator 20, main radiator 10 be integrated from radiator 20.Corresponding to fitting tightly from substrate 22 lower surfaces of radiating fin group 24 positions and the electronic component around the central processing unit.
During central processing unit work, the heat of its generation at first reaches the lug boss 122 of main radiator 10, is dispelled the heat to being uploaded to main radiating fin 14 by lug boss 122 again; Around the central processing unit during electronic component work, the heat of its generation at first reach be close to it around the lower surface of radiator 20 substrates 22, again by substrate 22 through dispelling the heat to the external world from radiating fin group 24.
In the foregoing description, the pedestal 12 of main radiator 10 passes from the opening 26 of radiator 20 central authorities and stacked from radiator 20 parts, compact conformation; The lug boss 122 of main radiator 10 directly contacts with central processing unit, and corresponding substrate 22 from radiating fin group 24 is sticked with electronic component around the central processing unit and dispels the heat, and at the diverse location electronic element radiating, suitability is good.In addition, when fixing two radiators and being one, only need a screw to pass master and slave radiator in turn and can realize for 10,20 4 jiaos, time saving and energy saving.
Claims (7)
1. heat abstractor, in order to central processing unit and electronic element radiating on every side thereof, comprise that a main radiator and is from radiator, this main radiator comprises a pedestal and is arranged on main radiating fin on the pedestal, should comprise with the substrate that is sticked of electronic component around the central processing unit and be arranged on some on the substrate from radiator from the radiating fin group, it is characterized in that: the pedestal of described main radiator with from the substrate stacked of radiator, around being set around main radiating fin from the radiating fin group, the bottom of described main radiator base is provided with a lug boss that is sticked with central processing unit, described lug boss passes from the substrate of radiator and protrudes out substrate surface, fits tightly corresponding to the lower surface of described substrate from radiating fin group position and the electronic component around the central processing unit.
2. heat abstractor as claimed in claim 1 is characterized in that: describedly be provided with a corresponding opening from radiator base plate central authorities, described lug boss passes the opening central processing unit that is sticked.
3. heat abstractor as claimed in claim 2 is characterized in that: describedly be distributed in upper surface of base plate in twos relatively and be positioned at this around openings from the radiating fin group.
4. heat abstractor as claimed in claim 2 is characterized in that: the pedestal of described main radiator is provided with for four jiaos to be close to from radiator base plate feet on every side.
5. heat abstractor as claimed in claim 2 is characterized in that: described lug boss is in the form of annular discs, and the opening on the described substrate is rounded.
6. heat abstractor as claimed in claim 4 is characterized in that: the feet of described main radiator is provided with the aperture, is provided with screw from the corresponding aperture of the substrate of radiator, and screw passes the aperture and fixes master and slave radiator in one with screw.
7. heat abstractor as claimed in claim 4 is characterized in that: be provided with one from the radiating fin group between described any adjacent two feets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610033587A CN101018467B (en) | 2006-02-11 | 2006-02-11 | Heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610033587A CN101018467B (en) | 2006-02-11 | 2006-02-11 | Heat radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101018467A CN101018467A (en) | 2007-08-15 |
| CN101018467B true CN101018467B (en) | 2010-05-26 |
Family
ID=38727147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200610033587A Expired - Fee Related CN101018467B (en) | 2006-02-11 | 2006-02-11 | Heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101018467B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101453857B (en) * | 2007-12-07 | 2012-07-04 | 富准精密工业(深圳)有限公司 | Heat Radiation device |
| CN102724849A (en) * | 2012-06-01 | 2012-10-10 | 加弘科技咨询(上海)有限公司 | Heat-radiating system, heat-radiating device and heat-radiating fin base thereof |
| JP6877523B1 (en) * | 2019-12-20 | 2021-05-26 | 株式会社東芝 | Heat sink and electronics unit |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2503606Y (en) * | 2001-08-23 | 2002-07-31 | 富准精密工业(深圳)有限公司 | Heat sink base |
| CN2509715Y (en) * | 2001-08-01 | 2002-09-04 | 富准精密工业(深圳)有限公司 | Lock joining device for radiator |
| CN2543120Y (en) * | 2002-01-22 | 2003-04-02 | 旭扬热导股份有限公司 | Cooling device capable of promoting cooling efficiency |
| US6992895B2 (en) * | 2001-11-23 | 2006-01-31 | Finisar Corporation | Heat controlled optoelectrical unit |
-
2006
- 2006-02-11 CN CN200610033587A patent/CN101018467B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2509715Y (en) * | 2001-08-01 | 2002-09-04 | 富准精密工业(深圳)有限公司 | Lock joining device for radiator |
| CN2503606Y (en) * | 2001-08-23 | 2002-07-31 | 富准精密工业(深圳)有限公司 | Heat sink base |
| US6992895B2 (en) * | 2001-11-23 | 2006-01-31 | Finisar Corporation | Heat controlled optoelectrical unit |
| CN2543120Y (en) * | 2002-01-22 | 2003-04-02 | 旭扬热导股份有限公司 | Cooling device capable of promoting cooling efficiency |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101018467A (en) | 2007-08-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100526 Termination date: 20120211 |