CN103447753B - A kind of method inlaying copper coin on aluminum soleplate - Google Patents
A kind of method inlaying copper coin on aluminum soleplate Download PDFInfo
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- CN103447753B CN103447753B CN201310399265.9A CN201310399265A CN103447753B CN 103447753 B CN103447753 B CN 103447753B CN 201310399265 A CN201310399265 A CN 201310399265A CN 103447753 B CN103447753 B CN 103447753B
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- copper coin
- aluminum soleplate
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Abstract
The invention discloses a kind of method inlaying copper coin on aluminum soleplate, the step that the method includes has: the die cavity of processing aluminum soleplate and copper coin; Copper coin is carried out freezing processing, aluminum soleplate is carried out heat treatment; The copper coin processed is pressed into the die cavity of aluminum soleplate; Aluminum soleplate after pressing and copper coin are put into 80 DEG C of environment stand, then this coalition is placed into normal temperature environment makes its temperature naturally be reduced to room temperature. The method of the present invention, by the emphasis heat radiation position damascene copper plate at heat-radiator plate, namely make use of the outstanding heat dispersion of copper coin, has the advantage that the light weight price that make use of aluminium is low, reduce material cost while meeting radiating effect.
Description
Technical field
The present invention relates to the production method of a kind of air-cooled radiator plate, especially relate to a kind of method inlaying copper coin on aluminum soleplate.
Background technology
The thermal conductivity of copper is 391W/m DEG C, and the thermal conductivity of aluminum is 180W/m DEG C. The thermal conductivity of copper material is more than 2 of aluminium thermal conductivity, it is meant that the heat transfer efficiency of an equal amount of copper material exceeds about 2 times than aluminium. And the proportion of aluminium is 2712kg/m3, copper material is 8940kg/m3, say, that copper material and the aluminium weight of formed objects almost differ from 3 times. Weighing bi-material from radiating efficiency angle is that copper material is better than aluminium certainly, but the weight of copper material itself and fancy price make radiator define unfavorable factor in using and producing.
Summary of the invention
The technical problem that present invention mainly solves is to provide a kind of method inlaying copper coin on aluminum soleplate, by the emphasis heat radiation position damascene copper plate at heat-radiator plate, namely make use of the outstanding heat dispersion of copper coin, there is the advantage that the light weight price that make use of aluminium is low, while meeting radiating effect, reduce material cost.
For solving above-mentioned technical problem, the technical solution used in the present invention is: providing a kind of method inlaying copper coin on aluminum soleplate, the method comprises the steps:
(1) on aluminum soleplate, the predetermined position inlaying copper coin processes die cavity, copper board processes the copper coin of profile corresponding to described die cavity as copper coin to be inlayed, is interference fit between described die cavity and copper coin described to be inlayed;
(2) copper coin described to be inlayed carrying out freezing in refrigerator-freezer, described aluminum soleplate is warmed to more than 100 DEG C, the temperature difference of copper coin to be inlayed described in making and described aluminum soleplate reaches more than 140 DEG C;
(3) the copper coin level to be inlayed after described freezing is fixed, copper coin to be inlayed described in the described die cavity of the described aluminum soleplate after being warmed to is aligned, copper coin to be inlayed described in this aluminum soleplate vertical depression being made enters the described die cavity of this aluminum soleplate, makes described copper coin and described aluminum soleplate inlay and combines;
(4) it is positioned in the environment of 60 DEG C～100 DEG C by the coalition of the described copper coin after inlaying with described aluminum soleplate to stand more than 10 hours, then this coalition is placed into normal temperature environment makes its temperature naturally be reduced to room temperature.
In a preferred embodiment of the present invention, the dimensioned error of described die cavity and described aluminum soleplate is within 0.1mm.
In a preferred embodiment of the present invention, described step (2) for by copper coin described to be inlayed freezing 24 hours in the refrigerator-freezer of-20 DEG C, being warmed to 120 DEG C by aluminum soleplate.
In a preferred embodiment of the present invention, described step (4) is that the coalition of the described copper coin after inlaying with described aluminum soleplate is positioned in 80 DEG C of environment and is stood more than 12 hours, then this coalition is placed into normal temperature environment makes its temperature naturally be reduced to room temperature.
In a preferred embodiment of the present invention, copper coin to be inlayed described in this aluminum soleplate vertical depression being made in described step (3) entered the activity duration of the mosaic process of the described die cavity of this aluminum soleplate less than 30 seconds.
The method of the present invention, by the emphasis heat radiation position damascene copper plate at heat-radiator plate, namely make use of the outstanding heat dispersion of copper coin, has the advantage that the light weight price that make use of aluminium is low, reduce material cost while meeting radiating effect.
Detailed description of the invention
Below in conjunction with concrete preferred embodiment, the present invention will be described in detail, so that advantages and features of the invention can be easier to be readily appreciated by one skilled in the art, these embodiments are only the purpose illustrated, it is no intended to the scope of the present invention is defined.
The present invention inlays the method for copper coin on aluminum soleplate and comprises the steps:
(1) on aluminum soleplate, the predetermined position inlaying copper coin processes die cavity, copper board processes the copper coin of profile corresponding to described die cavity as copper coin to be inlayed, is interference fit between described die cavity and copper coin described to be inlayed;
(2) copper coin described to be inlayed is carried out in refrigerator-freezer freezing, described aluminum soleplate is warmed to more than 100 DEG C, the temperature difference of copper coin to be inlayed described in making and described aluminum soleplate reaches more than 140 DEG C, preferably, by copper coin described to be inlayed freezing 24 hours in the refrigerator-freezer of-20 DEG C, aluminum soleplate is warmed to 120 DEG C;
(3) the copper coin level to be inlayed after described freezing is fixed, copper coin to be inlayed described in the described die cavity of the described aluminum soleplate after being warmed to is aligned, copper coin to be inlayed described in this aluminum soleplate vertical depression being made enters the described die cavity of this aluminum soleplate, makes described copper coin and described aluminum soleplate inlay and combines;
(4) it is positioned in the environment of 60 DEG C～100 DEG C by the coalition of the described copper coin after inlaying with described aluminum soleplate to stand more than 10 hours, this coalition is placed into normal temperature environment again makes its temperature naturally be reduced to room temperature, preferably, described step (4) is that the coalition of the described copper coin after inlaying with described aluminum soleplate is positioned in 80 DEG C of environment and is stood more than 12 hours, then this coalition is placed into normal temperature environment makes its temperature naturally be reduced to room temperature.
Preferably, described die cavity and the dimensioned error of described aluminum soleplate are within 0.1mm.
Preferably, this aluminum soleplate vertical depression is made by described step (3) described in copper coin to be inlayed enter activity duration of mosaic process of described die cavity of this aluminum soleplate less than 30 seconds.
It addition, the size according to heat-radiator plate size, the cooling time of copper coin and the warm-up time of aluminum soleplate can be adjusted, it is ensured that together with copper coin can be mounted to smoothly with aluminum soleplate.
It is appreciated that the die cavity quantity of aluminum soleplate and the quantity of copper coin can be corresponding one or more.
Further, the full-size of the aluminum soleplate that the method for the use present invention is suitable for is 580X1180X30mm, and the full-size of copper coin mosaic block is 200X350X30mm.
It is different from prior art, the method of the present invention is by the emphasis heat radiation position damascene copper plate at heat-radiator plate, namely make use of the outstanding heat dispersion of copper coin, have the advantage that the light weight price that make use of aluminium is low, while meeting radiating effect, reduce material cost.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every equivalent structure utilizing description of the present invention to make or equivalence flow process conversion; or it is used in relevant technical field directly or indirectly, all in like manner include in the scope of patent protection of the present invention.
Claims (5)
1. the method inlaying copper coin on aluminum soleplate, it is characterised in that the method comprises the steps:
(1) on aluminum soleplate, the predetermined position inlaying copper coin processes die cavity, copper board processes the copper coin of profile corresponding to described die cavity as copper coin to be inlayed, is interference fit between described die cavity and copper coin described to be inlayed;
(2) copper coin described to be inlayed carrying out freezing in refrigerator-freezer, described aluminum soleplate is warmed to more than 100 DEG C, the temperature difference of copper coin to be inlayed described in making and described aluminum soleplate reaches more than 140 DEG C;
(3) the copper coin level to be inlayed after described freezing is fixed, copper coin to be inlayed described in the described die cavity of the described aluminum soleplate after being warmed to is aligned, copper coin to be inlayed described in this aluminum soleplate vertical depression being made enters the described die cavity of this aluminum soleplate, makes described copper coin and described aluminum soleplate inlay and combines;
(4) it is positioned in the environment of 60 DEG C～100 DEG C by the coalition of the described copper coin after inlaying with described aluminum soleplate to stand more than 10 hours, then this coalition is placed into normal temperature environment makes its temperature naturally be reduced to room temperature.
2. the method inlaying copper coin on aluminum soleplate according to claim 1, it is characterised in that the dimensioned error of described die cavity and described aluminum soleplate is within 0.1mm.
3. the method inlaying copper coin on aluminum soleplate according to claim 1, it is characterised in that described step (2) for by copper coin described to be inlayed freezing 24 hours in the refrigerator-freezer of-20 DEG C, being warmed to 120 DEG C by aluminum soleplate.
4. the method inlaying copper coin on aluminum soleplate according to claim 1, it is characterized in that, described step (4) is that the coalition of the described copper coin after inlaying with described aluminum soleplate is positioned in 80 DEG C of environment and is stood more than 12 hours, then this coalition is placed into normal temperature environment makes its temperature naturally be reduced to room temperature.
5. the method inlaying copper coin on aluminum soleplate according to claim 1, it is characterized in that, copper coin to be inlayed described in this aluminum soleplate vertical depression being made in described step (3) entered the activity duration of the mosaic process of the described die cavity of this aluminum soleplate less than 30 seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310399265.9A CN103447753B (en) | 2013-09-05 | 2013-09-05 | A kind of method inlaying copper coin on aluminum soleplate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310399265.9A CN103447753B (en) | 2013-09-05 | 2013-09-05 | A kind of method inlaying copper coin on aluminum soleplate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103447753A CN103447753A (en) | 2013-12-18 |
| CN103447753B true CN103447753B (en) | 2016-06-15 |
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| CN201310399265.9A Active CN103447753B (en) | 2013-09-05 | 2013-09-05 | A kind of method inlaying copper coin on aluminum soleplate |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109561638A (en) * | 2018-12-18 | 2019-04-02 | 东莞市金太阳精密技术有限责任公司 | A kind of aluminium edge copper base and its processing method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2503606Y (en) * | 2001-08-23 | 2002-07-31 | 富准精密工业(深圳)有限公司 | Heat sink base |
| CN2783249Y (en) * | 2005-03-21 | 2006-05-24 | 高瑞安 | Aluminium-steel composite profile material |
| CN101428385A (en) * | 2007-11-06 | 2009-05-13 | 贵州红林机械有限公司 | Non-pressure sleeve pressing process |
| KR20120038621A (en) * | 2010-10-14 | 2012-04-24 | (주)상원엔지니어링 | Manufacturing method of pipe using heat exchanger |
| CN203501115U (en) * | 2013-09-26 | 2014-03-26 | 广州光为照明科技有限公司 | Copper and aluminum composite type LED lamp radiator |
-
2013
- 2013-09-05 CN CN201310399265.9A patent/CN103447753B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2503606Y (en) * | 2001-08-23 | 2002-07-31 | 富准精密工业(深圳)有限公司 | Heat sink base |
| CN2783249Y (en) * | 2005-03-21 | 2006-05-24 | 高瑞安 | Aluminium-steel composite profile material |
| CN101428385A (en) * | 2007-11-06 | 2009-05-13 | 贵州红林机械有限公司 | Non-pressure sleeve pressing process |
| KR20120038621A (en) * | 2010-10-14 | 2012-04-24 | (주)상원엔지니어링 | Manufacturing method of pipe using heat exchanger |
| CN203501115U (en) * | 2013-09-26 | 2014-03-26 | 广州光为照明科技有限公司 | Copper and aluminum composite type LED lamp radiator |
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| CN103447753A (en) | 2013-12-18 |
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