CN2470952Y - Washing device for semiconductor package product - Google Patents
Washing device for semiconductor package product Download PDFInfo
- Publication number
- CN2470952Y CN2470952Y CN 01200541 CN01200541U CN2470952Y CN 2470952 Y CN2470952 Y CN 2470952Y CN 01200541 CN01200541 CN 01200541 CN 01200541 U CN01200541 U CN 01200541U CN 2470952 Y CN2470952 Y CN 2470952Y
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- cleaning
- semiconductor package
- package product
- cleaning device
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Abstract
A cleaning device for packaged semiconductor product comprises a conveying belt for directly conveying packaged product to a cleaning unit after passing through a reflow soldering machine, and connected with the reflow soldering machine. The cleaning unit comprises a cleaning zone including a water tank, a nozzle, a heating unit, and a water sucking unit; the cleaning unit and the reflow soldering mechanism form continuous operation to increase cleaning speed of the packaged semiconductor product; the water tank of each cleaning zone of the cleaning unit is provided with a heating unit for facilitating cleaning of the packaged product; the cleaning unit can effectively clean solder flux and impurities, which is suitable for cleaning operation of metallic balls with small diameter, and has good cleaning effect.
Description
The utility model relates to a kind of cleaning device of semiconductor package product, refer to especially a kind of be used for semiconductor that encapsulation is finished fast, the cleaning device that effectively cleans up.
Semiconductor element encapsulates it with a packaging body after finishing trace arrangements usually, with the protection semiconductor element, and makes the signal on the semiconductor be delivered to printed circuit board (PCB) by this packaging body.
The conventional semiconductor packages method, on this packaging body with the ball grid array mode be provided with one above morning Metal Ball, make the signal on the semiconductor element be connected to this Metal Ball, be delivered to circuit board by this Metal Ball again.
And the method for packing of existing ball grid array Metal Ball; semiconductor element is set on the substrate; metal wire by one or more is connected on the substrate again; with an adhesive body semiconductor element and the lead of one or more are sealed again; to protect this semiconductor element and the metal wire of one or more; at last; be connected on this substrate in order to the metal coupling that is connected to printed circuit board (PCB) more than one; this substrate is arranged in the reflow machine; after suitable temperature heating; this metal coupling then forms Metal Ball by the cohesive force of itself, and this is the method for packing of existing ball grid array Metal Ball.
As shown in Figure 1, after the making of finishing the ball grid array Metal Ball, because this metal coupling contains compositions such as tin, lead and scaling powder, therefore, this metal coupling after reflow machine heating is condensed into metal 10, the surface that scaling powder in it and impurity 12 will be squeezed Metal Ball 10, therefore, after finishing ball grid array Metal Ball 10 encapsulation, packaging body must be arranged in the cleaning device contaminant removals such as scaling powders, in order to avoid Metal Ball loose contact and have influence on semi-conductive signal transmission.
The cleaning device of conventional semiconductor is semiautomatic operating type, itself and reflow machine are the operation of discontinuous formula, semiconductor package product through the reflow machine, be not to enter cleaning device to clean at once, and must insert it in cleaning device one by one with manual type, at this moment, the temperature of the semiconductor package product of process reflow machine cools down to the normal temperature state at leisure from the 50-60 degree, and the impurity such as scaling powder on the ball grid array Metal Ball will be set in the Metal Ball surface at leisure, therefore, in cleaning process, be difficult for it is cleaned up, when the diameter of Metal Ball more hour, cleaning performance is poor more.
As shown in Figure 2, the cleaning device of existing discontinuous formula, include a plurality of cleanings zone 14,16 and 18, and owing to the semiconductor package product that enters this discontinuous formula cleaning device has cooled down, first cleaning area 14 of existing cleaning device is the normal temperature cleaning area, second is cleaned zone 16 also is the normal temperature cleaning area, and last cleans the cleaning area of zone 18 for heating through heater 17, in order to cleaning zone 14,16 impurity of not disposing such as scaling powder, 12 activation, so that this impurity 12 is cleaned up through first and second.But, when the diameter of Metal Ball 10 more hour, attached to the impurity such as scaling powder 12 of Metal Ball 10 and substrate 20 and be not easy to remove clean, and have influence on the cleanliness factor of packaging body, or must clean again.
Main purpose of the present utility model is to provide a kind of cleaning device of semiconductor package product, makes the cleaning of semiconductor package product more quick.
Another purpose of the present utility model is to provide a kind of cleaning device of semiconductor package product, makes the cleaning of semiconductor package product more clean.
Purpose of the present utility model is achieved by the following technical solution.
A kind of cleaning device of semiconductor package product, one directly is passed to the conveyer belt of cleaning device after making this semiconductor package product through reflow machine, and it is connected with the reflow machine, and this cleaning device comprises:
More than one cleaning zone, each cleans the zone and comprises an aqua storage tank;
More than one nozzle;
One is used for the water of aqua storage tank is heated to the heater of proper temperature;
One is used for that the water through heating is evacuated to nozzle and by the water plug of the water cleaning semiconductor encapsulating products of nozzle ejection proper temperature.
Cleaning device includes one first in regular turn and cleans zone, one second cleaning zone and one the 3rd cleaning zone.
First cleans the water temperature in zone near the temperature through reflow machine semiconductor package product.
The temperature of the semiconductor package product of process reflow machine is a 40-60C ° of degree.
The 3rd cleaning zone is provided with one and is used for the direct water guider that imports in the regional aqua storage tank of second cleaning of the water after the 3rd cleaning zone cleaning.
The water that an aqua storage tank overflowed after the aqua storage tank in each cleaning zone was can flow into the overflow-type aqua storage tank in the last aqua storage tank.
This conveyer belt is provided with the fixedly cylinder of semiconductor package product.
Can connect a blowing device behind this more than one cleaning zone.
Can connect a drying unit behind this blowing device.
The Metal Ball of this semiconductor package product is a ball bar display Metal Ball.
The utility model can improve the cleaning speed of semiconductor package product by cleaning device and the reflow mechanism mode that becomes to work continuously; The tank that each of cleaning device is cleaned the zone has heater, can make scaling powder and the impurity of the semiconductor package product of process reflow machine by hot water activated metal ball, is convenient to semiconductor package product is cleaned up; Cleaning device can be removed scaling powder and impurity effectively, and therefore, it is applicable to the quite little Metal Ball washing and cleaning operation of sphere diameter, and obtains preferable cleaning performance.
The utility model is described in further detail below in conjunction with drawings and Examples:
Fig. 1 is the schematic diagram that the Metal Ball of semiconductor package product is coated by impurity such as scaling powders.
Fig. 2 is the cleaning device schematic diagram of conventional semiconductor packages product.
Fig. 3 is the cleaning device schematic diagram of the utility model semiconductor package product.
Fig. 4 is the cleaning device partial schematic diagram of the utility model semiconductor package product.
As shown in Figure 3, after the utility model cleaning device 22 is connected to a reflow machine 26 by a conveyer belt 24, more than one semiconductor package product row is located at and finishes the making of ball bar display Metal Ball on the mould 28 simultaneously, after this row has the mould 28 process reflow machines 24 of more than one semiconductor package product, directly enter in the cleaning device 22 continuously, impurity such as scaling powder on the semiconductor package product Metal Ball on the mould 28 (ball grid array Metal Ball) are rinsed well, and the moisture content on the semiconductor package product is removed through a blowing device 32 and a drying unit 34.
This cleaning device 22 is provided with one first and cleans zone 36, one second cleans zone 38 and the 3rd cleans zone 40, each cleans zone 36,38 and 40 all are provided with an aqua storage tank 42,44 and 46, more than one nozzle 48,50 and 52, one heater 54,56 and 58, be used for aqua storage tank 42,44 and 46 water is heated to suitable temperature, one water plug 60,62 and 64 are used for aqua storage tank 42,44 and 46 are evacuated to nozzle 48,50 and 52, impurity such as scaling powder on the Metal Ball 30 of the semiconductor package product 28 of cleaning device 22 are rinsed well, through a blowing device 32 and a drying unit 34 moisture content on the semiconductor package product on the mould 28 is removed again.
The temperature of the semiconductor package product that comes out through reflow machine 26 is the 40-60 degree, first to clean aqua storage tank 42 heated temperatures in zone 36 close with the temperature 40-60 degree of semiconductor package product, makes the impurity activations such as scaling powder on the Metal Ball of semiconductor package product be convenient to wash.
In addition, the 3rd of cleaning device 22 cleans zone 40 and is provided with a water guider 54, clean in the zone 38 in order to the water after 40 cleanings of the 3rd cleaning zone is directly imported second, make the tank 46 interior water in the 3rd cleaning zone 40 keep clean state, can not pollute semiconductor package product once more.The tank 42,44 and 46 that each of cleaning device 22 is cleaned zone 36,38 and 40 also can be the overflow-type aqua storage tank, when the 3rd aqua storage tank 46 that cleans zone 40 fills up, clean in the aqua storage tank 44 in zone 38 overflowing automatically and flowing into second, the water of aqua storage tank 42,44 and 46 be can be recycled, save the consumption of water.
As shown in Figure 4, it is the partial enlarged drawing of Fig. 3, and conveyer belt 24 tops of cleaning device 22 are provided with cylinder 66, and is fixing with the mould 28 that will be sent to cleaning device 22, makes it in cleaning process, and unlikely being dashed of semiconductor package decreased or dashed from cleaning device 22.
Claims (10)
1, a kind of cleaning device of semiconductor package product, one directly is passed to the conveyer belt of cleaning device after making this semiconductor package product through reflow machine, and it is connected with the reflow machine, it is characterized in that: this cleaning device comprises:
More than one cleaning zone, each cleans the zone and comprises an aqua storage tank;
More than one nozzle;
One is used for the water of aqua storage tank is heated to the heater of proper temperature;
One is used for that the water through heating is evacuated to nozzle and by the water plug of the water cleaning semiconductor encapsulating products of nozzle ejection proper temperature.
2, the cleaning device of semiconductor package product as claimed in claim 1 is characterized in that: cleaning device includes one first in regular turn and cleans zone, one second cleaning zone and one the 3rd cleaning zone.
3, the cleaning device of semiconductor package product as claimed in claim 2 is characterized in that: first cleans the water temperature in zone near the temperature through reflow machine semiconductor package product.
4, the cleaning device of semiconductor package product as claimed in claim 1 is characterized in that: the temperature of the semiconductor package product of process reflow machine is a 40-60 ℃ of degree.
5, the cleaning device of semiconductor package product as claimed in claim 2 is characterized in that: the 3rd cleaning zone is provided with one and is used for the direct water guider that imports in the regional aqua storage tank of second cleaning of the water after the 3rd cleaning zone cleaning.
6, the cleaning device of semiconductor package product as claimed in claim 1 is characterized in that: the water that an aqua storage tank overflowed after the aqua storage tank in each cleaning zone was can flow into the overflow-type aqua storage tank in the last aqua storage tank.
7, the cleaning device of semiconductor package product as claimed in claim 1 is characterized in that: this conveyer belt is provided with the fixedly cylinder of semiconductor package product.
8, the cleaning device of semiconductor package product as claimed in claim 1 is characterized in that: can connect a blowing device behind this more than one cleaning zone.
9, the cleaning device of semiconductor package product as claimed in claim 7 is characterized in that: can connect a drying unit behind this blowing device.
10, the cleaning device of semiconductor package product as claimed in claim 1 is characterized in that: the Metal Ball of this semiconductor package product is a ball bar display Metal Ball.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01200541 CN2470952Y (en) | 2001-02-01 | 2001-02-01 | Washing device for semiconductor package product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01200541 CN2470952Y (en) | 2001-02-01 | 2001-02-01 | Washing device for semiconductor package product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2470952Y true CN2470952Y (en) | 2002-01-09 |
Family
ID=33622805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01200541 Expired - Fee Related CN2470952Y (en) | 2001-02-01 | 2001-02-01 | Washing device for semiconductor package product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2470952Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100364060C (en) * | 2005-03-17 | 2008-01-23 | 郑明德 | Cleaning method of semiconductor component |
| CN1824482B (en) * | 2005-02-25 | 2011-07-20 | 株式会社迪斯科 | Cutting device |
| CN104619125A (en) * | 2015-01-15 | 2015-05-13 | 上海铁路通信有限公司 | Selective washing drying device |
| CN105921441A (en) * | 2016-04-27 | 2016-09-07 | 贡享本草（永泰）生物科技有限公司 | High pressure mist spraying cleaning method and device for aoectochilus formosanus |
| CN110614248A (en) * | 2019-09-17 | 2019-12-27 | 苏州晶洲装备科技有限公司 | High-precision constant-temperature liquid storage device and OLED (organic light emitting diode) panel cleaning machine with same |
| CN114054412A (en) * | 2021-11-12 | 2022-02-18 | 江苏华兰药用新材料股份有限公司 | Medicinal material cleaning system |
| CN114289374A (en) * | 2021-12-01 | 2022-04-08 | 深圳市富诺依科技有限公司 | Zero-wastewater environment-friendly steel mesh cleaning process |
-
2001
- 2001-02-01 CN CN 01200541 patent/CN2470952Y/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1824482B (en) * | 2005-02-25 | 2011-07-20 | 株式会社迪斯科 | Cutting device |
| CN100364060C (en) * | 2005-03-17 | 2008-01-23 | 郑明德 | Cleaning method of semiconductor component |
| CN104619125A (en) * | 2015-01-15 | 2015-05-13 | 上海铁路通信有限公司 | Selective washing drying device |
| CN104619125B (en) * | 2015-01-15 | 2017-12-26 | 上海铁路通信有限公司 | A kind of selective cleaning drying device |
| CN105921441A (en) * | 2016-04-27 | 2016-09-07 | 贡享本草（永泰）生物科技有限公司 | High pressure mist spraying cleaning method and device for aoectochilus formosanus |
| CN110614248A (en) * | 2019-09-17 | 2019-12-27 | 苏州晶洲装备科技有限公司 | High-precision constant-temperature liquid storage device and OLED (organic light emitting diode) panel cleaning machine with same |
| CN114054412A (en) * | 2021-11-12 | 2022-02-18 | 江苏华兰药用新材料股份有限公司 | Medicinal material cleaning system |
| CN114054412B (en) * | 2021-11-12 | 2023-08-25 | 江苏华兰药用新材料股份有限公司 | Medicinal material cleaning system |
| CN114289374A (en) * | 2021-12-01 | 2022-04-08 | 深圳市富诺依科技有限公司 | Zero-wastewater environment-friendly steel mesh cleaning process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |