CN2559097Y - Chip size packing bare crystal protecting board on PC board - Google Patents
Chip size packing bare crystal protecting board on PC board Download PDFInfo
- Publication number
- CN2559097Y CN2559097Y CN 02236953 CN02236953U CN2559097Y CN 2559097 Y CN2559097 Y CN 2559097Y CN 02236953 CN02236953 CN 02236953 CN 02236953 U CN02236953 U CN 02236953U CN 2559097 Y CN2559097 Y CN 2559097Y
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- CN
- China
- Prior art keywords
- baffle
- circuit board
- pcb
- printed circuit
- chip scale
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model relates to a chip dimension packaging bare crystal protection board on a printed circuit board. The utility model comprises a printed circuit board provided with a plurality of packaged electronic components connected on the printed circuit board; and a protection board. The protection board is used for protecting the electronic components and is fitted on the printed circuit board, and after the fitting is completed, a plurality of packaged electronic components and the peripheral circuits thereof are completely bare. The chip dimension packaging bare crystal protection board of the utility model can be used as a buffer plate, and when being collided by undeserved external force, the electronic components on the printed circuit board can be protected from not being damaged.
Description
Technical field
The utility model relates to a kind of chip scale package (chip scale package; CSP) protection particularly provides the chip scale package on the printed circuit board (PCB) naked brilliant baffle.
Background technology
In very big type integrated circuit (ULSI) trend, the size of semiconductor element is constantly dwindled, in order to constantly to promote the integration of element on the wafer.After the downsizing along with electronic component dimensions, many new challenges on the manufacture process of integrated circuit, occur, many new challenges not only on the manufacture process of integrated circuit, occur, and with the technology of Chip Packaging also opposite face just before new subject under discussion.As electronic product under the promotion of the fast trend of compact, multi-functional speed, the not only more and more density of the semi-conductive output/input of integrated circuit (IC) (I/O) number are also more and more higher, make that the number of pins of potted element is also more and more thereupon, the requirement of speed is also more and more faster.Based on above-mentioned requirement, the problem of the heat radiation of deriving relatively, the structure of packaging body must be able to be protected chip and the heat that is produced in the chip operation process is shed efficiently.
The pin that utilizes lead frame has not met the demand of above-specified high density output/input as the structural design of the input of signal and output.In addition, ball arranged encapsulation technology (ball grid array is also followed in the encapsulation of high density output/input (I/O); Hereinafter to be referred as BGA encapsulation) development and have breakthrough, therefore, the encapsulation of integrated circuit (IC) semiconductor carrying trends towards utilizing conductive projection (or spheroid) array packages technology (ball grid package; BGA).The characteristics of above-mentioned projection (or spheroid) array packages technology structure dress are, the pin of being responsible for output/input (I/O) is spherical elongate pins than the leaded package element apart from lacking and being difficult for impaired distortion, the short speed of the electrical transmission range of its potted element is fast, can meet at present and the demand of following digital system speed.
In addition, in the encapsulation technology field in the past, input/input (I/O) aluminium pad partly is the surface that is connected to crystal grain, because chip area is limited, output/input (I/O) aluminium pad will limit its aluminium pad number under this limited area.Moreover the spacing of output/input (I/O) aluminium pad is too small will to cause coupling (signal coupling) between signal or the interference between signal.
No matter said integrated circuit (IC) semiconductor is to encapsulate in which way, all must be placed on the printed circuit board (PCB) after the encapsulation.And except integrated circuit component is arranged, also have other electronic component above the general printed circuit board (PCB), therefore,, must add one deck baffle to protect most naked brilliant particles on it in order to protect the naked brilliant particle above the printed circuit board (PCB).In traditional mode, be baffle to be fixed on above the printed circuit board (PCB) with screw or button nail, after fixedly finishing, the naked brilliant particle on the printed circuit board (PCB) is sealed under the baffle fully.Therefore, when improper external force was collided, the electronic component on the carriers for electronic components can be protected and can be not impaired.But because baffle is fixed in after the printed circuit board (PCB), electronic component wherein and its peripheral circuit seal fully, and therefore, the radiating effect of whole electronic component and its peripheral circuit is more undesirable.And the time of the fixed form of traditional protection plate cost is more, and the price of baffle is high too.
In order to protect the naked brilliant particle above the printed circuit board (PCB), to avoid naked brilliant particle to wreck and to shorten regular time.The utility model provides a kind of new baffle and fixed form.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art and defective, provides the chip scale package on a kind of printed circuit board (PCB) naked brilliant baffle.
For achieving the above object, the utility model discloses the naked brilliant baffle of chip scale package on a kind of printed circuit board (PCB), it comprises: a carriers for electronic components has a plurality of electronic components that encapsulated, peripheral circuit and a plurality of input and output interface (port) on this carriers for electronic components; And; one baffle, the thickness of above-mentioned baffle be greater than the thickness of above-mentioned packaged electronic element, and a plurality of open regions are arranged in the baffle; make that a plurality of electronic components that encapsulated and its peripheral circuit expose out fully when baffle is attached on the carriers for electronic components.
The naked brilliant baffle of chip scale package on the printed circuit board (PCB) of the present utility model can be used as a buffer board, and when improper external force was collided, the electronic component on the carriers for electronic components can be protected and can be not impaired.And because baffle is attached at after the carriers for electronic components, and a plurality of electronic components that encapsulated and its peripheral circuit expose out fully, therefore, whole electronic component and its peripheral circuit have preferable radiating effect when element operates.
Description of drawings
Fig. 1 is the naked brilliant baffle schematic diagram of the chip scale package on the existing printed circuit board (PCB);
Fig. 2 is a carriers for electronic components schematic diagram of the present utility model;
Fig. 3 is a baffle schematic diagram of the present utility model; And
Fig. 4 is the naked brilliant baffle schematic diagram of the chip scale package on the printed circuit board (PCB) of the present utility model.
Symbol description among the figure
100 carriers for electronic components, 110 baffles
120 screws, 200 printed circuit board (PCB)s (PCB)
210 inputs and output interface (port)
220 integrated circuits, 230 electric capacity
300 baffles, 310 open regions
The naked brilliant baffle of 400 chip scale package
Embodiment
Describe embodiment of the present utility model in detail below in conjunction with drawings and Examples.
The utility model discloses the naked brilliant baffle of chip scale package on a kind of printed circuit board (PCB), is described in detail as follows, and it is non-in order to limit the utility model that an explanation is only done in described preferred embodiment.
The utility model discloses the naked brilliant baffle of chip scale package on a kind of printed circuit board (PCB), and it comprises: a carriers for electronic components has a plurality of electronic components that encapsulated and a plurality of input and output interface (port) on this carriers for electronic components; And; one baffle, the thickness of above-mentioned baffle be greater than the thickness of above-mentioned packaged electronic element, and a plurality of open regions are arranged in the baffle; make that a plurality of electronic components that encapsulated and its peripheral circuit expose out fully when baffle is attached on the carriers for electronic components.
Figure 1 shows that the naked brilliant baffle schematic diagram of chip scale package on the existing printed circuit board (PCB).As is known to the person skilled in the art, can comprise a plurality of electronic components that encapsulated and a plurality of input and output interface (port) on the carriers for electronic components 100, this carriers for electronic components 100 can the two sides carrying.And baffle 110 is fixed on the carriers for electronic components 100, and it utilizes screw 120 that baffle 110 is fixed on the carriers for electronic components 100.Above-mentioned electronic component can comprise active member and passive device, and wherein active member for example is an integrated circuit, and passive device for example is an electric capacity.Baffle 110 materials can be plastics, and carriers for electronic components 100 for example is printed circuit board (PCB) (PCB).Figure 2 shows that carriers for electronic components schematic diagram of the present utility model.Its carriers for electronic components 200 is the same with the carriers for electronic components 100 of Fig. 1, and this carriers for electronic components 200 can the two sides carrying.Carriers for electronic components 200 for example is printed circuit board (PCB) (PCB), and printed circuit board (PCB) (PCB) 200 can comprise a plurality of electronic components that encapsulated and a plurality of input and output interface (port) 210.Above-mentioned electronic component can comprise active member and passive device, and wherein active member for example is an integrated circuit 220, and passive device for example is an electric capacity 230.
Figure 3 shows that baffle schematic diagram of the present utility model.The effect of baffle 300 is in order to protect all naked brilliant particles of chip scale package (CSP) on printed circuit board (PCB); make it reduce the infringement of the naked brilliant particle that is produced because of external force, collision; the material of baffle 300 can comprise: paper fibre (fiber), bakelite, glass fibre, all types of plastic materials such as (containing engineering plastics); the shape of baffle 300 changes with the shape of printed circuit board (PCB), for example is rectangle.And the production method of baffle 300 can comprise: methods such as punching press, injection mo(u)lding.Baffle can high temperature resistant and high pressure, and for example baffle also can not lose the function of its protection under temperature-25 ℃～125 ℃ situation.In addition, the lacquer that baffle 300 top can be sprayed different colours to be increasing attractive in appearance and sense of worth, or stamps the circuit part drawing.And the thickness of baffle 300 must make that baffle 300 can touch external force earlier, and avoids naked brilliant particle directly to contact external force when external force contacts greater than the thickness of above-mentioned packaged electronic element; Baffle 300 thickness can increase and decrease thickness for 1.1～1.2 millimeters (mm) or with the thickness of protected element.In addition, baffle 300 designs have open region 310, and wherein open region 310 is to be used for holding above-mentioned integrated circuit and the naked brilliant particle of electric capacity.So baffle 300 designs make that a plurality of naked brilliant particles that encapsulated and its peripheral circuit expose out fully when baffle 300 is attached on the printed circuit board (PCB).Wherein edge is relatively to be fit to more than above-mentioned electronic component about 20 microns (um) within the open region 310.
Figure 4 shows that the naked brilliant baffle schematic diagram of chip scale package on the printed circuit board (PCB) of the present utility model.The naked brilliant baffle 400 of chip scale package of the present utility model is that the printed circuit board (PCB) 200 of Fig. 2 and the baffle 300 of Fig. 3 are combined.Above-mentioned combination can for: directly baffle 300 is pasted on the printed circuit board (PCB) 200, in a glue mode baffle 300 being pasted and on the printed circuit board (PCB) 200 or with screw and button nail baffle 300 is being fixed on the printed circuit board (PCB) 200 with gum.If this printed circuit board (PCB) 200 two sides carrying electronic component, then the two sides all must use baffle 300 to paste or fix.With time cost, the first two kind mode is more desirable than the third party.Owing in the baffle 300 open region 310 is arranged, makes that a plurality of naked brilliant particles that encapsulated and its peripheral circuit can expose out fully when baffle 300 is attached on the printed circuit board (PCB) 200.In addition, after the naked brilliant baffle of chip scale package added, in the SODIMM module, its gross thickness must not be greater than 3.8 millimeters (mm).
Of the present utility model one is characterized as and can selects several different fixed forms, and as mentioned above: directly gum pastes, puts that gluing pastes or fixing with the button nail with screw, wherein follow closely the mode of fixing with screw and button and traditional fixed form similar.And the mode of gluing subsides is pasted, put to direct gum except shortening the manufacturing time, and the material of baffle itself is cheaply more many than traditional baffle, therefore, can save the manufacturing cost of the naked brilliant baffle of many chip scale package.In addition, gum of the present utility model is pasted repeatedly to repeat to tear and is pasted, and when making things convenient for individual die or element that fault is arranged, can reuse by the processing of surface mount machine (SMT).
Moreover the naked brilliant baffle of chip size packages of the present utility model can be used as a buffer board, and when improper external force was collided, the electronic component on the carriers for electronic components can be protected and can be not impaired.And because baffle is attached at after the carriers for electronic components, a plurality of electronic components that encapsulated and its peripheral circuit expose out fully, therefore, can promote the radiating effect of whole electronic component and its peripheral circuit.
The utility model with preferred embodiment explanation as above and is familiar with this art person, and in not breaking away from spiritual scope of the present utility model, when doing a little change retouching, its protection range more ought be decided with claims.
Claims (10)
1. the naked brilliant baffle of chip scale package on the printed circuit board (PCB) is characterized in that, comprises:
One carriers for electronic components has a plurality of electronic components that encapsulated, peripheral circuit and a plurality of input and output interface (port) on this carriers for electronic components; And
One baffle; the thickness of this baffle is greater than the thickness of these a plurality of packaged electronic elements; a plurality of open regions not of uniform size are arranged in this baffle, make that when this baffle was engaged on this carriers for electronic components, these a plurality of electronic components that encapsulated and its peripheral circuit can expose out fully.
2. the naked brilliant baffle of the chip scale package on the printed circuit board (PCB) as claimed in claim 1 is characterized in that this carriers for electronic components comprises printed circuit board (PCB) (PCB).
3. the naked brilliant baffle of the chip scale package on the printed circuit board (PCB) as claimed in claim 1 is characterized in that this electronic component comprises: active member and passive device, and wherein this active member is an integrated circuit for example, and this passive device for example is an electric capacity.
4. the naked brilliant baffle of the chip scale package on the printed circuit board (PCB) as claimed in claim 1 is characterized in that, this baffle can also can not lose its function under temperature-25 ℃～125 ℃ of situations.
5. the naked brilliant baffle of the chip scale package on the printed circuit board (PCB) as claimed in claim 1 is characterized in that this baffle thickness is decided on protected component thickness, for example is 1.1～1.2 millimeters (mm).
6. the naked brilliant baffle of the chip scale package on the printed circuit board (PCB) as claimed in claim 1 is characterized in that, after the naked brilliant baffle of this chip scale package added, in the SODIMM module, its gross thickness must not be greater than 3.8 millimeters (mm).
7. the naked brilliant baffle of the chip scale package on the printed circuit board (PCB) as claimed in claim 1 is characterized in that, this baffle is paper fibre (fiber), bakelite, glass fibre or all types of plastic (comprising engineering plastics).
8. the naked brilliant baffle of the chip scale package on the printed circuit board (PCB) as claimed in claim 1 is characterized in that the production method of this baffle is punching press or ejection formation.
9. the naked brilliant baffle of the chip scale package on the printed circuit board (PCB) as claimed in claim 1 is characterized in that the shape of this baffle changes with the shape of this printed circuit board (PCB), for example is rectangle.
10. the naked brilliant baffle of the chip scale package on the printed circuit board (PCB) as claimed in claim 1 is characterized in that, this juncture is that gluing subsides or fixing with screw and button nail are pasted, put to direct gum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02236953 CN2559097Y (en) | 2002-06-07 | 2002-06-07 | Chip size packing bare crystal protecting board on PC board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02236953 CN2559097Y (en) | 2002-06-07 | 2002-06-07 | Chip size packing bare crystal protecting board on PC board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2559097Y true CN2559097Y (en) | 2003-07-02 |
Family
ID=33711052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02236953 Expired - Lifetime CN2559097Y (en) | 2002-06-07 | 2002-06-07 | Chip size packing bare crystal protecting board on PC board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2559097Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106028649A (en) * | 2016-07-28 | 2016-10-12 | 广东欧珀移动通信有限公司 | Circuit board of mobile terminal and mobile terminal with the same |
-
2002
- 2002-06-07 CN CN 02236953 patent/CN2559097Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106028649A (en) * | 2016-07-28 | 2016-10-12 | 广东欧珀移动通信有限公司 | Circuit board of mobile terminal and mobile terminal with the same |
| CN106028649B (en) * | 2016-07-28 | 2019-02-12 | Oppo广东移动通信有限公司 | The circuit board of mobile terminal and mobile terminal with it |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: YUPEI SCIENCE CO., LTD. Free format text: FORMER NAME OR ADDRESS: YUPEI SCI. + TECH. CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Patentee after: Yupei Science & Technology Co., Ltd. Patentee before: Yupei Science and Technology Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20120607 Granted publication date: 20030702 |