CN2443423Y - Radiator for notebook computer - Google Patents
Radiator for notebook computer Download PDFInfo
- Publication number
- CN2443423Y CN2443423Y CN 00242573 CN00242573U CN2443423Y CN 2443423 Y CN2443423 Y CN 2443423Y CN 00242573 CN00242573 CN 00242573 CN 00242573 U CN00242573 U CN 00242573U CN 2443423 Y CN2443423 Y CN 2443423Y
- Authority
- CN
- China
- Prior art keywords
- heat
- heat conductor
- transfer medium
- conductor
- notebook computer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a radiator for a notebook computer, comprising a heat conductor, a heat transfer medium and at least one net-shaped tube. At least two hollow main channels are formed in the heat conductor, and at least one connecting channel is connected between the main channels. One end of the bottom surface of the heat conductor is contacted with a heat source, and the other end of the bottom surface of the heat conductor can realize heat exchange and heat extraction. A fluxible heat-transfer medium is filled into the space of the connecting channel and the main channels of the heat conductor. The net-shaped tube is arranged in the connecting channel and the main channels of the heat conductor in order to realize the heat absorption and the vaporization of the heat transfer medium in a high temperature point. Then, the heat transfer medium can move to a low temperature point via the main channels or the connecting channel in the heat conductor. The liquid state of the heat transfer medium can be realized through heat release and condensation at a low temperature point, and the heat transfer medium in a liquid state can be sucked back to the high temperature point along the net-shaped tube in order to form circulation conduction of heat in a two-dimensional surface mode.
Description
The utility model relates to a kind of heat abstractor of notebook computer.
Because the notebook computer product has compact, the advantage that portability is high, be a kind of popular gradually computer product, and its inner electronic component still precision and dense degree are quite not high, purpose is meeting the market demand of this series products, yet, design for fear of the notebook computer close packed structure, its heat dissipation problem seems even more important, especially now the CPU (central processing unit) (CPU) in the notebook computer has the trend towards the higher frequency running, thus the radiating efficiency of heat abstractor good corrupt will be a key factor that determines this notebook computer product stability in use.
As shown in Figure 1, it is the heat abstractor synoptic diagram of known a kind of notebook computer, it mainly has a heat conductor 11, in order to contact a thermal source 20 (being CPU (central processing unit) herein), and be connected in this heat conductor 11 with a heat pipe 12 1 ends, the other end then is connected in a radiating fin group 13, utilizes this heat pipe 12 that heat is guided to this radiating fin group 13 and can be carried out heat interchange with the extraneous air of notebook computer by this heat conductor 12, reduces the temperature of this thermal source 20 whereby.
Yet with above-mentioned heat abstractor, basically adopt the one dimension mode to be dispelled the heat, promptly the heat of this thermal source 20 is followed this heat pipe 12 and is conducted to this radiating fin group 13 by this heat conductor 11, relend by this radiating fin group 13 and air and carry out heat interchange, can be aided with radiator fan in case of necessity with enhance heat, therefore heat is to be conducted with single direction by this thermal source 20, and mainly with this heat pipe 12 as heat conducting passage, since this heat pipe 12 and heat conductor 11 and radiating fin group 13 are different materials be bonded with each other form, will produce thermal contact resistance to each other, and be enough to make radiating efficiency to be had a greatly reduced quality, and in order to keep the compact architectural feature of whole notebook computer, so it almost is impossible improving radiating efficiency in the mode that increases area of dissipation, therefore, in case when using the CPU (central processing unit) of working at high speed more, above-mentioned heat abstractor can't efficiently radiates heat, and the not enough problem of running stability is arranged.
The purpose of this utility model provides a kind of heat abstractor of significantly promoting the notebook computer of radiating efficiency with two-dimensional approach conduction heat.
The heat abstractor of notebook computer of the present utility model, its characteristics are: have an inside and be formed with the main channel of at least two hollows and be provided with the heat conductor that a connection channel links to each other between this main channel at least, this heat conductor bottom surface one end in contact thermal source, the other end can carry out heat interchange and heat extraction, make in the space of the main channel of this heat conductor and interface channel and be filled with flowable liquid heat transfer medium, and in the main channel of this heat conductor and interface channel, be provided with netted pipe, can make this heat transfer medium in this heat conductor main channel and interface channel internal cause high temperature place heat absorption and vaporize, and condense in the heat release of low temperature place, and then between the cold and hot end of this heat conductor, flow, compared to known heat abstractor, not only reduce the thermal contact resistance between different medium, more the configuration because of two-dimentional pipeline makes hot transmission two-dimentional direction to be transmitted toward the low temperature place by the high temperature place, make heat distribution more average, and then improve its radiating efficiency.
Be elaborated below by most preferred embodiment and accompanying drawing heat abstractor to notebook computer of the present utility model, in the accompanying drawing:
Fig. 1 is the heat abstractor synoptic diagram of known a kind of notebook computer;
Fig. 2 is a preferred embodiment structural representation of the present utility model;
Fig. 3 is a preferred embodiment combination diagrammatic cross-section of the present utility model;
Fig. 4 is a preferred embodiment conductive force synoptic diagram of the present utility model;
Please refer to Fig. 2 and shown in Figure 3, is the structural representation of a preferred embodiment of the heat abstractor of notebook computer of the present utility model; It consists predominantly of a heat conductor 31, a heat transfer medium 32 and two netted pipes 33; Wherein:
This heat conductor 31 can be the good aluminum metal of thermal conductivity and makes, make an end of its bottom surface can contact thermal source 40 just like CPU (central processing unit), the other end then can carry out heat interchange with air and hot type is removed, and an end that carries out heat interchange can be formed with a plurality of radiating fins 311, and the inside of this heat conductor 31 has the main channel 312 of at least two hollows, it is shown the mode that is parallel to each other and keeps at a certain distance away greatly and disposes, and its direction is to extend to the end of this heat conductor 31 in order to heat extraction by the end that this heat conductor 31 contacts thermals source 40, and 312 of this two main channels are provided with more than one interface channel 313 and link to each other, this interface channel 313 is to be connected 312 of two main channels with the direction perpendicular to this main channel 312, and in the middle of the present embodiment, this heat conductor 31 and main channel 312 thereof, the mode that interface channel 313 is shaped can adopt two corresponding half housings 310 that produce in the die casting mode, 310 ' the mode that makes up is mutually reached, make this half housing 310, be reserved with the depressed part of symmetry on 310 ' the relative faying face, can form main channel 312 and interface channel 313 in the heat conductor 31 after the combination, in addition, specific location at this heat conductor 31 is provided with a filling runner 314, can connect main channel 312 and interface channel 313 formed spaces outside and this heat conductor 31.
This heat transfer medium 32 can be the liquid pure water or the condensing agent of tool heat-absorbing action, can insert in the main channel 312 and interface channel 313 formed spaces of this heat conductor 31 by above-mentioned filling runner 314, and in this main channel 312 or 313 of interface channels flow and conduct heat.
This netted pipe 33 can be copper product and makes, it is netted that its tube wall is hollow out, can be embedded in the main channel 312 and interface channel 313 of this heat conductor 31, in order to form a capillarity, the direction that makes this heat transfer medium 32 can follow this netted pipe 33 is flowed to the high temperature place by the low temperature place, makes heat conduct to this heat conductor 31 rapidly fifty-fifty.
During applied in any combination, can be simultaneously with reference to Fig. 3 and Fig. 4; This netted pipe 33 is 2 half housings 310 that are embedded in this heat conductor 31 in advance, in the space of 310 ' main channel of being reserved 312 and interface channel 313,2 half housings 310 at this heat conductor 31,310 ' the marginal position that combines face is sentenced tinfoil paper material 315 and is welding medium, after in vacuum drying oven, utilizing the mode of vacuum brazing that this tinfoil paper material 315 is melted with this 2 half housing 310,310 ' in conjunction with also sealing, and after making this main channel 312 and interface channel 313 bleed the formation vacuum by this filling runner 314, by this filling runner 314 this heat transfer medium 32 is packed in this main channel 312 and the interface channel 313, should fill runner 314 again and seal and make this heat transfer medium 32 unlikely leaking outside, and cause this main channel 312 and interface channel 313 to become the pipeline of a complete closed; Whereby, this heat transfer medium 32 can flow in this main channel 312 and interface channel 313, when heat conductor 31 bottom surfaces one end raises because of contacting these thermal source 40 temperature, the other end is then because of having radiating fin 311 can carry out the heat interchange heat extraction and make temperature relatively low the time, heat transfer mediums 32 in this heat conductor 31 are positioned at the high end of temperature and promptly are vaporizated into gas and absorb heat, flow toward the low end of these heat conductor 31 temperature and follow this main channel 312 or interface channel 313, when heat transfer medium 32 then is condensed into liquid state and heat release at the low temperature place, and the thermal medium 32 of liquid state is drawn go back to the high temperature place by netted pipe 33, so will be different from the heat transfer that known heat abstractor adopts heat pipe one-dimensional linear direction, and the heat transfer type of formation two-dimensional surface, can dispel the heat efficiently, and then make thermal source 40 keep normal working temperature, improve the stability of its running.
Disclose as can be known via above, the utility model mainly is to comprise a heat conductor, a heat transfer medium and at least one netted pipe, this heat conductor inside is formed with the main channel of at least two hollows, being provided with interface channel between this two main channel links to each other, make and be filled with a flowable heat transfer medium in it, and in the main channel of this heat conductor and interface channel, be embedded with a netted pipe; Its advantage is: the design of main channel and interface channel in this heat conductor, and the heat transfer medium that can in this main channel and interface channel, flow, make the heat that thermal source produced conduct rapidly in the mode of two-dimensional surface, and its also can avoid known heat pipe must be connected with heat conductor the thermal resistance that engages of the different materials that produces, can significantly promote radiating efficiency, promote the stability of notebook computer running.
Claims (5)
1. the heat abstractor of a notebook computer includes a heat conductor, and is filled in the interior heat transfer medium of this heat conductor and at least one netted pipe that is arranged in this heat conductor, it is characterized in that:
This heat conductor, its inside is formed with the main channel of at least two hollows, is provided with a connection channel between this main channel at least and links to each other;
This heat transfer medium is the condensing agent of liquid state, in the main channel and the formed space of interface channel of inserting this heat conductor;
This netted pipe can be imbedded in the main channel or interface channel of this heat conductor.
2. the heat abstractor of notebook computer as claimed in claim 1, it is characterized in that: this heat conductor can be 2 half housing be combined intos.
3. the heat abstractor of notebook computer as claimed in claim 1 is characterized in that: bottom surface one end of this heat conductor is contact one thermal source, and the other end is formed with at least one radiating fin.
4. the heat abstractor of notebook computer as claimed in claim 1, it is characterized in that: two main channels of this heat conductor can be the configuration that is parallel to each other and has a spacing distance, and this interface channel then connects between two main channels with the direction perpendicular to this main channel.
5. the heat abstractor of notebook computer as claimed in claim 1, it is characterized in that: this heat transfer medium is liquid pure water.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 00242573 CN2443423Y (en) | 2000-08-14 | 2000-08-14 | Radiator for notebook computer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 00242573 CN2443423Y (en) | 2000-08-14 | 2000-08-14 | Radiator for notebook computer |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2443423Y true CN2443423Y (en) | 2001-08-15 |
Family
ID=33602680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 00242573 Expired - Fee Related CN2443423Y (en) | 2000-08-14 | 2000-08-14 | Radiator for notebook computer |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2443423Y (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102052870B (en) * | 2009-10-28 | 2015-07-15 | 杨泰和 | Heat conduction principle and device of cross structures with different heat characteristics |
CN109634395A (en) * | 2019-02-01 | 2019-04-16 | 汉中市中心医院 | A kind of heat radiator of computer CPU |
-
2000
- 2000-08-14 CN CN 00242573 patent/CN2443423Y/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102052870B (en) * | 2009-10-28 | 2015-07-15 | 杨泰和 | Heat conduction principle and device of cross structures with different heat characteristics |
CN109634395A (en) * | 2019-02-01 | 2019-04-16 | 汉中市中心医院 | A kind of heat radiator of computer CPU |
CN109634395B (en) * | 2019-02-01 | 2022-05-17 | 汉中市中心医院 | Computer CPU heat abstractor |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100517665C (en) | Heat-pipe radiating apparatus | |
CN203163564U (en) | Loop gravity assisted heat pipe heat transfer device provided with flat plate type evaporator | |
CN201726630U (en) | Heat conducting pipe bridging structure and radiating module thereof | |
CN203276154U (en) | Efficient heat dissipation device of computer CPU | |
CN103206805A (en) | Semiconductor refrigerating device | |
CN110035642A (en) | A kind of liquid-cooled heat-conducting block and water-cooling type radiator | |
CN2485699Y (en) | Phase changing heat radiator for fanless desk computer | |
WO2023010836A1 (en) | Heat dissipation module and electronic device | |
CN203298523U (en) | Semiconductor refrigeration device | |
CN2443423Y (en) | Radiator for notebook computer | |
CN1842265B (en) | Heat pipe radiator | |
CN204042816U (en) | A kind of LED radiator based on vapor chamber heat dissipation technology | |
CN210773598U (en) | Steam cavity heat abstractor | |
CN1804756A (en) | Pulsating type heat transmission device | |
CN111664733A (en) | Heat radiator combining micro-channel heat exchanger with heat pipe | |
CN201306960Y (en) | High-power loop type heat pipe radiating device | |
CN201532140U (en) | Circular thermosiphon loop heat pipe radiator | |
CN2389343Y (en) | Heat-pipe fin integrated radiator | |
CN2834121Y (en) | Remote forced liquid-cooled micro-grooves phase change heat radiation system | |
CN2882205Y (en) | Adhesive sheet contact thermal conduction type heat pipe radiator | |
CN2443424Y (en) | Low-heat resistance radiator for notebook computer | |
CN2543122Y (en) | Heat Pipe radiator | |
CN2865211Y (en) | Radiator specially for electronic component | |
CN108614627B (en) | Fin-superconducting heat pipe integrated heat radiator for CPU | |
CN208171080U (en) | Efficient microchannel heat sink based on hot pipe technique |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |