CN2422727Y - Radiator with heat-conducting pipe - Google Patents

Radiator with heat-conducting pipe Download PDF

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Publication number
CN2422727Y
CN2422727Y CN 00206990 CN00206990U CN2422727Y CN 2422727 Y CN2422727 Y CN 2422727Y CN 00206990 CN00206990 CN 00206990 CN 00206990 U CN00206990 U CN 00206990U CN 2422727 Y CN2422727 Y CN 2422727Y
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CN
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Prior art keywords
heat
heat sink
base
heat transfer
fins
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CN 00206990
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Chinese (zh)
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谢发光
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讯凯国际股份有限公司
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Abstract

The utility model relates to a radiator with heating conducting pipes. The utility model comprises a base which can contact the top surface of a central processing unit, the base is connected with a plurality of U-shaped heat conducting pipes which are quick in heat conduction, and each heat conducting pipe is respectively connected in series with a plurality of radiating fins which are stacked; the outer part of the base, the heat conducting pipes and the radiating fins is provided with a radiating seat, and one side end of the radiating seat is provided with a small-size fan; the radiator can be fastened on the central processing unit by a fastener, heat generated by the central processing unit can be quickly radiated by the base, the heat conducting pipes, the radiating fins and the radiating seat, and the small-size fan can quickly blow away the heat. The utility model has the advantage of high radiating efficiency and can achieve the purpose of preventing the central processing unit from excessive heating.

Description

具导热管的散热器 With heat pipe radiator

本实用新型为一种散热器,特别是一种具导热管的散热器。 The present invention as a heat sink, especially a heat sink having a heat pipe.

现今计算机中使用的中央处理器,由于厂家持续推陈改良,不但在外观上有着种种不同尺寸形状的区分,在运作效率上亦不断提升。 Today the central processor used in computers, manufacturers continued to push Chen improvement, not only for all its size and shape to distinguish between different in appearance, on the operational efficiency also continues to improve. 新的中央处理器的出现除了在功能、速度与规格上较为优越,其外型亦往往与旧款大不相同。 The emergence of new central processor in addition to the more superior in functionality, speed and size, its shape is also often very different from the old. 一般说来,新型中央处理器芯片在面积上通常越来越小,但因为运作效率越来越高,运作时因为功率消耗而产生的热量也因为越来越快速累积而较难散发。 In general, the new central processor chip is usually smaller and smaller in size, but because of increasing operational efficiency, because power consumption during operation of the heat generated is also because more and more difficult to quickly accumulate and distribute.

而一部计算机是否能正常工作,取决于计算机的中央处理器是否能够稳定运作。 And if a computer can work, depending on whether the computer's central processor is capable of stable operation. 若中央处理器的运作热量不断累积,安装在中央处理器上的散热器却无法及时将热量导出且快速发散,中央处理器即会发生过热现象。 If the operation of the central processor to accumulate heat, heat sink mounted on the central processor has not been able to heat away and quickly diverge, the central processor that is overheating will occur. 一旦过热,轻微者会造成计算机死机,严重者会造成中央处理器烧毁。 Once hot, mild cases can cause computer crashes, serious cases can cause central processor burned. 由此可见,若不防止中央处理器的过热现象,计算机因为容易死机而不能正常工作,将会致使生产力大幅降低,导致许多有形及无形的损失。 Thus, if the central processor to prevent overheating of the computer because it is easy to crash was not working properly, it will cause significantly reduce productivity, resulting in many tangible and intangible losses. 尤其对于新一代的高速计算机,本导热管散热器的超高散热效率,将是其持续在高速下正常工作的重要关键。 Especially for a new generation of high-speed computers, this ultra-high heat dissipation efficiency of the thermally conductive radiator tube, which is the key to high speed continuously in the normal operation.

一般传统的中央处理器散热结构为在其上以扣具扣合具有若干鳍片状的散热片,通过该散热片可将中央处理器上的热量散发出去,以维持计算机的正常运作。 Usually traditional central processor cooling structure in clip-like engaging with a plurality of fins on the heat sink, through which heat from the fin on the central processor can be dissipated to maintain the normal operation of the computer. 但是上述的构造却有着如下的缺点:因鳍片状的散热片,其热传效果较为有限,无法达到快速散热的目的,故无法使中央处理器达到快速降温的目的,故该种鳍片状的散热片的散热效率不佳,极易因中央处理器不能被迅速降温而使计算机因过热而发生故障。 However, the above-described configuration but has the following disadvantages: due to the fin-shaped fins, the heat transfer effect is more limited, rapid cooling can not be achieved, so that the central processor can not achieve rapid cooling, so that the fin-like species poor heat dissipation efficiency of the fins, the central processor can not be vulnerable to rapid cooling of the computer failure due to overheating.

本实用新型的主要目的在于提供一种具导热管的散热器,本实用新型可使中央处理器所散发出的热快速地散发,并将热吹散。 The main object of the present invention is to provide a heat pipe having a heat sink, the present invention allows the central processor sends out quickly dissipate heat, and the hot blown. 从而防止中央处理器过热而发生故障的现象。 Thereby preventing overheating phenomenon central processor failure.

实现本实用新型目的的技术方案是一种具导热管的散热器,其中包括有:一可与计算机内部中央处理器的顶面接触的金属制底座,底座上固设数支导热管,各导热管间分别串接堆栈数片呈平板状的金属制散热片,底座、导热管、散热片的外部设有一金属制散热座,散热座、散热片及底座的一侧端部设有一小型风扇,该小型风扇所吹出的风可吹向底座、导热管、散热片及散热座;散热座的两侧面底部分别形成有一孔,底座上位于散热座的两孔间可设置一扣件横向穿设,并可通过扣件将散热器稳固地扣合固定于计算机内部的中央处理器固定座上。 The object of the present invention achieve technical means is a heat pipe having a heat sink, which comprises: a metal base may be in contact with the top surface inside the computer's central processor, count the heat transfer tube is fixed on the base, each heat transfer between the pipes are connected in series the number of sheets stacked flat plate-shaped metal heat dissipating fin, the base, the heat transfer tubes, the fins of a small fan is provided with an outer metallic heat sink, the heat sink, one end portion of the fin and the base is provided, this small air blown by the fan can blow the base, the heat transfer tubes, the fins and the heat sink; heat sink bottom side surfaces are formed with a hole, a fastener may be provided on the base of the heat sink is located between two transverse bored hole, and through the heat sink fastener engaging firmly fixed to the holder inside the central processing computer.

如上所述的具导热管的散热器,各散热片呈平板状。 A heat sink having a heat transfer tube as described above, each of the flat plate-like fins.

如上所述的具导热管的散热器,各散热片呈波浪状。 A heat sink having a heat transfer tube as described above, each of the wavy fins.

如上所述的具导热管的散热器,导热管呈U型。 A heat sink having heat transfer tube as described above, the U-shaped heat transfer tubes.

如上所述的具导热管的散热器,散热座呈型。 A heat sink having a heat transfer tube as described above, the heat sink was  type.

经由以上的说明可知本实用新型至少具有如下的优点:可以使热量迅速散出,而不会过度集中聚积于中央处理器上,且散热效率高,可以防止中央处理器发生过热而损坏的问题。 The heat dissipated can quickly, without excessive concentration accumulated on the central processor, and a high heat dissipation efficiency, the central processor can be prevented from overheating and damage problems: the present invention has at least the following advantages can be seen through the above description.

以下结合附图进一步说明本实用新型的技术特征及目的。 The following description of the present invention together with further features and objects of technical drawings.

图1是本实用新型的立体外观图。 Figure 1 is a perspective external view of the invention.

图2是本实用新型的前视图。 FIG 2 is a front view of the present invention.

图3是本实用新型的侧视图。 FIG 3 is a side view of the present invention novel.

图4是本实用新型的另一较佳实施例的前视图。 FIG 4 is a front view of a further novel embodiment of the present invention preferred embodiment.

请参阅图1至3所示。 Please refer to FIGS. 1 to 3. 本实用新型为一种具导热管的散热器,其包括有:一可与计算机内部中央处理器的顶面接触的金属制底座10,底座10上以固定片11固设有数支金属制U型且热传迅速的导热管20,各导热管20间分别串接堆栈数片呈平板状的金属制散热片21,底座10、导热管20、散热片21的外部设有一呈型的金属制散热座30,散热座30、散热片21及底座10的一侧端部设有一小型风扇40,该小型风扇40所吹送出的风可吹向底座10、导热管20、散热片21及散热座30处,以使中央处理器所散发出的热可以顺利的被导出;散热座30的两侧面底部分别形成有一孔31,底座10上于散热座30相对的两孔31之间可设置一扣件32横向穿设,并可通过扣件32将本实用新型中的散热器稳固地扣合固定于计算机内部的中央处理器固定座上,以防止发生不当松脱的现象。 The present invention as a heat sink having a heat pipe, which comprising: a metal base may be in contact with the top surface inside the computer central processing unit 10, the base 10 fixed to a fixed plate 11 is provided with a metal U-count rapid heat transfer and heat transfer tubes 20, heat transfer tubes 20 of each series are stacked several sheets of flat plate-like metal heat sink 21, the base 10, the heat transfer tubes 20, 21 is provided with external fins form a shaped metallic  heat sink 30, cooling block 21 side end portion 30, and the heat sink base 10 is provided with a small fan 40, the fan blowing out the compact 40 can wind blown base 10, heat transfer tubes 20, the fins 21 and the heat sink 30, so that the heat emitting central processor may be smoothly exported; bottom side surfaces of each heat sink 30 has a hole 31 formed on the base 10 to the heat sink 30 may be disposed opposite the two holes 31 between a buckle a transverse member 32 is disposed through, and through the fastener 32 of the present invention a radiator engaging firmly fixed to the holder inside the central processing computer, to prevent unauthorized loosening phenomenon.

上述部件组合使用时,中央处理器上所散发出的热量经由底座10、数支热传迅速的导热管20、数片相互堆栈的散热片21及散热座30快速的将热导通,通过小型风扇40的吹风作用,可将热迅速地带走,因而可以达到快速散热的目的,并有着散热效率较佳的优点,以防止中央处理器因过热而发生无法正常运作的问题。 When used in combination the above-described member, the central processing unit via the heat emitted by the base 10, heat transfer count rapid heat transfer tubes 20, the number of sheets of each stack 21 and the heat sink fins 30 rapid heat conduction, through a small blowing effect of the fan 40, the heat may be rapidly carried away, it is possible to achieve rapid heat dissipation, and has the advantage of better heat dissipation efficiency, in order to prevent the central processor due to overheating problems occur not functioning.

再如图4中所示,其为本实用新型的另一较佳实施例的前视图。 Then, as shown in FIG. 4, which present a front view of another preferred embodiment of the novel utility. 该图中显示出各片散热片21可成型为波浪状的散热片21。 The figure shows each of the fins 21 may be molded into the corrugated fins 21. 通过该种波浪状的散热片21同样亦可达到相同于图1至3中所示的散热器的实用功效。 With this kind of corrugated fins 21 of the same heat sink can achieve the same shown in FIG. 1 to 3 practical effect.

Claims (5)

  1. 1. 1. 一种具导热管的散热器,其特征在于包括有:一可与计算机内部中央处理器的顶面接触的金属制底座,底座上固设数支导热管,各导热管间分别串接堆栈数片呈平板状的金属制散热片,底座、导热管、散热片的外部设有一金属制散热座,散热座、散热片及底座的一侧端部设有一小型风扇,该小型风扇所吹出的风可吹向底座、导热管、散热片及散热座,散热座的两侧面底部分别形成有一孔,底座上位于散热座的两孔间可设置一扣件横向穿设,并可通过扣件将散热器稳固地扣合固定于计算机内部的中央处理器固定座上。 One kind of heat pipe having a heat sink, characterized by comprising: a metal base may be in contact with the top surface inside the computer's central processor, count the heat transfer tube is fixed on the base, each of the heat transfer tubes are connected in series between the operand stack the outer sheet metal flat plate-shaped fins, the base, the heat transfer tubes, the fins are provided a wind metallic heat sink, the heat sink, one end portion of the fin and the base is provided with a fan, the fan blowing small can be blown to the base, the heat transfer tubes, the fins and the heat sink, the heat sink bottom side surfaces are formed with a hole, a fastener may be disposed transversely disposed through the heat sink is located between the two holes on the base, and through the heat sink fastener engaging firmly fixed to the holder inside the central processing computer.
  2. 2. 2. 根据权利要求1所述的具导热管的散热器,其特征在于:各散热片呈平板状。 The heat sink with a heat transfer tube according to claim, wherein: each of the flat plate-like fins.
  3. 3. 3. 根据权利要求1所述的具导热管的散热器,其特征在于:各散热片呈波浪状。 The heat sink with a heat transfer tube according to claim, wherein: each of the wavy fins.
  4. 4. 4. 根据权利要求1所述的具导热管的散热器,其特征在于:导热管呈U型。 The heat sink with a heat transfer tube according to claim, characterized in that: U-shaped heat transfer pipe.
  5. 5. 5. 根据权利要求1所述的具导热管的散热器,其特征在于:散热座呈型。 The heat sink with a heat transfer tube according to claim, wherein: the heat sink was  type.
CN 00206990 2000-05-12 2000-05-12 Radiator with heat-conducting pipe CN2422727Y (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1310317C (en) * 2002-09-25 2007-04-11 株式会社日立制作所 Electronic device having cooling mechanism
CN100423890C (en) 2005-11-03 2008-10-08 华虹精密股份有限公司 Method of molding radiator, and locative structure
CN100447989C (en) 2005-05-18 2008-12-31 新灯源科技有限公司 Integrated circuit packaging and manufacturing method
CN101201676B (en) 2006-12-15 2010-05-19 富准精密工业(深圳)有限公司;鸿准精密工业股份有限公司 Radiating device
US7948767B2 (en) 2005-05-06 2011-05-24 Neobulb Technologies, LLP. Integrated circuit packaging structure and method of making the same
CN101526200B (en) 2008-03-06 2013-05-29 三星电子株式会社 LED illumination device and radiating member thereof
CN106225509A (en) * 2016-07-29 2016-12-14 全椒赛德利机械有限公司 Inner liquid duct flow increasing flat radiator and manufacturing process thereof

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1310317C (en) * 2002-09-25 2007-04-11 株式会社日立制作所 Electronic device having cooling mechanism
US7948767B2 (en) 2005-05-06 2011-05-24 Neobulb Technologies, LLP. Integrated circuit packaging structure and method of making the same
CN100447989C (en) 2005-05-18 2008-12-31 新灯源科技有限公司 Integrated circuit packaging and manufacturing method
CN100423890C (en) 2005-11-03 2008-10-08 华虹精密股份有限公司 Method of molding radiator, and locative structure
CN101201676B (en) 2006-12-15 2010-05-19 富准精密工业(深圳)有限公司;鸿准精密工业股份有限公司 Radiating device
CN101526200B (en) 2008-03-06 2013-05-29 三星电子株式会社 LED illumination device and radiating member thereof
CN106225509A (en) * 2016-07-29 2016-12-14 全椒赛德利机械有限公司 Inner liquid duct flow increasing flat radiator and manufacturing process thereof
CN106225509B (en) * 2016-07-29 2018-08-03 全椒赛德利机械有限公司 The flooded seed mover bypass the radiator plate manufacturing process

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