CN2325870Y - Crossflow electric fan cooling means for semiconductor device - Google Patents
Crossflow electric fan cooling means for semiconductor device Download PDFInfo
- Publication number
- CN2325870Y CN2325870Y CN 98223614 CN98223614U CN2325870Y CN 2325870 Y CN2325870 Y CN 2325870Y CN 98223614 CN98223614 CN 98223614 CN 98223614 U CN98223614 U CN 98223614U CN 2325870 Y CN2325870 Y CN 2325870Y
- Authority
- CN
- China
- Prior art keywords
- cross flow
- flow fan
- radiator
- impeller
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a cross flow electric fan cooling device for a semiconductor device, comprising a radiator and a cross flow fan. Radiating fins of the radiator are vertically arranged. The cross flow fan is installed at one side of the radiator, and generated air flow is parallel to the surface of the radiator. The cross flow fan comprises a micro motor seat, a micro motor, an impeller, an impeller jacket, and a cover plate of the cross flow fan, wherein, the cover plate is covered on the surface of the impeller. The air blow cooling toward one side of the radiator by an outlet port of the cross flow fan can be realized. The utility model is particularly suitable for a note book type computer and a plug-in module plate, conduction and convective heat exchange can be furthest utilized, heat can be expeditiously carried away, and the cooling effect of the radiator can be enhanced.
Description
The utility model relates to radiator, particularly a kind of cross flow fan cooling device that is used to cool off high heat generation density semiconductor device.
Microelectronics industry and semi-conductor industry have developed central processor unit (CPU), as Pentium (Pentium), it is integrated millions of triodes are on a chip, and CPU adds that other IC chip can an integrated again multi-chip module (MCM), as Pentium II (Pentium II).These chips and module all have higher heat dissipation density, mean that these heat must take away as early as possible, otherwise its reliability and life-span can reduce all.
Multiple radiator is arranged in the market, and the radiator that has is a passive cooled, on the radiator that has aerofoil fan is housed, and this radiator is placed on the chip that is cooled again.In order to obtain high efficiency and low thickness structure, can design very thin aerofoil fan, but cause inefficient and low air quantity usually; Also can design special radiator, aerofoil fan is placed in the radiator, on thickness, deduct the thickness of a fan like this, lose part heat loss through conduction ability simultaneously, equally also reduce air quantity.
In the prior art, aerofoil fan is placed on the radiator because fan hub do not have refrigerating function, wheel hub topped zone do not have cross-ventilation, so this zone hottest point of semiconductor device normally.Secondly, aerofoil fan makes air circulate in the radiator with turbulence form, does not match with heat spreader structures, on the contrary, has hindered air movement, has reduced air movement speed.Have, how many heats are the outlet of aerofoil fan or import therefore can not just can not take away too near radiator, can not be used for book type structure, especially laptop in application again.
In order to overcome above-mentioned shortcoming, the purpose of this utility model provides a kind of new cross flow fan cooling device that is used for semiconductor device, and it obtains the convective heat exchange of optimum efficiency to be parallel to the air movement of spreader surface, thereby take away heat, cooling radiator.
A kind of cross flow fan cooling device that is used for semiconductor device described in the utility model, it comprises that one of them face is directly installed on a radiator and the fan on the semiconductor device, the fin of described radiator is vertically arranged; Described fan is one to be installed in radiator air one side, that the produced stream cross flow fan parallel with spreader surface, cross flow fan comprises the electrical micro-machine seat, the electrical micro-machine of in the electrical micro-machine seat, installing, be in transmission connection with it by micro-motor rotor, its all body is equipped with the impeller that the level of horizontally set blade is installed, the impeller chuck of installing at the impeller other end, be in transmission connection with it by wheel shaft and bearing, and hiding cross flow fan cover plate in impeller surface, the outlet of cross flow fan is to radiator one side air-supply cooling.
The utility model is a kind of book type structure, be specially adapted to laptop and plug-in module plate, farthest utilize conduction and convective heat exchange, take away heat expeditiously, as far as possible with market on standard radiator coupling, improved the cooling effect of radiator.
Below in conjunction with accompanying drawing the utility model is elaborated.
Fig. 1 is a kind of schematic appearance that is used for the cross flow fan cooling device of semiconductor device.
Fig. 2 is the STRUCTURE DECOMPOSITION schematic diagram of cooling device shown in Figure 1.
Fig. 3 is that above-mentioned cooling device is installed the schematic appearance that tightens up screw on diverse location.
Fig. 4 is the STRUCTURE DECOMPOSITION schematic diagram of cooling device shown in Figure 3.
Referring to Fig. 1 and Fig. 2, a kind of cross flow fan cooling device that is used for semiconductor device comprises that one of them face is directly installed on a radiator and the fan on the semiconductor device.
The fin 11 of radiator 1 is vertically arranged, and fin 11 can be needle-like (not shown) in the form of sheets, also can be column (not shown).Radiator 1 is angular facing to fin 11 ends 12 of that side of fan air-supply, helps air and flows through fin 11.Semiconductor device 3 is installed in the bottom surface of radiator 1.
Fan is one to be installed in the cross flow fan 2 of radiator 1 one sides, and the air stream that cross flow fan 2 produces is parallel to radiator 1 surface.
Cross flow fan 2 comprises electrical micro-machine seat 21, electrical micro-machine 22, impeller 23, impeller chuck 24 and cross flow fan cover plate 25.Electrical micro-machine 22 is installed in the electrical micro-machine seat 21.All bodies of impeller 23 are equipped with the blade of horizontally set.Impeller 23 centers are porose 231, and electrical micro-machine output shaft 221 plug-in mountings are gone in the impeller bore 231, make impeller 23 rotations.Impeller chuck 24 is installed in the other end of impeller 23, is in transmission connection with impeller 23 by impeller wheel shaft 232 and impeller chuck bearing 241.Like this, impeller 23 just level is installed between electrical micro-machine seat 21 and the impeller chuck 24, and the part surface of impeller 23 faces the end 12 that fin 11 is angular.Between the bearing 241 of impeller chuck 24 and the mesopore 242 of impeller chuck 24 sealing ring 243 is housed, caused potential vibration when rotating to reduce impeller 23.Cross flow fan cover plate 25 hides on impeller 23 surfaces.Guiding air stream is equipped with and air stream is parallel to the rod 26 that dams of the semiconductor device surface that will cool off in the top of impeller 23, and an end of the rod 26 that dams is installed on the electrical micro-machine seat 21, and the other end of the rod 26 that dams then is installed on the impeller chuck 24.Be respectively equipped with installing hole 211 on electrical micro-machine seat 21 and impeller chuck 24, the rod 26 that dams just is installed in these two installing holes 211.During work, the outlet of cross flow fan 2 is to radiator 1 one sides air-supply cooling.
Two sidepieces of the no air flows of radiator 1 are respectively equipped with the mounting groove 12 that cross flow fan 2 is installed, and these two sidepieces also are equipped with the tensioning clip 13 that semiconductor device 3 is installed respectively.Be respectively equipped with mounting groove 27 on electrical micro-machine seat 21 and the impeller chuck 24, be used to install cross flow fan cover plate 25, cross flow fan cover plate 25 is hidden on impeller 23 surfaces.Also be respectively equipped with on electrical micro-machine seat 21 and the impeller chuck 24 mounting groove 29 that tightens up screw 28 is installed, cross flow fan 2 laterally overlaps above-mentioned two sidepieces that install to radiator 1, and tightens up by tightening up screw 28.
See Fig. 3 and Fig. 4 again, two sidepieces of first air flows of radiator 1 are not established mounting groove, and two sides of cross flow fan cover plate 25 are respectively equipped with mounting groove 251, by tightening up screw 28 cross flow fan 2 are installed on the radiator 1.Cross flow fan cover plate 25 2 sides among the figure are respectively equipped with four mounting grooves 251, tighten up screw 28 and pass mounting groove 251 cross flow fan 2 is installed on the radiator 1, and tightened up.
The radiator 1 in the utility model and the size of cross flow fan 2 can be done more greatly or be longer, so that the semiconductor device 3 of coupling large-size, the tensioning clip of installation can difformity, and radiator 1 and semiconductor device 3 are tightened up.
Claims (4)
1. cross flow fan cooling device that is used for semiconductor device, it comprises that one of them face is directly installed on a radiator and the fan on the semiconductor device, is characterized in that the fin of described radiator is vertically arranged; Described fan is one to be installed in radiator air one side, that the produced stream cross flow fan parallel with spreader surface, cross flow fan comprises the electrical micro-machine seat, the electrical micro-machine of in the electrical micro-machine seat, installing, be in transmission connection with it by micro-motor rotor, its all body is equipped with the impeller that the level of horizontally set blade is installed, the impeller chuck of installing at the impeller other end, be in transmission connection with it by wheel shaft and bearing, and hiding cross flow fan cover plate in impeller surface, the outlet of cross flow fan is to radiator one side air-supply cooling.
2. the cross flow fan cooling device that is used for semiconductor device according to claim 1, it is characterized in that, guiding air stream is equipped with and air stream is parallel to the rod that dams of the semiconductor device surface that will cool off in the top of described impeller, the excellent end that dams is installed on the electrical micro-machine seat, and the other end of the rod that dams then is installed on the impeller chuck.
3. the cross flow fan cooling device that is used for semiconductor device according to claim 1 is characterized in that, between the mesopore of the bearing of described impeller chuck and impeller chuck sealing ring is housed, caused potential vibration when rotating to reduce impeller.
4. the cross flow fan cooling device that is used for semiconductor device according to claim 1 is characterized in that two sides of described cross flow fan cover plate are respectively equipped with mounting groove, by tightening up screw cross flow fan is installed on the radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98223614 CN2325870Y (en) | 1998-04-02 | 1998-04-02 | Crossflow electric fan cooling means for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98223614 CN2325870Y (en) | 1998-04-02 | 1998-04-02 | Crossflow electric fan cooling means for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2325870Y true CN2325870Y (en) | 1999-06-23 |
Family
ID=33974668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 98223614 Expired - Lifetime CN2325870Y (en) | 1998-04-02 | 1998-04-02 | Crossflow electric fan cooling means for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2325870Y (en) |
-
1998
- 1998-04-02 CN CN 98223614 patent/CN2325870Y/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |