CN2384312Y - Transverse current fan cooler for semiconductor device - Google Patents
Transverse current fan cooler for semiconductor device Download PDFInfo
- Publication number
- CN2384312Y CN2384312Y CN 99227679 CN99227679U CN2384312Y CN 2384312 Y CN2384312 Y CN 2384312Y CN 99227679 CN99227679 CN 99227679 CN 99227679 U CN99227679 U CN 99227679U CN 2384312 Y CN2384312 Y CN 2384312Y
- Authority
- CN
- China
- Prior art keywords
- fan
- cross flow
- flow fan
- impeller
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a cross flow fan cooler for semiconductor devices, which comprises a radiator and a cross flow fan. Radiator fins of the radiator are vertically ranged. The cross flow fan is installed on one side of the radiator and positioned between a left installation piece and a right installation piece of the fan, and the air flow produced by the cross flow fan is in parallel with the surface of the radiator. The cross flow fan comprises a micro motor, an impeller, an impeller jacket and a covering plate of the cross flow fan, and the outlet of the cross flow fan blows air towards one side of the radiator for cooling. The utility model has the advantages of thin structure, convenient installation and operation, high heat radiating efficiency, and good aeration-cooling effect. The utility model is especially suitable for notebook type computers and plug-in modules.
Description
The utility model relates to radiator, particularly a kind of cross flow fan cooling device that is used to cool off high heat generation density semiconductor device.
The development of microelectronics and semi-conductor industry, brought the stronger central processing unit of our function (CPU), Pentium chip for example, these high-power die can be integrated again and form multi-chip module (MCM) with other integrated circuit, as " Pentium II ", these central processing units and multi-chip module all have very high heat dissipation density, and this just means that people must take away these heats by some way as early as possible, otherwise will reduce reliability and reduce the life-span.
Multiple radiator is arranged in the market, and the radiator that has is a passive cooled, on the radiator that has aerofoil fan is housed, and this radiator is placed on the chip that is cooled again.In order to obtain high efficiency and low thickness structure, it is amiable and compliant to design very thin axial flow wind, but causes inefficient and low air quantity usually; Also can design special radiator, aerofoil fan is placed in the radiator, on thickness, deduct the thickness of a fan like this, lose part heat loss through conduction ability simultaneously, also reduce air quantity simultaneously.
In the prior art, aerofoil fan is placed on the radiator because fan hub do not have refrigerating function, wheel hub topped zone do not have cross-ventilation, so this zone hottest point of semiconductor device normally.Secondly, aerofoil fan makes air circulate in the radiator with turbulence form, does not match with heat spreader structures, on the contrary, has hindered air movement, has reduced air movement speed.Have, how many heats are the outlet of aerofoil fan or import therefore can not just can not take away too near radiator, can not be used for thin type structure, especially laptop in application again.
In order to overcome above-mentioned shortcoming, the purpose of this utility model provides the cross flow fan cooling device on a kind of semiconductor device, and it obtains the convective heat exchange of optimum efficiency, thereby take away heat, cooling radiator to be parallel to the air movement of spreader surface.
Technical solution of the present utility model is as follows:
Cross flow fan cooling device on a kind of semiconductor device, it comprises that one of them face is directly installed on a radiator and the fan on the semiconductor device, described radiator comprises fin two above vertical arrangements, that can pass through parallel air stream, one fan that is positioned at entire heat dissipation sheet left end is installed left sheet, and a fan that is positioned at entire heat dissipation sheet right-hand member is installed right sheet; Described fan is one to be installed in radiator one side, left sheet is installed and fan is installed between the right sheet at fan, the air stream cross flow fan parallel that is produced with spreader surface, cross flow fan comprises that being installed in fan installs electrical micro-machine on the right sheet, be in transmission connection with it by electrical micro-machine, its all body is equipped with the blade of horizontally set and the impeller that level is installed, install at the impeller other end, be in transmission connection with it by wheel shaft and bearing, and be installed in fan impeller chuck on the left sheet is installed, and hiding cross flow fan cover plate in impeller surface, the outlet of cross flow fan is to radiator one side air-supply cooling.
The utility model is a kind of thin type structure, be specially adapted to laptop and plug-in module plate, farthest utilize conduction and convective heat exchange, take away heat expeditiously, as far as possible with market on standard radiator coupling, improved the cooling effect of radiator.
The fan that the utility model is adorned at the two ends of radiator is installed by left sheet and fan is installed right sheet, and the impeller that the two can be used to support cross flow fan makes total more compact, and it is also convenient to install.
Below in conjunction with accompanying drawing the utility model is elaborated.
Fig. 1 is the stereogram of the cross flow fan cooling device on a kind of semiconductor device, wherein electrical micro-machine by the blade on its rotor, adorned and impeller in conjunction with being connected.
Fig. 2 is the STRUCTURE DECOMPOSITION schematic diagram of cooling device shown in Figure 1.
Fig. 3 is the stereogram of the cross flow fan cooling device on a kind of semiconductor device, and wherein electrical micro-machine is in transmission connection by output shaft and impeller.
Fig. 4 is the STRUCTURE DECOMPOSITION schematic diagram of cooling device shown in Figure 3.
Fig. 5 be the utility model be connected in parallel more than two in conjunction with schematic diagram.
Fig. 6 is by the schematic appearance behind the cover plate shown in Figure 5.
Referring to Fig. 1 to Fig. 4, the cross flow fan cooling device on a kind of semiconductor device comprises that one of them face is directly by the radiator and the fan that are installed on the semiconductor device.
The fin 11 of radiator 1 is formed by some, and they vertically arrange setting, can be by parallel air stream.Fin 11 can be needle-like (not shown) in the form of sheets, also can be column (not shown).The bottom surface of radiator 1 is installed on the semiconductor device 3.The left end that the left end of radiator 1 promptly is positioned at entire heat dissipation sheet 11 is provided with fan left sheet 12 is installed, and the right-hand member that the right-hand member of radiator 1 promptly is positioned at entire heat dissipation sheet 11 is provided with fan right sheet 13 is installed.
Fan is one to be installed in the cross flow fan 2 of radiator 1 one sides, and it installs left sheet 12 and fan is installed between the right sheet 13 at fan, and promptly two ends of cross flow fan 2 are installed in respectively that fan is installed left sheet 12 and fan is installed on the right sheet 13.The air stream that cross flow fan 2 produces is parallel to radiator 1 surface.
Cross flow fan 2 comprises that being installed in fan installs electrical micro-machine 21 on the right sheet 13, the impeller 22 that is in transmission connection with it by electrical micro-machine 21, impeller 22 other ends install to pass through wheel shaft 221 and bearing 231 that be in transmission connection with it and be installed in fan impeller chuck 23 on the left sheet 12 is installed, and hide cross flow fan cover plate 24 on impeller 22 surfaces.All bodies of impeller 22 are equipped with the blade of horizontally set.Impeller 22 is flatly installed.
As Fig. 2 and shown in Figure 4, at fan left sheet 12 and fan to be installed and to be installed on the right sheet 13 and be respectively equipped with installing hole 14, electrical micro-machine 21, impeller 22 and 23 of impeller chucks are installed in respectively on these installing holes 14.
The rubber ring 233 that causes vibration in the time of can reducing impeller 22 rotations is housed between the bearing 231 of impeller chuck 23 and the mesopore 232 of impeller chuck 23.
The other rod 25 that dams that semiconductor device 3 surfaces that radially are provided with, the guiding air flows and air stream is parallel to will cool off are housed of the side of impeller 22, rod 25 two ends that dam are installed in respectively that fan is installed left sheet 12 and fan is installed on the right sheet 13, can be installed on the installing hole 15.
Fan is installed by left sheet 12 and fan is installed the mounting groove 16 that also is respectively equipped with cross flow fan cover plate 24 on the right sheet 13, two ends of cross flow fan cover plate 24 are respectively equipped with installs projection 241, but projection 241 setting-ins are installed in mounting groove 16, cross flow fan cover plate 24 toilet covers are contained in impeller 22 surfaces thus.
This end that impeller 22 and electrical micro-machine 21 are in transmission connection tightens up screw 17 by four and electrical micro-machine 21 is installed in fan installs on the installing hole 14 of left sheet 12.The other end of impeller 22 is installed in fan by impeller chuck 23 and installs on the installing hole 14 of right sheet 13, and impeller chuck 23 tightens up screw 18 by three and is installed in fan and installs on the right sheet 13.
As shown in Figure 2, electrical micro-machine 21 combines with impeller 22 by the blade of being adorned on its rotor 211 and is in transmission connection, impeller 22 rotations thus.
As shown in Figure 4, electrical micro-machine 21 is in transmission connection by output shaft 212 and impeller 22, and in the driving hole 222 of impeller 22 rubber coupler 223 is installed, and electrical micro-machine output shaft 212 is installed in the impeller driving hole 222 impeller 22 rotations thus.
Radiator 1 and cross flow fan 2 can be installed on the semiconductor device 3 by tightening up screw 19.During work, the outlet of cross flow fan 2 is to radiator 1 one sides air-supply cooling.
Referring to Fig. 5, the size of radiator 1 and cross flow fan 2 can be done more greatly or be longer, and cross flow fan 2 and radiator can be connected in series more than 1 two, with the semiconductor device 3 of coupling large-size.
Referring to Fig. 6, at radiator 1 with above the cross flow fan 2 cover plate 20 can be installed, to form a kind of wind channel heat radiator, it can obtain higher ventilation cooling effect, can prevent the foreign matter into inside of radiator 1 and cross flow fan 2 of dropping again, avoid causing damage.
Claims (7)
1. the cross flow fan cooling device on the semiconductor device, it comprises that one of them face is directly installed on a radiator and the fan on the semiconductor device, it is characterized in that, described radiator comprises fin two above vertical arrangements, that can pass through parallel air stream, one fan that is positioned at entire heat dissipation sheet left end is installed left sheet, and a fan that is positioned at entire heat dissipation sheet right-hand member is installed right sheet; Described fan is one to be installed in radiator one side, left sheet is installed and fan is installed between the right sheet at fan, the air stream cross flow fan parallel that is produced with spreader surface, cross flow fan comprises that being installed in fan installs electrical micro-machine on the right sheet, be in transmission connection with it by electrical micro-machine, the blade of horizontally set and the impeller that level is installed originally are housed in its week, install at the impeller other end, be in transmission connection with it by wheel shaft and bearing, and be installed in fan impeller chuck on the left sheet is installed, and hiding cross flow fan cover plate in impeller surface, the outlet of cross flow fan is to radiator one side air-supply cooling.
2. the cross flow fan cooling device on the semiconductor device according to claim 1 is characterized in that, described fan is installed left sheet and fan and installed on the right sheet and be respectively equipped with installing hole.
3. the cross flow fan cooling device on the semiconductor device according to claim 1, it is characterized in that, the side of described impeller is other to be equipped with the rod that dams that radially be provided with, guiding air stream and the semiconductor surface that air stream is parallel to will cool off, and two ends of intercepter plate are installed in respectively that fan is installed left sheet and fan is installed on the right sheet.
4. the cross flow fan cooling device on the semiconductor device according to claim 1 is characterized in that, the rubber ring that causes vibration in the time of can reducing the impeller rotation is housed between the mesopore of the bearing of described impeller chuck and impeller chuck.
5. the cross flow fan cooling device on the semiconductor device according to claim 1 is characterized in that, described electrical micro-machine combines with impeller by the blade of being adorned on its rotor and is in transmission connection.
6. the cross flow fan cooling device on the semiconductor device according to claim 1 is characterized in that, described microelectronics machine is in transmission connection by output shaft and impeller.
7. the cross flow fan cooling device on the semiconductor device according to claim 1 is characterized in that, described cross flow fan and radiator are connected in series more than two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99227679 CN2384312Y (en) | 1999-06-28 | 1999-06-28 | Transverse current fan cooler for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99227679 CN2384312Y (en) | 1999-06-28 | 1999-06-28 | Transverse current fan cooler for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2384312Y true CN2384312Y (en) | 2000-06-21 |
Family
ID=34017159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 99227679 Expired - Lifetime CN2384312Y (en) | 1999-06-28 | 1999-06-28 | Transverse current fan cooler for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2384312Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104363736B (en) * | 2014-08-27 | 2017-08-25 | 华为技术有限公司 | The heat abstractor of electronic unit |
-
1999
- 1999-06-28 CN CN 99227679 patent/CN2384312Y/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104363736B (en) * | 2014-08-27 | 2017-08-25 | 华为技术有限公司 | The heat abstractor of electronic unit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |