CN221449000U - Double-layer water-cooling heat dissipation plate - Google Patents
Double-layer water-cooling heat dissipation plate Download PDFInfo
- Publication number
- CN221449000U CN221449000U CN202323572013.XU CN202323572013U CN221449000U CN 221449000 U CN221449000 U CN 221449000U CN 202323572013 U CN202323572013 U CN 202323572013U CN 221449000 U CN221449000 U CN 221449000U
- Authority
- CN
- China
- Prior art keywords
- water
- heat dissipation
- cooling
- double
- metal frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 88
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 82
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 60
- 239000002184 metal Substances 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims description 5
- 239000011159 matrix material Substances 0.000 claims description 3
- 239000000110 cooling liquid Substances 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 description 6
- 239000002826 coolant Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a double-layer water-cooling heat dissipation plate which comprises a main heat dissipation module and an auxiliary heat dissipation module, wherein the main heat dissipation module comprises two water-cooling plates, a connector, a water flow channel, a heat dissipation channel, a metal frame and a water return pipe, wherein the connector is connected with the water-cooling plates and communicated with the water-cooling plates, the water flow channel and the heat dissipation channel are arranged inside the water-cooling plates, the metal frame and the water return pipe are connected between the two water-cooling plates, the two heat dissipation channels are mutually communicated through the water return pipe, the auxiliary heat dissipation module comprises a plurality of bent rods, a turbine and a miniature electric fan, the bent rods are movably connected with the water-cooling plates close to the bottom of the metal frame, the turbine is sleeved at the bottom of the bent rods, the miniature electric fan is sleeved at the top ends of the bent rods, and the turbine is positioned inside the heat dissipation channel. In the utility model, when the cooling liquid circularly flows, the cooling liquid can influence the rotation of the turbine, and then the bent rod moves along with the turbine, so that the miniature electric fan circularly rotates, and in the process, the miniature electric fan accelerates the air circulation speed in the heat dissipation space, thereby effectively improving the heat dissipation efficiency of the water cooling plate.
Description
Technical Field
The utility model relates to the technical field of water-cooling heat dissipation plates, in particular to a double-layer water-cooling heat dissipation plate.
Background
The main cooling modes of the existing electronic device are as follows: natural convection and radiation of air, air cooling plates (forced air cooling with cooling fins), liquid cooling (forced indirect liquid cooling of water cooling plates), evaporative cooling (heat pipe phase change cooling). Wherein the heat dissipation efficiency is the highest by the evaporative cooling and the liquid cooling. However, evaporative cooling may be used in very small applications due to volume and cost constraints. In contrast, the water cooling plate is cooled, so that the heat dissipation efficiency is high, the volume of the heat dissipation substrate is small, the heat dissipation system is compact in structure, and the heat dissipation system is widely used in heat dissipation occasions with high heat flux density.
The application number 202321121546.3 discloses a high-temperature double-layer water cooling structure, including first water-cooling plate and second water-cooling plate, surface fixed mounting has circular heat conducting plate about first water-cooling plate and the second water-cooling plate, be provided with heat abstractor between first water-cooling plate and the second water-cooling plate, heat abstractor includes fixed column, connecting block, two rotary disks and fan blade. This high temperature double-deck water-cooling structure has two water-cooling boards of first water-cooling board and second water-cooling board, and double-deck water-cooling structure can effectively face the heat dissipation problem when high temperature, and the water-cooling ability of two-layer water-cooling board obtains improving greatly, and the heat abstractor that sets up between double-deck water-cooling board can in time scatter the heat of rivers between the two-layer water-cooling board, has reduced the pressure of water-cooling board, and the heat conduction board can be with the heat conduction of the device that needs the cooling to double-deck water-cooling structure again by the rivers taking away the heat, and the cooling effect is very good. However, in specific use, the heat dissipation speed of the application is still insufficient, and a large heat dissipation lifting space still exists.
Disclosure of utility model
The present utility model aims to solve one of the technical problems existing in the prior art or related technologies.
The technical scheme adopted by the utility model is as follows:
The utility model provides a double-deck water-cooling heating panel, includes main heat dissipation module and assists heat dissipation module, main heat dissipation module include two water-cooling plates, with the connector of water-cooling plate connection and intercommunication, set up in water-cooling plate inside flow channel and heat dissipation passageway, connect metal frame and wet return between two water-cooling plates, two heat dissipation passageways communicate each other through the wet return, assist heat dissipation module include with be close to a plurality of curved bars of water-cooling plate swing joint of metal frame bottom, cup joint in the turbine of curved bar bottom, cup joint in the miniature electric fan on curved bar top, the turbine is located heat dissipation passageway inside.
Through adopting above-mentioned technical scheme, when coolant liquid circulation flows, the coolant liquid can influence turbine and rotate, then the bent lever follows the motion for miniature electric fan is annular rotatory, and at this in-process, the air circulation speed in the miniature electric fan acceleration heat dissipation interval, effectively improves the radiating efficiency of water-cooling plate.
The present utility model may be further configured in a preferred example to: and a heat dissipation space is formed between the two water cooling plates, and the water return pipe is positioned in the heat dissipation space.
Through adopting above-mentioned technical scheme, adopt this overall arrangement design, water-cooling plate top and bottom all can obtain the heat dissipation, improve the radiating efficiency of water-cooling plate.
The present utility model may be further configured in a preferred example to: the water flow channel is positioned between the connector and the heat dissipation channel, the water flow channel is transversely coaxial with the connector, and the connector is communicated with the inside of the heat dissipation channel through the water flow channel.
Through adopting above-mentioned technical scheme, adopt this structural design, guarantee that the coolant liquid can circulation flow.
The present utility model may be further configured in a preferred example to: the plurality of curved bars are arranged in a matrix, and the metal frame is positioned among the plurality of curved bars.
By adopting the technical scheme, the heat dissipation area of the miniature electric fan is ensured by adopting the layout design.
The present utility model may be further configured in a preferred example to: the miniature electric fans are all located inside the heat dissipation space and are made of plastic materials.
Through adopting above-mentioned technical scheme, adopt this structural design, the air circulation speed in the heat dissipation interval is accelerated, improves the radiating efficiency of two water-cooling plates.
The present utility model may be further configured in a preferred example to: and the metal frame is internally provided with a heat collecting plate.
Through adopting above-mentioned technical scheme, set up the thermal-arrest board, can concentrate the heat unification and heat conduction, further improve water-cooling board heat dispersion.
The present utility model may be further configured in a preferred example to: the water cooling plate is provided with a plurality of through holes, and the through holes are surrounded on the outer side of the metal frame.
Through adopting above-mentioned technical scheme, set up the through-hole for the cold wind can circulate from top to bottom, improves the radiating efficiency of water-cooling board.
By adopting the technical scheme, the beneficial effects obtained by the utility model are as follows:
1. In the utility model, when the cooling liquid circularly flows, the cooling liquid can influence the rotation of the turbine, and then the bent rod moves along with the turbine, so that the miniature electric fan circularly rotates, and in the process, the miniature electric fan accelerates the air circulation speed in the heat dissipation space, thereby effectively improving the heat dissipation efficiency of the water cooling plate.
2. In the utility model, the upper connector is set as the water inlet, the lower connector is set as the water outlet, then the cooling liquid flows along the water flow channel and the heat dissipation channel, and then the circulation of the cooling liquid is completed from the water return pipe and the water cooling plate below the water return pipe, so that the whole water cooling plate can be cooled, and the heat dissipation capacity of the water cooling plate is improved.
Drawings
FIG. 1 is a perspective view of the overall structure of the present utility model;
FIG. 2 is a schematic diagram of a main heat dissipating module according to the present utility model;
FIG. 3 is a schematic diagram of a location of an auxiliary heat dissipation module according to the present utility model;
fig. 4 is an assembled perspective view of a portion of the structure of the auxiliary heat dissipation module of the present utility model.
Reference numerals:
100. A main heat dissipation module; 110. a water cooling plate; 120. a connector; 130. a water flow channel; 140. a heat dissipation channel; 150. a metal frame; 160. a water return pipe;
200. An auxiliary heat radiation module; 210. a curved bar; 220. a turbine; 230. a WeChat electric fan;
300. a heat collecting plate;
400. and a through hole.
Detailed Description
The objects, technical solutions and advantages of the present utility model will become more apparent by the following detailed description of the present utility model with reference to the accompanying drawings. It should be noted that, without conflict, the embodiments of the present utility model and features in the embodiments may be combined with each other.
It is to be understood that this description is merely exemplary in nature and is not intended to limit the scope of the present utility model.
A double-layer water-cooled heat sink according to some embodiments of the present utility model is described below with reference to the accompanying drawings.
Embodiment one:
Referring to fig. 1-4, the double-layer water-cooling heat dissipation plate provided by the utility model comprises a main heat dissipation module 100 and an auxiliary heat dissipation module 200, wherein the main heat dissipation module 100 comprises two water-cooling plates 110, a connector 120 connected and communicated with the water-cooling plates 110, a water flow channel 130 and a heat dissipation channel 140 which are arranged in the water-cooling plates 110, a metal frame 150 connected between the two water-cooling plates 110 and a water return pipe 160, and the two heat dissipation channels 140 are mutually communicated through the water return pipe 160;
The auxiliary heat dissipation module 200 includes a plurality of curved bars 210 movably connected with the water cooling plate 110 near the bottom of the metal frame 150, a turbine 220 sleeved at the bottom end of the curved bars 210, and a micro electric fan 230 sleeved at the top end of the curved bars 210, wherein the turbine 220 is located inside the heat dissipation channel 140.
Further, a heat dissipation space is formed between the two water cooling plates 110, the water return pipe 160 is located inside the heat dissipation space, and by adopting the layout design, both the top and the bottom of the water cooling plates 110 can be cooled, so that the heat dissipation efficiency of the water cooling plates 110 is improved.
Further, the water flow channel 130 is located between the connector 120 and the heat dissipation channel 140, the water flow channel 130 is transversely coaxial with the connector 120, the connector 120 is internally communicated with the heat dissipation channel 140 through the water flow channel 130, and by adopting the structural design, the cooling liquid can be ensured to circularly flow.
Further, the plurality of curved bars 210 are arranged in a matrix, and the metal frame 150 is located between the plurality of curved bars 210, and the heat dissipation area of the micro electric fan 230 is ensured by adopting the layout design.
Further, the plurality of micro fans 230 are all located inside the heat dissipation space, and the micro fans 230 are made of plastic materials, so that the air circulation speed in the heat dissipation space is accelerated by adopting the structural design, and the heat dissipation efficiency of the two water cooling plates 110 is improved.
Embodiment two:
Referring to fig. 1-2, on the basis of the first embodiment, the heat collecting plate 300 is installed in the metal frame 150, and the heat collecting plate 300 is provided, so that heat can be uniformly concentrated and conducted, and the heat dissipation capability of the water cooling plate 110 is further improved.
Embodiment III:
Referring to fig. 1-3, in the foregoing embodiment, the water cooling plate 110 is provided with a plurality of through holes 400, and the plurality of through holes 400 are surrounded on the outer side of the metal frame 150, and the through holes 400 are provided, so that the cooling air can flow up and down, and the heat dissipation efficiency of the water cooling plate 110 is improved.
The working principle and the using flow of the utility model are as follows: when the device is put into practical use, the connector 120 above is set as a water inlet, the connector 120 below is set as a water outlet, then the cooling liquid flows along the water flowing channel 130 and the heat dissipation channel 140, then the circulation of the cooling liquid is completed from the water return pipe 160 and the water cooling plate 110 below the water return pipe 160, in the process, the flowing cooling liquid can influence the rotation of the turbine 220, then the bent rod 210 follows the movement, so that the micro electric fan 230 does annular rotation, and in the process, the micro electric fan 230 accelerates the air circulation speed in the heat dissipation space, thereby effectively improving the heat dissipation efficiency of the water cooling plate 110.
In the present utility model, the term "plurality" means two or more, unless explicitly defined otherwise. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items. The terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; "coupled" may be directly coupled or indirectly coupled through intermediaries. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
It will be understood that when an element is referred to as being "mounted," "secured" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
In the description of the present specification, the terms "one embodiment," "some embodiments," "particular embodiments," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the utility model as defined by the appended claims and their equivalents.
Claims (7)
1. A double-layer water-cooled heat dissipating plate, comprising:
The main heat dissipation module (100) comprises two water cooling plates (110), a connector (120) connected and communicated with the water cooling plates (110), a water flow channel (130) and a heat dissipation channel (140) which are arranged inside the water cooling plates (110), a metal frame (150) connected between the two water cooling plates (110) and a water return pipe (160), wherein the two heat dissipation channels (140) are mutually communicated through the water return pipe (160);
The auxiliary heat dissipation module (200) comprises a plurality of bent rods (210) movably connected with the water cooling plate (110) close to the bottom of the metal frame (150), turbines (220) sleeved at the bottom ends of the bent rods (210) and miniature electric fans (230) sleeved at the top ends of the bent rods (210), wherein the turbines (220) are located inside the heat dissipation channels (140).
2. A double-layer water-cooled heat sink according to claim 1, wherein a heat dissipation space is formed between the two water-cooled plates (110), and the return pipe (160) is located inside the heat dissipation space.
3. The double-layer water-cooling heat dissipation plate according to claim 1, wherein the water flow channel (130) is located between the connector (120) and the heat dissipation channel (140), the water flow channel (130) is transversely coaxial with the connector (120), and the connector (120) is internally communicated with the heat dissipation channel (140) through the water flow channel (130).
4. A double-layer water-cooled heat dissipating plate according to claim 1, wherein a plurality of bent bars (210) are arranged in a matrix, and the metal frame (150) is located between the plurality of bent bars (210).
5. A double-layer water-cooled heat sink according to claim 2, wherein a plurality of micro-electric fans (230) are located inside the heat dissipation space, the micro-electric fans (230) being made of plastic material.
6. A double-layer water-cooled heat sink according to claim 1, wherein the metal frame (150) is internally mounted with a heat collecting plate (300).
7. The double-layer water-cooling heat dissipation plate according to claim 1, wherein the water-cooling plate (110) is provided with a plurality of through holes (400), and the plurality of through holes (400) are surrounded on the outer side of the metal frame (150).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323572013.XU CN221449000U (en) | 2023-12-27 | 2023-12-27 | Double-layer water-cooling heat dissipation plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323572013.XU CN221449000U (en) | 2023-12-27 | 2023-12-27 | Double-layer water-cooling heat dissipation plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221449000U true CN221449000U (en) | 2024-07-30 |
Family
ID=92063289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323572013.XU Active CN221449000U (en) | 2023-12-27 | 2023-12-27 | Double-layer water-cooling heat dissipation plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221449000U (en) |
-
2023
- 2023-12-27 CN CN202323572013.XU patent/CN221449000U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106774740A (en) | Board-like water-cooled graphic card radiator | |
| CN206657307U (en) | Board-like water cooling graphic card radiator | |
| CN101001514A (en) | Liquid-cooled radiating device and radiating unit | |
| CN114190054A (en) | Radiating fin and thermosiphon radiator | |
| CN221449000U (en) | Double-layer water-cooling heat dissipation plate | |
| CN220123320U (en) | Liquid cooling radiator | |
| CN117545246A (en) | Tower type mixed radiator based on diamond micro-channel | |
| CN211319165U (en) | Low flow resistance water-cooling chip radiator | |
| TWM609012U (en) | Liquid cooling system | |
| CN201066984Y (en) | Water cooling heat radiation bar and heat radiation device with this bar | |
| CN208175208U (en) | Electronic component radiator | |
| CN114510135B (en) | Uniform temperature plate with good heat conduction and heat dissipation effects | |
| CN110601443A (en) | Air-air cooler for motor | |
| CN200947713Y (en) | Heat radiator for electrical component | |
| RU2273970C1 (en) | Cooling device for electronic power modules | |
| CN215597553U (en) | Air conditioner heat radiation structure and air conditioner outdoor unit | |
| CN201894036U (en) | Honeycomb water-cooling radiator | |
| CN211607189U (en) | Liquid cooling device with pumping structure | |
| CN210804276U (en) | Novel blowing plate type heat dissipation module for server | |
| CN208507656U (en) | A kind of channel-type IGBT module radiator | |
| CN207070569U (en) | A kind of radiator based on open-porous metal | |
| CN218352993U (en) | Radiating fin group | |
| CN216773343U (en) | Equipment heat dissipation heat sink in high performance battery course of working | |
| CN212696401U (en) | Flat-plate heat pipe micro-channel composite radiator | |
| CN221510105U (en) | Heat exchange structure and power electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |