CN221409573U - Electronic equipment and temperature control device thereof - Google Patents

Abstract

An electronic device and a temperature control device thereof comprise a first structure; the second structure is connected with the first structure, and the first structure and the second structure can jointly form a heat dissipation surface in the same side direction; the first structure and the second structure have different heat conduction power along the first direction; the first direction is the direction of the first structure and the second structure towards the heat dissipation surface.

Description

Electronic equipment and temperature control device thereof

Technical Field

The application relates to the technical field of heat dissipation, in particular to electronic equipment and a temperature control device thereof.

Background

With the gradual development of electronic equipment, the body which is continuously updated is thinner, and the problem brought by the body is that the heat density of parts which emit heat is larger, so that the hot spot temperature of the body shell is more prominent, and the most direct cooling means is to reduce the power of the parts which emit heat, thereby sacrificing the high-quality system performance achieved by the electronic equipment. Although the general heat dissipation material can disperse equipment heat to a certain extent, a single material heat dissipation material has a soaking upper limit and is used for uniformly dissipating heat, and when the heat is continuously led into the graphite sheet to reach the upper limit, obvious hot spots can still be generated on the electronic equipment, so that the use experience is reduced.

Disclosure of utility model

In order to solve the technical problems, the following technical solutions are provided in the embodiments of the present application:

a first aspect of the present application provides a temperature control device, comprising:

A first structure; the second structure is connected with the first structure, and the first structure and the second structure can jointly form a heat dissipation surface in the same side direction;

the first structure and the second structure have different heat conduction power along the first direction; the first direction is the direction of the first structure and the second structure towards the heat dissipation surface.

In some variations of the first aspect of the present application, the second structure is at least one of:

The second structure is arranged circumferentially around the first structure;

the second structure is positioned on one side of the first structure perpendicular to the first direction;

The second structure is positioned on at least two sides of the first structure perpendicular to the first direction.

In some variations of the first aspect of the present application, a third structure having a first surface and a second surface for conducting heat is also included; the first surface is connected with the first structure and the second structure; the second surface is a surface facing away from the first structure and the second structure and is used for receiving or leading out heat; the third structure is at least one of the following:

The second surface of the third structure is covered on the shell;

The second surface of the third structure faces or overlies the heat generating source.

In some variations of the first aspect of the present application, two third structures are further included for conducting heat; the first structure and the second structure are arranged between the two third structures;

Each of the third structures is connected to the first structure and the second structure.

In some variations of the first aspect of the present application, the temperature control device is divided into a first composite layer and a second composite layer connected to the first composite layer; the first composite layer is composed of a layer of third structures and a first structure positioned between the two third structures; the second composite layer is composed of another layer of third structures and a second structure located between the two third structures.

In some variations of the first aspect of the present application, the first structure is provided as a thermally insulating material; the second structure is configured as a thermally conductive material that transfers heat in the first direction.

In some variations of the first aspect of the present application, the first structure forms a first region for the corresponding heat source to block the heat source from conducting heat to the enclosure; the second structure forms a second region offset from the heat generating source at a periphery of the first region for conducting heat to the cabinet.

In some variations of the first aspect of the present application, the third structure is configured as a soaking material for heat transfer in the second direction; the second direction is perpendicular to the first direction; wherein the coverage area formed on the third structure is not smaller than the sum of the plane areas of the first structure and the second structure.

In some variations of the first aspect of the present application, the soaking material is graphite flake.

The second aspect of the application provides an electronic device, comprising a heat source, a shell and a temperature control device arranged between the heat source and the shell;

The temperature control device comprises a first structure corresponding to the heating source; the second structure is connected with the first structure, and the first structure and the second structure jointly form a heat dissipation surface in the direction close to the shell;

the first structure and the second structure have different heat conduction power along the first direction; the first direction is the direction of the first structure and the second structure towards the heat dissipation surface.

Drawings

The above, as well as additional purposes, features, and advantages of exemplary embodiments of the present application will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. In the drawings, wherein like or corresponding reference numerals indicate like or corresponding parts, there are shown by way of illustration, and not limitation, several embodiments of the application, in which:

FIG. 1 schematically shows a schematic view of a first embodiment of a temperature control device according to the present application;

FIG. 2 schematically shows a schematic structural view of a second embodiment of a temperature control device according to the present application;

FIG. 3 schematically shows a schematic view of a third embodiment of a temperature control device according to the present application;

Fig. 4 schematically shows a schematic structural view of a fourth embodiment of a temperature control device according to the present application.

Reference numerals illustrate:

1. a housing; 2. a heat source;

11. a first structure; 12. a second structure; 13. and a third structure.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

It is noted that unless otherwise indicated, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs.

As is known from the development of market situations, various electronic products become necessities for life and work, and there are many problems affecting the reliability of electronic products, one of the most troublesome problems is that a hot spot is formed on a casing when the electronic products perform a high-performance operation mode, particularly, heat is generated from a heat source to the casing, so that human body is uncomfortable when contacting the hot spot, and the service life of equipment is also affected if the hot spot temperature is too high. In order to solve the problem of hot spot formation by heat aggregation, in some embodiments, the heat of the heat generating source is uniformly conducted to the casing through the graphite sheet, so as to solve the technical problem of forming obvious hot spots, the graphite sheet is a novel heat conducting material currently existing, and can be understood as a planar heat conducting material which can uniformly conduct heat in multiple directions, but the problem of hot spots still cannot be relieved due to uniform heat conduction.

Therefore, in order to solve the above technical problems, the inventor of the present application proposes an electronic device and a temperature control device thereof, and particularly, the first structure and the second structure form a composite temperature control device, so as to break through a mode that a single material soaking plate dissipates heat only through its soaking property, and further alleviate the problem of hot spot protrusion of the device.

Referring to fig. 1, the present application provides a temperature control device, including:

A first structure 11;

The second structure 12, the second structure 12 is connected with the first structure 11, and the first structure 11 and the second structure 12 can jointly form a heat dissipation surface in the same side direction;

Wherein, the heat conduction power of the first structure 11 and the second structure 12 along the first direction are different; the first direction is the direction of the first structure 11 and the second structure 12 towards the heat dissipation surface.

Specifically, in the technical scheme adopted by the application, a composite layer is formed by combining the first structure 11 and the second structure 12 in a connection manner, and it is required to say that the heat dissipation surface is necessarily formed by the surfaces of the first structure 11 and the second structure 12 in the same side direction together, for example, the surface of the side, where the first structure 11 and the second structure 12 are connected with the casing 1 in fig. 1, is the heat dissipation surface. In a preferred embodiment, the material of the first structure 11 is set to be a material with a low heat conduction rate along the first direction, and the material of the second structure 12 is set to be a material with a high heat conduction rate along the first direction, and a heat conduction plate capable of rapidly transferring heat to the first direction is selected.

When the heat source device is used, the first structure 11 can be installed corresponding to the heat source 2, so that hot spots are prevented from being formed on the machine shell 1 at positions corresponding to the heat source 2 by the heat source 2, heat generated by the heat source 2 is conducted in a plane by the heat dissipation surfaces formed by the first structure 11 and the second structure 12, and because the heat conduction power of the first structure 11 and the heat conduction power of the second structure 12 along the first direction are different, the heat dissipation surfaces are formed by the first structure 11 and the second structure 12 together in the same side direction to conduct heat unevenly, the heat radiated to the first structure 11 is transferred to the second structure 12, and the heat is conducted to the first direction through the second structure 12 to conduct heat to be dispersed and conducted out, so that excessive heat radiated by the first structure 11 in the first direction can be prevented, and obvious hot spots are prevented from being formed on one side of the first structure 11.

Further, referring to FIG. 1, in some embodiments, the second structure 12 is at least one of:

The second structure 12 is arranged circumferentially around the first structure 11;

the second structure 12 is located on one side of the first structure 11 perpendicular to the first direction;

The second structure 12 is located on at least two sides of the first structure 11 perpendicular to the first direction.

Specifically, two connection modes of the second structure 12 are provided in the technical scheme adopted by the application, and the second structure 12 can be circumferentially arranged around the first structure 11, and the first structure 11 can be understood to be positioned in the middle of the second structure 12; the second structure 12 may also be connected to at least two sides of the first structure 11 perpendicular to the first direction. Both of the above connection modes are for heat conduction balance so that the heat emitted from the heat source 2 is driven to spread to the surrounding by the first structure 11 until the heat is conducted to the first direction by the second structure 12.

Further, referring to fig. 2 and 3, in some embodiments, a third structure 13 is also included having a first surface and a second surface for conducting heat; the first surface is connected to the first structure 11 and the second structure 12; the second surface is the surface facing away from the first structure 11 and the second structure 12 for receiving or conducting away heat; the third structure 13 is at least one of the following:

The second surface of the third structure 13 is covered on the casing 1;

The second surface of the third structure 13 faces the heat generating source or overlies the heat generating source 2.

Specifically, a further preferred embodiment of the temperature control device is provided in the technical scheme adopted by the application, and in one embodiment, the first embodiment can be divided into two cases, namely, the third structure 13 can be arranged on one side of the first structure 11 and the second structure 12, which can be close to the heat source 2, and is used for conducting the heat emitted by the heat source 2 to all directions perpendicular to the first direction, and can be understood as assisting the heat to be dispersed to the direction of the second structure 12, so that the second structure 12 can quickly receive the heat dispersed to the surrounding; the second type is that the third structure 13 may be further disposed on a side of the first structure 11 and the second structure 12 away from the heat generating source 2, and the third structure 13 may be attached to the casing 1, so that heat conducted in the first direction by the second structure 12 may be conducted again along the plane of the third structure 13, and a hot spot with a larger range may be avoided from being formed on the casing 1.

Further, referring to fig. 4, in some embodiments, two third structures 13 are further included for conducting heat; the first structure 11 and the second structure 12 are arranged between two third structures 13.

Specifically, a second preferred embodiment of the third structure 13 is provided in the technical scheme adopted by the application, the temperature control device comprises two third structures 13, and the first structure 11 and the second structure 12 are arranged between the two third structures 13, so that two surfaces which can be respectively attached to the heat source 2 and the casing 1 are formed on the temperature control device through the two third structures 13; when the heat source device is used, heat emitted by the heat source 2 is emitted to the direction of the second structure 12 through one third structure 13, the second structure 12 can be quickly guided into the other third structure 13 after receiving the heat, the third structures 13 are made of planar heat conducting materials so as to gather the heat to the middle part again, if the area of the third structures 13 is far larger than that of the first structures 11 and the second structures 12, the heat can be diffused to the periphery again, and the first structures 11 can isolate the heat and correspond to the heat source 2, so that obvious hot spots can not be generated in a short time when the heat source 2 corresponds to the machine shell 1, and the obvious hot spots can not be generated on the machine shell 1 when the two third structures 13 are matched.

Further, referring to FIG. 4, in some embodiments, the temperature control device is divided into a first composite layer and a second composite layer that is coupled to the first composite layer; the first composite layer is composed of a layer of third structures 13 and a first structure 11 positioned between the two third structures 13 and is used for butt joint of the heat source 2; the second composite layer is composed of another layer of third structures 13 and a second structure 12 located between the two third structures 13.

Specifically, in the technical scheme adopted by the application, the temperature control device can also be composed of a first composite layer and a second composite layer, the first composite layer comprises a third structure 13 which is arranged in a laminated way and a first structure 11 fixed on the third structure 13, the second composite layer comprises a third structure 13 which is arranged in a laminated way and a second structure 12 fixed on the third structure 13, for convenience in configuration, the coverage area of the two third structures 13 can be set to be far larger than the coverage area of the first structure 11 and the second structure 12, the shape of the first structure 11 and the shape of the structure can be set to be matched or embedded, so that one side of the first composite layer with the first structure 11 and one side of the second composite layer with the second structure 12 are connected, specifically, the first structure 11 and the second structure 12 are connected to form the temperature control device with at least three layers, the outermost layer of the device is the third structure 13, and is composed of the first structure 11 and the second structure 12, and when in use, the first structure 11 and the second structure 11 can be correspondingly arranged to the heat source 2.

Further, referring to FIG. 1, in some embodiments, the first structure 11 is provided as a thermally insulating material; the second structure 12 is provided as a thermally conductive material that transfers heat in a first direction.

Specifically, in the technical scheme adopted by the application, the heat insulation material can be silica aerogel, the heat conduction material can be aluminum foil, and it is noted that other heat insulation materials or heat conduction materials can be adopted, wherein the heat insulation material can realize heat insulation, and the heat conduction material can realize efficient heat conduction to the first direction, which are all in the protection scope of the application.

Further, referring to fig. 1, in some embodiments, the first structure 11 forms a first area for the corresponding heat source 2 to block the heat source 2 from conducting heat to the casing 1; the second structure 12 forms a second region offset from the heat generating source 2 at the periphery of the first region for conducting heat to the cabinet 1.

Specifically, in the technical scheme adopted by the application, the silica aerogel is selected as the heat insulation material, so that a first area capable of isolating heat can be formed at the part of the temperature control device corresponding to the heating source 2; when the aluminum foil is used as the heat conducting material, a second area which conducts heat efficiently in the first direction can be formed on two sides or the periphery of the first area of the temperature control device, so that heat can be conducted from the first area to the second area and from the second area to the machine shell 1 in the process of conducting heat in the plane through the third structure 13, and obvious hot spots are avoided from being generated at the part of the machine shell 1 corresponding to the heat generating source 2. In the embodiment in which the temperature control device has two third structures 13, the heat conducted by the second region can also be received by the third structures 13 close to the casing 1, and the third structures 13 conduct planar heat again, so as to avoid forming a larger range of hot spots on the casing 1 after the third structures 13 close to the heat generating source 2 reach the limit of planar heat conduction.

Further, referring to fig. 2, 3, and 4, in some embodiments, the third structure 13 is configured as a soaking material that transfers heat in a second direction, the second direction being perpendicular to the first direction; wherein the coverage area formed on the third structure 13 is not smaller than the sum of the planar areas of the first structure 11 and the second structure 12.

Specifically, in the technical solution adopted in the present application, since the second structures 12 are disposed on two sides of the first structure 11 or circumferentially arranged, the coverage area of the third structure 13 in the temperature control device may be set to be equal to or greater than the sum of the planar areas of the first structure 11 and the second structure 12, that is, the third structure 13 may completely cover the first structure 11 and the second structure 12, and may further fully receive heat of the second structure 12 or transfer heat to the second structure 12.

Further, in some embodiments, the soaking material is graphite flake.

Referring to fig. 1 to 4, the present application further provides an electronic device, which includes a heat source 2, a housing 1, and a temperature control device disposed between the heat source 2 and the housing 1;

The temperature control device comprises a first structure 11 corresponding to the heat source 2; the second structure 12, the second structure 12 is connected with the first structure 11, and the first structure 11 and the second structure 12 together form a heat dissipation surface in the direction close to the casing 1;

Wherein, the heat conduction power of the first structure 11 and the second structure 12 along the first direction are different; the first direction is the direction of the first structure 11 and the second structure 12 towards the heat dissipation surface.

Specifically, the technical scheme adopted by the application also provides an electronic device, which is provided with the devices in the above embodiments, specifically, the temperature control device is arranged between the heating source 2 and the casing 1, and the specific arrangement mode is described in the above provided embodiments, so that the detailed description is omitted.

It should be noted that, in the description of the present specification, the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present application and simplifying the description, and are not indicative or implying that the apparatus or element in question must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present application; the terms "coupled," "mounted," "secured," and the like are to be construed broadly, and may be fixedly coupled, detachably coupled, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the description of the present specification, the terms "one embodiment," "some embodiments," "particular embodiments," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. A temperature control device, comprising:

A first structure;

the second structure is connected with the first structure, and the first structure and the second structure can jointly form a heat dissipation surface in the same side direction;

Wherein the first structure and the second structure have different heat conduction power along a first direction;

The first direction is a direction of the first structure and the second structure towards the heat dissipation surface.

2. The temperature control device according to claim 1, wherein,

The second structure is at least one of:

The second structure is arranged circumferentially around the first structure;

the second structure is positioned on one side of the first structure perpendicular to the first direction;

The second structure is positioned on at least two sides of the first structure perpendicular to the first direction.

3. The temperature control device of claim 1, further comprising:

A third structure having a first surface and a second surface for conducting heat;

the first surface is connected to the first structure and the second structure;

The second surface is a surface facing away from the first structure and the second structure and is used for receiving or outputting heat;

The third structure is at least one of:

The second surface of the third structure is covered on the shell;

The second surface of the third structure faces or is covered on the heat generating source.

4. The temperature control device of claim 1, further comprising:

Two third structures for conducting heat;

The first structure and the second structure are arranged between the two third structures;

Each of the third structures is connected to the first structure and the second structure.

5. The temperature control device according to claim 4, wherein,

The temperature control device is divided into a first composite layer and a second composite layer connected with the first composite layer;

The first composite layer is composed of one layer of the third structures and the first structures positioned between the two third structures;

The second composite layer is composed of another layer of the third structures and the second structure located between the two third structures.

6. The temperature control device according to any one of claims 1 to 5, characterized in that,

The first structure is provided as a thermally insulating material;

The second structure is configured as a thermally conductive material that transfers heat in the first direction.

7. The temperature control device according to claim 6, wherein,

The first structure forms a first area corresponding to the heating source so as to prevent the heating source from conducting heat to the shell;

the second structure forms a second region offset from the heat generating source at a periphery of the first region for conducting heat to the housing.

8. The temperature control device according to any one of claims 3 to 5, characterized in that,

The third structure is arranged as a soaking material for transferring heat along the second direction; the second direction is perpendicular to the first direction;

Wherein a coverage area formed on the third structure is not smaller than a sum of planar areas of the first structure and the second structure.

9. The temperature control device of claim 8, wherein the temperature control device comprises a temperature sensor,

The soaking material is graphite flake.

10. An electronic device, comprising,

The device comprises a heating source, a shell and a temperature control device arranged between the heating source and the shell;

The temperature control device comprises:

a first structure corresponding to the heat generation source;

The second structure is connected with the first structure, and the first structure and the second structure form a heat dissipation surface together in the direction close to the shell;

Wherein the first structure and the second structure have different heat conduction power along a first direction;

The first direction is a direction of the first structure and the second structure towards the heat dissipation surface.