CN221306361U - Novel crooked heating panel - Google Patents

Novel crooked heating panel Download PDF

Info

Publication number
CN221306361U
CN221306361U CN202322854650.XU CN202322854650U CN221306361U CN 221306361 U CN221306361 U CN 221306361U CN 202322854650 U CN202322854650 U CN 202322854650U CN 221306361 U CN221306361 U CN 221306361U
Authority
CN
China
Prior art keywords
metal layer
heat dissipation
bending
layer
plating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202322854650.XU
Other languages
Chinese (zh)
Inventor
李正林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xiamen Hongkai Electronic Technology Co ltd
Original Assignee
Xiamen Hongkai Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xiamen Hongkai Electronic Technology Co ltd filed Critical Xiamen Hongkai Electronic Technology Co ltd
Priority to CN202322854650.XU priority Critical patent/CN221306361U/en
Application granted granted Critical
Publication of CN221306361U publication Critical patent/CN221306361U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model relates to the technical field of heat dissipation plates, and discloses a novel bending heat dissipation plate, which comprises: the metal layer is bent along the axial direction, the bending radian of the metal layer is 0.1-0.8 rad, a layer of plating layer is plated on the surface of the metal layer, and the plating layer is made of metal. By designing the heat dissipation plate, matching the metal layer with the plating layer, main body heat dissipation, plating layer auxiliary heat dissipation, plating layer protection and the like can be realized, and by matching with the axial bending of the heat dissipation plate, rapid heat dissipation, enhanced protection, electrostatic shielding and the like can be realized; the single circumferential bending or double axial bending of the heat radiation plate can realize the abdication and the protection of devices matched on the device shell, and a certain bending radian can improve the occupied space, and because the bending radian is extruded by the outside, larger acting force is needed, so that the impact with smaller force and the like can be shielded; the copper metal layer can increase the heat dissipation effect, improve the heat dissipation efficiency of the device, and the like.

Description

Novel crooked heating panel
Technical Field
The utility model relates to the technical field of heat dissipation plates, in particular to a novel bending heat dissipation plate.
Background
Along with rapid development of technology, electronic products gradually lead the trend of the times, and many electronic products are deep into the lives of people and play different roles in the lives of people. The integrated circuit chip in the electronic product is an electronic base stone and is the most fragile device, better protection is needed, and the protection of the components is considered to be incapable of damaging the components, such as mechanical damage, electrostatic damage, thermal damage and the like. However, the conventional heat dissipation plate is a simple metal plane plate, and is made of a single metal iron sheet, so that the heat dissipation plate has a great defect.
Accordingly, in view of the above problems, the existing heat dissipation plate needs to be further improved.
Disclosure of utility model
The utility model aims to solve the problems that the existing heat dissipation plate is poor in heat dissipation effect and is extremely easy to cause metal damage, electrostatic influence and the like due to single metal (such as iron). Through the design to the heating panel, carry out the collocation of metal level and cladding material to and the axial bending of heating panel, can realize quick heat dissipation, reinforcing protection and electrostatic shielding etc..
The technical scheme of the utility model is as follows:
A novel curved heat dissipation plate, the curved heat dissipation plate comprising: the metal layer is bent along the axial direction, the bending radian of the metal layer is 0.1-0.8 rad, a layer of plating layer is plated on the surface of the metal layer, and the plating layer is made of metal materials.
Further, the metal layer is a square metal layer.
Further, the metal layer is provided with through holes for mounting on other objects by means of bolts or the like.
Further, the metal layer is selected from a copper metal layer or an aluminum metal layer.
Further, the copper metal layer is selected from a red copper metal layer or an iron bronze metal layer or an oxygen-free copper metal layer.
Further, the red copper component of the red copper metal layer comprises copper and silver, and the total weight percentage of the copper and the silver is in the range of 99% -99.99% in terms of the total weight percentage of the red copper being 100%.
Further, the iron bronze component of the iron bronze metal layer contains copper, iron and phosphorus, and the total weight percentage of copper, iron and phosphorus is in the range of 99.5-99.9% in terms of the total weight percentage of iron bronze to be 100%.
Further, the oxygen-free copper component of the oxygen-free copper metal layer comprises copper, phosphorus, zinc and silver, and the total weight percent of the copper, the phosphorus, the zinc and the silver is in the range of 99.9-99.99 percent according to the total weight percent of the oxygen-free copper to be 100 percent.
Further, the oxygen-free copper component of the oxygen-free copper metal layer also comprises nickel and lead, and the total weight of the nickel and the lead is 0.002-0.006 percent according to the total weight of the oxygen-free copper by 100 percent.
Further, the plating layer is made of metal nickel.
Further, the metal layer is a rectangular metal layer.
Further, the metal layers have two axial directions, the two metal layers are perpendicular to each other in the axial directions, the foot drop is coincident with the center of the metal layers, and the metal layers are bent along the two axial directions.
Further, the bending of the metal layer is performed by using a punch press forming technology.
Further, the thickness of the metal layer is selected to be 2 mm-3 mm.
Further, the plating layer adopts an electroplating process and nickel sulfamate is selected as an electroplating base material.
Further, the thickness of the plating layer is selected to be 1-5 mu m.
Advantageous effects
According to the utility model, through the design of the heat dissipation plate, the matching of the metal layer and the plating layer can realize main body heat dissipation, plating layer auxiliary heat dissipation, plating layer protection and the like, and the matching of the axial bending of the heat dissipation plate can realize rapid heat dissipation, enhanced protection, electrostatic shielding and the like; the single circumferential bending or double axial bending of the heat radiation plate can realize the abdication and the protection of devices matched on the device shell, and a certain bending radian can improve the occupied space, and because the bending radian is extruded by the outside, larger acting force is needed, so that the impact with smaller force and the like can be shielded; the red copper metal layer or the iron bronze metal layer or the oxygen-free copper metal is adopted, so that the heat dissipation effect can be increased, the heat dissipation efficiency of the device is improved, and the like.
Drawings
Fig. 1 is a schematic diagram of a single-curved structure of a novel curved heat dissipating plate according to the present utility model.
Fig. 2 is a schematic structural diagram of a single Qu Changzhou side of a novel curved heat spreader according to the present utility model.
Fig. 3 is a schematic structural diagram of a single Qu Duanzhou side of a novel curved heat spreader according to the present utility model.
Fig. 4 is a schematic structural view of a single curved plane of a novel curved heat dissipating plate according to the present utility model.
Fig. 5 is a schematic structural view of a single curved section of a novel curved heat dissipating plate according to the present utility model.
Fig. 6 is an enlarged schematic view of a single curved section of a novel curved heat dissipating plate according to the present utility model.
Fig. 7 is a schematic diagram of a hyperbolic structure of a novel curved heat sink according to the present utility model.
Fig. 8 is a schematic structural view of a side surface of a hyperbolic long axis of a novel curved heat sink plate according to the present utility model.
Fig. 9 is a schematic structural view of a hyperbolic short axis side of a novel curved heat spreader of the present utility model.
Fig. 10 is a schematic view showing the structure of a hyperbolic plane of a novel curved heat spreader according to the present utility model.
Fig. 11 is a schematic structural view of a hyperbolic cross section of a novel curved heat dissipating plate according to the present utility model.
Fig. 12 is an enlarged schematic view of a hyperbolic cross-section of a novel curved heat dissipating plate according to the present utility model.
Reference numerals: 01. a single-curved metal layer; 02. a sheet Qu Tongkong; 03. a sheet Qu Duceng; 04. a single curved red copper layer; 11. a hyperbolic metal layer; 12. a hyperbolic through hole; 13. a hyperbolic coating; 14. and a hyperbolic red copper layer.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden on the person of ordinary skill in the art based on embodiments of the present utility model, are intended to be within the scope of the present utility model.
Referring to fig. 1 to 6, the present utility model provides a novel curved heat dissipation plate, which includes: the single-bending metal layer 01 and a single Qu Duceng 03, wherein the single-bending metal layer 01 is a rectangular metal layer and is a red copper metal layer, namely a single-bending red copper layer 04, the thickness of the single-bending metal layer 01 is 3mm, the single-bending metal layer 01 is manufactured by bending by adopting a punching machine stamping forming technology and is manufactured by single Qu Tongkong 02, the single-bending metal layer 01 is bent along the longitudinal direction, the bending radian of the single-bending metal layer 01 is 0.1 rad-0.8 rad, a plating layer is plated on the surface of the single-bending metal layer 01, the plating layer is made of metal nickel, and a nickel sulfamate is selected as a plating base material by adopting a plating technology to plate a metal nickel layer with the thickness of 2 mu m on the surface of the single-bending metal layer 01;
Wherein, the red copper component comprises 95.5 percent of copper, 4.3 percent of silver, 0.005 percent of iron, 0.005 percent of lead and other impurities by weight percent, and the raw materials are uniformly mixed, are smelted in a smelting furnace at high temperature, and are cooled.
In a second embodiment, referring to fig. 7 to 12, the present utility model provides a novel curved heat dissipation plate, which includes: the hyperbolic metal layer 11 and the hyperbolic coating 13, the hyperbolic metal layer 11 is a rectangular metal layer, and is a red copper metal layer, namely a hyperbolic red copper layer 14, the thickness of the hyperbolic metal layer 11 is 3mm, the hyperbolic metal layer 11 is manufactured by bending by adopting a punching machine stamping forming technology and is manufactured by bending the hyperbolic metal layer 11 along the long axial direction, namely: the axial direction of the hyperbolic metal layer 11 is in two directions, the axial directions of the two hyperbolic metal layers 11 are mutually perpendicular, the foot drop is coincident with the center of the hyperbolic metal layer 11, and the hyperbolic metal layer 11 is bent along the two axial directions; the bending radian of the hyperbolic metal layer 11 is 0.1-0.8 rad, a plating layer is plated on the surface of the hyperbolic metal layer 11, the plating layer is made of metal nickel, and nickel sulfamate is selected as a plating base material by adopting a plating process to plate a metal nickel layer with the thickness of 2 mu m on the surface of the hyperbolic metal layer 11;
Wherein, the red copper component comprises 95.5 percent of copper, 4.3 percent of silver, 0.005 percent of iron, 0.005 percent of lead and other impurities by weight percent, and the raw materials are uniformly mixed, are smelted in a smelting furnace at high temperature, and are cooled.
In addition, the red copper material of the red copper metal layer used in the utility model can also be red copper in GB/T5231-2012; the iron bronze of the iron bronze metal layer can also be C19210 copper; the oxygen-free copper of the oxygen-free copper metal may also be copper of the T10150 type.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. A novel curved heat sink, the curved heat sink comprising: the metal layer is bent along the axial direction, the bending radian of the metal layer is 0.1-0.8 rad, a layer of plating layer is plated on the surface of the metal layer, and the plating layer is made of metal materials.
2. A novel curved heat sink according to claim 1, wherein the metal layer is a square metal layer.
3. A novel curved heat sink as claimed in claim 1, wherein the metal layer is provided with through holes for mounting on an object by means of bolts.
4. A novel curved heat sink according to claim 1, wherein the metal layer is selected from copper metal layer and aluminum metal layer.
5. A novel curved heat dissipating plate according to claim 4, wherein said copper metal layer is selected from a red copper metal layer, a bronze metal layer, and an oxygen-free copper metal layer.
6. A novel curved heat sink according to claim 1, wherein the plating layer is made of metallic nickel.
CN202322854650.XU 2023-10-24 2023-10-24 Novel crooked heating panel Active CN221306361U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322854650.XU CN221306361U (en) 2023-10-24 2023-10-24 Novel crooked heating panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322854650.XU CN221306361U (en) 2023-10-24 2023-10-24 Novel crooked heating panel

Publications (1)

Publication Number Publication Date
CN221306361U true CN221306361U (en) 2024-07-09

Family

ID=91750552

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322854650.XU Active CN221306361U (en) 2023-10-24 2023-10-24 Novel crooked heating panel

Country Status (1)

Country Link
CN (1) CN221306361U (en)

Similar Documents

Publication Publication Date Title
US10475750B2 (en) Systems, methods, and apparatuses for implementing an organic stiffener with an EMI shield for RF integration
CN107211555A (en) Electronic circuit board component including EMI shielding constructions and cooling pad
CN201487849U (en) Heat dissipation substrate for alternating current LED light source
US20150190985A1 (en) Chassis and method for manufacturing chassis
CN105472865A (en) Circuit board comprising heat transfer structure
JP2012248576A (en) Pin-like fin integrated-type heat sink
CN221306361U (en) Novel crooked heating panel
CN105666983A (en) Artificial graphite and copper composite heat sink and preparation method thereof
CN214155259U (en) Chip shielding structure and electronic device
CN204119719U (en) Radome
CN202998655U (en) Metal-base printed circuit board
CN202652697U (en) PCB with metal substrate
CN213547914U (en) High-frequency multilayer circuit board
CN210807775U (en) Circuit board of high temperature resistant quick installation
US7416011B2 (en) Electronic assembly having a substrate laminated within a backplate cavity
CN108184308B (en) PCB manufacturing method and PCB
TWI786182B (en) Thermal-dissipating substrate structure
CN207283902U (en) One kind heat dissipation pcb board
CN111394709A (en) Metal-plated graphite sheet and preparation method thereof
CN213280196U (en) Reinforced heat dissipation device for copper-clad plate
CN205800352U (en) The composite fin of electrographite/copper
CN105848418B (en) A kind of flexible circuit board for carrying Type-C interfaces and preparation method thereof
CN203120376U (en) Shielding cover plate
CN107660112B (en) Electromagnetic shield and method for manufacturing same
CN105355568A (en) Processing method of metal packaging shell of large-scale and large-power integrated circuit.

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant