CN221264343U - Loop type heat pipe unidirectional circulation device - Google Patents
Loop type heat pipe unidirectional circulation device Download PDFInfo
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- CN221264343U CN221264343U CN202323260346.9U CN202323260346U CN221264343U CN 221264343 U CN221264343 U CN 221264343U CN 202323260346 U CN202323260346 U CN 202323260346U CN 221264343 U CN221264343 U CN 221264343U
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- 239000012530 fluid Substances 0.000 claims abstract description 88
- 238000010521 absorption reaction Methods 0.000 claims abstract description 32
- 230000017525 heat dissipation Effects 0.000 claims description 38
- 238000002955 isolation Methods 0.000 claims description 4
- 230000004308 accommodation Effects 0.000 claims description 2
- 239000007788 liquid Substances 0.000 description 5
- 230000004913 activation Effects 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A unidirectional circulating device for loop heat pipe comprises a lower cover plate and an upper shell body which is tightly adhered to the lower cover plate. Wherein, the upper shell comprises a fluid inlet, a fluid outlet, a joint surface, a heat absorption area and a gas discharge cavity. The joint surface is tightly adhered to the lower cover plate, and the heat absorption area is formed between the fluid inlet and the fluid outlet. The heat absorption area comprises an inner surface height of the heat absorption area, and the gas discharge cavity is provided with a gas discharge cavity height which is larger than the inner surface height of the heat absorption area.
Description
Technical Field
The present invention relates to a unidirectional circulating device, and more particularly to a unidirectional circulating device for a loop-type heat pipe.
Background
With the increasing computing power of processors, temperature control during operation of electronic components such as processors is becoming increasingly important. When the operation speed of the working chip (i.e. the heating source) in the electronic devices such as the mobile phone, the tablet, the notebook computer and the like is continuously increased, the environmental temperature in the system is also increased, and the stability of the system is further reduced.
In order to solve the above-mentioned problems, the industry uses a heat pipe (heat pipe) and a vapor chamber (vapor chamber) to dissipate heat of the working wafer, so that the heat of the working wafer can be rapidly discharged out of the system, thereby controlling the temperature in the system of electronic devices such as mobile phone, tablet and notebook computer, and further maintaining the stability of the system.
In general, the temperature equalizing plate and the heat pipe can be connected to a heat source requiring heat dissipation and connected to a heat dissipation fin or other heat dissipation devices, so as to transfer heat to the heat dissipation fin or other heat dissipation devices by using the temperature equalizing plate or the heat pipe, so as to bring heat out of electronic devices such as a mobile phone, a tablet, a notebook computer and the like, and further improve the working reliability of electronic elements.
In addition, the loop heat pipe has the functions of high heat transfer capacity, long-distance heat transmission, low thermal resistance and the like, so that the loop heat pipe is widely applied to the fields of aerospace science and technology, energy sources, electronic cooling and the like. However, in the face of increasing technological progress, there is still room for improvement in existing loop heat pipes. Therefore, how to improve the performance of the loop heat pipe is a challenge for the related industry.
Disclosure of utility model
An objective of the present invention is to provide a unidirectional circulating device for loop heat pipes, which is used for improving the heat dissipation efficiency of the loop heat pipes.
According to an embodiment of the present invention, a loop type heat pipe unidirectional circulation device is provided. The loop type heat pipe unidirectional circulating device comprises a lower cover plate and an upper shell body which is tightly adhered to the lower cover plate. Wherein, the upper shell comprises a fluid inlet, a fluid outlet, a joint surface, a heat absorption area and a gas discharge cavity. The joint surface is tightly adhered to the lower cover plate, and the heat absorption area is formed between the fluid inlet and the fluid outlet. The heat absorption area comprises an inner surface height of the heat absorption area, and the gas discharge cavity is provided with a gas discharge cavity height which is larger than the inner surface height of the heat absorption area.
In some embodiments, the upper housing further comprises a fluid guiding block having a tip disposed toward the fluid outlet.
In some embodiments, the upper housing further comprises an inlet channel having an inlet channel upper surface height, and the heat absorbing region inner surface height is greater than the inlet channel upper surface height.
In some embodiments, the upper housing further comprises a gas chamber having a gas chamber height greater than the inner surface height of the heat absorbing region.
In some embodiments, the inlet flow channel is at least partially located between the heat absorption region and the gas receiving chamber.
In some embodiments, the inlet flow channels, the heat absorption region, the gas receiving chamber, and the gas discharge chamber surround the fluid guide block.
In some embodiments, the fluid guide block is attached to the lower cover plate.
In some embodiments, a gas chamber activation section is provided between the inlet flow channel and the gas chamber to determine whether the heat dissipating gas flows from the heat absorbing section to the gas chamber.
In some embodiments, the heat absorbing region further comprises a plurality of heat conducting bumps extending downward from the heat absorbing region.
In some embodiments, the upper housing further comprises a fluid inlet chamber at the fluid inlet, the fluid inlet chamber having a fluid inlet chamber height, and the fluid inlet chamber height being greater than the inlet flow channel upper surface height.
In some embodiments, the upper housing further comprises a fluid isolation bump disposed between the fluid inlet chamber and the gas chamber.
In some embodiments, the fluid outlet is about flush with a gas discharge chamber upper surface of the gas discharge chamber.
In some embodiments, the gas receiving chamber height is equal to the gas discharge chamber height.
Therefore, according to the structure of the embodiments of the loop type heat pipe unidirectional circulating device, the loop type heat pipe unidirectional circulating device can utilize the gas accommodating cavity and the fluid guide block to increase the pressure of gas exhaust, avoid gas backflow, improve the heat dissipation efficiency, and can further utilize the gas accommodating cavity to enable the interval so as to open or close the gas accommodating cavity according to the requirements, further improve the working efficiency of the loop type heat pipe unidirectional circulating device and increase the heat dissipation efficiency of the loop type heat pipe.
The above description is merely illustrative of the problems to be solved, the technical means for solving the problems, the efficacy of the solutions, etc., and the details of the present invention are described in the following description and related drawings.
Drawings
The above and other objects, features, advantages and embodiments of the present invention will become more apparent by reading the following description of the accompanying drawings in which:
Fig. 1 is a schematic side view of a loop type heat pipe unidirectional circulating device according to an embodiment of the present invention.
Fig. 2 is a schematic bottom view of the loop type heat pipe unidirectional circulating device of fig. 1.
Fig. 3 is a schematic perspective view of the loop type heat pipe unidirectional circulating device of fig. 1 in a bottom view.
Wherein reference numerals are as follows:
100: loop type heat pipe unidirectional circulation device
110: Upper shell
112: Junction surface
120: Fluid inlet
130: Fluid outlet
140: Heat absorption area
142: Height of inner surface of heat absorbing zone
150: Gas discharge chamber
152: Height of gas discharge chamber
154: Upper surface of gas discharge chamber
160: Fluid guide block
162: Height of fluid guide block
164: Tip end
170: Gas accommodating cavity
172: Height of gas accommodating chamber
174: Gas accommodation chamber activation section
180: Fluid inlet chamber
182: Fluid inlet chamber height
190: Inlet flow channel
192: Height of upper surface of inlet flow channel
200: Fluid isolation bump
201: First gas flow passage
202: Second gas flow passage
203: Third gas flow passage
210: Heat conduction bump
220: Lower cover plate
222: Upper surface of lower cover plate
300: Gas outlet pipeline
400: Heat source
500: Fluid inlet line
Detailed Description
Various embodiments of the present invention are disclosed in the drawings, and for the purposes of explanation, numerous practical details are set forth in the following description. However, it should be understood that these practical details are not to be taken as limiting the present invention. That is, in the present novel embodiment, these practical details are unnecessary. Moreover, for the sake of simplicity of the drawing, some well-known and conventional structures and elements are shown in the drawings in a simplified schematic manner.
Fig. 1 is a schematic side view of a loop type heat pipe unidirectional circulating device, fig. 2 is a schematic bottom view thereof, and fig. 3 is a schematic perspective view of the loop type heat pipe unidirectional circulating device in the bottom view thereof.
Referring to fig. 1 to 3, the loop type heat pipe unidirectional circulation device 100 includes an upper housing 110 and a lower cover 220. The heat source 400 is, for example, a processor of an electronic device or a heat pipe connected to the processor, but the present invention is not limited thereto. The heat source 400 is connected to the upper case 110 to dissipate heat of the electronic components.
In some embodiments, the upper housing 110 includes a fluid inlet 120, a fluid outlet 130, a junction 112, a heat absorption region 140, and a gas discharge chamber 150.
In addition, the lower cover 220 has a lower cover upper surface 222 partially adhered to the joint surface 112 of the upper housing 110. The heat absorption region 140 is formed between the fluid inlet 120 and the fluid outlet 130, and the heat absorption region 140 includes a heat absorption region inner surface height 142. In addition, the gas discharge chamber 150 has a gas discharge chamber height 152, wherein the gas discharge chamber height 152 is greater than the heat sink inner surface height 142. Therefore, when the heat absorption region 140 absorbs the heat from the heat source 400 and heats the heat dissipation fluid to become heat dissipation gas, the heat dissipation gas can flow to the fluid outlet 130 through the gas discharge chamber 150, and then enter the loop-type heat pipe through the gas outlet pipe 300 connected to the fluid outlet 130 for subsequent cooling. When the cooled heat dissipation fluid can enter the loop-type heat pipe unidirectional circulating device 100 again through the fluid inlet 120 via the fluid inlet pipeline 500 of the loop-type heat pipe, so as to dissipate heat of the electronic component. It should be noted that the upper housing 110 of the loop-type heat pipe unidirectional circulation device 100 further includes a fluid guiding block 160, such as the fluid guiding block 160 having a heart-shaped cross section, so that the fluid guiding block 160 has a tip 164, and referring to fig. 2, the tip 164 is disposed towards the fluid outlet 130 to guide the heat dissipation fluid, and the heat dissipation fluid collected by the second air flow channels 202 and the third air flow channels 203 at two sides of the tip 164 will generate an acceleration to flow to the fluid outlet 130 and enter the loop-type heat pipe through the air outlet pipeline 300.
In some embodiments, the loop-type heat pipe unidirectional circulation device 100 further includes a gas chamber 170 having a gas chamber height 172, and the gas chamber height 172 is greater than the inner surface height 142 of the heat absorption region. Therefore, the gas accommodating chamber 170 can also accommodate a portion of the heat dissipation gas formed by heating the heat dissipation fluid from the heat absorption region 140, and guide the heat dissipation gas to the fluid outlet 130 through the first gas flow channel 201 and the second gas flow channel 202, and then enter the loop-type heat pipe through the gas outlet pipeline 300.
In addition, since the gas accommodating chamber 170 is closer to the heat source 400, the temperature and pressure of the heat dissipation gas accommodated in the gas accommodating chamber 170 are higher than those of the heat dissipation gas in the gas discharging chamber 150, so that the heat dissipation gas discharged from the first gas flow channel 201 and the second gas flow channel 202 has a larger pressure, and the heat dissipation gas in the gas discharging chamber 150 can be pushed to the fluid outlet 130, thereby avoiding the heat dissipation gas of the loop-type heat pipe unidirectional circulation device 100 from flowing back, and increasing the heat dissipation efficiency of the loop-type heat pipe unidirectional circulation device 100.
In some embodiments, the loop-type heat pipe unidirectional circulation device 100 further comprises an inlet flow channel 190 having an inlet flow channel upper surface height 192, and the heat absorption region inner surface height 142 is greater than the inlet flow channel upper surface height 192.
Notably, the inlet flow channel 190 is at least partially located between the heat absorption region 140 and the gas receiving chamber 170. Thus, a gas receiving chamber enabling region 174 is formed between the inlet flow channel 190 and the gas receiving chamber 170, which determines whether the heat dissipating gas can flow from the heat absorbing region 140 to the gas receiving chamber 170 via the first gas flow channel 201.
In some embodiments, when the height of the liquid of the heat dissipation fluid is greater than the height 192 of the upper surface of the inlet channel, that is, the upper surface of the liquid is between the gas receiving chamber enabling regions 174, the liquid fills the inlet channel 190, so that the heat dissipation gas in the heat absorption region 140 directly flows from the third gas channel 203 to the fluid outlet 130 to enter the loop heat pipe through the gas outlet pipeline 300.
In some embodiments, when the height of the liquid of the heat dissipation fluid is smaller than the height 192 of the upper surface of the inlet flow channel, that is, the upper surface of the liquid is lower than the activation region 174 of the gas accommodating chamber, the heat dissipation gas is moved from the heat absorption region 140 to the inlet flow channel 190 due to the fact that the height 172 of the gas accommodating chamber is higher than the height 192 of the upper surface of the inlet flow channel, and the heat dissipation gas is prevented from flowing back from the inlet flow channel 190 to the fluid inlet 120, as shown in fig. 2, the heat dissipation gas can flow from the heat absorption region 140 to the gas accommodating chamber 170 through the first gas flow channel 201, and then is accommodated in the gas accommodating chamber 170 to increase the temperature and pressure of the heat dissipation gas, and then is discharged through the second gas flow channel 202, and meanwhile, the heat dissipation gas in the gas discharging chamber 150 is pushed to the fluid outlet 130, so that the heat dissipation gas of the loop-type unidirectional heat pipe circulation device 100 is effectively prevented from flowing back, and the heat dissipation efficiency of the loop-type unidirectional heat pipe circulation device 100 is increased.
In some embodiments, the inlet flow channel 190, the heat absorbing region 140, the gas receiving chamber 170, and the gas discharge chamber 150 surround the fluid guide block 160.
In some embodiments, the first gas flow channel 201, the second gas flow channel 202, and the third gas flow channel 203 surround the fluid guide block 160.
In some embodiments, the fluid guide block 160 is attached to the lower cover plate 220. The fluid guide block height 162 of the fluid guide block 160 is thus approximately equal to the gas discharge chamber height 152, in other words approximately equal to the height of the gas discharge chamber upper surface 154 to the lower cover plate upper surface 222.
In some embodiments, the gas receiving chamber height 172, the fluid guide block height 162, and the gas discharge chamber height 152 are the same height as one another.
In some embodiments, the heat absorbing region 140 further includes a plurality of heat conducting protrusions 210 extending downward from the heat absorbing region 140, and preferably the heat conducting protrusions 210 are also attached to the lower cover 220.
In some embodiments, the upper housing 110 of the loop-type heat pipe unidirectional circulation device 100 further includes a fluid inlet chamber 180 disposed at the fluid inlet 120, the fluid inlet chamber 180 has a fluid inlet chamber height 182, and the fluid inlet chamber height 182 is higher than the inlet channel upper surface height 192.
In some embodiments, the upper housing 110 of the loop-type heat pipe unidirectional circulation device 100 further includes a fluid isolation bump 200 disposed between the fluid inlet chamber 180 and the gas containing chamber 170 for isolating the heat dissipation fluid in the fluid inlet chamber 180 and the heat dissipation fluid in the gas containing chamber 170.
In some embodiments, the fluid outlet 130 is preferably about flush with the gas discharge chamber upper surface 154 of the gas discharge chamber 150 to increase the efficiency of gas discharge.
Therefore, according to the structure of the embodiments of the unidirectional circulating device for loop heat pipes, the unidirectional circulating device for loop heat pipes can utilize the gas accommodating cavity and the fluid guiding block to increase the pressure of the gas exhaust, avoid the gas backflow, improve the heat dissipation efficiency, and can further utilize the enabling interval of the gas accommodating cavity to open or close the gas accommodating cavity according to the requirements, thereby improving the working efficiency of the unidirectional circulating device for loop heat pipes and increasing the heat dissipation efficiency of the loop heat pipes.
Finally, the embodiments disclosed above are not intended to limit the invention, and any person skilled in the art may make various modifications and alterations without departing from the spirit and scope of the invention. The scope of the present invention is therefore defined in the appended claims.
Claims (13)
1. A loop heat pipe unidirectional circulation device, comprising:
A lower cover plate; and
An upper housing sealed to the lower cover plate, wherein the upper housing comprises:
A fluid inlet;
a fluid outlet;
A joint surface closely adhered to the lower cover plate;
A heat absorbing area formed between the fluid inlet and the fluid outlet, wherein the heat absorbing area comprises a height of an inner surface of the heat absorbing area; and
A gas discharge chamber having a gas discharge chamber height, wherein the gas discharge chamber height is greater than the suction zone inner surface height.
2. The loop type heat pipe unidirectional circulating apparatus of claim 1, wherein the upper housing further comprises a fluid guiding block having a tip disposed toward the fluid outlet.
3. The loop type heat pipe unidirectional circulating device as claimed in claim 2, wherein the upper housing further comprises an inlet runner having an inlet runner upper surface height, and the heat absorption area inner surface height is greater than the inlet runner upper surface height.
4. The apparatus of claim 3, wherein the upper housing further comprises a gas chamber having a gas chamber height greater than the heat absorption area inner surface height.
5. The loop heat pipe unidirectional circulating apparatus of claim 4, wherein the inlet flow passage is at least partially located between the heat absorption region and the gas receiving chamber.
6. The loop heat pipe unidirectional circulating apparatus of claim 5, wherein the inlet flow channel, the heat absorption region, the gas receiving chamber, and the gas discharge chamber surround the fluid guide block.
7. The loop type heat pipe unidirectional circulating apparatus of claim 6, wherein the fluid guiding block is attached to the lower cover plate.
8. The loop type heat pipe unidirectional circulating device as claimed in claim 6, wherein a gas accommodating chamber enabling section is provided between the inlet flow passage and the gas accommodating chamber to determine whether heat dissipation gas flows from the heat absorption section to the gas accommodating chamber.
9. The loop type heat pipe unidirectional circulating apparatus of claim 7, wherein the heat absorption region further comprises a plurality of heat conduction bumps extending downward from the heat absorption region.
10. The unidirectional circulating device of claim 4, wherein the upper housing further comprises a fluid inlet chamber positioned at the fluid inlet, the fluid inlet chamber having a fluid inlet chamber height, and the fluid inlet chamber height being greater than the inlet flow channel upper surface height.
11. The loop type heat pipe unidirectional circulating apparatus of claim 10, wherein the upper housing further comprises a fluid isolation protrusion disposed between the fluid inlet chamber and the gas receiving chamber.
12. The loop heat pipe unidirectional circulating apparatus of claim 1, wherein the fluid outlet is approximately flush with a gas discharge chamber upper surface of the gas discharge chamber.
13. The loop type heat pipe unidirectional circulating apparatus of claim 4, wherein the gas accommodation chamber height is equal to the gas discharge chamber height.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202363462108P | 2023-04-26 | 2023-04-26 | |
| US63/462,108 | 2023-04-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221264343U true CN221264343U (en) | 2024-07-02 |
Family
ID=91269365
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323260346.9U Active CN221264343U (en) | 2023-04-26 | 2023-11-28 | Loop type heat pipe unidirectional circulation device |
| CN202323262498.2U Active CN221427092U (en) | 2023-04-26 | 2023-11-28 | Heat dissipation device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323262498.2U Active CN221427092U (en) | 2023-04-26 | 2023-11-28 | Heat dissipation device |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN221264343U (en) |
| TW (2) | TWM653182U (en) |
-
2023
- 2023-11-28 TW TW112212934U patent/TWM653182U/en unknown
- 2023-11-28 TW TW112212932U patent/TWM653181U/en unknown
- 2023-11-28 CN CN202323260346.9U patent/CN221264343U/en active Active
- 2023-11-28 CN CN202323262498.2U patent/CN221427092U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWM653181U (en) | 2024-03-21 |
| CN221427092U (en) | 2024-07-26 |
| TWM653182U (en) | 2024-03-21 |
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