JP3169381U - Electronic device cooling device and heat sink module thereof - Google Patents

Abstract

The present invention provides a heat sink module provided with a structure for promoting gas-liquid circulation in a cooling device used in an electronic device or the like. A hollow main body 11 filled with a cooling working fluid is provided, and a first inlet end 111, a first outlet end 112, and a flow guiding region 113 for the cooling working fluid are arranged inside the hollow main body. Furthermore, the first inlet end and the first outlet end of the cooling working fluid are located on both ends of the flow introduction region, and the flow introduction region operates from the first inlet end toward the first outlet end. A plurality of guiding fluids 1131 for guiding fluid are arranged at intervals, and a cooling working fluid channel 1132 is formed between these guiding fluids to constitute a cooling device. [Selection] Figure 2

Description

  The present invention relates to a cooling device for an electronic device and a heat sink module thereof, and particularly relates to a cooling device for an electronic device provided with a structure for promoting gas-liquid circulation in the cooling device and the heat sink module thereof.

With the rapid development of the electronic semiconductor industry in recent years, progress in process technology, and the trend of market demand, electronic devices are gradually moving toward light, thin and small forms. Functions and computing power are constantly improving. In the information industry, when large-capacity notebook computers and desktop computers actually operate, many electronic components generate heat, of which the heat generated by the CPU (Central Processing Unit) is the largest. Sometimes, a heat sink composed of a combination of a heat sink piece and a fan provides a heat sink function, i.e., plays an important role in protecting the CPU, maintains the normal operating temperature of the CPU, and performs the intended function. CPU heat sinks are now an important part in the information industry.

Therefore, in recent years, the application of water cooling technology to personal computers has begun to expand, and the water cooling technology omits a heat sink with a large volume, but it actually collects the heat of the heat source in the system in the working liquid, After that, the operation of exchanging heat with air by the heat exchanger is unified, and the length of the pipe can be changed by itself, so the position of the heat exchanger is also relatively flexible, and the heat exchanger (heat sink fin ) Design is not subject to space restrictions. However, since the water cooling technology needs to drive the flow of the working liquid by one pump and further requires a tank, the entire system still has problems of pump reliability, pipe leakage, etc. Have

In the prior art, heat is still transferred by using a heat pipe, and then heat exchange is performed by radiating heat using a heat sink fin. Besides increasing efficiency, the power consumption of the CPU can only be reduced.

Please refer to FIG. It is a cross-sectional view of a conventional loop heat sink module. As shown in the figure, the heat sink module 8 is composed of a heat absorbing member 81, a cooling member 82, and a pipe line member 83, and the cooling member 82 includes a plurality of cooling members 82. The heat absorbing member 81 has an outlet 811 and an inlet 812 for cooling working fluid and is filled with the working fluid 84. The heat absorbing member 81 includes the pipe member 83 and A heat conduction loop is formed through the connection of the cooling member 82.

The pipe member 83 further includes a first portion 831, a second portion 832, and a third portion 833, and the first portion 831 is provided between the heat absorbing member 81 and the cooling member 82, and The second portion 832 is wound through and installed in the cooling member 82, and the third portion 833 is provided between the cooling member 82 and the inlet 812 of the heat absorbing member 81. The first, second, and third portions 831, 832, and 833 are continuously and integrally connected.

  When conducting heat, first, the heat absorbing member 81 is brought into contact with at least one heat generating member 9 to absorb the amount of heat generated by the heat generating member 9, and the working fluid 84 in the heat absorbing member 81 is evaporated from the liquid. The gas is converted into gas, flows through the first portion 831 of the pipe member 83 and flows to the cooling member 82 for cooling, and the gaseous working fluid 84 is supplied to the second portion of the pipe member 83 inside the cooling member 82. After entering 832, heat is transmitted from the second portion 832 to the cooling member 82 to dissipate heat to the outside by radiation, and at the same time, the gas working fluid 84 in the second portion 832 of the pipe member 83 is cooled. It condenses and transforms into a liquid. Subsequently, the liquid working fluid 84 is guided from the second portion 832 through the third portion 833 to be continuously circulated to the heat absorbing member 81, and the circulation is continued.

The working fluid 84 is converted from gas to liquid in the second portion 832, and the liquid working fluid 84 in the second portion 832 gently circulates in the heat absorbing member 81 simply by gravity, A dead space is formed at a discontinuous portion or a bent portion of the second portion 832 of the pipe member 83, and the efficiency of circulation of the working fluid 84 is not improved. Therefore, the prior art has the following defects:
1. Poor thermal conductivity effect;
2. Having a heat transfer ineffective area;
3. Cost is high.

JP 2011-18500 A JP 2009-49010 A

In order to solve the above problems, a main object of the present invention is to provide a cooling device with improved gas-liquid circulation effect.

Another object of the present invention is to provide a heat sink module that can improve gas-liquid circulation and reduce the occurrence of dead space of thermal convection.

In order to achieve the above object, the cooling device and the heat sink module thereof provided by the present invention include a hollow body having at least one first inlet end, at least one first outlet end, and a conduction region. And the first inlet end and the first outlet end are respectively disposed corresponding to both sides of the flow guiding region, and the flow guiding region has a plurality of fluid guiding fluids, and one end of the fluid guiding fluid is the first fluid conveying channel. Corresponding to the inlet end, the other end corresponds to the first outlet end, and the guide fluid is spaced apart and has at least one flow path between the guide fluids.

To achieve the above object, a heat sink module provided by the present invention comprises a cooling device and at least one heat absorbing member, and the cooling member has a hollow body, and the hollow body has at least one hollow body. A first inlet end and at least one first outlet end and a diverting region, wherein the first inlet end and the first outlet end are respectively installed on both sides of the diverting region; And having one end of the guide fluid corresponding to the first inlet end and the other end corresponding to the first outlet end, the guide fluid being arranged at intervals, And at least one flow path between the heat absorption member and the heat absorption member. The heat absorption member has an evaporation portion, and both sides of the evaporation portion have a second inlet and a second outlet, respectively. The first outlet end is connected via a member, and the second outlet is connected via the second heat conducting member, Connected to the primary inlet end.

The installation of the flow guiding region of the present invention not only improves the gas-liquid circulation of the cooling device and the heat sink module, but also can avoid the generation of dead space in which the working fluid stays in heat conduction.

Therefore, the present invention has the following advantages:
1. There is no working fluid retention area for heat conduction;
2. Improve gas-liquid circulation;
3. Greatly improve heat transfer efficiency;
4). Reduce costs.

1 is a cross-sectional view of a first embodiment of a heat sink module of the prior art. It is sectional drawing of 1st Example of the cooling device of this invention. It is sectional drawing of 2nd Example of the cooling device of this invention. It is sectional drawing of 3rd Example of the cooling device of this invention. It is sectional drawing of 4th Example of the cooling device of this invention. It is sectional drawing of 5th Example of the cooling device of this invention. It is sectional drawing of 1st Example of the heat sink module of this invention. It is sectional drawing of 1st Example of the heat sink module of this invention. It is operation | movement explanatory drawing of the heat sink module of this invention.

The above object and the structural and functional characteristics of the present invention will be described below with reference to preferred embodiments based on the drawings.

Please refer to FIG. It is a cross-sectional view of a first embodiment of the cooling device of the present invention. As shown in the figure, the cooling device 1 includes a hollow body 11.

The hollow body 11 has at least one first inlet end 111, at least one first outlet end 112, and a flow guiding region 113, and the first inlet end 111 and the first outlet end 112 are each guided by the guide. The flow guide region 113 is provided corresponding to both ends of the flow region 113, and the flow guide region 113 has a plurality of fluid guides 1131, and the fluid guide fluids 1131 are arranged at intervals, and at least one is provided between the fluids 1131. One flow path 1131 is formed, and one end of the guiding fluid 1131 corresponds to the first inlet end 111 and the other end corresponds to the first outlet end 112.

The flow path 1132 has a first end 1132a and a second end 1132b.

FIG. 3 is a sectional view of a second embodiment of the cooling device of the present invention. As shown in the figure, this embodiment has the same partial structure as the first embodiment, and is not described again here. The difference of the present embodiment from the first embodiment is that the first inlet end 111 of the present embodiment further extends the auxiliary diffusion portion 114, and the auxiliary diffusion portion 114 includes the first diffusion end 1141 and the first diffusion end 1141. A second diffusion end 1142 is provided, and the width of the first diffusion end 1141 is smaller than the second diffusion end 1142.

FIG. 4 is a cross-sectional view of a third embodiment of the cooling device of the present invention. As shown in the figure, this embodiment has the same part of the structure as the first embodiment, and will not be described again here.
This embodiment differs from the first embodiment in that the inner wall of the hollow body 11 of this embodiment has a capillary structure 11a, and the capillary structure 11a is either sintered metal powder or mesh. In this embodiment, sintering of metal powder will be described as an example, but the present invention is not limited to this.

FIG. 5 is a cross-sectional view of a fourth embodiment of the cooling device of the present invention. As shown in the figure, this embodiment has the same part of the structure as the first embodiment, and will not be described again here.
The difference between the present embodiment and the first embodiment is that the inner wall of the hollow body 11 of the present embodiment has any one of a plurality of grooves and a plurality of recesses 11b or protrusions. The recess 11b will be described as an example, but the present invention is not limited to this.

FIG. 6 is a sectional view of a fifth embodiment of the cooling device of the present invention. As shown in the figure, this embodiment has the same part of the structure as the first embodiment, and will not be described again here.
This embodiment is different from the first embodiment in that a plurality of heat sink fins 11c are provided outside the hollow body 11 of the present embodiment.

The working fluid 2 is provided in the hollow main body 11 of each of the embodiments, and the working fluid 2 is any one of refrigerants such as pure water, methanol, acetone, R134A and the like.

FIG. 7 is a cross-sectional view of the first embodiment of the heat sink module of the present invention. As shown in the figure, the heat sink module 3 includes a cooling device 1, at least one heat absorbing member 4, a first heat conducting member 5, and a second heat conducting member 6.

The cooling device 1 has the same structure as that of the first embodiment of the cooling device 1, and the description of the first embodiment of the cooling device 1 and the drawings will be referred to, and will not be described again in the description of this embodiment.

The heat absorbing member 4 has an evaporation part 41, and both sides of the evaporation part 41 have a second inlet 42 and a second outlet 43, respectively, and the second inlet 42 passes through the first heat conducting member 5. The second outlet 43 is connected to the first outlet end 112 via the second heat conducting member 6.

  The first heat conducting member 5 and the second heat conducting unit 6 are in a hollow tube state, and are formed of either metal or plastic material. The first heat conducting member 5 in the present invention is a heat pipe and has a capillary structure 51 or a groove structure therein.

Both sides of the cooling device 1 are provided on a plurality of heat sink fins 11c.

  FIG. 8 is a sectional view of a second embodiment of the heat sink module of the present invention. As shown in the figure, this embodiment has the same structure as that of the first embodiment of the heat sink module 3, and will not be described again here. The difference between the present embodiment and the first embodiment of the heat sink module 3 is that the first inlet end 111 of the cooling device 1 of the present embodiment further extends the auxiliary diffusion section 114, and the auxiliary diffusion section 114 is , A first diffusion end 1141 and a second diffusion end 1142, and the width of the first diffusion end 1141 is smaller than the second diffusion end 1142.

  FIG. 9 is an operation explanatory view of the heat sink module of the present invention. As shown in the figure, when the heat sink module 3 performs a heat conduction operation, the heat sink module 3 is brought into contact with at least one heat source 7 by the heat absorbing member 4 and receives heat from the working fluid 2 in the heat absorbing member 4 in the evaporation region. The liquid is converted into a gas, and the working fluid 21 is discharged from the second outlet 43, and at the same time, is transmitted to the first inlet end 111 of the cooling device 1 by the second heat conducting member 6 and enters the cooling device 1. Then, a high-pressure drive required for gas-liquid circulation is established through the conduction region 113 in the cooling device 1, and a low-pressure end is generated in the conduction region 113 by an appropriate pressure-reducing structure. A pressure gradient required for gas-liquid circulation is formed, and finally the liquid working fluid 22 is guided to return from the first heat conducting member 5 to the heat absorbing member 4, thereby improving the heat conduction efficiency of the heat sink module 3. To improve the problem of invalid area in the cooling member.

DESCRIPTION OF SYMBOLS 1 Cooling device 11 Hollow main body 11a Capillary structure 11b Recessed part 111 1st inlet end 112 1st outlet end 113 Flow introduction area | region 1131 Fluid introduction | transduction 1132 Flow path 1132a 1st end 1132b 2nd end 114 Auxiliary diffusion part 1141 1st diffusion end 1142 1st 2 diffusion end 2 working fluid 21 gaseous working fluid 22 liquid working fluid 3 heat sink module 4 heat absorbing member 41 evaporating part 42 second inlet 43 second outlet 44 capillary structure 5 first heat conducting member 51 capillary structure 6 second heat conducting member 7 Heat source

Claims (13)

A hollow body filled with a cooling working fluid,
A first inlet end and a first outlet end of the cooling working fluid and a flow guiding region are provided inside the hollow body,
The first inlet end and the first outlet end of the cooling working fluid are located at both ends of the flow guiding region,
A plurality of guide fluids that guide the working fluid from the first inlet end toward the first outlet end are arranged at intervals in the guide region, and a cooling working fluid is interposed between the guide fluids. A cooling device in which a flow path is formed. The cooling device according to claim 1, wherein the flow path has a first end through which a working fluid for cooling flows in and a second end through which the working fluid flows out. The first inlet end is further formed by extending an auxiliary diffusion part into which the cooling working fluid flows, and the auxiliary diffusion part is introduced from the first diffusion end having a narrow flow path into which the cooling working fluid flows. The cooling device according to claim 1, further comprising a second diffusion end whose flow path is enlarged toward the surface. The cooling device according to claim 1 which has a capillary structure in an inner wall of said hollow main part. The cooling device according to claim 4, wherein the capillary structure is one of sintered metal powder and mesh. The cooling device according to claim 1, wherein the inner wall of the hollow body has any one of a plurality of grooves and a plurality of concave portions or a plurality of convex portions. The cooling device according to claim 1, wherein the hollow main body is filled with a working fluid, and the working fluid is any one of refrigerants such as pure water, methanol, acetone, and R134A. A hollow body filled with a cooling working fluid,
A first inlet end and a first outlet end of the cooling working fluid and a flow guiding region are provided inside the hollow body,
The first inlet end and the first outlet end of the cooling working fluid are located at both ends of the flow guiding region,
A plurality of guide fluids that guide the working fluid from the first inlet end toward the first outlet end are arranged at intervals in the guide region, and a cooling working fluid is interposed between the guide fluids. A cooling device that forms a flow path;
An evaporating section filled with a cooling working fluid, and the evaporating section is provided with a second inlet through which cooling working fluid flows and a second outlet through which cooling working fluid flows out at both ends; A first outlet end of the cooling device is connected via a first heat conducting member for circulating a cooling working fluid, and a cooling working fluid is circulated between the second outlet and the first inlet of the cooling device. At least one heat absorbing member connected via two heat conducting members;
Heat sink module composed of   The heat sink module according to claim 8, wherein the flow path has a first end through which a cooling working fluid flows and a second end through which the cooling working fluid flows. The first inlet end is further formed by extending an auxiliary diffusion part into which the cooling working fluid flows, and the auxiliary diffusion part is introduced from the first diffusion end having a narrow flow path into which the cooling working fluid flows. The heat sink module according to claim 8, further comprising a second diffusion end whose flow path is enlarged toward the surface. The heat sink module according to claim 8, wherein the hollow body is filled with a working fluid, and the working fluid is one of refrigerants such as pure water, methanol, acetone, and R134A. The heat sink module according to claim 8, wherein the heat absorbing member is filled with a working fluid, and the working fluid is one of refrigerants such as pure water, methanol, acetone, and R134A. The heat sink module according to claim 8, wherein the first heat conducting member is a heat pipe and has a capillary structure therein.

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