TWM653181U - Heat dissipation device - Google Patents

Abstract

A heat dissipation device includes an inclined heat pipe and a plurality of inclined heat dissipation fins. The inclined heat pipe includes an inclined heat dissipation area, and each inclined heat dissipation fin includes an inclined heat dissipation portion. In addition, the inclined heat dissipation area of ​​the inclined heat pipe is fixed to the inclined heat dissipation portion, so that the inclined heat dissipation area of ​​the inclined heat pipe forms a predetermined angle relative to a horizontal plane.

Description

Cooling device

The new system relates to a heat dissipation device. In particular, it relates to a heat dissipation device with a sloped heat pipe.

With the advancement of technology, electronic products are becoming more and more popular and have gradually changed the way many people live or work. As computer computing power increases, the temperature control of electronic components such as CPUs and graphics chips becomes more and more important.

Electronic components such as CPUs and graphics chips generate heat during operation and require proper cooling to achieve optimal performance. In order to keep CPUs and graphics chips running at an ideal temperature, the proper cooling device configuration will determine the performance of the electronic device.

In addition, as the size of current electronic devices is getting smaller and smaller, and the number of cores in their computing chips is increasing, the heat generated is also increasing. In a small space, not only computing chips and heat dissipation devices are installed, but also other mechanisms and electronic components are installed at the same time.

Therefore, how to take into account space utilization and improve heat dissipation efficiency to reduce the operating temperature of the computing chip will help improve the overall working efficiency of the electronic device.

The novel content is intended to provide a simplified summary of the present disclosure so that readers can have a basic understanding of the present disclosure. This novel content is not a complete overview of the present disclosure, and its purpose is not to point out the important/key elements of the present invention or to define the scope of the present invention.

One purpose of the present invention is to provide a heat dissipation device that can improve the heat dissipation efficiency of the heat dissipation device, thereby improving the overall working efficiency of the electronic device.

To achieve the above-mentioned purpose, according to one embodiment of the present disclosure, a heat dissipation device is provided, which includes a tilted heat pipe and a plurality of tilted heat dissipation fins. The tilted heat pipe includes a tilted heat dissipation area, and each tilted heat dissipation fin includes a tilted heat dissipation portion. The tilted heat dissipation area of the tilted heat pipe is fixed to the tilted heat dissipation portion so that the tilted heat dissipation area of the tilted heat pipe is at a predetermined angle relative to the horizontal plane.

In some embodiments, each inclined heat dissipation fin further includes a first heat dissipation portion connected below the inclined heat dissipation portion for horizontal fixation on a substrate.

In some embodiments, each inclined heat dissipation fin further includes an extended heat dissipation portion connected above the first heat dissipation portion and connected to one side of the inclined heat dissipation portion.

In some embodiments, the inclined heat pipe further includes a heat absorption area that is horizontally attached to a heat source.

In some embodiments, each inclined heat sink fin further includes an expanded air inlet located above the first heat sink portion to guide the heat sink air into the inclined heat sink fin.

In some embodiments, each inclined heat dissipation fin further includes an air guide protrusion to guide the heat dissipation air toward the inclined heat dissipation portion.

In some embodiments, each inclined heat dissipation fin further includes an air guide opening, and the air guide protrusion protrudes from the air guide opening to guide the heat dissipation air through the air guide opening.

In some embodiments, the air guiding openings and the air guiding protrusions are rectangular, triangular or polygonal.

In some embodiments, each inclined heat sink fin further includes an air guide opening to allow heat dissipation air to pass through the inclined heat sink fin.

In some embodiments, the first heat dissipation portion of each inclined heat dissipation fin further includes a lower inclined portion, so that the lower part of the first heat dissipation portion forms an angle with the horizontal plane.

In some embodiments, the first heat dissipation portion of each inclined heat dissipation fin further includes an air guide flange protruding from the lower inclined portion to guide the heat dissipation air.

In some embodiments, the inclined heat dissipation portion of each inclined heat dissipation fin includes an air guide flange to increase the contact area with the inclined heat dissipation area of the inclined heat pipe and guide the heat dissipation air.

In some embodiments, the extended heat dissipation portion of each inclined heat dissipation fin includes an L-shaped air guide flange connected to the air guide flange of the inclined heat dissipation portion.

In some embodiments, the heat dissipation device further includes a fan located on one side of the inclined heat dissipation fins to drive the heat dissipation air to the inclined heat dissipation areas of the inclined heat dissipation fins and the inclined heat pipes.

In some embodiments, the inclined heat dissipation area of the inclined heat pipe forms a predetermined angle of 5 to 45 degrees relative to the horizontal plane.

Therefore, the aforementioned heat dissipation device effectively increases the air inlet volume of the heat dissipation fins, and at the same time effectively increases the outlet width of the heat dissipation fins, reducing the bottleneck of the heat dissipation air flow, thereby increasing the heat dissipation efficiency, improving the heat dissipation quality, and increasing the overall stability of the electronic device. efficacy.

The following is a detailed description with reference to the embodiments and the attached drawings, but the embodiments provided are not intended to limit the scope of the disclosure, and the description of the structure and operation is not intended to limit the order of execution. Any device with equal functions produced by the re-combination of components is within the scope of the disclosure. In addition, the drawings are for illustration purposes only and are not drawn according to the original size. For ease of understanding, the same or similar components in the following description will be indicated by the same symbols.

In addition, the terms used throughout the specification and the patent application generally have the ordinary meaning of each term used in this field, in the context of this disclosure, and in the specific context, unless otherwise specified. Certain terms used to describe the present disclosure will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in describing the present disclosure.

In the embodiments and the scope of the patent application, unless there is a special limitation on the article in the context, "a" and "the" can generally refer to a single one or a plurality. The numbers used in the steps are only used to mark the steps for ease of explanation, but are not used to limit the order and implementation manner.

Secondly, the words "include", "include", "have", "contain", etc. used in this article are all open terms, which mean including but not limited to.

Figures 1 to 3 are schematic side views of the heat dissipation device according to various embodiments of the present invention. Figure 4 is a three-dimensional schematic view of the heat dissipation fins of the heat dissipation device, and Figure 5 is a schematic view of the heat dissipation device. Three-dimensional diagram.

First referring to FIG. 1 , as shown in the figure, the heat dissipation device 100 includes an inclined heat pipe 800 and a plurality of inclined heat dissipation fins 200 . Referring to FIG. 5 , the inclined heat pipe 800 includes a heat absorption area 810 and an inclined heat dissipation area 820 . The inclined heat dissipation fin 200 includes a first heat dissipation part 210 and an inclined heat dissipation part 220. The first heat dissipation part 210 is connected below the inclined heat dissipation part 220 for horizontal fixation on a substrate. The inclined heat dissipation area 820 of the inclined heat pipe 800 is fixed on the hypotenuse of the inclined heat dissipation part 220, so that the inclined heat dissipation area 820 of the inclined heat pipe 800 forms a predetermined angle relative to the horizontal plane. In some embodiments, the heat-absorbing area 810 of the inclined heat pipe 800 is used to be horizontally attached to a heat source, and the inclined heat-dissipating area 820 of the inclined heat pipe 800 is rotated at a predetermined angle relative to the heat-absorbing area 810 of the inclined heat pipe 800. to be installed on the inclined heat dissipation portion 220 of the inclined heat dissipation fin 200 .

In some embodiments, the first heat sink 210 includes a first side 212, a second side 214, a third side 216, and a fourth side 218, and is approximately rectangular. The inclined heat sink 220 includes a first side 222, a second side 224, and a third side 226, and is approximately triangular. The first side 222 of the inclined heat sink 220 is connected to a portion of the third side 216 of the first heat sink 210, and is preferably integrally formed with a portion of the third side 216 of the first heat sink 210. The inclined heat dissipation area 820 of the inclined heat pipe 800 is fixed to the third side 226 of the inclined heat dissipation portion 220, so that the inclined heat dissipation area 820 of the inclined heat pipe 800 and the first side 222 of the inclined heat dissipation portion 220 and/or the first side 212 of the first heat dissipation portion 210 form a predetermined angle of about 5 to 45 degrees, preferably about 10 to 40 degrees, but the present invention is not limited thereto. The inclination of the inclined heat dissipation area 820 of the inclined heat pipe 800 and the third side 226 of the inclined heat dissipation portion 220 can be designed according to actual needs and heat dissipation efficiency to improve the actual heat dissipation efficiency of the heat dissipation device 100, all of which are within the spirit and protection scope of the present invention.

In some embodiments, the first side 222 of the inclined heat dissipation part 220 and the first side 212 of the first heat dissipation part 210 are preferably arranged parallel to the substrate.

In some embodiments, the tilted heat sink 200 may further include an extended heat sink 230 connected to the top of the first heat sink 210 and to a side of the tilted heat sink 220. For example, the extended heat sink 230 includes a first side 232, a second side 234, a third side 236, and a fourth side 238, and is approximately rectangular. The second side 224 of the tilted heat sink 220 is connected to a portion of the second side 234 of the extended heat sink 230, and is preferably integrally formed with a portion of the second side 234 of the extended heat sink 230 to form the desired tilted heat sink 200.

It is worth noting that the heat dissipation device 100 further includes a fan 900, which is located at the second side 214 of the first heat dissipation portion 210, that is, located at the left side of the inclined heat dissipation fin 200 in the figure, to drive the heat dissipation air to blow toward the inclined heat dissipation fin 200 and the inclined heat dissipation area 820 of the inclined heat pipe 800. The heat dissipation air driven by the fan 900 can enter the inclined heat dissipation fin 200 through the air inlet 101, and then pass through the first heat dissipation portion 210, the inclined heat dissipation portion 220 and the extended heat dissipation portion 230 to reach the air outlet 102. The inclined heat sink 220 forms a gradually expanding air outlet width, see the inclined heat sink air outlet width 105, which can effectively cooperate with the first heat sink air outlet width 104 of the first heat sink 210 to increase the air outlet width, avoid air outlet bottleneck, and further improve the overall heat dissipation efficiency of the heat sink 100.

Referring to FIG. 2, as shown in the figure, the heat dissipation device 100 includes a tilted heat pipe 800 and a plurality of tilted heat dissipation fins 300. The tilted heat dissipation fins 300 include a first heat dissipation portion 310 and a tilted heat dissipation portion 320. The first heat dissipation portion 310 is connected to the bottom of the tilted heat dissipation portion 320 and is horizontally fixed on a substrate. The tilted heat dissipation area 820 of the tilted heat pipe 800 is fixed to the inclined side of the tilted heat dissipation portion 320 so that the tilted heat dissipation area 820 of the tilted heat pipe 800 is at a predetermined angle relative to the horizontal plane.

In some embodiments, the first heat dissipation part 310 includes a first side 312, a second side 314, a third side 316 and a fourth side 318, and is approximately rectangular. The inclined heat dissipation portion 320 includes a first side 322, a second side 324, and a third side 326, approximately forming a triangle. Among them, the first side 322 of the inclined heat dissipation part 320 is connected to a part of the third side 316 of the first heat dissipation part 310, and is preferably integrally formed on a part of the third side 316 of the first heat dissipation part 310. . The inclined heat dissipation area 820 of the inclined heat pipe 800 is fixed to the third side 326 of the inclined heat dissipation part 320, so that the inclined heat dissipation area 820 of the inclined heat pipe 800 is connected with the first side 322 of the inclined heat dissipation part 320 and/or the first heat dissipation. The first side 312 of the portion 310 forms a predetermined angle, about 5 degrees to 45 degrees, preferably about 10 to 40 degrees, but the present invention is not limited to this. The inclined heat dissipation area 820 of the inclined heat pipe 800 and the inclined heat dissipation The inclination of the third side 326 of the portion 320 can be designed according to actual needs and heat dissipation efficiency to improve the actual heat dissipation efficiency of the heat dissipation device 100, without departing from the spirit and protection scope of the present invention.

In some embodiments, the first side 322 of the inclined heat dissipation part 320 and the first side 312 of the first heat dissipation part 310 are preferably arranged parallel to the substrate.

In some embodiments, the tilted heat sink 300 may further include an extended heat sink 330 connected to the top of the first heat sink 310 and connected to a side of the tilted heat sink 320. For example, the extended heat sink 330 includes a first side 332, a second side 334, a third side 336 and a fourth side 338, and is approximately rectangular. The second side 324 of the tilted heat sink 320 is connected to a portion of the second side 334 of the extended heat sink 330, and is preferably integrally formed with a portion of the second side 334 of the extended heat sink 330 to form the desired tilted heat sink 300.

It is worth noting that the heat dissipation device 100 further includes a fan 900 located on the second side 314 of the first heat dissipation part 310, that is, on the left side of the inclined heat dissipation fins 300 in the figure, to drive the heat dissipation air to blow towards the inclined heat dissipation fins. 300 and the inclined heat dissipation area 820 of the inclined heat pipe 800. The heat dissipation air driven by the fan 900 can enter the inclined heat dissipation fins 300 through the air inlet 101 and an expanded air inlet 103, and then pass through the first heat dissipation part 310, the inclined heat dissipation part 320 and the extended heat dissipation part 330 to reach the air outlet 102.

The expanded air inlet 103 is located on the third side 316 of the first heat dissipation part 310 , the part not covered by the inclined heat dissipation part 320 , to further guide the heat dissipation air into the inclined heat dissipation fins 300 .

In some embodiments, the inclined heat dissipation fin 300 further includes an air guide protrusion 340 to guide the heat dissipation air toward the inclined heat dissipation portion 320 to effectively increase the heat dissipation efficiency of the overall heat dissipation device 100 .

In some embodiments, the inclined heat sink fin 300 further includes an air guide opening 341 to facilitate heat dissipation air to pass through the inclined heat sink fin 300, thereby effectively increasing the heat dissipation efficiency of the entire heat sink 100.

In some embodiments, the inclined heat sink fin 300 includes an air guiding protrusion 340 and an air guiding opening 341, and the air guiding protrusion 340 protrudes from one side of the air guiding opening 341 to guide the heat dissipation air to pass through the air guiding opening 341, so as to effectively increase the heat dissipation efficiency of the entire heat dissipation device 100.

In some embodiments, the air guiding opening 341 and the air guiding protrusion 340 are rectangular, triangular or polygonal, but the present invention is not limited thereto.

It is worth noting that in this embodiment, the inclined heat sink fin 300 can form a gradually expanding air outlet width by tilting the inclined heat sink 320 of the inclined heat sink fin 300, see the inclined heat sink air outlet width 105, which can effectively cooperate with the first heat sink air outlet width 104 of the first heat sink 310 to increase the air outlet width, avoid air outlet bottleneck, and further improve the overall heat dissipation efficiency of the heat sink 100.

Referring to FIG. 3, as shown in the figure, the heat dissipation device 100 includes a tilted heat pipe 800 and a plurality of tilted heat dissipation fins 400. The tilted heat dissipation fins 400 include a first heat dissipation portion 410 and a tilted heat dissipation portion 420. The first heat dissipation portion 410 is connected to the bottom of the tilted heat dissipation portion 420 to be horizontally fixed on a substrate. The tilted heat dissipation area 820 of the tilted heat pipe 800 is fixed to the inclined side of the tilted heat dissipation portion 420 so that the tilted heat dissipation area 820 of the tilted heat pipe 800 is at a predetermined angle relative to the horizontal plane.

In some embodiments, the first heat dissipation portion 410 includes a first side 412, a second side 414, a third side 416, a fourth side 418 and a lower inclined portion 419, forming a pentagonal shape. . The inclined heat dissipation portion 420 includes a first side 422, a second side 424, and a third side 426, approximately forming a triangle. The first side 422 of the inclined heat dissipation part 420 is connected to a part of the third side 416 of the first heat dissipation part 410, and is preferably integrally formed on a part of the third side 416 of the first heat dissipation part 410. . The inclined heat dissipation area 820 of the inclined heat pipe 800 is fixed to the third side 426 of the inclined heat dissipation part 420, so that the inclined heat dissipation area 820 of the inclined heat pipe 800 is connected with the first side 422 of the inclined heat dissipation part 420 and/or the first heat dissipation. The first side 412 of the portion 410 forms a predetermined angle, about 5 degrees to 45 degrees, preferably about 10 to 40 degrees, but the present invention is not limited to this. The inclined heat dissipation area 820 of the inclined heat pipe 800 and the inclined heat dissipation The inclination of the third side 426 of the portion 420 can be designed according to actual needs and heat dissipation efficiency to improve the actual heat dissipation efficiency of the heat dissipation device 100, without departing from the spirit and protection scope of the present invention.

In some embodiments, the first side 422 of the inclined heat sink 420 and the first side 412 of the first heat sink 410 are preferably disposed parallel to each other on the substrate.

In some embodiments, the tilted heat sink 400 may further include an extended heat sink 430 connected to the top of the first heat sink 410 and connected to a side of the tilted heat sink 420. For example, the extended heat sink 430 includes a first side 432, a second side 434, a third side 436, and a fourth side 438, which are approximately rectangular. The second side 424 of the tilted heat sink 420 is connected to a portion of the second side 434 of the extended heat sink 430, and is preferably integrally formed with a portion of the second side 434 of the extended heat sink 430 to form the desired tilted heat sink 400.

Similarly, the fan 900 is located on the second side 414 of the first heat dissipation part 410, that is, on the left side of the inclined heat dissipation fins 400 in the figure, to drive the heat dissipation air to blow toward the inclined heat dissipation fins 400 and the inclination of the inclined heat pipe 800. Heat dissipation zone 820. The heat dissipation air driven by the fan 900 can enter the inclined heat dissipation fins 400 through the air inlet 101, and then pass through the first heat dissipation part 410, the inclined heat dissipation part 420 and the extended heat dissipation part 430 to reach the air outlet 102.

It is worth noting that in this embodiment, the lower inclined portion 419 of the first heat sink 410 of the inclined heat sink fin 400 is connected between the first side 412 and the fourth side 418 of the first heat sink 410, so that a portion of the lower portion of the first heat sink 410 is at an angle to the horizontal plane to form an accommodation space. Therefore, through the lower inclined portion 419, some electronic components or structures can be installed below the heat sink 100, and through the inclined heat sink 420 of the inclined heat sink fin 400, a gradually expanding air outlet width can be formed, referring to the inclined heat sink air outlet width 105, which can effectively cooperate with the first heat sink air outlet width 104 of the first heat sink 410 to increase the air outlet width, avoid air outlet bottleneck, and avoid affecting the heat dissipation efficiency of the heat sink 100 due to the reduction of the outlet width of the first heat sink 410, thereby improving the overall heat dissipation efficiency of the heat sink 100.

Referring to FIG. 4 , the inclined heat dissipation fin 500 is drawn in a perspective view. As shown in the figure, the inclined heat dissipation fin 500 includes a first heat dissipation part 510 and an inclined heat dissipation part 520 . The first heat dissipation part 510 is connected below the inclined heat dissipation part 520 .

The first heat dissipation part 510 includes a first side 512, a second side 514, a third side 516, a fourth side 518 and a lower inclined part 519, and is approximately pentagonal. The lower inclined portion 519 is connected between the first side 512 and the fourth side 518 of the first heat dissipation portion 510, so that part of the lower portion of the first heat dissipation portion 510 forms an angle with the horizontal plane.

In addition, the inclined heat sink 520 includes a first side 522, a second side 524 and a third side 526, and is approximately triangular in shape. The first side 522 of the inclined heat sink 520 is connected to a portion of the third side 516 of the first heat sink 510, and is preferably integrally formed with a portion of the third side 516 of the first heat sink 510. The third side 526 of the inclined heat sink 520 is used to fix the inclined heat sink area of the inclined heat pipe.

In some embodiments, the first side 522 of the inclined heat dissipation part 520 and the first side 512 of the first heat dissipation part 510 are preferably arranged parallel to the substrate.

In some embodiments, the tilted heat sink 500 may further include an extended heat sink 530 connected to the top of the first heat sink 510 and connected to a side of the tilted heat sink 520. For example, the extended heat sink 530 includes a first side 532, a second side 534, a third side 536 and a fourth side 538, which are approximately rectangular. The second side 524 of the tilted heat sink 520 is connected to a portion of the second side 534 of the extended heat sink 530, and is preferably integrally formed with a portion of the second side 534 of the extended heat sink 530 to form the desired tilted heat sink 500.

It is worth noting that the inclined heat dissipation fin 500 is further formed with an air guide flange 511 protruding from the first side 512 of the first heat dissipation part 510, and an air guide flange 525 protruding from the third side of the inclined heat dissipation part 520. The edge 526 and an air guide flange 517 protrude from the lower inclined portion 519 of the first heat dissipation portion 510 to form a flow channel for heat dissipation air after multiple inclined heat dissipation fins 500 are stacked to effectively increase the heat dissipation device 100 heat dissipation efficiency.

In some embodiments, the air guide flange 525 protruding from the third side 526 of the inclined heat dissipation portion 520 can not only guide the heat dissipation air, but also increase the contact area with the inclined heat dissipation zone of the inclined heat pipe 800 to improve the heat dissipation efficiency.

In addition, an air guiding flange 533 protrudes from the second side 534 of the extended heat sink 530, and an air guiding flange 535 protrudes from the third side 536 of the extended heat sink 530, and the two form an L-shaped air guiding flange, and are connected to the air guiding flange 525 of the inclined heat sink 520 to further guide the flow of the cooling air, thereby increasing the heat dissipation efficiency of the heat sink 100.

Please refer to Figure 5. Figure 5 is a perspective view of the plurality of inclined heat dissipation fins 500 and the inclined heat pipe 800 in Figure 4 after being assembled. Therefore, the second side 514 of the first heat dissipation part 510 forms the air inlet 101, and the The portion of the third side 516 of a heat dissipation portion 510 that is not connected to the inclined heat dissipation portion 520 can be formed with an expanded air inlet 103 to increase the air inlet volume of the inclined heat dissipation fins 500, thereby effectively increasing the heat dissipation efficiency of the heat dissipation device 100.

In some embodiments, the inclined heat dissipation fin 500 further includes an air guide protrusion 540 to guide the heat dissipation air toward the inclined heat dissipation portion 520 to effectively increase the heat dissipation efficiency of the overall heat dissipation device 100 .

In some embodiments, the inclined heat dissipation fin 500 further includes an air guide opening 541 to facilitate heat dissipation air to pass through the inclined heat dissipation fin 500 to effectively increase the heat dissipation efficiency of the overall heat dissipation device 100 .

In some embodiments, the inclined heat dissipation fin 500 includes an air guide protrusion 540 and an air guide opening 541, and the air guide protrusion 540 protrudes from one side of the air guide opening 541 to guide the heat dissipation air through The air guide opening 541 is provided to effectively increase the heat dissipation efficiency of the overall heat dissipation device 100 .

In some embodiments, the air guiding opening 541 and the air guiding protrusion 540 are triangular in shape, but the present invention is not limited thereto.

In some embodiments, by tilting the lower inclined portion 519 of the first heat dissipation portion 510 of the heat dissipation fin 500 , electronic components or structures can be installed below the heat dissipation device 100 . 520, can also form a gradually expanding air outlet width, see the inclined heat dissipation portion air outlet width 105, which can effectively match the first heat dissipation portion air outlet width 104 of the first heat dissipation portion 510 to increase the air outlet width and avoid wind outflow. Bottleneck, avoid affecting the heat dissipation efficiency of the heat dissipation device 100 due to the reduction in the outlet width of the first heat dissipation part 510, thereby improving the overall heat dissipation efficiency of the heat dissipation device 100.

In some embodiments, the aforementioned inclined heat pipe is a flat heat pipe.

In summary, the heat sink disclosed in the present invention can effectively increase the air intake of the heat sink fins, and at the same time effectively increase the outlet width of the heat sink fins, reduce the bottleneck of the heat dissipation air flow, thereby increasing the heat dissipation efficiency, improving the heat dissipation quality, and further increasing the overall performance of the electronic device.

Although the present disclosure has been disclosed in the above implementation form, it is not intended to limit the present disclosure. Any person with ordinary knowledge in the field can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be defined by the scope of the attached patent application.

100: heat dissipation device 101: air inlet 102: air outlet 103: extended air inlet 104: first heat dissipation unit air outlet width 105: inclined heat dissipation unit air outlet width 200: inclined heat dissipation fins 210: first heat dissipation unit 212: first side 214: second side 216: third side 218: fourth side 220: inclined heat dissipation unit 222: first side 224: second side 226: third side 230: extended heat dissipation unit 232: first side 234: second side 236: third side 238: fourth side 300: inclined heat sink fins 310: first heat sink 312: first side 314: second side 316: third side 318: fourth side 320: inclined heat sink 322: first side 324: second side 326: third side 330: extended heat sink 332: first side 334: second side 336: third side 338: fourth side 340: air guide protrusion 341: air guide opening 400: inclined heat sink fins 410: first heat sink 412: first side 414: second side 416: third side 418: Fourth side 419: Lower inclined portion 420: Inclined heat sink 422: First side 424: Second side 426: Third side 430: Extended heat sink 432: First side 434: Second side 436: Third side 438: Fourth side 500: Inclined heat sink fin 510: First heat sink 511: Wind guide flange 512: First side 514: Second side 516: Third side 517: Wind guide flange 518: Fourth side 519: Lower inclined portion 520: Inclined heat sink 522: First side 524: Second side 525: Air guide flange 526: Third side 530: Extended heat dissipation section 532: First side 533: Air guide flange 534: Second side 535: Air guide flange 536: Third side 538: Fourth side 540: Air guide protrusion 541: Air guide opening 800: Inclined heat pipe 810: Heat absorption area 820: Inclined heat dissipation area 900: Fan

In order to make the above and other purposes, features, advantages and embodiments of the present disclosure more clearly understandable, the attached drawings are described as follows: FIG. 1 is a schematic side view of a heat sink according to an embodiment of the present invention. FIG. 2 is a schematic side view of a heat sink according to another embodiment of the present invention. FIG. 3 is a schematic side view of a heat sink according to another embodiment of the present invention. FIG. 4 is a three-dimensional schematic view of a heat sink fin of a heat sink according to another embodiment of the present invention. FIG. 5 is a three-dimensional schematic view of a heat sink according to yet another embodiment of the present invention.

100: Cooling device

101:Air inlet

102:Air outlet

104: Air outlet width of the first heat dissipation unit

105: Inclined heat dissipation part air outlet width

200: tilted heat sink fins

210: First heat dissipation unit

212: First side

214:Second side

216: The third side

218:Fourth side

220: Inclined heat sink

222:First side

224: Second side

226: The third side

230: Extended heat sink

232: First side

234:Second side

236:Third side

238: Fourth side

800: Inclined heat pipe

900: Fan

Claims (15)

A heat dissipation device comprises: a tilted heat pipe comprising a tilted heat dissipation area; and a plurality of tilted heat dissipation fins, each of which comprises a tilted heat dissipation portion, wherein the tilted heat dissipation area of the tilted heat pipe is fixed to the tilted heat dissipation portion so that the tilted heat dissipation area of the tilted heat pipe is at a predetermined angle relative to a horizontal plane. The heat dissipation device as claimed in claim 1, wherein each of the inclined heat dissipation fins further includes: A first heat dissipation part is connected below the inclined heat dissipation part for horizontal fixation on a substrate. The heat dissipation device as claimed in claim 2, wherein each of the inclined heat dissipation fins further includes: An extended heat dissipation part is connected above the first heat dissipation part and connected to one side of the inclined heat dissipation part. The heat dissipation device as described in claim 1, wherein the inclined heat pipe further comprises: A heat absorption area horizontally attached to a heat source. The heat dissipation device as described in claim 2, wherein each of the inclined heat dissipation fins further comprises: An expanded air inlet located above the first heat dissipation portion to guide the heat dissipation air into the inclined heat dissipation fins. The heat dissipation device as described in claim 1, wherein each of the inclined heat dissipation fins further comprises: an air guide protrusion to guide the heat dissipation air toward the inclined heat dissipation portion. The heat dissipation device as described in claim 6, wherein each of the inclined heat dissipation fins further comprises: an air guide opening, and the air guide protrusion protrudes from the air guide opening to guide the heat dissipation air to pass through the air guide opening. A heat dissipation device as described in claim 7, wherein the air-guiding opening and the air-guiding protrusion are rectangular, triangular or polygonal. The heat dissipation device as claimed in claim 1, wherein each of the inclined heat dissipation fins further includes: An air guide opening is provided to allow cooling air to pass through each of the inclined cooling fins. The heat dissipation device as claimed in claim 2, wherein the first heat dissipation portion of each of the inclined heat dissipation fins further includes: and a lower inclined portion, so that the lower portion of the first heat dissipation portion forms an angle with the horizontal plane. The heat dissipation device of claim 10, wherein the first heat dissipation portion of each of the inclined heat dissipation fins further includes: An air guide flange protrudes from the lower inclined portion to guide the heat dissipation air. The heat dissipation device as claimed in claim 3, wherein the inclined heat dissipation portion of each of the inclined heat dissipation fins includes: An air guide flange is used to increase the contact area with the inclined heat dissipation area of the inclined heat pipe and guide the heat dissipation air. The heat dissipation device as claimed in claim 12, wherein the extended heat dissipation portion of each of the inclined heat dissipation fins includes: An L-shaped air guide flange is connected to the air guide flange of the inclined heat dissipation part. The heat dissipation device of claim 2 further includes a fan located on one side of the inclined heat dissipation fins to drive the heat dissipation air to blow toward the inclined heat dissipation fins and the inclined heat dissipation area of the inclined heat pipe. The heat dissipation device as claimed in claim 1, wherein the inclined heat dissipation area of the inclined heat pipe forms a predetermined angle of 5 degrees to 45 degrees relative to the horizontal plane.

Images