CN100568493C - The water-cooling radiating module device of display card - Google Patents
The water-cooling radiating module device of display card Download PDFInfo
- Publication number
- CN100568493C CN100568493C CN 200710101080 CN200710101080A CN100568493C CN 100568493 C CN100568493 C CN 100568493C CN 200710101080 CN200710101080 CN 200710101080 CN 200710101080 A CN200710101080 A CN 200710101080A CN 100568493 C CN100568493 C CN 100568493C
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- water
- display card
- heat
- module device
- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A kind of water-cooling radiating module device of display card is used to cool off the wafer on the display card, and the water-cooling radiating module device of this display card comprises substrate, water cooler, radiator and water pump.This substrate is arranged on this display card.The part of the lower surface of this water cooler is contacted with this substrate, and another part of this lower surface is contacted with this wafer, lining first heat-conducting layer between the heat-conducting part of this substrate and the lower surface of this water cooler.This radiator is connected in this water cooler by intake line and output pipe.This water pump is arranged on this output pipe.Wherein form the cooling circuit of sealing between this water cooler and this radiator by water pump, output pipe and intake line.For this reason, by this substrate, water pump and water cooler modularization on display card, are solved traditional water-cooling type radiator assembling and are difficult for, easily leak and bulky problem.
Description
Technical field
The present invention relates to a kind of water-cooling radiating module device, particularly relate to a kind of water-cooling radiating module device that is applied on the display card.
Background technology
Traditional radiator utilization can be smooth with integrated circuit fin, fan is set on it.When the integrated circuit computing, a large amount of heats that it produced, by with the mode of the smooth conduction of fin, heat is taken to fin, utilize fan that fin is lowered the temperature again, and reach the purpose of radiating and cooling.In this kind radiator, fin is because of dispelling the heat by conduction pattern, and its amplitude that can lower the temperature is still limited, when being used in the integrated circuit of higher arithmetic speed, often be difficult to the radiating effect that reaches preferable, cause the electronic product fault and influence its computational calculation power, so still have improved necessity.
Other has a kind of water-cooling type radiator, and it is made up of tank, water pump, water-cooled head and radiator.Tank and water pump place in the computer chassis, and radiator is arranged at the louvre on the pairing casing, by radiator and by the liquid in the water pump driving pipeline, heat are carried into radiator heat-dissipation by the water-cooled head that contacts with thermal source.Yet there is following point in traditional water-cooling type radiator: one, this kind water-cooling type radiator is many because of assembly, comparatively bothers when mounted.Two, installed not at that time, liquid leakage easily takes place in tank.Three, water pump and tank are arranged in the computer chassis, and shared volume is more greatly and comparatively heavy, and the element on motherboard often makes that whole computer assembly is huge and complicated for a long time, assembling with use all inconvenience to some extent.
In addition, traditional water-cooling type radiator main body is to solve the heat dissipation problem of the CPU (CPU) on the motherboard, and be auxilliary with the heat dissipation problem that solves the wafer on the display card, yet, in fact, the heat that wafer produced on the display card is the main cause that influences the computer arithmetic speed, therefore, the water-cooling radiating module device of the display card that can solve foregoing problems is provided, and is the task of top priority in fact.
As from the foregoing, on reality is used, obviously there is the problem that remains to be improved in traditional water-cooling type radiator.
For this reason, the inventor thinks that the problems referred to above still need improve, and the spy concentrates on studies and cooperates academic utilization, has proposed a kind of reasonable in design and effectively improve the present invention of the problems referred to above.
Summary of the invention
First purpose of the present invention is to provide a kind of water-cooling radiating module device of display card, in order to solve the heat dissipation problem of display card wafer.
Second purpose of the present invention is to provide a kind of water-cooling radiating module device of display card, by substrate with water pump and water cooler modularization on display card, in order to reduce assembly, be easy to install.
The 3rd purpose of the present invention is to provide a kind of water-cooling radiating module device of display card, and it has the cooling circuit of sealing, in order to solve the problem of liquid leakage.
The 4th purpose of the present invention is to provide a kind of water-cooling radiating module device of display card, by substrate with the water pump modularization on display card, be arranged in the computer chassis with tank in order to reduce water pump, shared volume is the problem of heaviness more greatly and comparatively.
The 5th purpose of the present invention is to provide a kind of water-cooling radiating module device of display card, by another water cooler, in order to solve the heat dissipation problem of the CPU on the motherboard.
In order to achieve the above object, the present invention mainly provides a kind of water-cooling radiating module device of display card, be used to cool off the wafer on the display card, the water-cooling radiating module device of this display card comprises: substrate, be arranged on this display card, this substrate has fixed part, the opening corresponding to this wafer, heat-conducting part and radiating part; Water cooler, the part of its lower surface is contacted with this heat-conducting part, and another part of this lower surface contacts lining first heat-conducting layer between the heat-conducting part of this substrate and the lower surface of this water cooler corresponding to this opening and with this wafer. Radiator is connected in this water cooler by pipeline; And water pump, be arranged on this pipeline, and be fixed in the fixed part of this substrate; Wherein form cooling circuit by this water pump and this pipeline between this water cooler and this radiator.
In preferred embodiment, the water-cooling radiating module device of described display card, it further comprises another water cooler, is connected on this pipeline.
The present invention has following beneficial effect: one, by this substrate, on display card, make things convenient for the user to assemble water pump and water cooler modularization, it is many because of assembly to solve traditional water-cooling type radiator, and assembling is difficult for and bulky problem.Two, form the cooling circuit of sealing between this water cooler and this radiator by this water pump and this pipeline, solve the problem that traditional water-cooling type radiator easily leaks.Three,, reach the purpose of the heat dissipation problem that solves the CPU on the motherboard by another water cooler.
Description of drawings
Fig. 1 is the exploded view of a preferred embodiment of the water-cooling radiating module device of display card of the present invention;
Fig. 2 is the constitutional diagram of a preferred embodiment of the water-cooling radiating module device of display card of the present invention;
Fig. 3 is the vertical view of a preferred embodiment of the water-cooling radiating module device of display card of the present invention;
Fig. 4 is the user mode figure of a preferred embodiment of the water-cooling radiating module device of display card of the present invention; And
Fig. 5 is the constitutional diagram of another preferred embodiment of the water-cooling radiating module device of display card of the present invention.
The main symbol description of accompanying drawing
Fixed part 10 openings 12
Heat-conducting part 14 radiating parts 16
Water inlet 30 delivery ports 32
Water pump 4
Water inlet 40 delivery ports 42
Wafer 50
Intake line 6
First heat-conducting layer 8
Second heat-conducting layer 9
Computer chassis 100
Louvre 102
Water cooler 200
Embodiment
Reach technological means and the function that predetermined purpose is taked in order further to set forth the present invention, see also following about detailed description of the present invention and accompanying drawing, believe purpose of the present invention, feature and characteristics, can obtain thus to go deep into and concrete understanding, yet appended accompanying drawing only is used to provide reference and explanation, is not to be used for the present invention is limited.
Seeing also Figure 1 and Figure 2, is the exploded view and the constitutional diagram of a preferred embodiment of the water-cooling radiating module device of a kind of display card of the present invention.The water-cooling radiating module device of a kind of display card of the present invention is used to cool off the wafer 50 on the display card 5, and the water-cooling radiating module device of this display card comprises: substrate 1, water cooler 2, radiator 3 and water pump 4.
The metallic plate that this substrate 1 is one of the forming.This substrate 1 according to the size of the display card of required installation and on circuit arrangement tailor and form.This substrate 1 has fixed part 10, the opening 12 corresponding to this wafer 50, heat-conducting part 14 and radiating part 16.Wherein this fixed part 10 is a support, and this heat-conducting part 14 and this radiating part 16 be along the periphery setting of this opening 12, and this radiating part 16 is made up of a plurality of sub-radiating fin.
This water cooler 2 is the water-cooled head.This water cooler 2 comprises base plate 20 and top board 22.The end face projection of this top board 22, and be provided with water inlet 220 and delivery port 222.This top board 22 and these base plate 20 driving fits to form the chamber 24 for flow of cooling water, are provided with cold water runner (not shown) together in it.
This radiator 3 is water-cooling row, and it has water inlet 30 and delivery port 32.This radiator 3 has the current loop, and these current return number of routes row cooling water pipe and form.
This water pump 4 is a small pump, and it has water inlet 40 and delivery port 42.This water pump 4 is electrically connected at power supply by connecting the lead (not shown), with the running of supply-water pump 4 itself.
During assembling, this substrate 1 is arranged on this display card 5, makes the wafer 50 of the opening 12 of this substrate 1 corresponding to this display card 5.The water inlet 220 of this water cooler 2 and delivery port 222 are communicated in the delivery port 32 and the water inlet 30 of this radiator 3 respectively by intake line 6 and output pipe 7, this water pump 4 is arranged on this output pipe 7, the water inlet 40 of this water pump 4 is communicated in the delivery port 222 of this water cooler 2, the delivery port 42 of this water pump 4 is communicated in the water inlet 30 of this radiator 3, passes through the cooling circuit of this water pump 4 and this input, output pipe 6,7 formation sealings between this water cooler 2 and this radiator 3.Afterwards, this water pump 4 is fixed in the fixed part 10 of this substrate 1, again the part of base plate 20 lower surfaces of this water cooler 2 is contacted with the heat-conducting part 14 of this substrate 1, and another part of base plate 20 lower surfaces of this water cooler 2 contacts corresponding to this opening 12 and with this wafer 50, utilize retaining element that this water cooler 2 is fixed on this display card 5 again, make this water cooler 2 be contacted with this substrate 1 and this wafer 50 closely, in addition, in the present embodiment, lining first heat-conducting layer 8 between base plate 20 lower surfaces of the heat-conducting part 14 of this substrate 1 and this water cooler 2, this first heat-conducting layer 8 can be formed by heat-conducting cream or heat conduction paster.Moreover, lining second heat-conducting layer 9 between base plate 20 lower surfaces of this water cooler 2 and this wafer 50, this second heat-conducting layer 9 can be formed by heat conduction paster or heat-conducting cream, makes the heat-conducting effect between this water cooler 2 and this substrate 1 and this wafer 50 better by this first and second heat-conducting layer 8,9.
During operation, please cooperate shown in Figure 3, when these water pump 4 operations, cooling water promptly flows in cooling circuit, the base plate 20 of this water cooler 2 is because be contacted with the heat-conducting part 14 of this wafer 50 and this substrate 1 simultaneously, the heat that is produced when therefore this water cooler 2 not only can be taken away these wafer 50 operations, and can take away the heat that integrated circuit absorbed (because this substrate 1 be fixed in this display card 5 on) of this substrate 1 from this display card 5 itself, and the heat that is absorbed is carried into this radiator 3 discharges, in addition, because this water cooler 2 has part to contact with this substrate 1, so the part heat that is absorbed can shed by the radiating part 14 on this substrate 1, reaches preferable radiating effect thus.The heat that the heat that this wafer 50 is produced so this water cooler 2 can loose simultaneously and this substrate 1 are absorbed, and shed by the radiating part 14 of this radiator 3 and this substrate 1.
During use, see also shown in Figure 4ly, the water-cooling radiating module device of described display card is disposed in the computer chassis 100, wherein this radiator 3 is installed in the louvre 102 on the pairing casing 100.
See also shown in Figure 5, the water-cooling radiating module device of described display card, it further comprises another water cooler 200, it is connected in this output pipe 7.This another water cooler 200 can be installed on the motherboard, and contact central processing unit thereon, with solving the heat that central processing unit produces, therefore, the water-cooling radiating module device of display card of the present invention is auxilliary to solve the heat dissipation problem of display card wafer with the heat dissipation problem that solves the central processing unit on the motherboard.
Therefore,, have characteristics described as follows:, water pump and water cooler modularization on display card, are reached purpose easy to assembly one, by this substrate by the water-cooling radiating module device of a kind of display card of the present invention.Two, form the cooling circuit of sealing between this water cooler and this radiator by this water pump and this pipeline, avoid causing computer glitch because of leaking.Three, can solve the heat dissipation problem of the CPU on the motherboard by another water cooler.
The above, it only is the detailed description of specific embodiments of the invention and graphic, be not in order to restriction the present invention and feature of the present invention, the equivalence that every those skilled in the art does according to spirit of the present invention is modified or is changed, and all should be contained in the scope of claim of the present invention.
Claims (9)
1, a kind of water-cooling radiating module device of display card is used to cool off the wafer on the display card, and the water-cooling radiating module device of this display card is characterized in that, comprising:
Substrate is arranged on this display card, and this substrate has fixed part, the opening corresponding to this wafer, heat-conducting part and radiating part;
Water cooler, the part of its lower surface is contacted with this heat-conducting part, and another part of this lower surface contacts lining first heat-conducting layer between the heat-conducting part of this substrate and the lower surface of this water cooler corresponding to this opening and with this wafer;
Radiator is connected in this water cooler by pipeline; And
Water pump is arranged on this pipeline, and is fixed in the fixed part of this substrate;
Wherein form the cooling circuit of sealing between this water cooler and this radiator by this water pump and this pipeline.
2, the water-cooling radiating module device of display card as claimed in claim 1 is characterized in that, the metallic plate that this substrate is one of the forming.
3, the water-cooling radiating module device of display card as claimed in claim 2 is characterized in that, this first heat-conducting layer is formed by heat-conducting cream or heat conduction paster.
4, the water-cooling radiating module device of display card as claimed in claim 1 is characterized in that, the radiating part of this substrate is made up of a plurality of sub-radiating fin.
5, the water-cooling radiating module device of display card as claimed in claim 1 is characterized in that, lining second heat-conducting layer between the lower surface of this water cooler and this wafer.
6, the water-cooling radiating module device of display card as claimed in claim 4 is characterized in that, this second heat-conducting layer is formed by heat conduction paster or heat-conducting cream.
7, the water-cooling radiating module device of display card as claimed in claim 1 is characterized in that, this water cooler is the water-cooled head.
8, the water-cooling radiating module device of display card as claimed in claim 1 is characterized in that, this radiator is water-cooling row.
9, the water-cooling radiating module device of display card as claimed in claim 1 is characterized in that, further comprises another water cooler, is connected on this pipeline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710101080 CN100568493C (en) | 2007-04-26 | 2007-04-26 | The water-cooling radiating module device of display card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710101080 CN100568493C (en) | 2007-04-26 | 2007-04-26 | The water-cooling radiating module device of display card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101295681A CN101295681A (en) | 2008-10-29 |
| CN100568493C true CN100568493C (en) | 2009-12-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710101080 Expired - Fee Related CN100568493C (en) | 2007-04-26 | 2007-04-26 | The water-cooling radiating module device of display card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100568493C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017012336A1 (en) * | 2015-07-23 | 2017-01-26 | 中兴通讯股份有限公司 | Water cooling system on board module level |
| TWI800936B (en) * | 2021-09-30 | 2023-05-01 | 超恩股份有限公司 | Cooling system |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102194529A (en) * | 2010-03-19 | 2011-09-21 | 上海微电子装备有限公司 | Patch type heat-radiating device with active cooling |
| CN102791107B (en) * | 2011-05-20 | 2015-05-20 | 周哲明 | Sealing and water-cooling method and equipment for cooling electronic equipment |
| CN106155241A (en) * | 2015-04-03 | 2016-11-23 | 深圳市万景华科技有限公司 | Heat abstractor |
-
2007
- 2007-04-26 CN CN 200710101080 patent/CN100568493C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017012336A1 (en) * | 2015-07-23 | 2017-01-26 | 中兴通讯股份有限公司 | Water cooling system on board module level |
| US10212856B2 (en) * | 2015-07-23 | 2019-02-19 | Zte Corporation | Water cooling system of single board module level |
| TWI800936B (en) * | 2021-09-30 | 2023-05-01 | 超恩股份有限公司 | Cooling system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101295681A (en) | 2008-10-29 |
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Granted publication date: 20091209 Termination date: 20120426 |