CN221217802U - Nucleic acid amplification reaction temperature control device and nucleic acid amplification instrument - Google Patents

Abstract

The application discloses a temperature control device for nucleic acid amplification reaction and a nucleic acid amplification instrument. The temperature control device for nucleic acid amplification reaction comprises a temperature compensation module, a reaction module, a thermoelectric device and a radiator which are sequentially stacked. The radiator comprises a plurality of fins, the fins are arranged in parallel along the air inlet and outlet direction to form a fin array, the fin array is provided with a front end face, a rear end face and a lower end face, and adjacent fins form an air channel; the air duct has a front air opening, a rear air opening and a lower air opening, each front air opening and each rear air opening have the same width and height as each other, and the lower air openings have the same length and width as each other. The nucleic acid amplification instrument comprises the temperature control device and a voltage transformation switch. The application can change the air inlet path in the radiator, and is beneficial to the temperature uniformity of the reaction module.

Description

Nucleic acid amplification reaction temperature control device and nucleic acid amplification instrument

Technical Field

The application belongs to the technical field of biological detection, and particularly relates to a temperature control device for a nucleic acid amplification reaction and a nucleic acid amplification instrument.

Background

The nucleic acid amplification instrument is a basic instrument for polymerase reaction in the biomedical field, and the rapid heating or cooling response is required to be realized when the polymerase chain reaction (Polymerase Chain Reaction, PCR) is carried out, and the uniform and stable temperature environment is required to be maintained in the reaction process. At present, a temperature control device of a mainstream nucleic acid amplification instrument mainly comprises a heating module, a semiconductor refrigerating sheet and a radiator, wherein the heating module is used for placing samples and carrying out PCR reaction, and the temperature uniformity of the heating module directly influences the actual temperature detected by each sample.

When the nucleic acid amplification instrument performs nucleic acid amplification reaction, the requirement on temperature uniformity is very high, and the uniformity of the nucleic acid amplification reaction temperature can be influenced due to uneven heat dissipation in the working process of the radiator, or too slow heat conduction caused by too heavy mass of the heating module.

In the prior art, the conditions that the heat sink may cause the reaction temperature to be uneven include: 1) The surface area of the radiator base is far larger than the area of the reaction module, so that the heat dissipation area around the radiator base is large, the heat dissipation is fast, the temperature around the radiator base is low, the temperature is higher towards the middle, and the reaction module has the trend of cooling the center of the edge; 2) When the radiator works, air blown out by the fan flows along the air channel between the fins, so that the fins of the radiator are the lowest in temperature at the air inlet and the highest in temperature at the air outlet, the temperature of the reaction module is gradually increased in the air inlet and outlet direction, and the trend of front cooling and back heating is shown.

In the prior art, the heating module has the general structure that: 1) The reactor comprises a thick metal plate with upper and lower surfaces, wherein the upper surface of the metal plate is provided with holes which are arranged in a geometric array and directly serve as the reactor. 2) A metal base plate is provided on which the independently formed reactors are arranged in a geometric array. The rate of heating or cooling of the sample within the reactor will vary with the mass of the heating module. The lower the mass of metal through which heat needs to be conducted to the sample, the faster the heat conduction. Therefore, in case 1), the heating module is too heavy in mass, more heat needs to be conducted, and the time is longer; in case 2), if the metal bottom plate is not thin enough, the problem of excessive quality still exists, and if the metal bottom plate is thin enough, the reactor array directly fixed on the bottom plate is unstable in structure, and the whole structure of the heating module is not rigid enough and is easy to damage.

In the prior art, the heat loss around the module is usually compensated by adding an integral electrothermal film around the side or bottom of the heating module, but the method can only realize rough temperature compensation and cannot precisely compensate the temperature of each sample hole because the heat dissipated by each sample reactor of the module is uneven. In the related improvement technology, even if temperature compensation is carried out for each sample reactor, the scheme of independently attaching the flexible circuit board and the resistance heater on the cylindrical sample reactor is adopted, the contact area is small, the heat conduction is slow, the structure is complex, and the installation and maintenance are inconvenient.

Therefore, it is highly desirable to provide a nucleic acid amplification apparatus capable of improving the uniformity of the temperature of a nucleic acid amplification reaction.

Disclosure of utility model

In view of the above-mentioned drawbacks or shortcomings of the prior art, the present application is to provide a temperature control device for nucleic acid amplification reaction and a nucleic acid amplification apparatus.

In order to solve the technical problems, the application is realized by the following technical scheme:

The application provides a temperature control device for nucleic acid amplification reaction, which comprises a temperature compensation module, a reaction module, a thermoelectric device and a radiator which are sequentially stacked, and is characterized in that the radiator comprises a base and a plurality of fins fixed below the base, the fins are mutually arranged in parallel to form a fin array, and the fin array is provided with a front end face, a rear end face and a lower end face; the fins are adjacent to form an air channel, the air channel is provided with a front air opening, a rear air opening and a lower air opening, and the front air opening, the rear air opening and the lower air opening are used for air in-out; the front air openings of each air duct have the same width and height, the rear air openings have the same width and height, and the lower air openings have the same length and width.

Optionally, the actual air inlet and outlet surface formed by the air outlets is located in the front side area of the lower end surface, and the area of the actual air inlet and outlet surface formed by the air outlets is smaller than that of the lower end surface.

Optionally, the actual air inlet and outlet surface formed by the front air openings is located in the lower side area of the front end surface, and the area of the actual air inlet and outlet surface formed by the front air openings is smaller than that of the front end surface.

Optionally, the reaction module comprises a bottom plate, connecting ribs and a plurality of reactors, wherein the connecting ribs are of a staggered hollow net structure and are fixedly connected with the bottom plate; the connecting ribs and the bottom plate jointly form a containing cavity which is used for arranging the reactors and is arranged in an array mode, and the reactors are arranged in the containing cavity.

Optionally, the bottom plate and the connecting ribs are integrally formed, and the connecting ribs and the bottom plate can be divided into a plurality of reaction units which are arranged in an array and have equal mass.

Optionally, the position of the bottom plate, which is not directly connected with the connecting ribs, is provided with a lightening hole, and the thickness of the bottom plate is 0.3-0.5mm.

Optionally, the temperature compensation module includes the flexible circuit board, have on the flexible circuit board with the reactor mounting hole that the reactor one-to-one set up, and with reactor mounting hole quantity assorted resistance heater, resistance heater set up in every reactor mounting hole department, and with the bending portion connection of flexible circuit board.

Optionally, the reactor is a hollow conical cup-shaped structure comprising: the upper part, the middle part and the lower part are sequentially connected, the upper part and the middle part are of hollow structures, the hollow part of the upper part forms a taper hole, and the lower part is arranged in the accommodating cavity; the side wall of the upper part has the same thickness, and the outer wall of the middle part is provided with a first connecting wall used for being connected with the resistance heater and a second connecting wall used for being connected with the optical fiber.

Optionally, an exhaust hole is provided on the bottom surface of the lower part.

Optionally, the thermoelectric device comprises at least one semiconductor refrigeration piece, wherein the semiconductor refrigeration piece comprises an upper substrate, P-N type semiconductor particles and a lower substrate, and the refrigeration piece is provided with sealant only at the edge adjacent to other refrigeration pieces.

Optionally, the reactor is fully distributed in the accommodating cavity, and the projection area of a rectangle surrounded by extension lines of four sides of the bottom plate in the vertical direction is equal to the projection area of the upper surface of the radiator base in the vertical direction.

Optionally, a first heat-conducting medium is arranged between the reaction module and the thermoelectric device, and/or a second heat-conducting medium is arranged between the thermoelectric device and the radiator, and the first heat-conducting medium and the second heat-conducting medium are graphite paper or heat-conducting silicone grease.

Optionally, the first heat conducting medium and/or the second heat conducting medium is flexible graphite paper.

The application also provides a nucleic acid amplification instrument, which uses the temperature control device.

Preferably, the nucleic acid amplification apparatus further comprises a variable-voltage switching power supply electrically connected to the thermoelectric device.

Compared with the prior art, the application has the following technical effects:

Compared with the structure that the bottom of the radiator is completely closed and fins on the front side and the rear side are completely exposed in the prior art, the bottom sealing panel of the bottom of the radiator is removed, and the bottom sealing panel is arranged at the bottom of the radiator and can allow air to flow in and out.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the accompanying drawings in which:

Fig. 1: an exploded view of an embodiment of the present application;

fig. 2: a first schematic diagram of a radiator according to an embodiment of the application;

Fig. 3: a second schematic diagram of the radiator according to an embodiment of the present application;

Fig. 4: a rear view of the structure shown in fig. 2;

fig. 5: a first schematic diagram of a reaction module according to an embodiment of the present application;

fig. 6: a second schematic diagram of a reaction module according to an embodiment of the present application;

fig. 7: a side view of the structure shown in fig. 5;

Fig. 8: a front view of the structure shown in fig. 5;

fig. 9: a cross-sectional view of the structure shown in fig. 8;

fig. 10: the connecting rib schematic diagram in the reaction module of the application;

fig. 11: the connecting rib and the bottom plate in the reaction module are connected in a schematic diagram;

Fig. 12: the reaction unit structure in the reaction module is schematically shown;

Fig. 13: the connection structure of the reaction unit and the reactor in the reaction module is schematically shown;

Fig. 14: a schematic diagram of a temperature compensation module according to an embodiment of the present application;

Fig. 15: a side view of the structure shown in fig. 14;

fig. 16: a schematic of a thermoelectric device in accordance with an embodiment of the present application;

fig. 17: an exploded view of the structure shown in fig. 16;

Fig. 18: a top view of the cooling fin a in the configuration shown in fig. 17;

fig. 19: a rear view of the structure shown in fig. 18;

fig. 20: a partial block diagram of an embodiment of the present application;

fig. 21: the appearance of the nucleic acid amplification instrument using the temperature control module of the present application.

In the figure: radiator 1, fin 101, front face 1011, rear face 1012, lower face 1013, front tuyere 1021, rear tuyere 1022, lower tuyere 1023, baffle 103, reaction module 2, bottom plate 201, connection rib 202, reactor 203, upper portion 2031, middle portion 2032, lower portion 2033, taper hole 2034, accommodation cavity 2035, first connection wall 2036, second connection wall 2037, temperature measurement hole 2038, weight reduction hole 2039, temperature compensation module 3, flexible circuit board 301, reactor mounting hole 3011, bent portion 3012, resistance heater 302, thermoelectric device 4, semiconductor cooling fin 401, upper substrate 4011, P-N type semiconductor particles 4012, lower substrate 4013, sealant 4014, first heat conductive medium 51, second heat conductive medium 52.

Detailed Description

The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

In the present application, a direction parallel to the upper surface of the base of the heat sink 1 and parallel to the fins 101 is defined as a length of the heat sink 1, a direction perpendicular to the fins 101 is defined as a width of the heat sink 1, and a direction perpendicular to the upper surface of the base of the heat sink 1 is defined as a height of the heat sink 1.

In the present application, the upper, lower, left, right, front and rear are described based on the drawings, and the upper, lower, left, right, front and rear directions are shown in fig. 2.

As shown in fig. 1, one embodiment of the present application is a temperature control device for nucleic acid amplification reaction, which includes a temperature compensation module 3, a reaction module 2, a first heat conducting medium 51, a thermoelectric device 4, a second heat conducting medium 52, and a heat sink 1 stacked in order. The first heat-conducting medium 51 and the second heat-conducting medium 52 may be graphite paper or heat-conducting silicone grease, respectively, for example, the first heat-conducting medium 51 is flexible graphite paper, and the second heat-conducting medium 52 is heat-conducting silicone grease, which has better heat-conducting effect.

As shown in fig. 2 to 4, a heat sink 1 of one embodiment of the present application, the heat sink 1 includes: the heat exchanger comprises a base and a plurality of fins 101 arranged below the base, wherein the fins 101 are mutually arranged in parallel to form a fin array, an air channel is formed between the adjacent fins 101, and the fin array is provided with a front end face 1011, a rear end face 1012 and a lower end face 1013; the flowing air can enter and exit from the front air port 1021, the rear air port 1022 and the lower air port 1023 at the bottom of the air duct at the two sides, so that heat on the fins 101 is taken away, and the heat dissipation effect is achieved. When the front tuyere 1021 and the lower tuyere 1023 are not blocked, the area of the actual air inlet/outlet surface formed by the front tuyere 1021 of each air duct is regarded as being equal to the area of the front end surface 1011, and the area of the actual air inlet/outlet surface formed by the lower tuyere 1023 of each air duct is regarded as being equal to the area of the lower end surface 1013.

In the present embodiment, by blocking part of the front air port 1021 and the lower air port 1023, the area of the actual air inlet/outlet surface formed by the air duct front air port 1021 is smaller than the area of the front end surface 1011, and the area of the actual air inlet/outlet surface formed by the air duct lower air port 1023 is smaller than the area of the lower end surface 1013. External flowing air may enter the tunnel from the front tuyere 1021 and the lower tuyere 1023 and exit the tunnel from the rear tuyere 1022.

The front tuyere 1021 and/or the lower tuyere 1023 can be plugged by integrally forming, sealing, arranging a baffle 103 and the like. The front tuyere 1021 and/or the lower tuyere 1023 should be plugged in exactly the same way, i.e. the front tuyere 1021 after plugging of each air duct has the same width and height, and the lower tuyere 1023 has the same length and width, so that the air ducts realize the same ventilation path change.

In this embodiment, the front tuyere 1021 and the lower tuyere 1023 are air inlets, and the rear tuyere 1022 is an air outlet. Blocking the upper region of the front tuyere 1021 to enable the actual air inlet surface of the front tuyere 1021 to be positioned in the lower region of the front end surface 1011, and enabling flowing air to only enter from the front tuyere 1021 positioned in the lower region; and simultaneously, the rear side area of the lower tuyere 1023 is blocked, so that the actual air inlet surface of the lower tuyere 1023 is positioned in the front side area of the lower end surface 1013. This achieves a change in ventilation path of the radiator 1, and the flowing air can be taken in only from the front tuyere 1021 located in the area below the front end face 1011 and can be taken in from the lower tuyere 1023 located in the area in front of the lower end face 1013. Thereby realizing the problem of alleviating the low temperature of the air inlet side and the high temperature of the air outlet side of the radiator 1, and being beneficial to the temperature uniformity of the bottom of the reaction module 2.

As shown in fig. 5 to 13, a reaction module 2 according to one embodiment of the present application includes: the reactor comprises a bottom plate 201, connecting ribs 202 and a plurality of reactors 203, wherein the connecting ribs 202 are of a staggered hollow net structure, and the connecting ribs 202 are fixedly connected with the bottom plate 201; the connection rib 202 and the bottom plate 201 may be divided into a plurality of identical units arranged in an array, as shown in fig. 12, and the connection rib units and the bottom plate units are all centrally symmetrical and have the same central axis, so as to jointly form a reaction unit. Any one of the connection rib units has a receiving cavity 2035 for receiving the reactor 203. The accommodating cavity 2035 is an open accommodating cavity, and the reactor 203 is disposed in the accommodating cavity 2035. The bottom plate 201 is provided with weight reducing holes 2039 at positions where the connection ribs 202 are not directly connected. The thickness of the base plate 201 should be as small as possible while ensuring rigidity, and preferably 0.3mm to 0.5mm. Compared with the prior art, the embodiment can realize the light weight requirement; all the reaction units have equal mass, so that the heat conduction is more uniform; meanwhile, the connection rib 202 ensures rigidity of the entire structure, so that the uniformity of the entire temperature of the reaction module 2 is excellent while the structure is stable.

Specifically, the bottom plate 201 and the connecting ribs 202 are integrally formed, and may be formed by cutting off a corresponding part of metal from a metal plate, so as to facilitate industrial production.

Alternatively, the reactor 203 may be a hollow conical cup-shaped structure, as shown in fig. 9, including: an upper portion 2031, a middle portion 2032, and a lower portion 2033, the upper portion 2031 and the middle portion 2032 being hollow structures; the lower portion 2033 is accommodated in the accommodating cavity 2035, and an exhaust hole can be formed in the bottom surface of the lower portion 2033 for exhausting gas when the reaction module 2 is blackened by anodic oxidation, so as to prevent the hole bottom from being left white due to bubbles at the hole bottom. The hollow portion of the upper portion 2031 is formed with a tapered hole 2034, and the side wall of the upper portion 2031 has the same thickness. By the above arrangement, the reactor 203 formed by this embodiment is lighter than the structure in which the inner sidewall is formed in a conical shape but the outer sidewall is formed in a cylindrical shape in the prior art, and can be more firmly disposed in the receiving chamber 2035.

Specifically, the outer wall of the middle portion 2032 is provided with a first connection wall 2036 for connecting with the resistance heater 302 and a second connection wall 2037 for connecting with an optical fiber, so as to connect with the resistance heater 302 and the optical fiber, respectively.

Optionally, the reaction module 2 further comprises: the temperature measuring hole 2038 is arranged on the side wall of the reactor 203, and is used for placing a temperature sensor.

As shown in fig. 14 and 15, the temperature compensation module 3 according to one embodiment of the present application includes: a flexible circuit board 301 with a plurality of reactor mounting holes 3011, and resistive heaters 302 matching the number of the reactor mounting holes 3011; the resistance heater 302 is provided at each of the reactor mounting holes 3011 and connected to the bent portion 3012 of the flexible circuit board 301. The embodiment has simple structure and strong flexibility, can realize accurate compensation heating of each reactor 203 in the reaction module 2, is more beneficial to batch processing, improves the efficiency and reduces the labor cost.

As shown in fig. 16 to 19, the thermoelectric device 4 of one embodiment of the present application includes: the semiconductor refrigerating sheet 401 comprises an upper substrate 4011, P-N type semiconductor particles 4012 and a lower substrate 4013, the edge of the refrigerating sheet 401 adjacent to other refrigerating sheets 401 is provided with sealing glue 4014, the position which is not adjacent to other refrigerating sheets 401, namely the periphery of the whole thermoelectric device 4 is not provided with sealing glue 4014 or other sealing devices, the P-N type semiconductor particles 4012 at the periphery of the thermoelectric device 4 are directly exposed to air, and the arrangement can improve the corner temperature value of the semiconductor refrigerating sheet 401 at high temperature and improve the uniformity of the whole temperature of the thermoelectric device 4. Four through holes are formed in the semiconductor refrigeration piece 401, so that bolts can pass through the through holes to fixedly connect the semiconductor refrigeration piece 401 with the upper surface of the base of the radiator 1.

As shown in fig. 20, one embodiment of the present application is a temperature control device for nucleic acid amplification reaction, which includes a temperature compensation module 3, a reaction module 2, a first heat conducting medium 51, a thermoelectric device 4, a second heat conducting medium 52, and a heat sink 1 stacked in this order. The reaction module 2 comprises a bottom plate 201, connecting ribs 202, a plurality of reactors 203 and a containing cavity 2035 for containing the reactors 203, wherein the containing cavity 2035 is fully distributed by the reactors 203, and the projection area of a rectangle surrounded by extension lines of four sides of the bottom plate 201 in the vertical direction is equal to the projection area of the upper surface of the base of the radiator 1 in the vertical direction. The temperature compensation module 3 comprises a flexible circuit board 301 with a plurality of reactor mounting holes 3011, and a resistance heater 302 arranged at each reactor mounting hole 3011, wherein the resistance heater 302 is connected with a bending part 3012 of the flexible circuit board 301, and the resistance heater 302 is connected with a first connecting wall 2036 on the outer wall of a middle part 2032 of the reactor 203. The thermoelectric device 4 comprises a plurality of semiconductor refrigerating sheets 401, the semiconductor refrigerating sheets 401 comprise an upper substrate 4011, P-N type semiconductor particles 4012 and a lower substrate 4013, the sealing glue 4014 is only arranged at the edge adjacent to other refrigerating sheets 401 of the refrigerating sheets 401, the sealing glue 4014 or other sealing devices are not arranged at the position which is not adjacent to other refrigerating sheets 401, namely the periphery of the whole thermoelectric device 4, the P-N type semiconductor particles 4012 at the periphery of the thermoelectric device 4 are directly exposed to the air, the corner temperature value of the semiconductor refrigerating sheets 401 at high temperature can be improved, and the uniformity of the whole temperature of the thermoelectric device 4 is improved. The first heat conducting medium 51 and the second heat conducting medium 52 can be graphite paper or heat conducting silicone grease respectively, for example, the first heat conducting medium 51 is flexible graphite paper, the second heat conducting medium 52 is heat conducting silicone grease, and the heat conducting medium has better heat conducting effect, the first heat conducting medium 51 is arranged between the thermoelectric device 4 and the reaction module 2, and the second heat conducting medium 52 is arranged between the radiator 1 and the thermoelectric device 4.

The application also provides a nucleic acid amplification instrument which comprises the temperature compensation module 3, the reaction module 2, the thermoelectric device 4 and the radiator 1.

Specifically, the temperature compensation module 3, the reaction module 2, the thermoelectric device 4 and the heat sink 1 are described in detail above, and will not be described again here.

Specifically, the nucleic acid amplification apparatus further comprises: a switching power supply (not shown) electrically connected to the thermoelectric device 4 for setting heating or cooling of the nucleic acid amplification apparatus.

Optionally, the switching power supply includes, but is not limited to, a variable voltage switching power supply.

The thermoelectric device 4 is used for controlling the temperature of the heating module in the PCR amplification test process, when the temperature of the reactor 203 is controlled, the higher the voltage provided to the thermoelectric device 4 is, the faster the temperature rising speed is, when the temperature of the reactor 203 is controlled, the higher the voltage provided to the thermoelectric device 4 is, the faster the temperature falling speed is, but the amplitude of the temperature falling speed increase is not large after the voltage is raised to a certain value. In the prior art, the temperature rise and the temperature reduction voltage value provided by the switching power supply are the same, and when the voltage value is higher, the temperature rise and the temperature reduction speed are high, but the voltage waste is caused, the generated heat is excessive, and the noise is larger; when the voltage value is low, the temperature reduction speed is not greatly affected, and the temperature rise speed is greatly reduced. The nucleic acid amplification instrument of the embodiment uses a variable-voltage switching power supply, and when the temperature is raised, the variable-voltage switching power supply provides a higher voltage value for the thermoelectric device 4; another lower voltage value is provided to the thermoelectric device 4 during the temperature reduction control. By adopting the variable-voltage switching power supply, different voltage values can be provided for the refrigerating sheet when the nucleic acid amplification instrument needs to be heated/cooled, and the variable-voltage switching power supply has the advantages of high response speed, low energy consumption and low noise.

As shown in FIG. 21, the appearance of a nucleic acid amplification apparatus using the temperature control module of the present application is shown.

In the description of the present application, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "left", "right", "front", "rear", and the like are orientation or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.

The above embodiments are only for illustrating the technical scheme of the present application, but not for limiting the same, and the present application is described in detail with reference to the preferred embodiments. It will be understood by those skilled in the art that various modifications and equivalent substitutions may be made to the technical solution of the present application without departing from the spirit and scope of the technical solution of the present application, and it is intended to cover the scope of the claims of the present application.

Claims (15)

1. The temperature control device for the nucleic acid amplification reaction comprises a temperature compensation module, a reaction module, a thermoelectric device and a radiator which are sequentially stacked, and is characterized in that the radiator comprises a base and a plurality of fins fixed below the base, the fins are mutually arranged in parallel to form a fin array, and the fin array is provided with a front end face, a rear end face and a lower end face; the fins are adjacent to form an air channel, the air channel is provided with a front air opening, a rear air opening and a lower air opening, and the front air opening, the rear air opening and the lower air opening are used for air in-out; the front air openings of each air duct have the same width and height, the rear air openings have the same width and height, and the lower air openings have the same length and width.

2. The temperature control device according to claim 1, wherein an actual air inlet/outlet surface formed by the respective tuyeres is located in a front side region of the lower end surface, and an area of the actual air inlet/outlet surface formed by the tuyeres is smaller than an area of the lower end surface.

3. The temperature control device according to claim 1, wherein an actual air inlet/outlet surface formed by the front tuyeres is located in a lower area of the front end surface, and an area of the actual air inlet/outlet surface formed by the front tuyeres is smaller than an area of the front end surface.

4. The temperature control device according to claim 1, wherein the reaction module comprises a bottom plate, connecting ribs and a plurality of reactors, wherein the connecting ribs are of a staggered hollow net structure and are fixedly connected with the bottom plate; the connecting ribs and the bottom plate jointly form a containing cavity which is used for arranging the reactors and is arranged in an array mode, and the reactors are arranged in the containing cavity.

5. The temperature control device according to claim 4, wherein the bottom plate and the connecting ribs are integrally formed, and the connecting ribs and the bottom plate can be divided into a plurality of reaction units which are arranged in an array and have equal mass.

6. The temperature control device according to claim 4, wherein the bottom plate is provided with a lightening hole at a position which is not directly connected with the connecting rib, and the thickness of the bottom plate is 0.3-0.5mm.

7. The temperature control device according to claim 4, wherein the temperature compensation module comprises a flexible circuit board, wherein the flexible circuit board is provided with reactor mounting holes which are arranged in one-to-one correspondence with the reactors, and resistance heaters which are matched with the number of the reactor mounting holes, are arranged at each reactor mounting hole, and are connected with bending parts of the flexible circuit board.

8. The temperature control device of claim 7, wherein the reactor is a hollow conical cup-shaped structure comprising: the upper part, the middle part and the lower part are sequentially connected, the upper part and the middle part are of hollow structures, the hollow part of the upper part forms a taper hole, and the lower part is arranged in the accommodating cavity; the side wall of the upper part has the same thickness, and the outer wall of the middle part is provided with a first connecting wall used for being connected with the resistance heater and a second connecting wall used for being connected with the optical fiber.

9. The temperature control device of claim 8, wherein: the bottom surface of the lower part is provided with an exhaust hole.

10. The temperature control device of any one of claims 1 to 9, wherein the thermoelectric device comprises at least one semiconductor cooling fin comprising an upper substrate, P-N semiconductor particles, and a lower substrate, the cooling fin having a sealant disposed only at edges adjacent to other cooling fins.

11. The temperature control device according to any one of claims 4 to 9, wherein the reactor is covered with the accommodating chamber, and a projected area of a rectangle surrounded by extension lines of four sides of the bottom plate in a vertical direction is equal to a projected area of an upper surface of the radiator base in the vertical direction.

12. Temperature control device according to claim 1, characterized in that a first heat conducting medium is arranged between the reaction module and the thermoelectric device, and/or a second heat conducting medium is arranged between the thermoelectric device and the heat sink, wherein the first heat conducting medium and the second heat conducting medium are graphite paper or heat conducting silicone grease.

13. Temperature control device according to claim 12, characterized in that the first heat conducting medium and/or the second heat conducting medium is flexible graphite paper.

14. A nucleic acid amplification apparatus, characterized in that the temperature control device according to any one of claims 1 to 13 is used.

15. The nucleic acid amplification apparatus of claim 14, further comprising: and the variable-voltage switching power supply is electrically connected with the thermoelectric device.